Miniaturized camera module structure

By setting pins in the camera module to replace flexible circuit boards and connectors, the miniaturization of the circuit board design is achieved, solving the problems of large module structure and high cost caused by large circuit board size, and realizing the miniaturization and cost reduction of camera modules.

CN223681125UActive Publication Date: 2025-12-16KUNSHAN QIUTI PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202423294457.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-27
Publication Date
2025-12-16
Estimated Expiration
2034-12-27

AI Technical Summary

Technical Problem

The existing camera modules have large circuit board structures, resulting in large module structures and high production costs, and do not conform to the trend of thinner and lighter designs.

Method used

In the camera module, pins are set on the side of the circuit board, and electrical connections with other electronic components are made through the pins. This reduces the structure of flexible circuit boards and connectors, realizes miniaturization design, and adopts square flat leadless package or small outline package.

Benefits of technology

This design enables miniaturization of the camera module, reducing production costs and decreasing the size of the phone.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223681125U_ABST
    Figure CN223681125U_ABST
Patent Text Reader

Abstract

The utility model provides a miniaturized camera module structure. The miniaturized camera module structure comprises a lens, a motor, a chip and a circuit board, the lens is mounted on the motor, the motor is arranged on the upper surface of the circuit board, the chip is arranged on the upper surface of the circuit board and electrically connected with the circuit board, and the chip is accommodated in the motor and corresponds to the lens; according to the camera module, the pins are arranged on the side edges of the circuit board, and the circuit board is electrically connected with other electronic elements such as a power supply through the pins, so that the structure of the circuit board is changed, the arrangement of structures such as a flexible board and a connector is reduced, the structural size is reduced, and the structural size of the camera module is correspondingly controlled; the camera module is designed in a miniaturized manner, the production cost is reduced, and the camera module can be packaged in a square and flat manner without pins or in a small shape, so that the packaging mode of the camera module is changed, the camera module is directly assembled on a mainboard of a mobile phone, and the size and volume of the mobile phone are correspondingly reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to camera module technical field especially is related to a miniaturized camera module structure. BACKGROUND

[0002] As shown in the accompanying drawings Figure 1 The current mobile phone camera module generally comprises: a lens 2, a motor 3, a chip 4 and a circuit board 5; the lens 2 is installed on the motor 3, the motor 3 is arranged at the upper surface of the circuit board 5, the chip 4 is arranged at the upper surface of the circuit board 5 and is electrically connected with the circuit board 5, and the chip 4 is contained in the lower part of the motor 3 and corresponds to the lens 2. Among them, the circuit board 5 in the existing camera module generally extends a soft board 51 from the body, the soft board 51 is provided with a connector 51, and the connector 52 is connected with an external power supply to provide power supply or signal transmission for the circuit board 5.

[0003] But the structure of the circuit board 5 is large in size, which will correspondingly increase the volume of the camera module, and will also correspondingly increase the mold opening, plate design time and material cost of the circuit board 5, thus increasing the production cost; in addition, when the camera module is installed on the mainboard of the mobile phone, the camera module needs to be buckled to the mainboard of the mobile phone through the male and female seats, so that the structure size of the mobile phone is greatly increased, which does not meet the development trend of light and thin.

[0004] Therefore, it is necessary to provide a technical scheme that can reduce the structure size of the camera module. UTILITY MODEL CONTENTS

[0005] The utility model provides a miniaturized camera module structure to solve the problem that the structure size of the camera module is large and the production cost is high due to the large structure size of the circuit board in the existing camera module.

[0006] The technical scheme adopted by the utility model is as follows: a miniaturized camera module structure comprises: a lens, a motor, a chip and a circuit board; the lens is installed on the motor, the motor is arranged at the upper surface of the circuit board, the chip is arranged at the upper surface of the circuit board and is electrically connected with the circuit board, and the chip is contained in the interior of the motor and corresponds to the lens; the side edge of the circuit board is provided with a pin, and the circuit board is electrically connected with other electronic elements through the pin.

[0007] In an embodiment, the pin is in a strip structure and is arranged at a side wall of the circuit board and located at the lower part of the side wall, and the surface of the pin away from the circuit board is parallel to the side wall of the circuit board; the pin is exposed at the lower part of the camera module after the camera module is assembled, so as to facilitate the connection with other electronic elements.

[0008] In an embodiment, the pins are in strip structure and are arranged at the lower part of the side wall of the camera module in equal intervals; the pins are arc-shaped away from the surface of the circuit board, so as to facilitate reliable connection with other electronic components.

[0009] In an embodiment, the pins are arranged at the lower part of the side wall of the camera module in equal intervals and extend from the side wall of the camera module to the surface of the bottom wall.

[0010] In an embodiment, the motor is provided with a through hole penetrating the upper and lower end faces thereof, and the lens is mounted in the through hole and located at the upper part of the through hole.

[0011] In an embodiment, the through hole is provided with a filter, which is located below the lens and above the chip.

[0012] In an embodiment, the through hole is provided with an internal thread, and the side wall of the lens is provided with an external thread, the internal thread and the external thread being matched to mount the lens in the through hole.

[0013] In an embodiment, the upper surface of the lens is provided with a protective film.

[0014] In an embodiment, the protective film is an AR film.

[0015] In an embodiment, the chip and the circuit board are electrically connected by a gold wire, one end of the gold wire being connected to the upper surface of the chip and the other end being connected to the upper surface of the circuit board.

[0016] In an embodiment, a glue layer is arranged between the motor and the circuit board, and the glue layer is used to fix the motor and the circuit board.

[0017] The utility model has the advantages of:

[0018] The camera module packaging structure of this application includes: a lens, a motor, a chip, and a circuit board; the lens is mounted on the motor, the motor is located on the upper surface of the circuit board, the chip is located on the upper surface of the circuit board and electrically connected to the circuit board, the chip is housed inside the motor and corresponds to the lens; pins are provided on the side of the circuit board, and the circuit board is electrically connected to other electronic components through the pins; in this application, pins are provided on the side of the circuit board, and the circuit board is electrically connected to other electronic components such as power supply through the pins, thereby changing the structure of the circuit board, reducing the structure of flexible circuit boards and connectors, thereby reducing its structural size, and thus controlling the structural volume of the camera module accordingly, enabling the camera module to achieve miniaturization design, reducing production costs, and enabling the camera module to achieve square flat leadless packaging or small outline packaging, thereby changing the packaging method of the camera module, directly assembling it onto the mobile phone motherboard, and correspondingly reducing the size of the mobile phone. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the following detailed description to explain the present invention, but should not be construed as limiting the present invention. In the drawings:

[0020] Figure 1 This is a schematic diagram showing the disassembly of a mobile phone camera module in the prior art;

[0021] Figure 2 This is a split view of the camera module packaging structure according to an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the circuit board and chip according to an embodiment of the present invention.

[0023] Figure labeling: 1. Protective film; 2. Lens; 201. External thread; 3. Motor; 301. Through hole; 4. Chip; 5. Circuit board; 51. Flexible board; 52. Connector; 501. Pin. Detailed Implementation

[0024] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0025] Please see Figures 2-3The embodiment provides a small camera module structure, which comprises a lens 2, a motor 3, a chip 4 and a circuit board 5; the lens 2 is installed on the motor 3, the motor 3 is arranged on the upper surface of the circuit board 5, the chip 4 is arranged on the upper surface of the circuit board 5 and is electrically connected with the circuit board 5, and the chip 4 is arranged in the interior of the motor 3 and corresponds to the lens 2; the circuit board 5 is provided with pins 501 on the side edges, and the circuit board 5 is electrically connected with other electronic elements through the pins 501; in the application, the pins 501 are arranged on the side edges of the circuit board 5, the circuit board 5 is electrically connected with a power supply and other electronic elements through the pins 501, the structure of the circuit board 5 is changed, the structures such as the soft board 51 and the connector 52 are reduced, the structural size is reduced, the structural size of the camera module is controlled correspondingly, the camera module is designed to be small, the production cost is reduced, and the camera module can be packaged in a square flat pinless 501 or a small outline package, the packaging mode of the camera module is changed, the camera module is directly assembled on a mobile phone mainboard, and the size of the mobile phone is reduced correspondingly.

[0026] In the application, the circuit board 5 is generally square, meanwhile, the pins 501 are arranged on one side wall of the circuit board 5 and are located at the lower part of the side wall, of course, the pins 501 can also be arranged on multiple side walls, and the specific arrangement can be determined according to actual conditions; the pin 501 is in a strip structure, meanwhile, the surface of the pin 501 away from the circuit board 5 is parallel to the side wall of the circuit board 5, and after the assembly of the components of the camera module is completed, the pin 501 is exposed at the lower part of the camera module, so that the pin 501 is convenient to connect with other electronic elements.

[0027] In another embodiment, the pin 501 is in a strip structure and is arranged at the lower part of the side wall of the camera module at equal intervals; the surface of the pin away from the circuit board is in an arc shape / convex shape (not shown in the figure), so that the pin is convenient to reliably connect with other electronic elements; when the surface of the pin is in an arc shape / convex shape, the pin can be tightly abutted with other electronic elements as a modular element, and the reliability of the connection is ensured. In order to make the surface of the pin in an arc shape / convex shape, a conductive metal layer in an arc shape / convex shape can be plated on the surface of the pin. Alternatively, a plurality of point-shaped metal bumps can be added on the surface of the pin which is parallel to the side wall of the circuit board, so that the camera module can be tightly connected with other electronic elements as a modular element, and the reliability of the communication is ensured.

[0028] In another embodiment, the pins are arranged at equal intervals at the lower part of the side wall of the camera module, and one end of the pin is arranged at the side wall of the camera module, and the other end extends from the side wall of the camera module to the surface of the bottom wall and continues to extend in a direction perpendicular to the side wall, so that the pin is arranged in the "L" shape (not shown in the figure) at the side wall and the bottom wall of the circuit board; when assembled with other electronic components, the mounting groove of the other electronic components is also provided with a "L" shaped metal conductive surface corresponding to the pin; when the mounting groove is slightly larger, the part of the pin located on the side wall of the circuit board cannot be well connected with the metal conductive surface on the inner side wall of the mounting groove, at this time, the part of the pin located on the bottom wall of the circuit board can be connected with the metal conductive surface on the bottom wall of the mounting groove, so that the "L" shaped pin arrangement can double guarantee the reliability of the connection. As a preferred, the width of the pin on the camera module can be slightly larger than the width of the metal conductive surface on the mounting groove.

[0029] In another embodiment, the camera module can be set as a fixed focus camera, at this time, the motor 3 structure is replaced by a support, and the lens 2 and other components are installed through the support.

[0030] Further, please refer to Figures 2-3 , the motor 3 is provided with a through hole 301 penetrating the upper and lower end faces thereof, the lens 2 is installed in the through hole 301 and located at the upper part of the through hole 301, and a filter (not shown in the figure) is arranged in the through hole 301 and located below the lens 2 and above the chip 4. When the camera module performs the photographing work, the lens 2 converges and transmits the light of the observed target to the filter, the light is filtered at the filter, and then the light is projected to the chip 4 after passing through the filter, and the imaging of the light source is calculated at the chip 4, so as to complete the photographing work. The motor 3 is used to drive the lens 2 to move to perform the focusing work. The circuit board 5 is used to connect with the external power supply or other electronic components, so as to provide power supply for each component in the camera module or perform signal transmission.

[0031] Further, please refer to Figures 2-3 , the through hole 301 is provided with an internal thread (not shown in the figure), and the side wall of the lens 2 is provided with an external thread 201, the internal thread cooperates with the external thread 201, so as to install the lens 2 into the through hole 301.

[0032] Further, please refer to Figures 2-3 , the upper surface of the lens 2 is provided with a protective film 1, and specifically, the protective film 1 is an AR film (anti-reflective film); wherein the protective film 1 can reduce or eliminate the reflected light at the surface of the lens 2, so as to improve the imaging quality of the camera module, and the protective film 1 can prevent the surface of the lens 2 from being damaged by scratches and affect the light intake effect of the lens 2.

[0033] Further, the chip 4 and the circuit board 5 are electrically connected through gold wires (not shown in the figure), one end of the gold wires is connected with the upper surface of the chip 4, and the other end is connected with the upper surface of the circuit board 5.

[0034] Further, the motor 3 and the circuit board are provided with a glue layer (not shown in the figure), and the glue layer is used for connecting and fixing the motor 3 and the circuit board 5.

[0035] Further, a support plate (not shown in the figure) is further included, specifically, the support plate is a steel sheet and is arranged at the bottom surface of the circuit board 5, the circuit board 5 is supported by the support plate, the structural strength of the circuit board 5 is improved, and the circuit board 5 is stably assembled in the camera module.

[0036] Compared with the prior art, the camera module packaging structure of the application includes a lens 2, a motor 3, a chip 4 and a circuit board 5; the lens 2 is installed on the motor 3, the motor 3 is arranged at the upper surface of the circuit board 5, the chip 4 is arranged at the upper surface of the circuit board 5 and is electrically connected with the circuit board 5, the chip 4 is arranged in the interior of the lens 2 and corresponds to the lens 2; the circuit board 5 is provided with pins 501 at the side edges, and the circuit board 5 is electrically connected with other electronic elements through the pins 501; in the application, the pins 501 are arranged at the side edges of the circuit board 5, the circuit board 5 is electrically connected with a power supply and other electronic elements through the pins 501, the structure of the circuit board 5 is changed, the structures such as the soft board 51 and the connector 52 are reduced, the structural size is reduced, the structural size of the camera module is controlled, the camera module is designed to be small, the production cost is reduced, the camera module can be packaged in a square flat pinless 501 or a small outline, the packaging mode of the camera module is changed, the camera module is directly assembled on a mobile phone mainboard, and the size of the mobile phone is reduced.

[0037] As long as the various different embodiments of the application are not combined in violation of the idea of the application, they should be regarded as the disclosed content of the application; within the technical concept of the application, various simple modifications of the technical scheme and arbitrary combinations of different embodiments that do not violate the idea of the application should be regarded as being within the protection scope of the application.

Claims

1. A miniaturized camera module structure, characterized in that, The utility model relates to a camera module, which comprises: a lens, a motor, a chip and a circuit board; the lens is mounted on the motor, the motor is arranged at the upper surface of the circuit board, the chip is arranged at the upper surface of the circuit board and electrically connected with the circuit board, the chip is contained in the interior of the motor and corresponds to the lens; the side of the circuit board is provided with a pin, and the circuit board is electrically connected with other electronic elements through the pin.

2. The compact camera module structure of claim 1, wherein: The pin is in a strip structure and arranged at the lower part of the side wall of the circuit board, and the surface of the pin away from the circuit board is parallel to the side wall of the circuit board; the pin is exposed at the lower part of the camera module after the assembly of the camera module, so as to facilitate the connection with other electronic elements.

3. The compact camera module structure of claim 1, wherein: The pin is in a strip structure and arranged at the lower part of the side wall of the camera module at equal intervals; the surface of the pin away from the circuit board is arc-shaped, so as to facilitate the reliable connection with other electronic elements. ​ 4. The compact camera module structure of claim 1, wherein: The pin is arranged at the lower part of the side wall of the camera module at equal intervals and extends from the side wall of the camera module to the surface of the bottom wall.

5. The compact camera module structure of claim 1, wherein: The motor is provided with a through hole penetrating through the upper and lower end faces thereof, and the lens is mounted in the through hole and located at the upper part of the through hole.

6. The compact camera module structure of claim 5, wherein: An optical filter is arranged in the through hole, and the optical filter is located below the lens and above the chip.

7. The compact camera module structure of claim 5, wherein: An internal thread is arranged in the through hole, an external thread is arranged at the side wall of the lens, and the internal thread cooperates with the external thread to mount the lens in the through hole.

8. The compact camera module structure of claim 1, wherein: An upper surface of the lens is provided with a protective film.

9. The compact camera module structure of claim 8, wherein: The protective film is an AR film.

10. The compact camera module structure of claim 1, wherein: The chip and the circuit board are electrically connected through a gold wire, one end of the gold wire is connected to the upper surface of the chip, and the other end is connected to the upper surface of the circuit board.