Adjustable polishing device for quartz wafer

Abstract

The adjustable polishing device comprises a base, the upper surface of the base is fixedly connected with a guide cylinder and a servo electric cylinder, a guide rod slidably connected in the guide cylinder is fixedly connected with an object carrying plate, a telescopic rod of the servo electric cylinder is fixedly connected with the lower surface of the object carrying plate, and the upper surface of the object carrying plate is fixedly connected with the upper surface of the base. Positioning grooves are symmetrically formed in the upper surface of the carrying plate, main sliding grooves are formed in the bottoms of the positioning grooves, main lead screws are movably connected into the main sliding grooves through bearings, meanwhile, moving plates are slidably connected into the main sliding grooves through the main lead screws in threaded connection, the moving plates are fixedly connected to the lower surfaces of clamping plates, and base plates are fixedly connected to the bottoms of the positioning grooves. The upper surface of the substrate is slidably connected with a clamping plate. According to the utility model, through the cooperation of the loading plate, the clamping plate, the main screw rod, the moving plate and the adsorption plate, quartz wafers with different sizes can be doubly fixed in the positioning grooves, so that the stability of the quartz wafers during grinding and polishing is enhanced, and the quartz wafers are prevented from being damaged by accidents.

Description

TECHNICAL FIELD

[0001] The utility model relates to quartz wafer polishing technical field, concretely relates to a adjustable polishing device for quartz wafer. BACKGROUND

[0002] Quartz crystal needs to be cut and polished when processing, but the existing polishing equipment for processing quartz wafer needs to use adhesive to fix quartz wafer on the support when using, so that quartz wafer cannot be conveniently assembled and disassembled, and different sizes of quartz wafer cannot be effectively fixed before polishing, thereby leading to the situation that quartz wafer is easily thrown and flown in the process of polishing and polishing, so as to cause the damage of quartz wafer. SUMMARY

[0003] In order to overcome the defects in the prior art, the adjustable polishing device for quartz wafer is provided to solve the problems in the background art.

[0004] In order to achieve the above purpose, the adjustable polishing device for quartz wafer is provided, which comprises a base, the base is fixedly connected with a main motor through a fixed frame, the output shaft of the main motor is fixedly connected with a polishing disc, the upper surface of the base is fixedly connected with a guide cylinder and a servo cylinder respectively, the guide rod slidingly connected in the guide cylinder is fixedly connected with a carrier plate, the extension rod of the servo cylinder is fixedly connected with the lower surface of the carrier plate, the upper surface of the carrier plate is symmetrically provided with a positioning groove, the bottom of the positioning groove is provided with a main sliding groove, the main sliding groove is movably connected with a main lead screw through a bearing, a moving plate is slidingly connected with the main lead screw in the main sliding groove through screwing, the moving plate is fixedly connected with the lower surface of a clamping plate, a base plate is fixedly connected with the bottom of the positioning groove, the clamping plate is slidingly connected with the upper surface of the base plate, the middle part of the base plate is fixedly connected with a suction plate, the suction plate is fixedly connected with a vacuum generator through a gas conveying pipe, and the vacuum generator is fixedly connected with the lower surface of the carrier plate.

[0005] Preferably, the upper surface of the base is symmetrically connected with four groups of guide cylinders, the four groups of guide cylinders are in cylindrical structure, and the four groups of guide cylinders are located directly below the carrier plate, and the guide rod slidingly connected in the guide cylinder is in cylindrical structure, and the upper end of the guide rod is fixedly connected with the lower surface of the carrier plate.

[0006] Preferably, the carrier plate is in circular structure, four groups of positioning grooves are symmetrically and equidistantly arranged on the upper surface of the carrier plate along the circumference, and the four groups of positioning grooves are in cylindrical structure, and the main sliding groove arranged at the bottom of the positioning groove is in strip structure.

[0007] Preferably, the base plate fixedly connected at the bottom of the positioning groove is in a circular structure, two groups of sub-slots are symmetrically arranged on the surface of the base plate relative to the two sides of the main sliding groove, and the two groups of sub-slots are in a strip structure, the length of the sub-slots is equal to the length of the main sliding groove, and a discharging groove is arranged at the bottom of the main sliding groove relative to the position of the sub-slots.

[0008] Preferably, the main lead screw is symmetrically screwed with two groups of moving plates at the two ends in the main sliding groove, and the two groups of moving plates are in a U-shaped structure, the main body of the moving plate is matched with the size of the main sliding groove, and the bending part at the two ends of the moving plate is matched with the size of the sub-slots.

[0009] Preferably, the bending part at the two ends of the moving plate is fixedly connected to the lower surface of the clamping plate, the clamping plate is in an L-shaped structure, the inner side of the clamping plate is fixedly connected with a buffer layer, and the thickness of the clamping plate is less than the depth of the positioning groove.

[0010] Preferably, the middle part of the base plate is fixedly connected with the adsorption plate through the through hole, the adsorption plate is in a circular structure, the axial section of the adsorption plate is in a mouth-shaped structure, a plurality of adsorption holes are uniformly arranged on the upper surface of the adsorption plate, and the sealing layer fixedly connected to the upper surface of the adsorption plate is in a circular structure.

[0011] Compared with the prior art, the utility model has the advantages that through the cooperation of the object plate, the main lead screw, the clamping plate, the moving plate, the adsorption plate, the base plate and the vacuum generator, different sizes of quartz wafers can be doubly fixed in the positioning groove, so that the stability of the quartz wafer placed on the surface of the object plate can be enhanced, the situation that the quartz wafer is accidentally thrown away during polishing can be effectively avoided, and the safety of the quartz wafer is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a front view schematic diagram of the utility model embodiment.

[0013] Figure 2 It is a side view schematic diagram of the utility model embodiment.

[0014] Figure 3 It is an object plate top view schematic diagram of the utility model embodiment.

[0015] Figure 4 It is an A place enlarged schematic diagram of the utility model embodiment. Figure 2

[0016] In the drawing: 1, base; 2, servo cylinder; 3, guide cylinder; 4, guide rod; 5, vacuum generator; 6, adsorption plate; 7, object plate; 8, main lead screw; 9, moving plate; 10, clamping plate; 11, base plate; 12, polishing disc; 13, fixed frame; 14, main motor; 15, positioning groove; 16, discharging groove. DETAILED DESCRIPTION​

[0017] Referring to Figures 1 to 4 The utility model provides a adjustable polishing device for quartz wafer, include: base 1, base 1 is fixedly connected main motor 14 through fixed frame 13, and the output shaft of main motor 14 is fixedly connected polishing disc 12, the upper surface of base 1 is fixedly connected guiding cylinder 3 and servo electric jar 2 respectively, and guiding cylinder 3 is fixedly connected guiding rod 4 of sliding connection in, and the lower surface of servo electric jar 2 is fixedly connected with the object plate 7 of extension rod, and the upper surface of object plate 7 is symmetrically provided with positioning groove 15, and the bottom of positioning groove 15 is provided with main sliding slot, and main lead screw 8 is movably connected in main sliding slot through bearing, and moving plate 9 is slidably connected in main sliding slot through the main lead screw 8 of screwing, and moving plate 9 is fixedly connected in the lower surface of clamping plate 10, and base plate 11 is fixedly connected in the bottom of positioning groove 15, and the upper surface of base plate 11 is slidably connected with clamping plate 10, and base plate 11 is fixedly connected with adsorption plate 6 in the middle, and adsorption plate 6 is fixedly connected vacuum generator 5 through gas pipe, and vacuum generator 5 is fixedly connected in the lower surface of object plate 7.

[0018] In the embodiment, different sizes of quartz wafer are placed in the positioning groove 15 opened on the surface of the object plate 7, the main lead screw 8 is rotated, the main lead screw 8 pushes the two sets of clamping plates 10 to move relative to each other through the moving plate 9 connected by screwing, then the two sets of clamping plates 10 can abut against the side surface of the quartz wafer through the buffer layer, so that the quartz wafer can be preliminarily positioned and fixed in the middle of the positioning groove 15, the switch of the vacuum generator 5 is started, the vacuum generator 5 extracts the gas in the inner cavity of the adsorption plate 6 through the gas pipe, so that a negative pressure environment is formed in the inner cavity of the adsorption plate 6, thereby the adsorption plate 6 can uniformly adsorb and fix the quartz wafer through the adsorption holes opened on the upper surface, then the quartz wafers of different sizes can be double-fixed for easy loading and unloading in the positioning groove 15 opened on the object plate 7, then the switch of the servo electric jar 2 is started, the extension rod of the servo electric jar 2 pushes the object plate 7 to move upwards, so that the upper surface of the quartz wafer can smoothly abut against the polishing disc 12, the switch of the main motor 14 is started, the output shaft of the main motor 14 drives the polishing disc 12 fixedly connected thereto to rotate synchronously, so that the polishing disc 12 can perform corresponding polishing treatment on the quartz wafer.

[0019] As a preferred embodiment, the upper surface of the base 1 is symmetrically connected with four sets of guiding cylinders 3, the four sets of guiding cylinders 3 are all in cylindrical structure, and the four sets of guiding cylinders 3 are all located directly below the object plate 7, and the guiding rod 4 slidably connected in the guiding cylinder 3 is in cylindrical structure, and the upper end of the guiding rod 4 is fixedly connected with the lower surface of the object plate 7.

[0020] In the embodiment, as Figure 1 , Figure 2 and Figure 3The arrangement of the guide cylinder 3 and the guide rod 4 can effectively enhance the stability of the carrier plate 7 during movement, and can ensure the stability of the carrier plate 7 when lifting the quartz wafer, and improve the polishing effect of the polishing disc 12 on the quartz wafer.

[0021] As a preferred embodiment, the carrier plate 7 is circular, and four groups of positioning grooves 15 are evenly arranged on the upper surface of the carrier plate 7 in the circumferential direction. The four groups of positioning grooves 15 are all in a cylindrical structure, and the main sliding groove arranged at the bottom of the positioning groove 15 is in a strip-shaped structure.

[0022] In this embodiment, as shown in Figure 1 , Figure 3 and Figure 4 , the arrangement of the positioning groove 15 can facilitate the preliminary positioning of the quartz wafer, and can avoid the interference of the adjustable clamping structure arranged in the carrier plate 7 with the polishing of the quartz wafer.

[0023] As a preferred embodiment, the base plate 11 fixedly connected at the bottom of the positioning groove 15 is in a circular structure, two groups of auxiliary sliding grooves are symmetrically arranged on the surface of the base plate 11 relative to the positions on both sides of the main sliding groove, and the two groups of auxiliary sliding grooves are both in a strip-shaped structure. The length of the auxiliary sliding groove is equal to the length of the main sliding groove, and a material discharge groove 16 is arranged at the bottom of the main sliding groove corresponding to the position of the auxiliary sliding groove.

[0024] In this embodiment, as shown in Figure 1 , Figure 3 and Figure 4 , the arrangement of the base plate 11 can effectively shield the main lead screw 8, thereby avoiding the attachment of foreign matter to the main lead screw 8, and reducing the probability of transmission failure between the main lead screw 8 and the moving plate 9. The arrangement of the auxiliary sliding groove and the material discharge groove 16 can enhance the stability of the moving plate 9 during movement, and reduce the probability of foreign matter falling into the main sliding groove.

[0025] As a preferred embodiment, two groups of moving plates 9 are symmetrically screwed at both ends of the main lead screw 8 in the main sliding groove, and the two groups of moving plates 9 are both in a U-shaped structure. The size of the main body of the moving plate 9 is matched with the size of the main sliding groove, and the size of the bending part at both ends of the moving plate 9 is matched with the size of the auxiliary sliding groove.

[0026] In this embodiment, as shown in Figure 1 and Figure 4 , the structure of the moving plate 9 can enhance the stability of the clamping plate 10 during movement, and reduce the probability of the main lead screw 8 being directly exposed to the outside, thereby effectively enhancing the stability of the polishing device during use, and reducing the probability of transmission failure of the main lead screw 8.

[0027] As a preferred implementation, the lower surface of the clamping plate 10 is fixedly connected to the bent portion at both ends of the moving plate 9, and the clamping plate 10 is in an L-shaped structure, the inner side of the clamping plate 10 is fixedly connected to the buffer layer, and the thickness of the clamping plate 10 is less than the depth of the positioning groove 15.

[0028] In this embodiment, as Figure 1 、 Figure 3 and Figure 4 , the buffer layer is made of silica gel material, which can effectively reduce the damage of the quartz wafer due to the clamping of the clamping plate 10, and the structure of the clamping plate 10 can be fixed and positioned for different sizes of quartz wafers, ensuring that the quartz wafer can be located in the middle of the positioning groove 15.

[0029] As a preferred implementation, the middle of the substrate 11 is fixedly connected to the adsorption plate 6 through the through hole, the adsorption plate 6 is in a circular structure, and the axial section of the adsorption plate 6 is in a mouth-shaped structure, and a plurality of adsorption holes are uniformly arranged on the upper surface of the adsorption plate 6, and the sealing layer fixedly connected to the upper surface of the adsorption plate 6 is in a circular structure.

[0030] In this embodiment, as Figure 1 、 Figure 3 and Figure 4 , the sealing layer is made of silica gel material, which can effectively enhance the adsorption and fixation effect of the adsorption plate 6 on the quartz wafer, thereby effectively enhancing the fixation effect of the quartz wafer of different sizes in the positioning groove 15.

[0031] The adjustable polishing device for quartz wafers of the utility model can double-fix different sizes of quartz wafers in the positioning groove 15, thereby enhancing the stability of the quartz wafer during polishing and polishing, avoiding damage of the quartz wafer due to accidents, and the double-fixing structure can be used together or separately, so that the fixing structure of the polishing device can be flexibly adjusted according to the size change of the quartz wafer, and the flexibility of the polishing device during use is enhanced.

Claims

1. An adjustable polishing apparatus for a quartz wafer, comprising: The base (1) is fixedly connected with the main motor (14) through the fixed frame (13), and the output shaft of the main motor (14) is fixedly connected with the polishing disc (12), characterized in that the upper surface of the base (1) is fixedly connected with the guide cylinder (3) and the servo cylinder (2) respectively, the guide rod (4) slidably connected in the guide cylinder (3) is fixedly connected with the object plate (7), the telescopic rod of the servo cylinder (2) is fixedly connected with the lower surface of the object plate (7), the upper surface of the object plate (7) is symmetrically provided with the positioning groove (15), the bottom of the positioning groove (15) is provided with the main sliding groove, the main lead screw (8) is movably connected with the main sliding groove through the bearing, the moving plate (9) is slidably connected in the main sliding groove through the main lead screw (8) screwed, the moving plate (9) is fixedly connected with the lower surface of the clamping plate (10), the base plate (11) is fixedly connected with the bottom of the positioning groove (15), the upper surface of the base plate (11) is slidably connected with the clamping plate (10), and the middle of the base plate (11) is fixedly connected with the adsorption plate (6), the adsorption plate (6) is fixedly connected with the vacuum generator (5) through the gas conveying pipe, and the vacuum generator (5) is fixedly connected with the lower surface of the object plate (7).

2. The adjustable polishing apparatus for a quartz wafer according to claim 1, wherein The upper surface of the base (1) is symmetrically connected with four groups of guide cylinders (3), the four groups of guide cylinders (3) are all in cylindrical structure, and the four groups of guide cylinders (3) are all located directly below the object plate (7), and the guide rod (4) slidably connected in the guide cylinder (3) is in cylindrical structure, and the upper end of the guide rod (4) is fixedly connected with the lower surface of the object plate (7).

3. The adjustable polishing apparatus for a quartz wafer of claim 1, wherein, The object plate (7) is in circular structure, the upper surface of the object plate (7) is circumferentially provided with four groups of positioning grooves (15) at equal intervals, and the four groups of positioning grooves (15) are all in cylindrical structure, and the main sliding groove provided at the bottom of the positioning groove (15) is in strip-shaped structure.

4. The adjustable polishing apparatus for a quartz wafer of claim 1, wherein, The base plate (11) fixedly connected with the bottom of the positioning groove (15) is in circular structure, two groups of auxiliary sliding grooves are symmetrically provided on the surface of the base plate (11) relative to the positions of the two sides of the main sliding groove, the two groups of auxiliary sliding grooves are all in strip-shaped structure, the length of the auxiliary sliding groove is equal to the length of the main sliding groove, and the discharge groove (16) is provided at the bottom of the main sliding groove relative to the position of the auxiliary sliding groove.

5. The adjustable polishing apparatus for a quartz wafer of claim 1, wherein, The two ends of the main lead screw (8) located in the main sliding groove are symmetrically screwed with two groups of moving plates (9), and the two groups of moving plates (9) are all in U-shaped structure, the main body part of the moving plate (9) is matched with the size of the main sliding groove, and the bending parts at the two ends of the moving plate (9) are matched with the size of the auxiliary sliding groove.

6. The adjustable polishing apparatus for a quartz wafer of claim 1, wherein, The two ends of the moving plate (9) are fixedly connected with the bending parts at the two ends of the moving plate (9), the clamping plate (10) is in L-shaped structure, the inner side of the clamping plate (10) is fixedly connected with the buffer layer, and the thickness of the clamping plate (10) is less than the depth of the positioning groove (15).

7. The adjustable polishing apparatus for a quartz wafer of claim 1, wherein, The middle of the base plate (11) is fixedly connected with the adsorption plate (6) through the penetrating hole, the adsorption plate (6) is in circular structure, the axial section of the adsorption plate (6) is in mouth-shaped structure, a plurality of adsorption holes are uniformly provided on the upper surface of the adsorption plate (6), and the sealing layer fixedly connected with the upper surface of the adsorption plate (6) is in circular structure.

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