Heat dissipation structure, power module and vehicle
By setting multiple heat exchange components on the substrate and using reinforced structural connections, the heat dissipation effect and structural strength of the heat sink in the power module are solved, achieving a more efficient heat dissipation effect and structural strength.
Patent Information
- Application Number
- CN202520293595.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-02-21
AI Technical Summary
The heat sinks in existing power modules have poor heat dissipation and structural strength, which affects their performance.
By setting multiple heat exchange components on the substrate and connecting adjacent heat exchange components using a first reinforcing structure, a reinforced heat exchange component group is formed, which increases the heat dissipation area and guides the turbulence of the heat exchange medium, thereby improving the heat dissipation effect.
While ensuring the structural strength of the heat exchange components, the heat dissipation area and turbulence effect are increased to improve the heat dissipation effect and ensure the normal operation of electronic components.
Smart Images
Figure CN223680111U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of electronic device heat dissipation, in particular to a heat dissipation structure, a power module and a vehicle. BACKGROUND
[0002] In the related art, the heat dissipation effect and structural strength of the heat sink in the power module are poor, which affects the use effect of the power module. CONTENT OF THE INVENTION
[0003] The purpose of the present disclosure is to provide a heat dissipation structure, a power module and a vehicle to improve the heat dissipation effect and structural strength of the heat dissipation structure, thereby at least partially solving the above technical problems.
[0004] To achieve the above purpose, the first aspect of the present disclosure provides a heat dissipation structure, comprising: a substrate; a heat exchange assembly comprising a plurality of heat exchange pieces arranged at intervals on the substrate; and a first reinforcing structure connecting at least two heat exchange pieces.
[0005] Optionally, the plurality of heat exchange pieces are arranged in an array on the substrate, and two adjacent columns of heat exchange pieces are staggered; and the heat exchange piece is connected to at least one heat exchange piece arranged adjacent to the heat exchange piece through the first reinforcing structure.
[0006] Optionally, the equivalent diameter of the heat exchange piece is less than or equal to 1 mm; and / or, the gap between two adjacent heat exchange pieces is less than or equal to 1 mm.
[0007] Optionally, at least two heat exchange pieces arranged adjacent in the X direction are connected through the first reinforcing structure; and / or, at least two heat exchange pieces arranged adjacent in the Y direction are connected through the first reinforcing structure.
[0008] Optionally, the substrate comprises a high temperature area, the heat exchange pieces connected through the first reinforcing structure form a reinforced heat exchange piece group, and the reinforced heat exchange piece group is arranged close to the high temperature area to guide the heat exchange medium in the heat dissipation structure to flow towards the high temperature area.
[0009] Optionally, the reinforced heat exchange piece group has two groups, and the high temperature area is located between the two groups of reinforced heat exchange piece groups.
[0010] Optionally, the surface of the substrate is a plane; and / or, the thickness of the substrate is greater than or equal to 2 mm.
[0011] Optionally, among the plurality of heat exchange pieces connected through the first reinforcing structure, at least two heat exchange pieces are further connected by a second reinforcing structure, and the first reinforcing structure and the second reinforcing structure are arranged at intervals in the height direction of the heat exchange piece.
[0012] Optionally, the first reinforcing structure and the second reinforcing structure are arranged on a side wall of the heat exchange member; and the first reinforcing structure and / or the second reinforcing structure are arranged on a side of the side wall close to the base plate.
[0013] Optionally, the first reinforcing structure and / or the second reinforcing structure are configured as a flat plate structure.
[0014] Optionally, the heat dissipation structure further comprises a top cover connected with the base plate to cover a top of the heat exchange member; the top cover comprises a bending portion, and the top cover is connected with the base plate through the bending portion; and / or, opposite sides of the top cover are both formed with an opening with respect to the base plate, one of the two openings forms an inlet for the heat exchange medium to enter the heat dissipation structure, and the other forms an outlet for the heat exchange medium to flow out of the heat dissipation structure.
[0015] According to a second aspect of the present disclosure, a power module is provided, comprising the heat dissipation structure.
[0016] According to a third aspect of the present disclosure, a vehicle is provided, comprising the power module.
[0017] According to the above technical solution, the first reinforcing structure can improve the structural strength of the heat exchange members arranged on the base plate after the heat exchange members are connected by the first reinforcing structure, so that the structural strength of the heat exchange members provided with the first reinforcing structure can be ensured while the size of the heat exchange members and the gap between the heat exchange members are reduced, the heat dissipation area of the heat dissipation structure is increased, and the heat dissipation effect is improved; in addition, the arrangement of the first reinforcing structure can also increase the turbulence, that is, the turbulent flow effect of the heat exchange medium in the area is achieved, so as to further improve the heat dissipation effect. Based on this, the heat dissipation structure of the present disclosure can improve the heat dissipation effect of the heat dissipation structure while ensuring the structural strength of the heat exchange members.
[0018] Other features and advantages of the present disclosure will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0019] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, and are used together with the following specific embodiments to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:
[0020] Figure 1 is a first view of the heat dissipation structure provided by the embodiment of the present disclosure;
[0021] Figure 2 is a second view of the heat dissipation structure provided by the embodiment of the present disclosure;
[0022] Figure 3 is a top view of the heat dissipation structure provided by an embodiment of the present disclosure;
[0023] Figure 4 is a structural schematic diagram of the power module provided by an embodiment of the present disclosure.
[0024] Legend of reference signs
[0025] 1 - substrate; 101 - high temperature area; 2 - heat exchange component; 3 - first reinforcing structure; 4 - second reinforcing structure; 5 - top cover; 51 - bending part; 52 - opening; 6 - reinforced heat exchange component group. DETAILED DESCRIPTION
[0026] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure, and are not used to limit the present disclosure.
[0027] In the present disclosure, the terms "first", "second", and the like used in the present disclosure are used to distinguish one element from another element, and do not have sequential and important meanings. In addition, in the following description, the same reference signs in different drawings represent the same or similar elements unless otherwise explained. The above definition is only used to explain and illustrate the present disclosure, and should not be understood as a limitation of the present disclosure.
[0028] In the related art, the heat dissipation device in the power module can increase the density of the heat dissipation needle in the unit area, increase the heat dissipation area, and thus improve the heat dissipation effect of the heat dissipation device. However, this will make the size of the heat dissipation needle small, resulting in insufficient structural strength of the heat dissipation needle, affecting the normal use and heat dissipation effect of the heat dissipation device.
[0029] The heat dissipation structure in the exemplary embodiments of the present disclosure will be described below with reference to the accompanying drawings.
[0030] Reference Figures 1 to 4 As shown in the drawings, the first aspect of the present disclosure provides a heat dissipation structure, which can include a substrate 1, a heat exchange component, and a first reinforcing structure 3; wherein the heat exchange component includes a plurality of heat exchange components 2 arranged at intervals on the substrate 1; at least two heat exchange components 2 are connected by the first reinforcing structure 3.
[0031] The flow channels for the heat exchange medium to flow through are formed between the plurality of heat exchange elements 2 arranged at intervals on the substrate 1, and the heat exchange medium exchanges heat with the heat exchange elements 2 during the process of flowing through the flow channels, so as to achieve the effect of heat dissipation. Under the action of the first reinforcing structure 3, the structural strength of the heat exchange elements 2 connected by the first reinforcing structure 3 can be improved. In this way, more heat exchange elements 2 with smaller size and smaller spacing can be arranged in a unit area on the substrate 1 on the basis of ensuring the structural strength of the heat exchange elements 2. Therefore, the increase in the number of heat exchange elements 2 and the arrangement of the first reinforcing structure 3 can improve the heat exchange area of the heat dissipation structure in a unit area, thereby improving the heat dissipation effect of the heat dissipation structure. In addition, since the first reinforcing structure 3 is located between the heat exchange elements 2, the heat exchange medium can collide with the first reinforcing structure 3 when flowing through the flow channels, thereby increasing the turbulence effect and causing the heat exchange medium at this position to produce turbulent flow, thereby improving the heat dissipation effect. Based on this, the heat dissipation structure of the present disclosure can improve the heat dissipation effect of the heat dissipation structure while ensuring the structural strength of the heat exchange elements 2.
[0032] Exemplarily, the substrate 1 of the heat dissipation structure can be arranged in contact with the electronic element of the power module which needs to be cooled. The heat generated by the electronic element during operation can be exchanged with the heat exchange elements 2. The heat exchange elements 2 absorb the heat generated by the electronic element and then exchange heat with the heat exchange medium. In this way, the heat dissipation of the electronic element is achieved.
[0033] In addition, in order to avoid large pressure loss of the heat exchange medium during the process of exchanging heat with the heat exchange elements 2 in the flow channels, the first reinforcing structure 3 can be arranged in the area which needs to be strengthened for heat dissipation, that is, the heat exchange elements in the area which needs to be strengthened for heat dissipation can be provided with the first reinforcing structure 3.
[0034] It should be noted that the heat exchange medium can be a gaseous medium or a liquid medium, etc. When the heat exchange medium is a gaseous medium, the gaseous medium can be air. When the heat exchange medium is a liquid medium, the liquid medium can be cooling water or ethylene glycol solution, etc. Exemplarily, when the heat exchange medium is ethylene glycol solution, the decrease in the size of the heat exchange elements 2 and the gap between the heat exchange elements 2 will cause the local pressure to decrease, thereby causing the vaporization temperature of the ethylene glycol solution to continuously decrease, generating cavitation bubbles. In this case, the first reinforcing structure 3 can also break part of the cavitation bubbles in the Z direction, thereby reducing the size of the cavitation bubbles and reducing the influence of the cavitation bubbles on the heat dissipation effect.
[0035] In the embodiments of the present disclosure, as Figure 3As shown, the plurality of heat exchange elements 2 can be arranged in an array on the substrate 1, and the two adjacent columns of heat exchange elements 2 are staggered. The heat exchange elements 2 are connected to at least one heat exchange element 2 arranged adjacent to the heat exchange element 2 by the first reinforcing structure 3. The arrayed heat exchange elements 2 can enable the heat exchange elements 2 to be fully distributed on the surface of the substrate 1, thereby maximizing the heat exchange area of the heat exchange elements 2 with the heat exchange medium. In addition, since the two adjacent columns of heat exchange elements 2 are staggered, the strength of the turbulence can be increased to some extent, thereby improving the overall heat dissipation effect of the heat dissipation structure. Furthermore, this can facilitate the connection of the first reinforcing structure 3 to the adjacent heat exchange elements 2. According to the needs, the heat exchange elements 2 can be connected together by the first reinforcing structure 3 in various ways. For example, on the same heat exchange element 2, one first reinforcing structure 3 can be provided, which is connected to another heat exchange element 2 adjacent thereto. Alternatively, a plurality of first reinforcing structures 3 can be provided, which are arranged at intervals on the peripheral side of the heat exchange element 2. Thus, the heat exchange element 2 can be connected to a plurality of heat exchange elements 2 on the peripheral side by a plurality of first reinforcing structures 3, thereby improving the strength and heat dissipation effect of the heat exchange elements 2 in this region.
[0036] Specifically, as shown, Figures 1 to 3 The size of the heat exchange element 2 can be less than or equal to 1 mm, for example, 0.5-1 mm; and / or the gap between the two adjacent heat exchange elements 2 can be less than or equal to 1 mm, for example, 0.5-1 mm. Thus, more heat exchange elements 2 can be provided in a unit area of the substrate 1, and after the first reinforcing structure 3 is provided on the heat exchange element 2, the heat dissipation effect of the heat dissipation structure in a unit area can be improved while ensuring the structural strength of at least part of the heat exchange elements 2.
[0037] In addition, since the shape of the heat exchange element 2 can be adjusted as needed, for example, the heat exchange element 2 can be configured as a columnar structure with a rectangular cross section, or can also be configured as a cylindrical structure, therefore, the above-mentioned size is the equivalent diameter of the heat exchange element 2, that is, it can be understood as the diameter of the heat exchange element 2 with a non-circular cross section converted into an equivalent circular cross section with the same heat transfer characteristics.
[0038] It can be understood that the size of the heat exchange element 2 provided with the first reinforcing structure 3 can be the same as or different from the size of the remaining heat exchange elements 2. When the size of the heat exchange element 2 provided with the first reinforcing structure 3 is the same as the size of the remaining heat exchange elements 2, the heat exchange elements 2 on the substrate 1 can be easily formed. When the size of the heat exchange element 2 provided with the first reinforcing structure 3 is different from the size of the remaining heat exchange elements 2, the structural strength of different heat exchange elements 2 can be adjusted to some extent. For example, the size of the heat exchange element 2 provided with the first reinforcing structure 3 is smaller, and the size of the remaining heat exchange elements 2 is larger. In this way, the structural strength of the heat exchange elements 2 without the first reinforcing structure 3 can be ensured to some extent.
[0039] In some embodiments, as shown in Figure 1 and Figure 2 at least two heat exchange pieces 2 arranged adjacent to each other in the X direction are connected by the first reinforcing structure 3; and / or, at least two heat exchange pieces 2 arranged adjacent to each other in the Y direction are connected by the first reinforcing structure 3. The first reinforcing structure 3 increases the effect of the disturbance mainly because it can increase the disturbance effect in the X, Y and Z directions. Since the first reinforcing structure 3 connecting two heat exchange pieces 2 is located in the flow channel, the heat exchange medium flowing in the flow channel will be blocked by the first reinforcing structure 3, and the blocked heat exchange medium will change the flow path, forming a disturbance, thereby improving the heat dissipation effect.
[0040] For example, after two heat exchange pieces 2 adjacent in the X direction are connected by the first reinforcing structure 3, they can hinder the flow of the heat exchange medium in the Y direction, thereby forming a disturbance in the Y direction. In addition, part of the heat exchange medium will flow in the Z direction under the blocking action of the first reinforcing structure 3, thereby generating a disturbance in the Z direction. Of course, since the disturbances in each direction will affect each other, a certain X direction disturbance will also be formed. Alternatively, after two heat exchange pieces 2 adjacent in the Y direction are connected by the first reinforcing structure 3, they will mainly hinder the flow of the heat exchange medium in the X direction, thereby forming a disturbance in the X direction. In addition, part of the heat exchange medium will flow in the Z direction under the blocking action of the first reinforcing structure 3, thereby generating a disturbance in the Z direction. Of course, since the disturbances in each direction will affect each other, a certain Y direction disturbance will also be formed. Thus, the first reinforcing structure 3 of the heat exchange piece 2 can form a disturbance in multiple directions, thereby improving the heat dissipation effect.
[0041] It can be understood that even if the two heat exchange pieces 2 connected by the first reinforcing structure 3 are not parallel to the X direction or the Y direction, the multi-directional disturbance effect can be improved, thereby improving the heat dissipation efficiency.
[0042] It should be noted that the X direction and the Y direction can be two directions perpendicular to each other in a plane parallel to the substrate 1, and the Z direction can be the height direction of the heat exchange piece 2.
[0043] In the embodiments of the present disclosure, as shown in Figure 3As shown, the substrate 1 may include a high-temperature zone 101. Heat exchange components 2 connected by a first reinforcing structure 3 form a reinforced heat exchange component group 6. The reinforced heat exchange component group 6 is positioned close to the high-temperature zone 101 to guide the heat exchange medium in the heat dissipation structure towards the high-temperature zone 101. Exemplarily, after the heat dissipation structure is attached to the electronic component, the position of the high-temperature zone 101 corresponds to the area of the electronic component that is prone to heat generation. Since the first reinforcing structure 3 blocks the flow of heat exchange medium in some channels after some of the heat exchange components 2 are connected, the reinforced heat exchange component group 6, positioned close to the high-temperature zone 101, guides some of the heat exchange medium to flow towards the high-temperature zone 101, thereby increasing the flow rate of the heat exchange medium in the high-temperature zone 101, improving the heat dissipation effect of the heat dissipation structure on the heat-generating areas of the electronic component, and ensuring the normal operation of the electronic component.
[0044] Among them, such as Figure 3 As shown, there can be two sets of enhanced heat exchanger assembly 6, and the high-temperature zone 101 can be located between the two sets of enhanced heat exchanger assembly 6. The two sets of enhanced heat exchanger assembly 6 can guide the heat exchange medium from both sides of the high-temperature zone 101 to the high-temperature zone 101. The projection of the two sets of enhanced heat exchanger assembly 6 on the substrate 1 can form a channel-like structure to guide more heat exchange medium to the high-temperature zone 101. For example, the two sets of enhanced heat exchanger assembly 6 can extend gradually from the beginning to the end towards the other enhanced heat exchanger assembly 6. In this way, the projection of the two sets of enhanced heat exchanger assembly 6 on the substrate 1 can form a channel-like structure with a larger opening 52 at one end and a smaller opening 52 at the other end. As a result, a larger flow rate of heat exchange medium can be concentrated at the end of the enhanced heat exchanger assembly 6. If the high-temperature zone 101 is located near this area, the heat dissipation effect of the high-temperature zone 101 can be maximized.
[0045] Of course, in some embodiments not shown, the enhanced heat exchanger assembly 6 can extend in any direction, as long as it can guide the heat exchange medium to flow towards the high-temperature zone 101 and improve the heat exchange capacity of the high-temperature zone 101.
[0046] In some implementations, such as Figures 1 to 4 As shown, the surface of substrate 1 is flat. Compared with substrate 1 with a groove structure on the surface, substrate 1 with a flat surface can avoid the problem of stress concentration. In addition, the thickness of substrate 1 can be greater than or equal to 2mm, which can improve the strength of substrate 1 and ensure the normal use of heat dissipation structure.
[0047] In some embodiments of this disclosure, such as Figure 1 and Figure 2As shown, in order to further improve the structural strength of the heat exchange element 2, at least two heat exchange elements 2 connected by the first reinforcing structure 3 can be further connected by a second reinforcing structure 4, and the first reinforcing structure 3 and the second reinforcing structure 4 are arranged at intervals in the height direction of the heat exchange element 2. That is, more reinforcing structures are arranged between two heat exchange elements 2 to improve the structural strength of the heat exchange element 2, and the arrangement of multiple reinforcing structures can also improve the turbulence effect in this area, further improving the heat dissipation efficiency.
[0048] As shown in Figure 1 and Figure 2 , the first reinforcing structure 3 and the second reinforcing structure 4 can be arranged on the side wall of the heat exchange element 2; the first reinforcing structure 3 and / or the second reinforcing structure 4 is located on the side of the side wall close to the base plate 1. That is, the first reinforcing structure 3 and / or the second reinforcing structure 4 is arranged close to the bottom of the heat exchange element 2, so that the turbulence intensity at the bottom of the heat exchange element 2 can be strengthened during the flow of the heat exchange medium, thereby improving the heat dissipation effect of the heat exchange element 2.
[0049] In some embodiments, as shown in Figure 1 and Figure 2 , the first reinforcing structure 3 and / or the second reinforcing structure 4 is configured as a flat plate structure. In this way, the heat on the heat exchange element 2 can be dissipated in time after being transferred to the first reinforcing structure 3 and / or the second reinforcing structure 4, thereby improving the heat dissipation effect of the heat dissipation structure.
[0050] In addition, as shown in Figure 4 , the heat dissipation structure can further include a top cover 5 connected with the base plate 1 to cover the top of the heat exchange element 2; the top cover 5 includes a bending portion 51, and the top cover 5 is connected with the base plate 1 through the bending portion 51. The bending portion 51 can increase the contact area between the top cover 5 and the base plate 1, thereby improving the connection effect of the top cover 5 and the base plate 1. For example, the bending portion 51 can be connected with the base plate 1 by adhesion or welding; and / or, openings 52 are formed between the opposite sides of the top cover 5 and the base plate 1. One of the two openings 52 forms an inlet for the heat exchange medium to enter the heat dissipation structure, and the other forms an outlet for the heat exchange medium to flow out of the heat dissipation structure. When the heat dissipation structure is working, the heat exchange medium can flow into the flow channel formed by the plurality of heat exchange elements 2 from the inlet, and exchange heat with the heat exchange element 2 therein. The heat exchanged heat exchange medium is discharged from the outlet to achieve the effect of heat exchange of the heat exchange element 2, so that the heat exchange element 2 can exchange heat with the electronic element that needs to be heat exchanged.
[0051] In a second aspect of the present disclosure, a power module is provided, which includes the heat dissipation structure described above. It should be noted that the power module has all the beneficial effects of the heat dissipation structure described above, and the present disclosure will not be repeated here.
[0052] In a third aspect, the present disclosure provides a vehicle comprising the power module described above. It should be noted that the vehicle has all the beneficial effects of the power module described above, and the present disclosure will not be repeated here.
[0053] In summary, the present disclosure exemplarily illustrates the working principle of the heat dissipation structure.
[0054] In the plurality of heat exchange elements 2 on the substrate 1, at least some of the heat exchange elements 2 are provided with the first reinforcing structure 3 and / or the second reinforcing structure 4. The heat exchange elements 2 provided with the reinforcing structure have better structural strength, and therefore, the heat exchange elements 2 can be reduced in size and the gap between the heat exchange elements 2 can be reduced. In this way, by providing more heat exchange elements 2 and the first reinforcing structure 3 and / or the second reinforcing structure 4 in a unit area of the substrate 1, the heat dissipation area in the unit area is increased, thereby improving the heat dissipation effect of the heat dissipation structure. When the heat dissipation structure needs to dissipate heat from the electronic components, the heat exchange medium flowing in the flow channel between the heat exchange elements 2 will generate turbulence at the position due to the presence of the first reinforcing structure 3 and / or the second reinforcing structure 4, thereby improving the heat dissipation effect. In addition, the reinforced heat exchange element group 6 can also guide the heat exchange medium to flow towards the high-temperature area 101, thereby improving the heat exchange effect of the high-temperature area 101 and ensuring the heat dissipation effect of the heat-prone area of the electronic components. Based on this, the heat dissipation structure of the present disclosure can improve the heat dissipation effect of the heat dissipation structure while ensuring the structural strength of the heat exchange elements 2.
[0055] The preferred embodiments of the present disclosure are described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details in the above-described embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
[0056] It should be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction, and in order to avoid unnecessary repetition, the present disclosure will not further describe various possible combination manners.
[0057] In addition, various different embodiments of the present disclosure can also be combined in any appropriate manner, as long as they do not deviate from the idea of the present disclosure, they should also be considered as disclosed by the present disclosure.
Claims
1. A heat dissipating structure, characterized by comprising: The heat dissipation structure comprises: a substrate; a plurality of heat exchange components arranged on the substrate; a first reinforcing structure connecting at least two of the heat exchange components.
2. The heat dissipating structure according to claim 1, wherein The plurality of heat exchange components are arranged in an array on the substrate, and two adjacent columns of the heat exchange components are staggered; the heat exchange components are connected to at least one of the heat exchange components arranged adjacent to the heat exchange component through the first reinforcing structure.
3. The heat dissipating structure according to claim 1, wherein An equivalent diameter of the heat exchange component is less than or equal to 1 mm; and / or A gap between two adjacent heat exchange components is less than or equal to 1 mm.
4. The heat dissipating structure according to claim 1, wherein At least two of the heat exchange components arranged adjacent in an X direction are connected through the first reinforcing structure; and / or At least two of the heat exchange components arranged adjacent in a Y direction are connected through the first reinforcing structure.
5. The heat dissipating structure according to claim 1, wherein The substrate comprises a high-temperature area, and the heat exchange components connected through the first reinforcing structure form a reinforcing heat exchange component group, which is arranged close to the high-temperature area to guide the heat exchange medium in the heat dissipation structure to flow towards the high-temperature area.
6. The heat dissipating structure according to claim 5, wherein The reinforcing heat exchange component group has two groups, and the high-temperature area is located between the two groups of the reinforcing heat exchange component group.
7. The heat dissipating structure according to claim 1, wherein A surface of the substrate is a plane; and / or A thickness of the substrate is greater than or equal to 2 mm.
8. The heat dissipating structure according to any one of claims 1 to 7, wherein In the plurality of heat exchange components connected through the first reinforcing structure, at least two of the heat exchange components are further connected through a second reinforcing structure, and the first reinforcing structure and the second reinforcing structure are arranged in a height direction of the heat exchange component.
9. The heat dissipating structure according to claim 8, wherein The first reinforcing structure and the second reinforcing structure are arranged on a side wall of the heat exchange component; The first reinforcing structure and / or the second reinforcing structure are located on a side of the side wall close to the substrate.
10. The heat dissipating structure according to claim 8, wherein The first reinforcing structure and / or the second reinforcing structure are configured as a flat plate structure.
11. The heat dissipating structure according to claim 1, wherein The heat dissipation structure further comprises a top cover connected with the substrate to cover a top of the heat exchange component; The top cover comprises a bending part, and the top cover is connected with the substrate through the bending part; and / or Opposite sides of the top cover and the substrate form openings, one of the two openings forms an inlet for the heat exchange medium to enter the heat dissipation structure, and the other forms an outlet for the heat exchange medium to flow out of the heat dissipation structure.
12. A power module, characterized by The heat dissipation structure according to any one of claims 1-11.
13. A vehicle characterized by comprising: The power module according to claim 12.