Large-size sapphire wafer double-sided grinding machine equipment

Abstract

The utility model discloses large-size sapphire wafer double-sided grinding machine equipment which comprises a working table, and a support is arranged on the working table. The support is in a U shape, and polishing pieces are symmetrically arranged on the two sides of the support. The number of the mounting blocks, the number of the clamping blocks and the number of the driving blocks are all two; one mounting block is fixed to the workbench, the other mounting block is connected with the bottom of the support through a connecting rod, and the two mounting blocks are arranged up and down and located between the two sets of polishing pieces; clamping blocks are connected to the opposite sides of the two mounting blocks in an inserted mode, and arc-shaped grooves are formed in the clamping blocks. The two driving blocks are slidably arranged on the workbench and symmetrically arranged on the two sides of the clamping block, and rolling wheels are rotationally arranged in the middles of the ends, close to the clamping block, of the driving blocks. The sapphire wafer double-face polishing device can polish double faces of a sapphire wafer comprehensively and is high in polishing efficiency.

Description

TECHNICAL FIELD

[0001] The utility model belongs to sapphire grinder technical field especially relates to a large -size sapphire wafer double -sided grinder equipment. BACKGROUND

[0002] Sapphire wafer has excellent light transmission, abrasion resistance, corrosion resistance and high temperature and high pressure resistance, and is mainly used for LED chip manufacturing, and needs to be polished in the existing sapphire wafer production process, and the grinding equipment in the prior art is mostly single, and needs to be removed and reinstalled when polishing the other side, which is time-consuming and laborious, and the overall structure is large, flexible and low in polishing efficiency. UTILITY MODEL CONTENTS

[0003] Based on the above background, the utility model aims at providing a large -size sapphire wafer double -sided grinder equipment.

[0004] To achieve the above object, the utility model adopts the following technical scheme:

[0005] A large -size sapphire wafer double -sided grinder equipment, including workbench, be equipped with support on the workbench, the support is U type, and the support both sides symmetry is equipped with polishing piece;

[0006] Still including mounting block, clamping block and drive block and the number is two;

[0007] One mounting block is fixed on the workbench, and the other mounting block is connected with the bottom of the support through the connecting rod, and the two mounting blocks are arranged in an upper and lower mode, and are located between the two groups of polishing pieces;

[0008] Two mounting blocks are inserted with clamping blocks on the opposite side, and the clamping blocks are provided with arc grooves;

[0009] Two drive blocks are slidably arranged on the workbench and symmetrically arranged on the two sides of the clamping block, and the drive block is rotatably provided with a roller in the middle of the end close to the clamping block.

[0010] Through the above technical scheme, the sapphire wafer is placed in the arc groove of the lower clamping block, the upper clamping block is lowered to clamp the upper sapphire wafer, the polishing pieces on the two sides are moved to the two sides of the sapphire wafer for polishing, the drive block close to the side surface of the sapphire wafer is started, the sapphire wafer is driven to rotate in the two arc grooves by the rotation of the roller, the sapphire wafer in the arc groove part is rotated to the outside of the arc groove, and then the edge position of the sapphire crystal is polished by the polishing piece.

[0011] Further, the side of the clamping block close to the mounting block is provided with an insertion block, and the top sides of the insertion block are provided with inclined edges;The two sides of the insertion block are provided with insertion grooves, and the cross section of the insertion groove is triangular.

[0012] The installation groove is provided with a sliding groove on both sides and the sliding groove penetrates the installation block;

[0013] The sliding block is T-shaped and one end is arranged outside the installation block, and the other end of the sliding block is connected with a stop block, and the stop block is slidingly arranged in the sliding groove; the stop block is provided with a triangular block, and the triangular block is located in the insertion groove;

[0014] When the installation groove is inserted with the insertion block, the triangular block is inserted with the insertion groove.

[0015] According to the above technical scheme, the installation block and the clamping block are connected by the installation groove and the insertion block, and the triangular block and the insertion groove are inserted and fixed, when the clamping block needs to be replaced, the sliding block is pulled to make the triangular block and the insertion groove disengage, and the clamping block can be taken out.

[0016] Further, a spring is arranged in the sliding groove, one end of the spring is fixedly connected with the sliding groove, and the other end is fixedly connected with the stop block.

[0017] According to the above technical scheme, when the clamping block is installed, the elastic force of the spring can automatically insert the triangular block into the insertion groove, without manual insertion.

[0018] Further, one end of the sliding block extending out of the sliding groove is provided with a pulling block, which facilitates pulling the sliding block when the clamping block is disassembled, so that the triangular block and the insertion groove are disengaged and inserted.

[0019] Further, the installation block is rotatably provided with a locking block on both sides, the locking block is provided with a locking groove, and the locking groove is correspondingly clamped with one corner of the end of the sliding block.

[0020] According to the above technical scheme, after the insertion groove and the triangular block are inserted, the locking groove is clamped with the sliding block, so that the sliding block is locked in the sliding direction, when replacement is needed, the locking groove is disengaged from the sliding block after the locking block is rotated, then the sliding block is pulled, and the locking block is located between the end of the sliding block and the installation block after the locking block is rotated, so that the disengaged state of the triangular block and the insertion groove can be locked, without pulling the sliding blocks on both sides at the same time, and the operation is simple.

[0021] Further, the bracket is provided with a pneumatic cylinder, and the output end of the pneumatic cylinder is connected with a connecting rod, the connecting rod is driven to move up and down by the pneumatic cylinder, and the upper clamping block is driven to cooperate with the lower clamping block to fix or take out the sapphire crystal.

[0022] Further, the driving block is L-shaped and provided with a groove at the top, the roller is rotatably arranged in the groove, one of the driving blocks is provided with a transmission wheel, two transmission wheels are rotatably arranged on the side surface of the driving block, and a transmission belt is arranged between the transmission wheels.

[0023] The motor is fixed on the driving block, one transmission wheel is connected with the motor, and the other transmission wheel is coaxially arranged with the roller and connected with the roller through a rotating shaft.

[0024] Through the above technical scheme, the driving block moves to contact the side surface of the sapphire wafer, the motor drives the transmission wheel to rotate, thereby driving the roller to rotate, the sapphire wafer rotates between the clamping blocks, the edge of the sapphire wafer in the arc-shaped groove is rotated out, and local polishing is performed.

[0025] Further, the moving groove is arranged on the workbench, the moving block is slidably arranged in the moving groove, and the moving groove and the moving block are both convex;

[0026] The moving block is fixedly connected with the driving block;

[0027] The electric telescopic rod is arranged in the moving groove, and the output end of the electric telescopic rod is connected with the moving block.

[0028] Through the above technical scheme, the electric telescopic rod pushes the moving block to move, thereby pushing the driving block to move.

[0029] The utility model has the following beneficial effects:

[0030] 1. The utility model discloses a sapphire wafer polishing device, which comprises a workbench, a clamping block is arranged on the workbench, and a driving block is arranged on the clamping block.

[0031] 2. The utility model discloses a sapphire wafer polishing device, which comprises a workbench, a clamping block is arranged on the workbench, and a driving block is arranged on the clamping block.

[0032] 3. The utility model discloses a sapphire wafer polishing device, which comprises a workbench, a clamping block is arranged on the workbench, and a driving block is arranged on the clamping block. DRAWINGS

[0033] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structure shown in the drawings without creative labor.

[0034] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0035] Figure 2 It is the split three-dimensional structure schematic view of the mounting block and the clamping block of the utility model;

[0036] Figure 3 It is the split three-dimensional structure schematic view of the mounting block and the clamping block of the utility model;

[0037] Figure 4 It is the split three-dimensional structure schematic view of the locking block and the sliding block working state when the triangular block is located in the mounting groove of the utility model;

[0038] Figure 5 It is the split three-dimensional structure schematic view of the locking block and the sliding block working state when the triangular block is located in the sliding groove of the utility model;

[0039] Figure 6 It is the split three-dimensional structure schematic view of the driving block provided with the transmission wheel of the utility model;

[0040] Figure 7 It is the split three-dimensional structure schematic view of the driving block provided with the transmission wheel of the utility model;

[0041] Wherein: 1. workbench;11. support;12. moving groove;13. moving block;14. electric telescopic rod;

[0042] 2. Polishing piece;

[0043] 3. Mounting block;31. Mounting groove;32. Triangular block;33. Stop block;34. Sliding block;35. Sliding groove;36. Spring;37. Pulling block;38. Locking block;39. Locking groove;

[0044] 4. Clamping block;41. Arc-shaped groove;42. Insert block;43. Insert groove;

[0045] 5. Driving block;51. Roller;52. Groove;53. Transmission wheel;54. Transmission belt;55. Motor;

[0046] 6. Air cylinder;61. Connecting rod. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0048] It should be noted that all the directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directionality indications will also change accordingly.

[0049] In addition, the descriptions such as "first", "second" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0050] As shown in Figures 1-7 A large-size sapphire wafer double-sided grinding machine device, including a workbench 1, the workbench 1 is equipped with support 11;Support 11 is U-shaped, and the two sides of support 11 are symmetrically provided with polishing piece 2;Polishing piece 2 contains driving assembly, can move horizontally and move along the vertical plane around, can move close to sapphire wafer, and the surface of wafer is polished by circumferential motion, also includes mounting block 3, clamping block 4 and driving block 5, and the number is two;One mounting block 3 is fixed on the workbench 1, the other mounting block 3 is connected with the bottom of support 11 through connecting rod 61, and the two mounting blocks 3 are arranged in upper and lower, and located in the middle of two groups of polishing piece 2;The opposite side of two mounting blocks 3 is inserted with clamping block 4, arc slot 41 is opened in clamping block 4, and the arc slot 41 can be provided with protective layer, which plays a protective role when clamping sapphire wafer;Two driving blocks 5 are symmetrically arranged on both sides of clamping block 4 and are slidably arranged on workbench 1, one end of driving block 5 close to clamping block 4 is rotatably provided with roller 51 in the middle of the inner part, the side surface of roller 51 is provided with rubber layer, the rubber layer is provided with pattern, which can increase the friction force of the side surface of sapphire wafer, and is convenient for rotating sapphire wafer.

[0051] In use, the sapphire wafer is placed in the arc slot 41 of the lower clamping block 4, the upper clamping block 4 is lowered to clamp the upper side of the sapphire wafer, the polishing pieces 2 on both sides are moved to the sides of the sapphire wafer for polishing, the driving blocks 5 close to the side surface of the sapphire wafer are started, the sapphire wafer is rotated in the two arc slots 41 by rotating the rollers 51, the sapphire wafer in the arc slot 41 part is rotated to the outside of the arc slot 41, and then the edge position of the sapphire wafer is polished by the polishing pieces 2.

[0052] The clamping block 4 is provided with an insertion block 42 on the side close to the mounting block 3, and the top of the insertion block 42 is provided with bevels on both sides; the two sides of the insertion block 42 are provided with insertion grooves 43, and the cross section of the insertion groove 43 is triangular; the mounting block 3 is provided with a mounting groove 31 on the side close to the clamping block 4, and the two sides of the mounting groove 31 are provided with sliding grooves 35 which penetrate the mounting block 3; a sliding block 34 is slidingly arranged in the sliding groove 35, the sliding block 34 is T-shaped and one end is arranged outside the mounting block 3, the other end of the sliding block 34 is connected with a stop block 33, and the stop block 33 is slidingly arranged in the sliding groove 35; a spring 36 is arranged in the sliding groove 35, one end of the spring 36 is fixedly connected with the sliding groove 35, the other end is fixedly connected with the stop block 33, the stop block 33 is provided with a triangular block 32, and the triangular block 32 is located in the insertion groove 43; when the mounting groove 31 and the insertion block 42 are correspondingly inserted, the triangular block 32 and the insertion groove 43 are correspondingly inserted, and one end of the sliding block 34 which extends out of the sliding groove 35 is provided with a pulling block 37.

[0053] The mounting block 3 and the clamping block 4 are connected by the insertion of the mounting groove 31 and the insertion block 42, and the triangular block 32 and the insertion groove 43 are inserted and fixed, the bevels on the top of the insertion block 42 can generate a thrust on the triangular block 32 to make it slide into the sliding groove 35, the elastic force of the spring 36 can make the triangular block 32 automatically inserted into the insertion groove 43, and manual insertion is not required, when the clamping block 4 is replaced, the triangular block 32 is separated from the insertion groove 43 by pulling the pulling block 37, so that the clamping block 4 is replaced.

[0054] The mounting block 3 is provided with a locking block 38 on both sides, the locking block 38 is provided with a locking groove, the locking groove 39 is correspondingly clamped with one corner of the end of the sliding block 34, the locking block 38 makes the locking groove 39 clamped with the sliding block 34, so that the sliding block 34 is locked in the sliding direction, and when the clamping block 4 is disassembled, the locking block 38 is located between the end of the sliding block 34 and the mounting block 3 by rotating the locking block 38, so that the separated state of the triangular block 32 and the insertion groove 43 is locked, and the sliding block 34 on both sides does not need to be pulled at the same time, and the operation is simple.

[0055] The bracket 11 is provided with a gas cylinder 6, and the output end of the gas cylinder 6 is connected with a connecting rod 61.

[0056] The driving block 5 is L-shaped and has a groove 52 at the top, and a roller 51 is rotatably arranged in the groove 52, one of the driving blocks 5 is provided with a transmission wheel 53, two transmission wheels 53 are rotatably arranged on the side surface of the driving block 5, and a transmission belt 54 is arranged between the transmission wheels 53; a motor 55 is fixedly arranged on the driving block 5, one of the transmission wheels 53 is connected with the motor 55, the other transmission wheel 53 is coaxially arranged with the roller 51 and is connected with the roller 51 through a rotating shaft, the moving groove 12 is arranged on the workbench 1, the moving block 13 is slidably arranged in the moving groove 12, and the moving groove 12 and the moving block 13 are both convex.

[0057] The motor 55 drives the transmission wheel 53 to rotate, thereby driving the roller 51 to rotate, the sapphire wafer is rotated between the clamping blocks 4, the edge of the sapphire wafer located in the arc-shaped groove 41 is rotated out, and local polishing is carried out.

[0058] The working principle of the utility model is as follows: the appropriate clamping blocks 4 are respectively inserted into the mounting blocks 3, the triangular blocks 32 are inserted and fixed with the insertion grooves 43, the locking blocks 38 make the locking grooves 39 clamped with the sliding blocks 34, the sliding blocks 34 are locked in the sliding direction, then the sapphire wafer is placed in the arc-shaped grooves 41 of the lower clamping blocks 4, the upper clamping blocks 4 are driven downward by the air cylinders 6 to clamp the upper sapphire wafer, the polishing pieces 2 on the two sides are moved to the two sides of the sapphire wafer to polish, then the motor 55 drives the transmission wheel 53 to rotate, thereby driving the roller 51 to rotate, the sapphire wafer is rotated between the clamping blocks 4, the edge of the sapphire wafer located in the arc-shaped groove 41 is rotated out, and local polishing is carried out, thereby the sapphire wafer is polished comprehensively.

[0059] Of course, the above description is not a limitation of the utility model, the utility model is not limited to the above examples, and the changes, modifications, additions or replacements made by the person skilled in the art within the essential scope of the utility model should also belong to the protection scope of the utility model.

Claims

1. A large-size sapphire wafer double-side polishing machine device, comprising a workbench (1), wherein a support (11) is arranged on the workbench (1); the support (11) is in a U shape, and a polishing piece (2) is symmetrically arranged on both sides of the support (11), characterized in that: Two mounting blocks (3), two clamping blocks (4) and two driving blocks (5) are further included; One of the mounting blocks (3) is fixed on the workbench (1), and the other mounting block (3) is connected with the bottom of the support (11) through a connecting rod (61), and the two mounting blocks (3) are arranged in a top-down manner and located between the two groups of polishing pieces (2); The opposite side of the two mounting blocks (3) is inserted with the clamping block (4), and the clamping block (4) is provided with an arc-shaped slot (41); The two driving blocks (5) are slidably arranged on the workbench (1) and symmetrically arranged on the two sides of the clamping block (4), and the driving block (5) is rotatably arranged with a roller (51) in the middle of one end of the clamping block (4).

2. The apparatus for double side polishing of large size sapphire wafer according to claim 1, wherein: The side of the clamping block (4) close to the mounting block (3) is provided with an insertion block (42), and the top sides of the insertion block (42) are provided with inclined edges; the two sides of the insertion block (42) are provided with insertion grooves (43), and the cross sections of the insertion grooves (43) are triangular; The side of the mounting block (3) close to the clamping block (4) is provided with a mounting groove (31), and the two sides of the mounting groove (31) are provided with sliding grooves (35) and the sliding grooves (35) penetrate the mounting block (3); The sliding groove (35) is slidably provided with a sliding block (34), the sliding block (34) is T-shaped and one end is arranged outside the mounting block (3), the other end of the sliding block (34) is connected with a stop block (33), and the stop block (33) is slidably arranged in the sliding groove (35); the stop block (33) is provided with a triangular block (32), and the triangular block (32) is located in the insertion groove (43); When the mounting groove (31) and the insertion block (42) are correspondingly inserted, the triangular block (32) and the insertion groove (43) are correspondingly inserted.

3. The apparatus for double side polishing of large size sapphire wafer according to claim 2, wherein: The sliding groove (35) is provided with a spring (36), one end of the spring (36) is fixedly connected with the sliding groove (35), and the other end is fixedly connected with the stop block (33).

4. The apparatus for double side polishing of large size sapphire wafer according to claim 2, wherein: The end of the sliding block (34) extending out of the sliding groove (35) is provided with a pulling block (37).

5. The apparatus for double-side polishing of large-size sapphire wafer according to any one of claims 2-4, characterized in that: The two sides of the mounting block (3) are rotatably provided with locking blocks (38), the locking blocks (38) are provided with locking grooves (39), and the locking grooves (39) are correspondingly clamped with one corner of the end of the sliding block (34).

6. The apparatus for double side polishing of large size sapphire wafer according to claim 1, wherein: The support (11) is provided with a pneumatic cylinder (6), and the output end of the pneumatic cylinder (6) is connected with the connecting rod (61).

7. The apparatus for double side polishing of large size sapphire wafer according to claim 1, wherein: The driving block (5) is L-shaped and provided with a recess (52) at the top, and the roller (51) is rotatably arranged in the recess (52); one of the driving blocks (5) is provided with a transmission wheel (53), and the two transmission wheels (53) are rotatably arranged on the side of the driving block (5), and a transmission belt (54) is arranged between the transmission wheels (53); The driving block (5) is fixedly provided with a motor (55), one of the transmission wheels (53) is connected with the motor (55), and the other transmission wheel (53) is coaxially arranged with the roller (51) and connected with the roller (51) through a rotating shaft.

8. The apparatus for double side polishing of large size sapphire wafer according to claim 7, wherein: The workbench (1) is provided with a moving groove (12), and the moving groove (12) is slidably provided with a moving block (13), and the moving groove (12) and the moving block (13) are both convex. The moving block (13) is fixedly connected with the driving block (5); The moving groove (12) is internally provided with an electric telescopic rod (14), and an output end of the electric telescopic rod (14) is connected with the moving block (13).

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