Hot welding crimping device

By introducing a pressure sensor and adjustment device into the hot welding press device, the distance and pressure between the hot welding head and the circuit board are dynamically adjusted, solving the overpressure problem caused by thermal expansion and ensuring welding quality and circuit board integrity.

CN223681289UActive Publication Date: 2025-12-16PROGRESS Y&Y
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Patent Information

Application Number
CN202423174235.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-12-16
Estimated Expiration
2034-12-23

AI Technical Summary

Technical Problem

When using a hot-press welding device, the hot-press welding head may come close to the circuit board due to thermal expansion, resulting in excessive pressure on the circuit board, which may damage the circuit board's pins and affect the welding quality.

Method used

A pressure sensor and adjustment device are used to sense the pressure change between the hot-press welding head and the circuit board, and adjust the distance and pressure between the welding head and the circuit board to avoid overpressure caused by thermal expansion. Dynamic adjustment is achieved by using a voice coil motor and slide rail structure.

Benefits of technology

It effectively avoids damage to the circuit board caused by thermal expansion of the hot-press welding head, ensures welding quality, and improves the welding yield of the circuit board.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a hot welding crimping device, which is used for hot-pressing a circuit board to be welded and is provided with a hot-pressing welding head device, a pressure sensor and an adjusting device. The thermocompression welding head device is provided with a thermocompression welding head and a temperature feedback line. The thermocompression welding head can be attached to a circuit board to be welded, and the temperature feedback line is used for measuring the temperature of the thermocompression welding head. The pressure sensor is arranged on the thermocompression welding head device and can sense the contact pressure of the thermocompression welding head device and the circuit board to be welded. The adjusting device is connected to the pressure sensor and can adjust the distance and the pressure between the thermocompression welding head device and the circuit board to be welded according to the pressure sensed by the pressure sensor. The pressure sensor and the adjusting device are additionally arranged, so that the distance between the hot-pressure welding head and the circuit board to be welded can be adjusted according to the pressure change between the hot-pressure welding head and the circuit board to be welded.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a hot welding crimping device. BACKGROUND

[0002] With the development of electronic industry, in order to make electronic products lighter and smaller, flexible print circuit (FPC) and printed circuit board (PCB) are used as circuit connection in large quantities. When connecting circuits, in order to avoid the problem of inaccurate position caused by traditional manual bonding, a hot welding crimping device is used for automatic welding to ensure automation and product yield.

[0003] In the process of welding using the hot welding crimping device, the hot pressure welding head is placed on the circuit board to be welded, and the pins of the circuit board to be welded are heated to a molten state by continuous heating, and all the pins are welded. However, when heating the hot pressure welding head and the circuit board to be welded, the hot pressure welding head will expand due to heat and move closer to the circuit board to be welded, and the circuit board to be welded will be subjected to greater pressure, which may damage the pins of the circuit board to be welded, thereby affecting the welding of the circuit board.

[0004] Therefore, a better improvement scheme is proposed to solve the above-mentioned problems. CONTENT OF THE UTILITY MODEL

[0005] The main purpose of the utility model is to provide a hot welding crimping device, which is used to solve the problem that when heating the hot pressure welding head and the circuit board to be welded, the hot pressure welding head will expand due to heat and move closer to the circuit board to be welded, and the circuit board to be welded will be subjected to greater pressure, thereby affecting the welding of the circuit board.

[0006] To achieve the above-mentioned purpose, the hot welding crimping device provided by the utility model is used to hot-press a circuit board to be welded, and has the following features:

[0007] A hot pressure welding head device can be attached to the circuit board to be welded, and has the following features:

[0008] A hot pressure welding head can be attached to the circuit board to be welded;

[0009] A temperature feedback line is connected to the contact surface of the hot pressure welding head and the circuit board to be welded, and is used to measure the temperature of the hot pressure welding head;

[0010] A pressure sensor is arranged on the hot pressure welding head device and can sense the pressure of the contact between the hot pressure welding head device and the circuit board to be welded;

[0011] An adjusting device connected to the pressure sensor and capable of adjusting the distance and pressure between the hot bar device and the circuit board to be welded according to the pressure sensed by the pressure sensor.

[0012] The hot bar device as claimed in the preceding description, wherein the adjusting device has:

[0013] a base;

[0014] a voice coil motor disposed on the base and having:

[0015] a stator fixed on the base;

[0016] a moving element movably disposed in the stator and connected to the hot bar device; the moving element is capable of moving up and down in the stator, and the pressure sensor and the hot bar device are capable of moving with the moving element.

[0017] The hot bar device as claimed in the preceding description, wherein the adjusting device has:

[0018] a slide rail disposed on the base and extending toward the voice coil motor, and the slide rail has a rail direction parallel to the moving direction of the moving element;

[0019] a sliding element connected to the moving element and disposed in the slide rail and capable of sliding along the slide rail.

[0020] The hot bar device as claimed in the preceding description, further comprising a flatness adjusting device, and the adjusting device is disposed on the pressure sensor through the flatness adjusting device.

[0021] The hot bar device as claimed in the preceding description, wherein the flatness adjusting device has:

[0022] two fixing elements respectively connected to the adjusting device and the pressure sensor;

[0023] a plurality of elastic elements, each of the elastic elements has two ends respectively connected to the two fixing elements and is equally spaced from the two fixing elements.

[0024] The hot bar device as claimed in the preceding description, further comprising:

[0025] a height control device movably connected to the adjusting device and capable of controlling the distance between the hot bar device and the circuit board to be welded.

[0026] The hot bar device as claimed in the preceding description, wherein the hot bar device has:

[0027] a fixed frame connected to the pressure sensor;

[0028] a heat dissipation mechanism disposed between the fixed frame and the hot bar;

[0029] At least one cooling nozzle connected to the fixed frame and capable of spraying a cooling fluid toward the hot bar.

[0030] The utility model discloses the advantage lies in through increasing pressure sensor and adjusting device, the distance and pressure between hot bar and the circuit board to be welded can be adjusted according to the pressure change between both, thereby when heating hot bar and carrying out circuit board welding, hot bar will pressurize the circuit board to be welded due to thermal expansion, at this time, the utility model can slightly move away hot bar from the circuit board to be welded and reduce pressure through adjusting device, so that hot bar does not destroy the pin of the circuit board to be welded, and the welding of the circuit board is influenced. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is the perspective drawing of the utility model;

[0032] Figure 2 It is the perspective drawing of the utility model not setting up a height control device;

[0033] Figure 3 It is the exploded view of the utility model;

[0034] Figure 4 It is the partial section view of the utility model;

[0035] Figure 5 It is the perspective drawing of the adjusting device of the utility model;

[0036] Figure 6 It is the side view of the hot bar device of the utility model.

[0037] REFERENCE NUMERALS

[0038] 10: hot bar device

[0039] 11: fixed frame

[0040] 12: hot bar

[0041] 13: heat dissipation mechanism

[0042] 14: temperature feedback line

[0043] 15: cooling nozzle

[0044] 20: pressure sensor

[0045] 30: adjusting device

[0046] 31: base

[0047] 32: voice coil motor

[0048] 321: stator

[0049] 322: mover

[0050] 33: slide rail

[0051] 34: slider

[0052] 40: flatness adjustment device

[0053] 41: fixing member

[0054] 42: elastic member

[0055] 43: positioning bead

[0056] 50: height control device DETAILED DESCRIPTION

[0057] Please refer to Figure 1 The utility model provides a hot welding pressure bonding device, it is used for hot pressing a circuit board to be welded, and has a hot pressure bonding head device 10, a pressure sensor 20 and an adjusting device 30, and can selectively have a flatness adjustment device 40 and a height control device 50.

[0058] Please refer to Figure 1 、 Figure 2 And Figure 6 The hot pressure bonding head device 10 can be attached to the circuit board to be welded, and has a fixing frame 11, a hot pressure bonding head 12, a heat dissipation mechanism 13, a temperature feedback line 14 and at least one cooling nozzle 15. The hot pressure bonding head 12 can be attached to the circuit board to be welded, and the heat dissipation mechanism 13 is arranged between the fixing frame 11 and the hot pressure bonding head 12. One end of the temperature feedback line 14 is connected to the attached surface of the hot pressure bonding head 12 and the circuit board to be welded, and is used to measure the temperature of the hot pressure bonding head 12. The cooling nozzle 15 is connected to the fixing frame 11, and can spray a cooling fluid towards the hot pressure bonding head 12, thereby reducing the temperature of the hot pressure bonding head 12 and the circuit board to be welded.

[0059] The pressure sensor 20 is arranged on the fixing frame 11 of the hot pressure bonding head device 10, and can sense the pressure of the hot pressure bonding head device 10 and the circuit board to be welded. Specifically, when the hot pressure bonding head 12 contacts the circuit board to be welded, the pressure is transmitted to the pressure sensor 20, so that the pressure sensor 20 can sense the pressure of the hot pressure bonding head 12 and the circuit board to be welded.

[0060] Please refer to Figures 3 to 5 The adjusting device 30 is connected to the pressure sensor 20, and can adjust the distance and pressure of the hot pressure bonding head device 10 and the circuit board to be welded according to the pressure sensed by the pressure sensor 20. The adjusting device 30 has a base 31, a voice coil motor 32, a slide rail 33 and a slider 34.

[0061] Please refer to Figure 4 andFigure 5 In this embodiment, the voice coil motor 32 is disposed on the base 31 and has a stator 321 and a mover 322. The stator 321 is fixed on the base 31. The mover 322 is movably disposed in the stator 321 and is connected to the hot bar apparatus 10. The mover 322 can move up and down in the stator 321, and the pressure sensor 20 and the hot bar apparatus 10 can move with the mover 322.

[0062] The slide rail 33 is disposed on the base 31 and extends toward the voice coil motor 32. The direction of the track of the slide rail 33 is parallel to the moving direction of the mover 322. The slider 34 is connected to the mover 322 and is disposed in the slide rail 33 and can slide along the slide rail 33. Thus, the mover 322 can slide along the direction of the track of the slide rail 33, and the pressure sensor 20 and the hot bar apparatus 10 can also slide along the direction of the track of the slide rail 33 without deviation. In other embodiments, the slide rail 33 and the slider 34 can be omitted.

[0063] Please refer to Figure 3 and Figure 4 The adjustment device 30 is disposed on the pressure sensor 20 through the flatness adjustment device 40, and the flatness adjustment device 40 can also move with the mover 322. In this embodiment, the flatness adjustment device 40 has two fixing members 41, a plurality of elastic members 42, a plurality of adjustment bolts (not shown in the figure), and a positioning bead 43. The fixing members 41 are respectively connected to the adjustment device 30 and the pressure sensor 20, the two ends of each elastic member 42 are respectively connected to the two fixing members 41, and the elastic members 42 are connected to the two fixing members 41 at equal intervals. Each adjustment bolt (not shown in the figure) is disposed in one of the elastic members 42 and can adjust the length of the elastic member 42. Thus, by adjusting the length of the elastic members 42, the user can adjust the flatness of the pressure sensor 20 and the hot bar apparatus 10 connected to the pressure sensor 20. Preferably, each elastic member 42 is connected to the periphery of the fixing member 41, so that each elastic member 42 has a longer length. The positioning bead 43 is disposed between the two fixing members 41 and is located on the central axis of the two fixing members 41. When the user adjusts the length of the elastic members 42, the two fixing members 41 can maintain a fixed interval, so that one of the fixing members 41 is inclined relative to the other fixing member 41. In other embodiments, the flatness adjustment device 40 can also not have the positioning bead 43.

[0064] The height control device 50 is movably connected to the adjustment device 30 and can control the distance between the hot bar apparatus 10 and the circuit board to be welded. The maximum distance that the adjustment device 30 can move on the height control device 50 is longer than the maximum distance that the hot bar apparatus 10 can move on the adjustment device 30.

[0065] In use of the utility model, the user can first use the height control device 50, set the hot press welding head device 10 at the place close to the circuit board to be welded, and use the adjusting device 30 to make the hot press welding head device 10 adhere to the circuit board to be welded. Then, the hot press welding head 12 of the hot press welding head device 10 is heated for welding, the hot press welding head 12 will expand due to temperature change and generate pressure with the circuit board to be welded, at this time, the pressure will be transmitted to the pressure sensor 20 through the hot press welding head device 10, and the adjusting device 30 can adjust the pressure and distance between the hot press welding head device 10 and the circuit board to be welded according to the pressure sensed by the pressure sensor 20.

[0066] The utility model discloses the advantage lies in that the distance and pressure between the hot press welding head 12 and the circuit board to be welded can be adjusted according to the pressure change between them by increasing the pressure sensor 20 and the adjusting device 30, so that when the hot press welding head 12 is heated for circuit board welding, the hot press welding head 12 will press the circuit board to be welded due to thermal expansion, at this time, the utility model can slightly move the hot press welding head 12 away from the circuit board to reduce the pressure by the adjusting device 30, so that the hot press welding head 12 will not damage the pins of the circuit board to be welded, and the circuit board welding is not affected.

[0067] The above is only the preferred embodiment of the utility model, and does not limit the utility model in any form, although the utility model has been disclosed as above, however, it is not used to limit the utility model, any skilled person in the art can make some changes or modifications to the equivalent embodiments with the disclosed technical content without departing from the scope of the utility model technical scheme, as long as it does not depart from the content of the utility model technical scheme, any simple modification, equivalent change and modification of the above embodiment according to the technical essence of the utility model, all still belong to the scope of the utility model technical scheme.

Claims

1. A hot wedge press bonding apparatus characterized by, A hot-pressing device for hot-pressing a circuit board to be soldered, comprising: a hot-pressing head assembly capable of abutting against the circuit board to be soldered, comprising: a hot-pressing head capable of abutting against the circuit board to be soldered; a temperature feedback wire having one end connected to the abutting surface of the hot-pressing head and the circuit board to be soldered, and used for measuring the temperature of the hot-pressing head; a pressure sensor disposed on the hot-pressing head assembly and capable of sensing the pressure of the hot-pressing head assembly contacting the circuit board to be soldered; an adjusting device connected to the pressure sensor and capable of adjusting the distance and pressure between the hot-pressing head assembly and the circuit board to be soldered according to the pressure sensed by the pressure sensor.

2. The hot wedge apparatus of claim 1, wherein, The adjusting device comprises: a base; a voice coil motor disposed on the base and comprising: a stator fixed on the base; a moving element movably disposed in the stator and connected to the hot-pressing head assembly; the moving element is capable of moving up and down in the stator, and the pressure sensor and the hot-pressing head assembly are capable of moving with the moving element.

3. The hot wedge apparatus of claim 2, wherein The adjusting device comprises: a slide rail disposed on the base and extending towards the voice coil motor, and the track direction of the slide rail is parallel to the moving direction of the moving element; a sliding element connected to the moving element and disposed in the slide rail and capable of sliding along the slide rail.

4. The hot wedge apparatus of any one of claims 1 to 3, wherein, There is also a flatness adjusting device, and the adjusting device is disposed on the pressure sensor through the flatness adjusting device.

5. The hot wedge apparatus of claim 4, wherein, The flatness adjusting device comprises: two fixing elements respectively connected to the adjusting device and the pressure sensor; a plurality of elastic elements, and two ends of each elastic element are respectively connected to the two fixing elements and are equally spaced from the two fixing elements.

6. The hot wedge apparatus of any one of claims 1 to 3, wherein, There is also: a height control device movably connected to the adjusting device, which is capable of controlling the distance between the hot-pressing head assembly and the circuit board to be soldered.

7. The hot wedge apparatus of any one of claims 1 to 3, wherein, The hot-pressing head assembly comprises: a fixing frame connected to the pressure sensor; a heat dissipation mechanism disposed between the fixing frame and the hot-pressing head; at least one cooling nozzle connected to the fixing frame and capable of spraying a cooling fluid towards the hot-pressing head.