Electronic equipment

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of heat dissipation of the electronic equipment. The electronic equipment comprises a heating assembly and a heat dissipation assembly. The heating assembly comprises a first heating part and a second heating part, the heat dissipation assembly comprises a heat dissipation part and a heat conduction part, the heat dissipation part is provided with a first air outlet and a second air outlet, one part of the heat conduction part is connected with the second heating part, and the other part of the heat conduction part is arranged on a flowing path of second airflow flowing out of the second air outlet. The first heating piece is arranged on a flowing path of the first airflow flowing out of the first air outlet. According to the electronic equipment, the cost of the heat dissipation assembly of the electronic equipment can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device heat dissipation, and in particular to an electronic device. BACKGROUND

[0002] Electronic devices, such as notebook computers, tablet computers, etc., will generate heat during normal use, and the heat generation problem of heat generation components is more obvious for electronic devices with relatively high power. If the temperature of the heat generation component is too high, it will cause power supply instability, overheating of the electronic device, and the electronic device will be dead or stuck, and then the heat dissipation component needs to dissipate heat from the heat generation component to maintain normal use of the electronic device.

[0003] In the related art, the cost of the heat dissipation component is high. CONTENT OF THE UTILITY MODEL

[0004] The present application aims to at least solve one of the technical problems in the prior art. To this end, the present application provides an electronic device to reduce the cost of the heat dissipation component of the electronic device.

[0005] The electronic device according to the first aspect of the present application comprises:

[0006] The heat generation component comprises a first heat generation component and a second heat generation component;

[0007] The heat dissipation component comprises a heat dissipation component and a heat conduction component, the heat dissipation component has a first air outlet and a second air outlet, a part of the heat conduction component is connected with the second heat generation component, another part of the heat conduction component is arranged on the flow path of the second air flow flowing out of the second air outlet, and the first heat generation component is arranged on the flow path of the first air flow flowing out of the first air outlet.

[0008] The electronic device according to the embodiments of the present application has at least the following beneficial effects:

[0009] The heat dissipation component has the first air outlet in addition to the second air outlet for dissipating heat from the second heat generation component. The first air flow flowing out of the first air outlet can dissipate heat from the first heat generation component, so that the first heat generation component does not need to be provided with a heat conduction component capable of conducting heat, which is conducive to reducing the number of heat conduction components in the heat dissipation component, and in turn is conducive to reducing the production cost of the electronic device. Furthermore, the first air flow has a certain diffusion capacity, so that the flow range of the first air flow is relatively wide, and in turn the installation position of the first heat generation component has more choices, i.e., the heat dissipation component of the present application can better adapt to the first heat generation component with different installation positions, which is conducive to improving the compatibility and universality of the heat dissipation component.

[0010] According to some embodiments of the present application, the first heat generation component and the second heat generation component are arranged at intervals along the flow direction of the first air flow, and the first heat generation component is located between the first air outlet and the second heat generation component.

[0011] According to some embodiments of the present application, the electronic device comprises a housing, the heat generating component and the heat dissipating component are arranged in the housing, the housing has a bottom surface, and the bottom surface has a first heat dissipation opening.

[0012] According to some embodiments of the present application, the first heat dissipation opening is located on a side of the first heat generating component away from the first air outlet along the flow direction of the first air flow.

[0013] According to some embodiments of the present application, the projection area of the first heat generating component on the bottom surface and the projection area of the second heat generating component on the bottom surface are both located outside the projection area of the first heat dissipation opening on the bottom surface.

[0014] According to some embodiments of the present application, the housing has a second heat dissipation opening on a side wall thereof relative to the flow direction of the second air flow, and the heat conducting component abuts against the second air outlet at one end thereof along the flow direction of the second air flow and abuts against the second heat dissipation opening at the other end thereof.

[0015] According to some embodiments of the present application, the housing has a third heat dissipation opening, and the third heat dissipation opening is used for heat dissipation of the first heat generating component.

[0016] According to some embodiments of the present application, the third heat dissipation opening is arranged on a side wall of the housing relative to the flow direction of the second air flow.

[0017] According to some embodiments of the present application, the electronic device comprises a temperature sensing component and a control component, the temperature sensing component is used for monitoring the temperature of the heat generating component, and the control component is used for controlling the start and stop of the heat dissipating component.

[0018] According to some embodiments of the present application, the heat conducting component comprises a heat conducting body and a heat dissipating fin, one part of the heat conducting body is connected with the second heat generating component, the other part of the heat conducting body is connected with the heat dissipating fin, and the heat dissipating fin is arranged on a flow path of the second air flow.

[0019] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0020] The present application will be further described below in conjunction with the accompanying drawings and embodiments, in which:

[0021] Figure 1 It is an assembly diagram of the heat dissipating component and the heat generating component in an embodiment of the present application.

[0022] Figure 2 It is a structural diagram of the housing in an embodiment of the present application.

[0023] Reference signs:

[0024] 100, electronic device; 1, heat generating component; 11, first heat generating member; 12, second heat generating member; 2, heat dissipating component; 21, heat dissipating member; 211, first air outlet; 212, second air outlet; 22, heat conducting member; 221, heat conducting body; 222, heat dissipating fin; 3, shell; 31, bottom surface; 311, first heat dissipating opening; 312, air inlet; 32, second heat dissipating opening; 33, third heat dissipating opening; 4, Mylar film. DETAILED DESCRIPTION

[0025] Embodiments of the present application are described below in detail with reference to the accompanying drawings, wherein the same or similar components are denoted by the same or similar reference numerals throughout the drawings. The embodiments described below by reference to the drawings are exemplary and are for the purpose of explaining the present application only, and are not to be understood as limiting the present application.

[0026] In the description of the present application, it is to be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and is not to indicate or imply that the device or component referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0027] In the description of the present application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than, etc. are understood as not including the number, above, below, within, etc. are understood as including the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the sequence of technical features indicated.

[0028] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0029] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0030] In the related art, the heat dissipation assembly of the electronic device can well control the temperature of the heat generating elements such as the central processor and the graphic processor, but for the heat generating elements such as the MOSFET, the inductor and the IC chip, the heat is usually conducted to the heat dissipation assembly by the copper sheet and the heat conduction strip to reduce the temperature of the electronic device. The cost of the copper sheet and the heat conduction strip is high, which makes the cost of the electronic device high.

[0031] Therefore, the electronic device 100 provided by the embodiments of the present application has the first air outlet 211, the first heat generating element 11 is arranged on the flow path of the first airflow flowing out of the first air outlet 211 to control the temperature of the first heat generating element 11, thereby reducing the number of heat conduction elements in the heat dissipation assembly 2, and then reducing the production cost of the electronic device 100.

[0032] Figure 1 The general structure of the heat generating assembly 1 and the heat dissipation assembly 2 is shown. Specifically, the electronic device 100 includes the heat generating assembly 1 and the heat dissipation assembly 2, and the electronic device 100 can be a notebook computer, a tablet computer, etc. The heat generating assembly 1 refers to the components that can generate heat during normal use of the electronic device 100, and the heat generating assembly 1 includes the first heat generating element 11 and the second heat generating element 12. The first heat generating element 11 can include the central processor and the graphic processor, and the second heat generating element 12 can include the MOSFET, the inductor and the IC chip. The heat dissipation assembly 2 includes the heat dissipation element 21 and the heat conduction element 22. The heat dissipation element 21 can be a fan to generate airflow to dissipate heat of the heat generating assembly 1, and the heat conduction element 22 can be made of a material with strong heat conduction performance. The heat dissipation element 21 has the first air outlet 211 and the second air outlet 212. The opening direction of the first air outlet 211 and the opening direction of the second air outlet 212 can be arranged in parallel, or can be arranged in cross as shown. Figure 1 As shown in Figure 1 , a part of the heat conduction element 22 is connected with the second heat generating element 12, and another part of the heat conduction element 22 is arranged on the flow path of the second airflow flowing out of the second air outlet 212, so that the heat conduction element 22 can transfer the heat generated by the second heat generating element 12 to the vicinity of the second air outlet 212, and the heat generated by the second heat generating element 12 is then carried to the external environment by the second airflow, so that the heat dissipation element 21 can effectively control the temperature of the second heat generating element 12. The first heat generating element 11 is arranged on the flow path of the first airflow flowing out of the first air outlet 211, so that the heat generated by the first heat generating element 11 is carried to the external environment by the first airflow, so that the heat dissipation element 21 can effectively control the temperature of the first heat generating element 11.

[0033] Exemplarily, Figure 1 andFigure 2 The direction indicated by R1 is the flow direction of the first air flow, and the direction indicated by R2 is the flow direction of the second air flow.

[0034] Exemplarily, the heat dissipation member 21 can be a fan, and the required air pressure and air volume of the fan is the sum of the air pressure and air volume of the first air flow flowing out of the first air outlet 211 and the air pressure and air volume of the second air flow flowing out of the second air outlet 212. Specifically, the air pressure and air volume of the first air flow and the air pressure and air volume of the second air flow can be determined by computer simulation analysis or test, so as to select a more matched fan.

[0035] Exemplarily, the heat dissipation member 21 can be a fan, and the thickness of the fan blade is inversely proportional to the number of the fan blades. Thinner fan blades enable more fan blades to be installed in the fan, so that the fan can generate greater air pressure and air volume at the same speed. For example, the thickness of the fan blade can be 0.1 mm.

[0036] In the embodiment of the present application, the heat dissipation member 21 has the first air outlet 211 in addition to the second air outlet 212 for dissipating heat of the second heat generating member 12. The first air flow flowing out of the first air outlet 211 can dissipate heat of the first heat generating member 11, so that the first heat generating member 11 does not need to be provided with a heat conduction member 22, which is conducive to reducing the number of heat conduction members 22 in the heat dissipation assembly 2, and in turn is conducive to reducing the production cost of the electronic device 100. Furthermore, the first air flow has a certain diffusion capacity, so that the flow range of the first air flow is wider, and in turn the installation position of the first heat generating member 11 has more choices, that is, the heat dissipation member 21 of the present application can better adapt to the first heat generating member 11 with different installation positions, which is conducive to improving the compatibility and universality of the heat dissipation member 21.

[0037] In an embodiment, referring to Figure 1 , the first heat generating member 11 and the second heat generating member 12 are arranged at intervals along the flow direction of the first air flow, and the first heat generating member 11 is located between the first air outlet 211 and the second heat generating member 12, so that after the first air flow flows through the first heat generating member 11, it can still flow through the second heat generating member 12 to carry at least part of the heat generated by the second heat generating member 12, and the remaining heat is transferred to the second air outlet 212 through the heat conduction member 22 and carried to the external environment by the second air flow, so as to improve the heat dissipation efficiency of the heat dissipation member 21 on the second heat generating member 12.

[0038] Exemplarily, referring to Figure 1, the first heating element 11 can be as close to the first air outlet 211 as possible, so that the first air flow can act on the first heating element 11 with greater air pressure and air volume. The first heating element 11 can include a metal-oxide-semiconductor field-effect transistor, an inductor, and an IC chip, which are arranged at a predetermined interval to facilitate the circulation of air among the three.

[0039] It can be understood that the positions of the first heating element 11 and the second heating element 12 are not limited. For example, the position of the first heating element 11 is not limited, and the heat dissipation member 21 is provided with the first air outlet 211 at the closest position relative to the first heating element 11.

[0040] In an embodiment, referring to Figure 1 , the electronic device 100 includes a housing 3, and the heating assembly 1 and the heat dissipation assembly 2 are arranged in the housing 3. For example, the housing 3 can include a mainboard, and the heating assembly 1 and the heat dissipation assembly 2 are arranged on the mainboard. The housing 3 has a bottom surface 31, and the bottom surface 31 has a first heat dissipation opening 311, so that the first air flow carrying the heat generated by the first heating element 11 can be discharged to the outside. In addition, the number of other components of the electronic device 100 arranged on the bottom surface 31 is small, and the first heat dissipation opening 311 is arranged on the bottom surface 31, which can reduce the influence of the first heat dissipation opening 311 on the area of the housing 3, and is beneficial to improve the space utilization of the electronic device 100.

[0041] It can be understood that the specific position of the first heat dissipation opening 311 is not limited. For example, the first heat dissipation opening 311 can also be arranged on the side wall of the housing 3.

[0042] In an embodiment, referring to Figure 1 , the first heat dissipation opening 311 is located on the side of the first heating element 11 away from the first air outlet 211 along the flow direction of the first air flow, so that after the first air flow flows out of the first air outlet 211, it can flow through the first heating element 11 to carry the heat generated by the first heating element 11, and then be discharged to the outside environment through the first heat dissipation opening 311, which is beneficial to reduce the flow path of the first air flow in the housing 3, and then is beneficial to improve the heat dissipation efficiency of the heat dissipation member 21 to the first heating element 11.

[0043] In an embodiment, referring to Figure 1 , the projection area of the first heating element 11 on the bottom surface 31 and the projection area of the second heating element 12 on the bottom surface 31 are both located outside the projection area of the first heat dissipation opening 311 on the bottom surface 31, so that after the first air flow flows through the first heating element 11, it can be discharged to the outside environment through the first heat dissipation opening 311, which is beneficial to reduce the possibility of backflow of the first air flow in the housing 3, and then is beneficial to improve the heat dissipation efficiency of the heat dissipation member 21 to the first heating element 11.

[0044] It can be understood that the projection area of the first heat-generating member 11 on the bottom surface 31 and the projection area of the second heat-generating member 12 on the bottom surface 31 are not limited to being located outside the projection area of the first heat dissipation port 311 on the bottom surface 31. Exemplarily, please refer to Figure 1 , the projection area of the first heat-generating member 11 on the bottom surface 31 and the projection area of the second heat-generating member 12 on the bottom surface 31 can be located inside the projection area of the first heat dissipation port 311 on the bottom surface 31, or partially overlap with the projection area of the first heat dissipation port 311 on the bottom surface 31, and the electronic device 100 further comprises a Mylar film 4, which is arranged in the projection area of the first heat-generating member 11 on the bottom surface 31 and the projection area of the second heat-generating member 12 on the bottom surface 31, respectively, to block the projection area of the first heat dissipation port 311 on the bottom surface 31 and the overlapping part of the projection area of the first heat-generating member 11 on the bottom surface 31 and the projection area of the second heat-generating member 12 on the bottom surface 31, so as to reduce the possibility of backflow of the first air flow in the shell 3.

[0045] In an embodiment, please refer to Figure 1 , the side wall of the shell 3 relative to the flow direction of the second air flow has a second heat dissipation port 32, and the heat-conducting member 22 abuts against the second air outlet 212 at one end along the flow direction of the second air flow and abuts against the second heat dissipation port 32 at the other end, so as to reduce the flow path of the second air flow in the shell 3, so that the second air flow can be discharged to the external environment more quickly, which is beneficial to improve the heat dissipation efficiency of the heat dissipation member 21 on the second heat-generating member 12.

[0046] It can be understood that the one end of the heat-conducting member 22 along the flow direction of the second air flow is not limited to abutting against the second air outlet 212, and there can be a gap between the one end of the heat-conducting member 22 and the second air outlet 212, and the other end is also not limited to abutting against the second heat dissipation port 32, and there can be a gap between the other end and the second heat dissipation port 32.

[0047] In an embodiment, please refer to Figure 1 , the shell 3 has a third heat dissipation port 33 to increase the heat dissipation area of the shell 3, and the third heat dissipation port 33 is used for heat dissipation of the first heat-generating member 11, so as to improve the heat dissipation efficiency of the heat dissipation member 21 on the first heat-generating member 11.

[0048] It can be understood that the shell 3 is not limited to having the third heat dissipation port 33.

[0049] In an embodiment, please refer to Figure 1The third heat dissipation opening 33 is arranged on the side wall of the shell 3 relative to the flow direction of the second air flow. Exemplarily, the third heat dissipation opening 33 and the second heat dissipation opening 32 are arranged on the same side wall of the shell 3, and the third heat dissipation opening 33 and the second heat dissipation opening 32 can be arranged in a spaced manner or in a continuous extending manner along the flow direction of the first air flow, so as to reduce the number of shell walls of the shell 3 in which the heat dissipation openings are arranged, and facilitate improving the aesthetic level of the shell 3.

[0050] In an embodiment, the electronic device 100 comprises a temperature sensing member and a control member, the temperature sensing member is configured to monitor the temperature of the heat generating component 1, and the control member is configured to control the start and stop of the heat dissipation component 2, so that the heat dissipation component 2 is started to dissipate heat of the heat generating component 1 only when the temperature of the heat generating component 1 is high, and the power consumption of the electronic device 100 is reduced.

[0051] Exemplarily, referring to Figure 1 and Figure 2 The bottom surface 31 further comprises an air inlet 312 located at the corresponding position of the heat dissipation member 21. When the temperature of the heat generating component 1 is higher than a preset temperature, the temperature sensing member transmits the temperature data of the heat generating component 1 to the control member, so that the control member starts the heat dissipation component 2. When the heat dissipation component 2 is started, the air with low temperature outside is drawn into the inside of the heat dissipation member 21 through the air inlet 312 on the bottom surface 31 under the suction of the heat dissipation member 21, and flows out from the first air outlet 211 and the second air outlet 212 to form the first air flow and the second air flow, respectively. The first air flow flows through the first heat generating member 11 and then flows out from the first heat dissipation opening 311 and the third heat dissipation opening 33 to control the temperature of the first heat generating member 11. The heat generated by the second heat generating member 12 is transmitted to the second air outlet 212 through the heat conduction member 22, so that the second air flow can carry the heat generated by the second heat generating member 12 to the outside environment to control the temperature of the second heat generating member 12.

[0052] In an embodiment, referring to Figure 1 The heat conduction member 22 comprises a heat conduction body 221 and a heat dissipation fin 222. One part of the heat conduction body 221 is connected with the second heat generating member 12, and the other part of the heat conduction body 221 is connected with the heat dissipation fin 222, so as to transmit the heat generated by the second heat generating member 12 to the heat dissipation fin 222. The heat dissipation fin 222 is arranged on the flow path of the second air flow, and the heat dissipation fin 222 has a plurality of heat dissipation channels, which increases the contact area between the heat conduction member 22 and the second air flow, so that the second air flow can carry more heat generated by the second heat generating member 12 to the outside environment, and the heat dissipation efficiency of the heat dissipation member 21 to the second heat generating member 12 is improved. One end of the heat dissipation fin 222 along the flow direction of the second air flow can abut against the second air outlet 212, and the other end can also abut against the second heat dissipation opening 32.

[0053] It can be understood that the wind pressure and the wind volume of the first air flow are proportional to the size of the first air outlet 211, and the wind pressure and the wind volume of the second air flow are proportional to the size of the second air outlet 212 and the aperture of the heat dissipation channel of the heat dissipation fin 222. Specifically, the size of the first air outlet 211 and the size of the second air outlet 212 can be determined by computer simulation analysis or test, so as to select appropriate size of the first air outlet 211 and the second air outlet 212.

[0054] The embodiments of the present application are described in detail above in combination with the drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. An electronic device, comprising: include: The heating element includes a first heating element and a second heating element; A heat dissipation assembly includes a heat sink and a heat conductor. The heat sink has a first air outlet and a second air outlet. A portion of the heat conductor is connected to a second heat-generating element, and another portion of the heat conductor is disposed on the flow path of a second airflow exiting from the second air outlet. The first heat-generating element is disposed on the flow path of a first airflow exiting from the first air outlet.

2. The electronic device of claim 1, wherein, The first heating element and the second heating element are arranged at intervals along the direction of the first airflow, with the first heating element located between the first air outlet and the second heating element.

3. The electronic device of claim 1, wherein, The electronic device includes a housing, and the heat-generating component and the heat-dissipating component are both disposed inside the housing. The housing has a bottom surface, and the bottom surface has a first heat dissipation vent.

4. The electronic device of claim 3, wherein, The first heat dissipation vent is located on the side of the first heat-generating element away from the first air outlet, along the direction of the first airflow.

5. The electronic device of claim 3, wherein, The projection areas of the first heating element and the second heating element on the bottom surface are both located outside the projection area of ​​the first heat dissipation vent on the bottom surface.

6. The electronic device of claim 3, wherein, The outer casing has a second heat dissipation vent on its side wall relative to the direction of the second airflow. One end of the heat-conducting element along the direction of the second airflow abuts against the second air outlet, and the other end abuts against the second heat dissipation vent.

7. The electronic device of claim 3, wherein, The outer casing has a third heat dissipation vent, which is used to dissipate heat from the first heat-generating component.

8. The electronic device of claim 7, wherein, The third heat dissipation vent is located on the side wall of the outer casing in the direction of the second airflow.

9. The electronic device of claim 8, wherein, The electronic device includes a temperature sensor and a control unit. The temperature sensor is used to monitor the temperature of the heat-generating component, and the control unit is used to control the start and stop of the heat dissipation component.

10. The electronic device of any of claims 1-7, wherein, The heat-conducting component includes a heat-conducting body and heat dissipation fins. A portion of the heat-conducting body is connected to the second heat-generating component, and another portion of the heat-conducting body is connected to the heat dissipation fins. The heat dissipation fins are disposed on the flow path of the second airflow.

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