HDI high-density laminated circuit board
By combining a heat-conducting plate, heat sink fins, heat pipes, and a fan, the problem of poor heat dissipation and easy component damage in HDI high-density circuit boards is solved, achieving efficient heat dissipation and protection, and adapting to the mounting of circuit boards of different thicknesses.
Patent Information
- Application Number
- CN202423146314.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-19
AI Technical Summary
Traditional HDI high-density circuit boards have poor heat dissipation near high-heat components, especially in areas with poor air circulation, which can easily lead to heat accumulation, affecting the lifespan of electronic components. At the same time, uneven soldering on the surface of electronic components can easily cause damage.
It adopts a combination structure of heat-conducting plate, heat dissipation fins, heat pipes and fan. Heat is conducted to the heat dissipation fins through heat pipes and dissipated into the air by the fan. The design of heat-conducting pillars and clamping plates protects and fixes electronic components, achieving efficient heat dissipation and protection.
It improves the heat dissipation efficiency of circuit boards, protects electronic components, prevents damage, and can be used to fix circuit boards of different thicknesses.
Smart Images
Figure CN223681389U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of circuit board, especially relates to a HDI high density lamination circuit board. BACKGROUND
[0002] HDI is the abbreviation of high density interconnection, is a kind of (technology) of production printed circuit board, uses the circuit board of micro blind hole technology's one kind line distribution density is relatively high, HDI high density circuit board is the high density interconnection board, is the circuit board of micro blind hole technology's one kind line distribution density is relatively high, HDI circuit board has inner layer circuit and outer layer circuit, again utilize drilling, hole metallization etc.
[0003] The traditional HDI high density circuit board mostly opens multiple heat dissipation holes near high heat generating element, utilizes the flow of air, carries away heat, and this heat dissipation mode is not easy to dissipate the heat of heat dissipation hole place when the air circulation is poor, causes heat accumulation, and leads to the higher temperature in the internal HDI circuit board, influences the service life of HDI circuit board and electronic component;Traditional HDI high density circuit board, the electronic components of surface welding in actual use process, high and low, lack protection in actual use process, and it is extremely easy to damage.In order to solve the above problems, we propose a kind of HDI high density lamination circuit board. UTILITY MODEL CONTENTS
[0004] The utility model is to provide a kind of HDI high density lamination circuit board, solve the existing problem.
[0005] To solve the above technical problems, the utility model is realized by the following technical solutions:
[0006] The utility model discloses a HDI high density lamination circuit board, including circuit board body and setting heat conduction plate at the lower extreme, the heat conduction plate and circuit board body four corners all are provided with auxiliary screw hole, the auxiliary screw hole position on the heat conduction plate and circuit board body correspond with each other, can be fixed through the screw to the heat conduction plate, circuit board body and outside, the heat conduction plate lower extreme surface is fixedly connected with the radiating fin, the radiating fin inner surface between is provided with a plurality of heat pipes, the heat conduction plate front end surface is fixedly connected with the fixed plate, the fixed plate front end surface is provided with a plurality of fan grooves, the fan grooves are inserted with the fan, the heat pipe can effectively transmit heat from heat source to radiating fin, improves the heat conduction efficiency, and then the fan emits heat to the air, the heat conduction plate left and right two end surfaces are all fixedly connected with the limit plate, the limit plate upper end surface is all fixedly connected with a plurality of guide rods, the limit plate upper end surface is provided with screw hole, the screw hole and the guide rod fixedly connected on the same limit plate are on the same straight line, and be located between two guide rods, the guide rod upper end surface is all fixedly connected with the auxiliary limit plate, the distance between the auxiliary limit plate is much larger than the diameter of the limit screw,
[0007] The utility model discloses a HDI high density lamination circuit board, including circuit board body and setting heat conduction plate at the lower extreme, the heat conduction plate and circuit board body four corners all are provided with auxiliary screw hole, the auxiliary screw hole position on the heat conduction plate and circuit board body correspond with each other, can be fixed through the screw to the heat conduction plate, circuit board body and outside, the heat conduction plate lower extreme surface is fixedly connected with the radiating fin, the radiating fin inner surface between is provided with a plurality of heat pipes, the heat conduction plate front end surface is fixedly connected with the fixed plate, the fixed plate front end surface is provided with a plurality of fan grooves, the fan grooves are inserted with the fan, the heat pipe can effectively transmit heat from heat source to radiating fin, improves the heat conduction efficiency, and then the fan emits heat to the air, the heat conduction plate left and right two end surfaces are all fixedly connected with the limit plate, the limit plate upper end surface is all fixedly connected with a plurality of guide rods, the limit plate upper end surface is provided with screw hole, the screw hole and the guide rod fixedly connected on the same limit plate are on the same straight line, and be located between two guide rods, the guide rod upper end surface is all fixedly connected with the auxiliary limit plate, the distance between the auxiliary limit plate is much larger than the diameter of the limit screw,
[0008] Further, the height of the heat conduction column and the clamping plate is same, and the height of the heat conduction column and the clamping plate is much larger than the height of the electronic element on the circuit board body.
[0009] The utility model has the advantages of the following:
[0010] The utility model discloses a HDI high density lamination circuit board, including circuit board body and setting heat conduction plate at the lower extreme, the heat conduction plate and circuit board body four corners all are provided with auxiliary screw hole, the auxiliary screw hole position on the heat conduction plate and circuit board body correspond with each other, can be fixed through the screw to the heat conduction plate, circuit board body and outside, the heat conduction plate lower extreme surface is fixedly connected with the radiating fin, the radiating fin inner surface between is provided with a plurality of heat pipes, the heat conduction plate front end surface is fixedly connected with the fixed plate, the fixed plate front end surface is provided with a plurality of fan grooves, the fan grooves are inserted with the fan, the heat pipe can effectively transmit heat from heat source to radiating fin, improves the heat conduction efficiency, and then the fan emits heat to the air, the heat conduction plate left and right two end surfaces are all fixedly connected with the limit plate, the limit plate upper end surface is all fixedly connected with a plurality of guide rods, the limit plate upper end surface is provided with screw hole, the screw hole and the guide rod fixedly connected on the same limit plate are on the same straight line, and be located between two guide rods, the guide rod upper end surface is all fixedly connected with the auxiliary limit plate, the distance between the auxiliary limit plate is much larger than the diameter of the limit screw,
[0011] The height of the heat-conducting column and the clamping plate is much greater than the height of the electronic components on the circuit board body, and the support frame fixedly connected to the clamping plate and the bracket fixedly connected to the upper end surface of the support frame are used to protect the electronic components on the circuit board body, and the bracket has an empty window, which can ensure that the electronic components are protected and the device is not hindered from dissipating heat;
[0012] The clamping plate, the threaded hole in the upper end surface of the limiting plate and the limiting screw work together to achieve the clamping and fixing of the circuit board body in a vertical direction, the guide rod provides a guide for the clamping plate, and the threaded cooperation of the limiting screw and the threaded hole can clamp circuit boards of different thicknesses.
[0013] Of course, any product implementing the present application does not necessarily need to achieve all the advantages described above. BRIEF DESCRIPTION OF DRAWINGS
[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed for the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0015] Figure 1 It is a schematic diagram of the overall structure of an HDI high-density multilayer circuit board.
[0016] Figure 2 It is a front view of an HDI high-density multilayer circuit board.
[0017] Figure 3 It is Figure 2 A-A sectional view.
[0018] Figure 4 It is a bottom view of an HDI high-density multilayer circuit board.
[0019] In the drawings, the components represented by each reference numeral are listed as follows: 1, circuit board body; 2, heat-conducting plate; 3, heat dissipation fin; 4, heat pipe; 5, fixed plate; 6, fan groove; 7, fan; 8, limiting plate; 9, guide rod; 10, threaded hole; 11, auxiliary limiting plate; 12, clamping plate; 13, limiting hole; 14, support frame; 15, bracket; 16, heat-conducting column; 17, limiting screw; 18, auxiliary threaded hole. DETAILED DESCRIPTION
[0020] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0021] In the description of the present application, it should be understood that the terms "upper", "middle", "outer", "inner" and the like indicate the orientation or positional relationship, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0022] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "connection" and the like should be understood broadly, for example, "connection" can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0023] Please refer to Figure 1 - Figure 4 As shown in the drawings, the utility model is a kind of HDI high-density multilayer circuit board, including circuit board body 1, and the heat conduction plate 2 of setting in lower end, auxiliary screw hole 18 is set in the four corners of heat conduction plate 2 and circuit board body 1, the position of auxiliary screw hole 18 on heat conduction plate 2 and circuit board body 1 is mutually corresponding, heat conduction plate 2, circuit board body 1 and outside can be fixed by screw, heat conduction plate 2 lower end surface is fixedly connected with radiating fin 3, several heat pipes 4 are arranged between the inner surface of radiating fin 3, fixed plate 5 is fixedly connected at the front end surface of heat conduction plate 2, several fan grooves 6 are set in the front end surface of fixed plate 5, fan 7 is inserted in fan groove 6, heat pipe 4 can effectively conduct heat from heat source to radiating fin 3, improve heat conduction efficiency, then heat is dissipated to air by fan 7, the left and right two end surfaces of heat conduction plate 2 are fixedly connected with limit plate 8, several guide rods 9 are fixedly connected on the upper end surface of limit plate 8, screw hole 10 is set in the upper end surface of limit plate 8, screw hole 10 and guide rod 9 fixedly connected on the same limit plate 8 are on the same straight line, and located between two guide rods 9;
[0024] The upper end surface of the guide rod 9 is fixedly connected with an auxiliary limiting plate 11, the distance between the auxiliary limiting plates 11 is greater than the diameter of the limiting screw 17, the lateral surface of the guide rod 9 is slidingly connected with a clamping plate 12, the upper end surface of the clamping plate 12 is provided with a limiting hole 13, the shape and size of the threaded hole 10 are adapted to the limiting hole 13, the threaded hole 10 corresponds to the limiting hole 13 in position, the limiting screw 17 is threadedly connected in the threaded hole 10, and the limiting screw 17 cooperates with the limiting hole 13, one side of the limiting hole 13 is provided with a support frame 14 fixedly connected with the clamping plate 12, the upper end surface of the support frame 14 is fixedly connected with a bracket 15, the bracket 15 is a H-shaped bracket, and the lower end surface of the support frame 14 is fixedly connected with a plurality of heat-conducting columns 16.
[0025] In one of the examples, the height of the heat-conducting column 16 is the same as that of the clamping plate 12, and the height of the heat-conducting column 16 and the clamping plate 12 is greater than the height of the electronic element on the circuit board body 1.
[0026] Please refer to Figure 1 - Figure 4 As shown in the figure, the embodiment is a use method of an HDI high-density multilayer circuit board: the heat dissipation effect of the device is improved by using the heat pipe 4, the heat dissipation fin 3 and the fan 7. The heat pipe 4 is a high-efficiency heat-conducting element, which quickly transfers heat through the internal heat-conducting liquid in a vacuum environment. When the electronic element on the circuit board body 1 works, the heat generated by the electronic element is transmitted to one end (evaporation end) of the heat pipe 4 through the contact surface, i.e. the fixed end of the heat-conducting plate 2. The heat-conducting liquid vaporizes after absorbing heat, and the steam flows to the other end (condensation end) of the copper pipe, i.e. the free end of the heat pipe 4, releases heat at the heat dissipation fin 3 and liquefies, and then returns to the evaporation end through capillary action, thereby effectively conducting heat from the heat source to the heat dissipation fin 3, improving the heat conduction efficiency, and then dissipating the heat to the air by the fan 7. At the same time, the heat-conducting column 16 also conducts the heat of the circuit board body 1 to the support frame 14 and the bracket 15, thereby assisting in heat dissipation, so as to improve the heat dissipation effect of the device;
[0027] The height of the heat-conducting column 16 and the clamping plate 12 is greater than the height of the electronic element on the circuit board body 1, and the support frame 14 fixedly connected with the clamping plate 12 and the bracket 15 fixedly connected with the upper end surface of the support frame 14 are provided, so as to protect the electronic element on the circuit board body 1. The bracket 15 has an empty window, which protects the electronic element without hindering the heat dissipation of the device;
[0028] The clamping plate 12 and the limiting plate 8 realize the clamping and fixing of the circuit board body 1 in a vertical direction through the cooperation of the limiting hole 13 on the clamping plate 12, the threaded hole 10 and the limiting screw 17 on the upper end face of the limiting plate 8, and the guide rod 9 provides a guide for the clamping plate 12, and the limiting screw 17 and the threaded hole 10 can be used to clamp circuit boards with different thicknesses;
[0029] It should be additionally explained that the auxiliary threaded holes 18 on the heat conduction plate 2 and the circuit board body 1 correspond to each other, and the heat conduction plate 2, the circuit board body 1 and the outside can be fixed through the threaded holes.
[0030] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0031] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details, nor limit the present application to the specific embodiments described. Obviously, according to the content of the present specification, many modifications and changes can be made. The present specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that the persons skilled in the art can well understand and utilize the present application. The present application is limited by the claims and the entire scope and equivalents thereof.
Claims
1. An HDI high-density build-up wiring board comprising a wiring board body (1), and a heat conductive plate (2) provided at a lower end, characterized in that: The lower end surface of the heat-conducting plate (2) is fixedly connected with a heat dissipation fin (3), the inner surfaces of the heat dissipation fin (3) are provided with a plurality of heat pipes (4), the front end surface of the heat-conducting plate (2) is fixedly connected with a fixed plate (5), the front end surface of the fixed plate (5) is provided with a plurality of fan grooves (6), the fan grooves (6) are inserted with fans (7), the left and right end surfaces of the heat-conducting plate (2) are fixedly connected with limiting plates (8), the upper end surfaces of the limiting plates (8) are fixedly connected with a plurality of guide rods (9), the upper end surfaces of the limiting plates (8) are provided with threaded holes (10), the upper end surfaces of the guide rods (9) are fixedly connected with auxiliary limiting plates (11), the circumferential surfaces of the guide rods (9) are slidably connected with clamping plates (12), the upper end surfaces of the clamping plates (12) are provided with limiting holes (13), one side of the limiting holes (13) is provided with a support frame (14) fixedly connected with the clamping plates (12), the upper end surfaces of the support frames (14) are fixedly connected with supports (15), the supports (15) are H-shaped supports, the lower end surfaces of the support frames (14) are fixedly connected with a plurality of heat-conducting columns (16).
2. The HDI high-density build-up circuit board according to claim 1, wherein, The heat-conducting plate (2) and the circuit board body (1) are provided with auxiliary threaded holes (18) at the four corners, the positions of the auxiliary threaded holes (18) on the heat-conducting plate (2) and the circuit board body (1) correspond to each other, and the heat-conducting plate (2), the circuit board body (1) and the outside can be fixed by screws.
3. The HDI high density build-up board according to claim 1, wherein, The shape and size of the threaded hole (10) are adapted to the limiting hole (13), the threaded hole (10) corresponds to the limiting hole (13) in position, the threaded hole (10) is threadedly connected with a limiting screw (17), and the limiting screw (17) cooperates with the limiting hole (13).
4. The HDI high density build-up board according to claim 1, wherein, The threaded hole (10) and the guide rod (9) fixedly connected with the same limiting plate (8) are in the same straight line and located between the two guide rods (9).
5. The HDI high density build-up circuit board of claim 1, wherein, The distance between the auxiliary limiting plates (11) is much greater than the diameter of the limiting screw (17).
6. The HDI high density build-up board according to claim 1, wherein, The height of the heat-conducting column (16) is the same as that of the clamping plate (12), and the height of the heat-conducting column (16) and the clamping plate (12) is much greater than the height of the electronic elements on the circuit board body (1).