Heat dissipation assembly, power module, electronic equipment and vehicle

Abstract

The utility model relates to a heat dissipation assembly, a power module, electronic equipment and a vehicle, and the assembly comprises a housing which is provided with an accommodation cavity, and an inlet and an outlet which are communicated with the accommodation cavity, and is suitable for being connected with a heating part; and the heat dissipation unit is connected with the shell, and the heat dissipation area of the heat dissipation unit is gradually increased from the inlet side to the outlet side. According to the technical scheme, the temperature uniformity of heat dissipation of the heat dissipation assembly is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation assemblies, and in particular to a heat dissipation assembly, a power module, an electronic device, and a vehicle. BACKGROUND

[0002] In related technologies, a power module assembly includes a chip. In order to avoid high-temperature failure or performance degradation of the chip, the power module assembly is usually provided with a cooling processing structure. However, the existing scheme cannot guarantee the uniformity of heat dissipation, thereby affecting the normal use of the power module assembly. SUMMARY

[0003] The present application provides a heat dissipation assembly, a power module, an electronic device, and a vehicle, which improves the uniformity of heat dissipation of the heat dissipation assembly, to at least partially solve the above technical problems.

[0004] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a heat dissipation assembly is provided, comprising: a shell having a receiving cavity, an inlet and an outlet respectively communicating with the receiving cavity, and the shell being adapted to be connected with a heat generating member; and a heat dissipation unit connected with the shell, the heat dissipation area of the heat dissipation unit gradually increasing along the direction from the inlet side to the outlet side.

[0005] Optionally, the heat dissipation assembly comprises a plurality of heat dissipation units arranged in the receiving cavity of the shell, and the heat dissipation area of the plurality of heat dissipation units gradually increases along the direction from the inlet side to the outlet side.

[0006] Optionally, the plurality of heat dissipation units are arranged at intervals.

[0007] Optionally, the heat generating member is a plurality of heat generating members, and the plurality of heat dissipation units are arranged one-to-one corresponding to the plurality of heat generating members.

[0008] Optionally, each heat dissipation unit comprises a plurality of heat dissipation columns, and the number of heat dissipation columns of each heat dissipation unit gradually increases along the direction from the inlet side to the outlet side.

[0009] Optionally, the plurality of heat dissipation columns are arranged at intervals.

[0010] Optionally, the plurality of heat dissipation columns are arranged at intervals along a first direction and / or a second direction, the direction from the inlet side to the outlet side being the first direction, and the first direction being perpendicular to the second direction.

[0011] Optionally, the intervals of the plurality of heat dissipation columns in each heat dissipation unit along the first direction are equal, and / or the intervals of the plurality of heat dissipation columns in each heat dissipation unit along the second direction are equal.

[0012] Optionally, the intervals between adjacent heat dissipation columns in at least two heat dissipation units are the same; and / or the size of the heat dissipation columns is the same.

[0013] Optionally, in a radial cross section of the heat dissipation column, a cross-sectional shape of the heat dissipation column along a length direction of the shell is at least one of a parallelogram, a circle, or a triangle.

[0014] Optionally, the shell includes a first shell and a second shell spaced along a length direction of the column, the first shell includes a first containing space, and the second shell includes a second containing space, the first containing space and the second containing space are in communication with each other, and a plurality of heat dissipation units are arranged in the first containing space and the second containing space.

[0015] Optionally, the heat generating component is located between the first shell and the second shell, a side wall of the first shell close to the second shell abuts against one side of the heat generating component, and a side wall of the second shell close to the first shell abuts against another side of the heat generating component.

[0016] Optionally, the heat generating component includes a first heat generating chip close to the first shell and a second heat generating chip close to the second shell.

[0017] Optionally, a number of heat dissipation columns corresponding to the plurality of first heat generating chips in the first shell is A1, a number of heat dissipation columns corresponding to the plurality of first heat generating chips in the second shell is A2, and A1≥A2.

[0018] Optionally, a number of heat dissipation columns corresponding to the plurality of second heat generating chips in the second shell is A3, a number of heat dissipation columns corresponding to the plurality of second heat generating chips in the first shell is A4, and A3≥A4.

[0019] Optionally, the heat dissipation assembly further includes a flow guide structure, and the flow guide structure is arranged between adjacent two heat dissipation units to guide the cooling medium.

[0020] Optionally, the flow guide structure includes a plurality of flow guide components, the plurality of flow guide components are spaced along a second direction, and a flow guide channel is formed between adjacent two flow guide components to guide the cooling medium of the heat dissipation unit close to the import side to the heat dissipation unit close to the export side.

[0021] Optionally, the flow guide channel is used to guide the cooling medium of the heat dissipation unit close to the import side to a middle part of the heat dissipation unit close to the export side.

[0022] Optionally, adjacent two flow guide components are mirror arranged along a first direction.

[0023] Optionally, a spacing between adjacent two flow guide components gradually decreases along the first direction.

[0024] According to a second aspect of the present application, a power module is provided, including the heat dissipation assembly described above.

[0025] According to a third aspect of the present application, an electronic device is provided, including the power module described above.

[0026] According to a fourth aspect of the present application, there is also provided a vehicle comprising the electronic device as above.

[0027] The heat dissipation assembly provided in the embodiments of the present application comprises a shell having a receiving cavity and an inlet and an outlet respectively communicating with the receiving cavity, the shell being used to connect with a heat generating component; and a heat dissipation unit connected with the shell, the heat dissipation area of the heat dissipation unit gradually increasing from the side of the inlet to the side of the outlet. According to the above technical solution, the area of the heat dissipation unit close to the side of the inlet is set to be smaller than the area of the heat dissipation unit close to the side of the outlet, so that the heat exchange area with the heat generating component gradually increases during the flow of the cooling liquid. Since the temperature of the cooling liquid close to the side of the inlet is lower than the temperature of the cooling liquid close to the side of the outlet, the heat exchange requirement of the heat generating component close to the side of the outlet is greater than the heat exchange requirement of the heat generating component close to the side of the inlet. In this way, the heat exchange areas of different heat dissipation regions can be adjusted, so as to ensure that the temperature of the heat dissipation unit remains relatively balanced, the temperature difference is reduced, and the heat dissipation effect is improved.

[0028] Other features and advantages of the present application will be described in detail in the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0030] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.

[0031] Figure 1 is a cross-sectional schematic view of the heat dissipation assembly provided in the exemplary first embodiment of the present disclosure;

[0032] Figure 2 is a cross-sectional schematic view of the heat dissipation assembly provided in the exemplary first embodiment of the present disclosure; Figure 1 is an enlarged schematic view of A in FIG. 1;

[0033] Figure 3 is a side view schematic view of the heat dissipation assembly provided in the exemplary second embodiment of the present disclosure;

[0034] Figure 4 is a cross-sectional schematic view of A-A in FIG. 2; Figure 3

[0035] Figure 5 is a cross-sectional schematic view of the heat dissipation assembly provided in the exemplary first embodiment of the present disclosure;

[0036] Figure 6 ​is Figure 3 An enlarged schematic view at B;

[0037] Legend:

[0038] heat dissipation assembly 1, housing 10, containing cavity 11, inlet 12, outlet 13, first housing 14, first containing space 141, second housing 15, second containing space 151,

[0039] heat dissipation unit 20, heat dissipation column 21,

[0040] heat generating member 30, first heat generating chip 31, second heat generating chip 32,

[0041] flow guide structure 40, flow guide member 41,

[0042] first direction X, second direction Y, third direction Z. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative labor are within the protection scope of the present application.

[0044] As Figures 1 to 6 shown, according to the first aspect of the present application, a heat dissipation assembly 1 is provided, comprising: a housing 10 having a containing cavity 11 and an inlet 12 and an outlet 13 respectively communicating with the containing cavity 11, the housing 10 being used for connecting with a heat generating member 30; a heat dissipation unit 20 connected with the housing 10, the heat dissipation area of the heat dissipation unit 20 gradually increasing from the side close to the inlet 12 to the side close to the outlet 13.

[0045] Through the above technical solution, since the temperature of the cooling liquid close to the inlet 12 is lower than the temperature of the cooling liquid close to the outlet 13, the heat exchange requirement of the heat generating member 30 close to the outlet 13 is greater than the heat exchange requirement of the heat generating member 30 close to the inlet 12, by setting the area of the heat dissipation unit 20 close to the inlet 12 side to be smaller than the area of the heat dissipation unit 20 close to the outlet 13 side, so that the heat exchange area of the cooling liquid with the heat generating member 30 gradually increases during the flow process, the flow resistance, flow rate and heat exchange area of the cooling liquid in different heat dissipation regions are adjusted, so as to ensure that the temperature of each heat dissipation unit 20 remains relatively balanced, the temperature difference is reduced, and the heat dissipation effect is improved.

[0046] In the present application, the inlet 12 side refers to the side close to the inlet 12, and the outlet 13 side refers to the side close to the outlet 13.

[0047] In the present application, the outer side wall of the shell 10 is connected with the side wall of the heat dissipation unit 20, so that the heat exchange efficiency can be improved, thereby improving the heat dissipation effect of the device.

[0048] Optionally, the heat dissipation assembly 1 comprises a plurality of heat dissipation units 20 arranged in the accommodating cavity 11 of the shell 10, and the heat dissipation area of the plurality of heat dissipation units 20 gradually increases along the direction from the inlet 12 to the outlet 13. In this way, the heat dissipation effect of the heat dissipation assembly 1 can be further improved to meet the use requirements of the device.

[0049] Optionally, the plurality of heat dissipation units 20 are arranged at intervals. In this way, the adjacent heat dissipation units 20 will not interfere with each other, thereby facilitating the stability of the heat dissipation units 20 during operation.

[0050] Optionally, the heat dissipation assembly 1 further comprises a plurality of heat generating components 30, and the heat dissipation units 20 are arranged one by one with the heat generating components 30. In this way, the heat dissipation uniformity of the heat dissipation assembly 1 to the plurality of heat generating components 30 can be ensured as much as possible, thereby facilitating the stability of the heat generating components 30 during operation.

[0051] Optionally, each heat dissipation unit 20 comprises a plurality of heat dissipation columns 21, and the number of heat dissipation columns of each heat dissipation unit 20 gradually increases along the direction from the inlet 12 to the outlet 13. In this way, the heat exchange area between the cooling liquid and the heat generating components 30 gradually increases during the flow process, so as to adjust the flow resistance, flow rate and heat exchange area of the cooling liquid in different heat dissipation areas, thereby ensuring that the temperature of each heat dissipation unit 20 remains relatively balanced, reducing the temperature difference and improving the heat dissipation effect.

[0052] Optionally, the plurality of heat dissipation columns 21 are arranged at intervals. In this way, the adjacent heat dissipation columns 21 will not interfere with each other, thereby facilitating the stability of the heat dissipation columns 21 during operation.

[0053] Optionally, the plurality of heat dissipation columns 21 are arranged at intervals along the first direction and / or the second direction, the direction from the inlet 12 to the outlet 13 is the first direction, and the first direction is perpendicular to the second direction. In this way, the heat dissipation effect of the device can be improved to meet the use requirements of the device.

[0054] In the present application, the first direction specifically refers to the direction from the inlet 12 to the outlet 13, and the second direction specifically refers to the width direction of the shell 10.

[0055] Optionally, the plurality of heat dissipation columns 21 within each heat dissipation unit 20 are equally spaced along the first direction, and / or the plurality of heat dissipation columns 21 within each heat dissipation unit 20 are equally spaced along the second direction. This arrangement facilitates machining with tools without affecting the machining efficiency, has mass production, so as not to increase the processing cost, and also does not affect the processing efficiency. Moreover, the arrangement of the heat dissipation columns 21 can increase the heat dissipation area, so as to more effectively transfer heat from the heat source to the surrounding environment. By optimizing the shape, size and arrangement of the heat dissipation unit 20, the heat dissipation efficiency can be further improved. Furthermore, the arrangement of the heat dissipation columns 21 generally has a compact design, which can provide sufficient heat dissipation capacity in a limited space. Such compactness makes the heat dissipation structure more easily integrated into various devices, especially in space-limited application scenarios.

[0056] Optionally, the spacing between adjacent heat dissipation columns 21 within at least two heat dissipation units 20 is the same; and / or, the size of the heat dissipation columns 21 is the same. The same spacing helps to form stable and orderly flow channels, thereby improving the flow efficiency of the cooling liquid and further improving the heat dissipation efficiency, while the same spacing makes the heat dissipation area between the heat dissipation columns 21 relatively uniform, avoiding the problem of uneven heat dissipation caused by uneven spacing. Uniform heat dissipation area helps to ensure the overall heat dissipation efficiency of the device, so that heat can be more evenly distributed throughout the device.

[0057] Further, the same spacing makes the connection between the heat dissipation columns 21 more uniform and stable, which helps to enhance the overall structural strength of the device. Such structural strength is crucial to ensure the long-term stable operation of the heat sink, especially under high load or harsh environment. The same spacing simplifies the manufacturing process of the heat sink, as standardized heat dissipation columns 21 can be used for production. Such standardized production helps to reduce manufacturing costs, improve production efficiency, and ensure product consistency.

[0058] Optionally, the spacing between the side walls of the two adjacent heat dissipation columns 21 corresponding to each other is L1, 0.6mm≤L1≤1mm. Within this range of spacing, the cooling liquid can flow more effectively between the heat dissipation columns 21, and a smaller spacing helps to reduce the resistance to the flow of the cooling liquid, so that heat can be more quickly transferred to the surrounding environment through the convection of the cooling liquid. The close arrangement of the heat dissipation columns 21 increases the heat dissipation area, thereby improving the heat radiation efficiency. A smaller spacing makes the heat dissipation structure more compact, which helps to save space. The close arrangement of the heat dissipation columns 21 helps to enhance the overall structural strength of the heat sink. When subjected to external forces, such closely arranged heat dissipation columns 21 can better disperse and resist external forces, thereby prolonging the service life of the heat sink. In the present application, L1 can be set to 0.6mm, 0.8mm or 1mm, etc.

[0059] Optionally, the cross-sectional shape of the heat dissipation member along the length direction of the shell 10 is at least one of parallelogram, circle, triangle. In this way, the heat dissipation member can meet the heat dissipation requirements of the device in different environments, thereby improving the applicability and scope of the heat dissipation member.

[0060] Optionally, in the radial cross-section of the heat dissipation column 21, the cross-sectional shape of the heat dissipation column 21 along the length direction of the shell 10 is a rhombus, and the height of the rhombus is L2, 0.6mm≤L2≤1mm. Compared with the traditional circular or square cross-sectional shape, the rhombus cross-sectional shape can provide a larger heat dissipation area under the same circumference. This is because the diagonal length of the rhombus is greater than its side length, thereby increasing the contact area with the surrounding cooling liquid, which is conducive to heat transfer and dissipation. At the same time, the rhombus cross-sectional shape can guide the flow of the cooling liquid and reduce the flow resistance. When the cooling liquid flows through the rhombic heat dissipation column 21, due to the change of shape, the cooling liquid flow will produce slight disturbance, which helps to enhance the convective heat dissipation effect and improve the heat dissipation efficiency. Within the given side length range 0.6mm≤L2≤1mm, the rhombic heat dissipation column 21 can maintain a small volume and weight while providing sufficient heat dissipation capacity. This makes the application of the heat dissipation column 21 in electronic equipment more flexible and can adapt to compact space layout. The rhombic heat dissipation column 21 design helps to distribute heat evenly. Due to the symmetry of the rhombus, heat can be more effectively transferred from the heat source to each part of the heat dissipation column 21, thereby improving the heat conduction efficiency. At the same time, the rhombic heat dissipation column 21 is relatively simple to manufacture and can be realized by stamping, cutting or injection molding and other processes. In the mass production process, this design can maintain high production efficiency and low cost. In the present application, L2 can be set to 0.6mm, 0.8mm or 1mm and the like.

[0061] In the present application, the radial direction of the heat dissipation column 21 is the direction perpendicular to the third direction.

[0062] Optionally, in the cross-section perpendicular to the length direction of the heat dissipation column 21, the cross-sectional shape of the heat dissipation column 21 is a rhombus with a side length of L1 and a height of L2, and L1 = L2. Due to L1 = L2, the space between the heat dissipation columns 21 is effectively utilized, and each heat dissipation column 21 can be maximally exposed to the surrounding cooling liquid, thereby increasing the heat dissipation area. This helps to accelerate the transfer and dissipation of heat, improving the heat dissipation efficiency. When the spacing between the heat dissipation columns 21 is equal to the side length, the cooling liquid can flow more smoothly through the gap between the heat dissipation columns 21, reducing the flow resistance. This design helps to form a more uniform cooling liquid flow pattern, improving the convective heat dissipation effect. While maintaining the heat dissipation performance, this design makes the layout of the heat dissipation columns 21 more compact. Due to L1 = L2, the space between the heat dissipation columns 21 is minimized, thereby saving space, making the heat dissipation system more flexible to adapt to different electronic devices and application scenarios. The rhombus-shaped heat dissipation column 21 design not only increases the heat dissipation area, but also improves the convective heat dissipation effect by optimizing the cooling liquid flow path. At the same time, due to the close arrangement of the heat dissipation columns 21, heat conduction is also enhanced. This design achieves a balance between heat conduction and convective heat dissipation, improving the overall heat dissipation performance.

[0063] Optionally, the heat dissipation column 21 extends in the height direction of the shell 10 by a length L3, and 3mm ≤ L3 ≤ 8mm. The appropriate extension L3 of the heat dissipation column 21 in the height direction increases the heat dissipation surface area, so that more heat can be transferred to the surrounding environment through the heat dissipation column 21. This helps to improve the heat dissipation efficiency, especially in high-power density or compact electronic devices. The height L3 of the heat dissipation column 21 and the rhombus-shaped cross-sectional shape jointly affect the cooling liquid flow pattern. The appropriate height can promote the convection of the cooling liquid between the heat dissipation columns 21, improving the heat dissipation effect. At the same time, the rhombus-shaped cross-sectional shape helps to guide the cooling liquid flow, reducing the flow resistance, further enhancing the convective heat dissipation. The extension of the heat dissipation column 21 in the height direction increases its structural rigidity, making the heat dissipation system more stable. This helps to resist external impact and vibration, protecting the electronic device from damage. The height L3 of the heat dissipation column 21 also affects the heat conduction path. The appropriate height can ensure that heat is effectively transferred from the heat source to the heat dissipation column 21 and dissipated to the surrounding environment through the surface of the heat dissipation column 21. This helps to achieve more uniform heat distribution and reduce the risk of local overheating. In this application, L3 can be set to 3mm, 5mm, or 8mm, etc.

[0064] Optionally, the shell 10 comprises a first shell 14 and a second shell 15 arranged in the height direction of the heat dissipation assembly 1, the first shell 14 comprises a first accommodating space 141, the second shell 15 comprises a second accommodating space 151, the first accommodating space 141 and the second accommodating space 151 are in communication with each other, and a plurality of heat dissipation units 20 are arranged in the first accommodating space 141 and the second accommodating space 151. In this way, the contact area of the heat dissipation assembly 1 and the heat generating part 30 can be increased, thereby improving the heat dissipation effect of the device to meet the heat dissipation requirements of the heat generating part 30.

[0065] Optionally, the heat generating part 30 is located between the first shell 14 and the second shell 15, the outer wall of the first shell 14 close to the second shell 15 abuts against one side of the heat generating part 30, and the outer wall of the second shell 15 close to the first shell 14 abuts against the other side of the heat generating part 30. In this way, the contact area of the heat dissipation assembly 1 and the heat generating part 30 can be increased, thereby improving the heat dissipation effect of the device to meet the heat dissipation requirements of the heat generating part 30.

[0066] Optionally, the heat generating part 30 comprises a first heat generating chip 31 close to the first shell 14 and a second heat generating chip 32 close to the second shell 15. In this way, the arrangement of the first heat generating chip 31 and the second heat generating chip 32 can be more reasonable, thereby improving the space utilization.

[0067] Optionally, the heat generating part 30 comprises a plurality of first heat generating chips 31, the number of the heat dissipation columns 21 corresponding to the plurality of first heat generating chips 31 in the first shell 14 is A1, the number of the heat dissipation columns 21 corresponding to the plurality of first heat generating chips 31 in the second shell 15 is A2, and A1≥A2. For a three-phase full-bridge structure, the number of the heat dissipation columns 21 increases from the first phase to the third phase to meet the requirement that the chip temperature is higher and higher; that is, the first phase cuts off more parts of the inlet and outlet, the second phase cuts off fewer parts of the inlet and outlet, and the third phase does not process the heat dissipation needles of the inlet and outlet to ensure that the maximum temperature of the third phase does not deteriorate.

[0068] Optionally, the heat generating part 30 comprises a plurality of second heat generating chips 32, the number of the heat dissipation columns 21 corresponding to the plurality of second heat generating chips 32 in the second shell 15 is A3, the number of the heat dissipation columns 21 corresponding to the plurality of second heat generating chips 32 in the first shell 14 is A4, and A3≥A4. For a three-phase full-bridge structure, the number of the heat dissipation columns 21 increases from the first phase to the third phase to meet the requirement that the chip temperature is higher and higher; that is, the first phase cuts off more parts of the inlet and outlet, the second phase cuts off fewer parts of the inlet and outlet, and the third phase does not process the heat dissipation needles of the inlet and outlet to ensure that the maximum temperature of the third phase does not deteriorate.

[0069] Optionally, the heat dissipation assembly 1 further comprises a flow guide structure 40, which is arranged between two adjacent heat dissipation units 20 to guide the flow of the cooling medium. Through the above structure, the fluid flowing through the rhombic waterway can be fully and uniformly distributed after flowing through one phase. However, for the power module of the next phase, a larger flow rate and speed are required in the middle. Therefore, through the flow guide, the flushing effect of the fluid to the middle area can be achieved, thereby reducing the temperature of the highest point of the power module.

[0070] In the present application, the cross section of the flow guide 41 is arc-shaped. Of course, the shape of the flow guide 41 can also be other structures as long as it can meet the flow guide requirements of the device.

[0071] Optionally, the flow guide structure 40 comprises a plurality of flow guides 41, and the plurality of flow guides 41 are arranged at intervals along the second direction. The interval between the two adjacent flow guides 41 is used to guide the cooling medium of the upstream heat dissipation unit 20 to the downstream heat dissipation unit 20. In this way, the distribution of the fluid in the housing 10 is facilitated, and the vortex and turbulence are reduced, thereby improving the flow efficiency and stability.

[0072] Optionally, the flow guide channel is used to guide the cooling medium of the heat dissipation unit 20 close to the inlet 12 side to the middle of the heat dissipation unit 20 close to the outlet 13 side. In this way, the distribution of the fluid in the housing 10 is facilitated, and the vortex and turbulence are reduced, thereby improving the flow efficiency and stability.

[0073] Optionally, the two adjacent flow guides 41 are mirror arranged along the first direction. The above structure is simple and easy to process, which not only reduces the production difficulty of the device, but also reduces the production cost of the device.

[0074] Optionally, the interval between the two adjacent flow guides 41 gradually decreases along the first direction. Since the temperature of the heat generating element 30 close to the outlet 13 is higher, a greater fluid flushing effect is required. Therefore, the above structure can improve the heat dissipation efficiency of the heat generating element 30 close to the outlet 13, so as to ensure that the temperature of each heat dissipation unit 20 remains relatively balanced, reduces the temperature difference, and improves the heat dissipation effect.

[0075] According to the second aspect of the present application, a power module is provided, comprising the heat dissipation assembly described above.

[0076] According to the third aspect of the present application, an electronic device is provided, comprising the power module described above.

[0077] According to the fourth aspect of the present application, a vehicle is also provided, comprising the electronic device described above.

[0078] The heat dissipation assembly 1 provided by the embodiment of the present application comprises a shell 10 having a receiving cavity 11 and an inlet 12 and an outlet 13 respectively communicating with the receiving cavity 11, an outer wall of the shell 10 being used to contact a heat generating element 30 to dissipate heat of the heat generating element 30; a plurality of heat dissipation units 20 are arranged in the receiving cavity 11 along a length direction of the shell 10, each heat dissipation unit 20 comprising a plurality of heat dissipation columns 21 arranged in the length direction of the shell 10 and / or a width direction of the shell 10; wherein the number of the heat dissipation columns 21 in the heat dissipation unit 20 close to the inlet 12 is less than the number of the heat dissipation columns 21 in the heat dissipation unit 20 close to the outlet 13. Through the above technical solution, since the temperature of the cooling liquid close to the inlet 12 is lower than the temperature of the cooling liquid close to the outlet 13, the heat exchange requirement of the heat generating element 30 close to the outlet 13 is greater than the heat exchange requirement of the heat generating element 30 close to the inlet 12, and by setting the number of the heat dissipation columns 21 in the heat dissipation unit 20 close to the inlet 12 to be less than the number of the heat dissipation columns 21 in the heat dissipation unit 20 close to the outlet 13, the heat exchange area of the cooling liquid with the heat generating element 30 gradually increases during the flow process, the flow resistance, flow rate and heat exchange area of the cooling liquid in different heat dissipation regions are adjusted, so that the temperature of each heat dissipation unit 20 is kept relatively balanced, the temperature difference is reduced, and the heat dissipation effect is improved.

[0079] It is to be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments consistent with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0080] The relative arrangement of parts and steps, numerical expressions, and numerical values set forth in the examples are not intended to limit the scope of the present application, unless otherwise specifically stated. It is to be understood that the drawings are not necessarily to scale as the dimensions of the parts shown are for the purpose of illustration and description only. Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, such techniques, methods, and devices can be understood to be within the scope of the application, and the application should be afforded the full breadth of interpretation and coverage afforded a patent. In all examples shown and discussed herein, any specific value is to be interpreted as merely illustrative and not as a limitation. Thus, other examples of the example embodiments can have different values. It is noted that like numbers and letters refer to like elements throughout the several views of the drawings and, as such, no further discussion regarding such like elements will be "further discussed" in the subsequent drawings.

[0081] In the description of the present application, it should be understood that the orientation words such as "front, back, upper, lower, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship are generally based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, without the opposite description, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0082] For the convenience of description, spatial relative terms such as "over", "above", "upper surface", "upper" and the like can be used herein to describe the spatial positional relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawing is inverted, the device described as "above" or "over" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0083] In addition, it should be noted that the use of "first", "second" and the like words to define parts only facilitates the differentiation of corresponding parts, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as a limitation on the scope of protection of the present application.

[0084] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a heat dissipation assembly. The shell is adapted to be connected with a heat generating element. The heat dissipation unit is connected with the shell, and the heat dissipation area of the heat dissipation unit gradually increases from the inlet side to the outlet side.

2. The heat dissipation assembly of claim 1, wherein, The heat dissipation assembly comprises a plurality of heat dissipation units arranged in the accommodating cavity of the shell, and the heat dissipation area of the plurality of heat dissipation units gradually increases from the inlet side to the outlet side.

3. The heat dissipation assembly of claim 2, wherein, The plurality of heat dissipation units are arranged at intervals.

4. The heat dissipation assembly of claim 2, wherein, The heat generating element is in plurality, and the plurality of heat dissipation units are arranged one by one corresponding to the plurality of heat generating elements.

5. The heat dissipation assembly of claim 2, wherein, Each heat dissipation unit comprises a plurality of heat dissipation columns, and the number of the heat dissipation columns of each heat dissipation unit gradually increases from the inlet side to the outlet side.

6. The heat dissipating assembly of claim 5, wherein, The plurality of heat dissipation columns are arranged at intervals in a first direction and / or a second direction.

7. The heat dissipating assembly of claim 5, wherein, The direction from the inlet to the outlet is the first direction, and the first direction is perpendicular to the second direction.

8. The heat dissipating assembly of claim 7, wherein, The intervals of the plurality of heat dissipation columns in the first direction are equal in each heat dissipation unit, and / or the intervals of the plurality of heat dissipation columns in the second direction are equal in each heat dissipation unit.

9. The heat dissipating assembly of claim 5, wherein, The intervals between adjacent heat dissipation columns in at least two heat dissipation units are the same, and / or the sizes of the heat dissipation columns are the same.

10. The heat dissipating assembly of claim 5, wherein, In the radial cross section of the heat dissipation column, the cross section shape of the heat dissipation column is at least one of parallelogram, circle and triangle.

11. The heat dissipating assembly of claim 7, wherein, The shell comprises a first shell and a second shell arranged at intervals in a third direction, the first shell and the second shell are in communication with each other, and the first direction, the second direction and the third direction are perpendicular to each other.

12. The heat dissipating assembly of claim 11, wherein, The first shell comprises a first accommodating space, and the second shell comprises a second accommodating space, and a plurality of heat dissipation units are arranged in the first accommodating space and the second accommodating space.

13. The heat dissipating assembly of claim 11, wherein, The heat generating element is located between the first shell and the second shell, the outer wall of the first shell close to the second shell is used for abutting against one side of the heat generating element, and the outer wall of the second shell close to the first shell is used for abutting against the other side of the heat generating element.

14. The heat dissipating assembly of claim 11, wherein, The heat generating element comprises a plurality of first heat generating chips close to the first shell and a plurality of second heat generating chips close to the second shell.

15. The heat dissipating assembly of claim 14, wherein, The number of the heat dissipation columns corresponding to the plurality of first heat generating chips in the first shell is A1, the number of the heat dissipation columns corresponding to the plurality of first heat generating chips in the second shell is A2, and A1 is greater than A2.

16. The heat dissipating assembly of claim 14, wherein, The number of the heat dissipation columns corresponding to the plurality of second heat generating chips in the second shell is A3, the number of the heat dissipation columns corresponding to the plurality of second heat generating chips in the first shell is A4, and A3 is greater than A4.

17. The heat dissipating assembly of claim 1, wherein, The heat dissipation assembly further comprises a flow guide structure arranged between adjacent two heat dissipation units to guide the cooling medium.

18. The heat dissipating assembly of claim 17, wherein, The flow guide structure comprises a plurality of flow guide members, the plurality of flow guide members are arranged at intervals along a second direction, and a flow guide channel is formed between two adjacent flow guide members for guiding the cooling medium of the heat dissipation unit close to the inlet side to the heat dissipation unit close to the outlet side.

19. The heat dissipating assembly of claim 18, wherein, The flow guide channel is used for guiding the cooling medium of the heat dissipation unit close to the inlet side to the middle part of the heat dissipation unit close to the outlet side.

20. The heat dissipating assembly of claim 18, wherein, Two adjacent flow guide members are mirror arranged along a first direction.

21. The heat dissipating assembly of claim 18, wherein, The interval between two adjacent flow guide members gradually decreases along the first direction.

22. A power module, characterized by The heat dissipation assembly comprises the heat dissipation assembly according to any one of claims 1-21.

23. An electronic device, comprising: The power module comprises the power module according to claim 22.

24. A vehicle characterized by comprising: The electronic device comprises the electronic device according to claim 23.

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