Wire heating mechanism, wire heating process cavity and coating equipment

Abstract

The utility model belongs to the technical field of coating equipment, and particularly relates to a hot wire mechanism, a hot wire process cavity and coating equipment. The hot wire fixing assembly comprises a hot wire conductive block; two hot wire fixing holes are formed in the bottom surface of the hot wire conductive block; one end of the hot wire is fixed in one hot wire fixing hole of one hot wire conductive block, and the other end of the hot wire is fixed in one hot wire fixing hole of the other hot wire conductive block, so that the two hot wire conductive blocks are connected in series; in all the serially connected hot wire conductive blocks, the lengths of the hot wires connected between the adjacent hot wire conductive blocks are the same, so that uniform distribution of the hot wire conductive blocks is realized, the hot wires are more uniformly arranged due to the serially connected hot wire conductive blocks, and the lengths of the hot wires between the adjacent hot wire conductive blocks are the same, so that a formed temperature field is more uniform; and the process gas can be fully pyrolyzed when passing through the temperature field, so that the coating uniformity is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of coating equipment technology, especially relates to a hot wire mechanism, hot wire process cavity and coating equipment. BACKGROUND

[0002] With the rapid progress and development of photovoltaic technology level, the conversion efficiency of crystalline silicon solar cells is improved year by year Current photovoltaic industry, the conversion efficiency of monocrystalline silicon solar cells has reached more than 22%. Because HJT (silicon-based heterojunction) solar cell has the advantages of short manufacturing process, low preparation process temperature, high conversion efficiency, high open circuit voltage, low temperature coefficient, no light-induced degradation (LID), no electrical degradation (PID), suitable for using thin silicon wafer to make bendable battery assembly, more power generation, etc., more and more attention is paid.

[0003] The existing heterojunction solar cell preparation process includes (1) texturing cleaning, (2) amorphous silicon deposition, (3) TCO deposition, (4) screen printing electric level. When carrying out amorphous silicon deposition coating, the commonly used equipment is HWCVD (hot wire chemical vapor deposition) equipment and PECVD (plasma chemical vapor deposition) equipment, wherein HWCVD has greater competitiveness due to its lower manufacturing cost and faster coating rate, and with the improvement of production capacity, the coating quality is unstable, and the coating is gradually becoming a problem of large-capacity hot wire CVD.

[0004] Therefore, due to the technical problem of uneven coating quality caused by uneven temperature during coating process, a hot wire mechanism, hot wire process cavity and coating equipment need to be designed.

[0005] It should be noted that the above information disclosed in the background section of the present application is only used to understand the background of the present application, and therefore, the above description is not considered to constitute prior art information. INVENTION CONTENTS

[0006] The present application provides at least a kind of hot wire mechanism, hot wire process cavity and coating equipment.

[0007] In a first aspect, the present application provides a hot wire mechanism, comprising:

[0008] A plurality of hot wire fixing assemblies in series;

[0009] The hot wire fixing assembly comprises a hot wire conductive block;

[0010] The bottom surface of the hot wire conductive block is provided with two hot wire fixing holes;

[0011] One end of the hot wire is fixed in one of the hot wire fixing holes of one of the hot wire conductive blocks, and the other end of the hot wire is fixed in one of the hot wire fixing holes of the other hot wire conductive block, so that the two hot wire conductive blocks are connected in series.

[0012] In all the hot wire conductive blocks connected in series, the lengths of the hot wires connected between adjacent hot wire conductive blocks are the same.

[0013] In an optional embodiment, the hot wire fixing assembly further comprises a ceramic insulating block.

[0014] The ceramic insulating block is hollow.

[0015] The ceramic insulating block is sleeved on the hot wire conductive block, and the bottom of the hot wire conductive block protrudes from the bottom of the ceramic insulating block.

[0016] An insulating pad is arranged on the top surface of the hot wire conductive block, and the insulating pad is arranged in the ceramic insulating block.

[0017] A fixing screw is arranged on the top surface of the insulating pad, and part of the fixing screw is arranged in the ceramic insulating block and part of the fixing screw protrudes from the top surface of the ceramic insulating block.

[0018] In an optional embodiment, a ring groove is arranged on the outer wall of the hot wire conductive block, and a spring contact finger is arranged in the ring groove.

[0019] The spring contact finger is arranged in the ceramic insulating block.

[0020] A fastening screw is arranged on the part of the hot wire conductive block protruding from the ceramic insulating block.

[0021] The fastening screw is arranged radially along the hot wire conductive block.

[0022] The fastening screw is configured to fix the hot wire in the hot wire fixing hole.

[0023] In a second aspect, the embodiments of the present disclosure further provide a hot wire process cavity adopting the hot wire mechanism, comprising:

[0024] A first cavity and a first upper cover arranged on the top of the first cavity.

[0025] A fixing plate is arranged on the bottom surface of the first upper cover, and the bottom surface of the fixing plate is provided with a hot wire mechanism.

[0026] The hot wire fixing assemblies in the hot wire mechanism are connected in series and arranged in a continuous S shape.

[0027] The hot wire mechanism is suitable for heating the first cavity.

[0028] In an alternative embodiment, the first upper cover is provided with a process gas inlet and a cleaning gas inlet;

[0029] The process gas inlet is connected with a first pipeline, and the first pipeline is in communication with the interior of the first chamber;

[0030] The cleaning gas inlet is connected with a second pipeline, and the second pipeline is in communication with the interior of the first chamber;

[0031] The first pipeline and the second pipeline are arranged on the first upper cover;

[0032] The first upper cover is provided with a cooling water outlet and a cooling water inlet;

[0033] The cooling water outlet and the cooling water inlet are connected by a third pipeline;

[0034] The third pipeline is arranged on the first upper cover;

[0035] A conveying assembly is arranged in the first chamber to convey the carrier plate conveyed into the first chamber.

[0036] In a third aspect, the embodiments of the present disclosure further provide a coating equipment employing the above-mentioned hot-wire process chamber, comprising:

[0037] A feeding mechanism, a discharging mechanism, and a first deposition part, a second deposition part and a third deposition part arranged in sequence between the feeding mechanism and the discharging mechanism;

[0038] A first sheet-turning mechanism is arranged between the first deposition part and the second deposition part;

[0039] A second sheet-turning mechanism is arranged between the second deposition part and the third deposition part;

[0040] An entering sheet chamber, an exiting sheet chamber and a plurality of groups of preheating chambers and hot-wire process chambers are arranged between the first deposition part, the second deposition part and the third deposition part;

[0041] The preheating chamber is closer to the entering sheet chamber than the hot-wire process chamber;

[0042] The preheating chamber in the next group is connected with the hot-wire process chamber in the previous group;

[0043] The loading mechanism transports the carrier plate carrying the silicon wafer to the wafer feeding cavity of the first deposition part, and after the carrier plate passes through each group of preheating cavities and hot wire process cavities of the first deposition part, it is output to the wafer output cavity of the first deposition part and then transported to the wafer feeding cavity of the first wafer turning mechanism. After the carrier plate passes through each group of preheating cavities and hot wire process cavities of the second deposition part, it is output to the wafer output cavity of the second deposition part and then transported to the wafer feeding cavity of the second wafer turning mechanism. After the carrier plate passes through each group of preheating cavities and hot wire process cavities of the third deposition part, it is output to the wafer output cavity of the third deposition part and then taken down by the unloading mechanism.

[0044] In an optional embodiment, a vacuum door valve is arranged between the wafer feeding cavity and the preheating cavity, and between the wafer output cavity and the hot wire process cavity.

[0045] The wafer feeding cavity is provided with a vacuum door valve, and the other side of the wafer feeding cavity is provided with an atmospheric door valve.

[0046] The wafer output cavity is provided with a vacuum door valve, and the other side of the wafer output cavity is provided with an atmospheric door valve.

[0047] In an optional embodiment, the wafer feeding cavity and the wafer output cavity are the same in structure and each comprises a second upper cover, a second cavity and a support.

[0048] The second cavity is arranged on the support.

[0049] The second upper cover is arranged on the top of the second cavity.

[0050] The carrier plate is transported into the second cavity.

[0051] In an optional embodiment, the preheating cavity comprises a preheating cavity.

[0052] The top of the preheating cavity is provided with a corresponding second upper cover.

[0053] A plurality of infrared lamp tubes are arranged in the preheating cavity, and the wiring ends of the infrared lamp tubes extend from the side wall of the preheating cavity.

[0054] A corresponding conveying assembly is arranged in the preheating cavity to convey the carrier plate transported into the preheating cavity.

[0055] The infrared lamp tubes are located below the carrier plate conveyed in the preheating cavity.

[0056] The infrared lamp tubes are equidistantly arranged along the conveying direction of the carrier plate.

[0057] In an optional embodiment, the preheating cavity comprises a preheating cavity.

[0058] The top of the preheating chamber is provided with a corresponding second upper cover;

[0059] The outer wall of the preheating chamber is provided with a plurality of magnetic fluid conveying devices;

[0060] One end of the magnetic fluid conveying device extends into the interior of the preheating chamber, and the part of the magnetic fluid conveying device extending into the preheating chamber is provided with a bearing wheel;

[0061] The top of the bearing wheel bears a carrier plate;

[0062] A heating aluminum plate is arranged in the preheating chamber, and the heating aluminum plate is located below the carrier plate in the preheating chamber;

[0063] A driving motor is arranged on the outer wall of the preheating chamber, and the driving motor is connected to all the magnetic fluid conveying devices through a synchronous belt.

[0064] The beneficial effects of the present application are as follows: the hot wire mechanism comprises: a plurality of series-connected hot wire fixing assemblies; the hot wire fixing assembly comprises: a hot wire conductive block; two hot wire fixing holes are formed in the bottom surface of the hot wire conductive block; one end of the hot wire is fixed in one of the hot wire fixing holes of one hot wire conductive block, and the other end of the hot wire is fixed in one of the hot wire fixing holes of another hot wire conductive block, so that the two hot wire conductive blocks are connected in series; in all the series-connected hot wire conductive blocks, the hot wires connected between adjacent hot wire conductive blocks have the same length, thereby realizing uniform distribution of the hot wire conductive blocks; the series-connected hot wire conductive blocks make the arrangement of the hot wires more uniform, the hot wires between adjacent hot wire conductive blocks have the same length, the formed temperature field is more uniform, the process gas can be fully pyrolyzed when passing through the temperature field, the quality of the coating film is improved, and the uniformity of the coating film is improved.

[0065] Other features and advantages of the present application will be described in the following description, and some will become apparent from the description, or will be understood from the practice of the present application. The purposes and other advantages of the present application are realized and obtained by the structures specifically indicated in the description and the drawings.

[0066] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the preferred embodiments are described in detail below, and the detailed description is made below with the help of the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0067] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0068] Figure 1 A structure schematic view of a hot wire fixing assembly provided by an embodiment of the present disclosure;

[0069] Figure 2 A sectional view of a hot wire fixing assembly provided by an embodiment of the present disclosure;

[0070] Figure 3 A structure schematic view of a hot wire process cavity provided by an embodiment of the present disclosure;

[0071] Figure 4 A structure schematic view of a hot wire mechanism provided by an embodiment of the present disclosure;

[0072] Figure 5 A sectional view of a first upper cover provided by an embodiment of the present disclosure;

[0073] Figure 6 A schematic view of a coating equipment provided by an embodiment of the present disclosure;

[0074] Figure 7 A structure schematic view of a film feeding cavity provided by an embodiment of the present disclosure;

[0075] Figure 8 A structure schematic view of a preheating cavity provided by an embodiment of the present disclosure;

[0076] Figure 9 A structure schematic view of an infrared lamp heating provided by an embodiment of the present disclosure;

[0077] Figure 10 A schematic view of a magnetic fluid conveying device provided by an embodiment of the present disclosure;

[0078] Figure 11 A structure schematic view of a heating aluminum plate heating provided by an embodiment of the present disclosure;

[0079] Figure 12 A structure schematic view of a carrier plate provided by an embodiment of the present disclosure;

[0080] In the figure:

[0081] 1 hot wire process cavity, 11 hot wire mechanism, 111 hot wire fixing assembly, 1111 hot wire conductive block, 1112 hot wire fixing hole, 1113 ceramic insulating block, 1114 insulating pad block, 1115 fixing screw, 1116 ring groove, 1117 spring contact finger, 1118 fastening screw, 1119 hot wire;

[0082] 12 first upper cover, 121 fixing plate, 13 process air inlet, 131 first pipeline, 14 cleaning gas air inlet, 141 second pipeline, 15 cooling water outlet, 151 cooling water inlet, 152 third pipeline, 16 hot wire terminal;

[0083] 2. Feeding mechanism; 21. Unloading mechanism;

[0084] 3. First sedimentary section; 31. Second sedimentary section; 32. Third sedimentary section;

[0085] 4. First film turning mechanism; 41. Second film turning mechanism;

[0086] 5. Inlet cavity, 51. Second upper cover, 52. Second chamber, 53. Support;

[0087] 6 film output chambers;

[0088] 7 Preheating chamber, 71 Preheating chamber, 72 Infrared lamp tube, 73 Terminal, 74 Magnetorheological fluid conveying device, 75 Bearing wheel, 76 Heated aluminum plate, 77 Drive motor, 78 Synchronous belt;

[0089] 8. Vacuum valve; 81. Atmospheric valve;

[0090] 9 substrates, 91 silicon wafers. Detailed Implementation

[0091] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0092] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0093] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0094] like Figure 1As shown, at least one disclosed embodiment provides a hot wire mechanism, including: a plurality of hot wire fixing assemblies 111 connected in series; each hot wire fixing assembly 111 includes: a hot wire conductive block 1111; the bottom surface of the hot wire conductive block 1111 has two hot wire fixing holes 1112; one end of a hot wire 1119 is fixed in one of the hot wire fixing holes 1112 of one hot wire conductive block 1111, and the other end of the hot wire 1119 is fixed in one of the hot wire fixing holes 1112 of the other hot wire conductive block 1111, so that the two... The hot wire conductive blocks 1111 are connected in series; among all the hot wire conductive blocks 1111 connected in series, the hot wires 1119 connected between adjacent hot wire conductive blocks 1111 are of the same length, thereby achieving a uniform distribution of the hot wire conductive blocks 1111. The series connection of the hot wire conductive blocks 1111 makes the arrangement of the hot wires 1119 more uniform. The fact that the hot wires 1119 between adjacent hot wire conductive blocks 1111 are of the same length makes the formed temperature field more uniform. When the process gas passes through this temperature field, it can be fully pyrolyzed, improving the quality of the coating and the uniformity of the coating.

[0095] The series-connected hot wire fixing components 111 can be more evenly distributed, so that the hot wires 1119 between adjacent hot wire fixing components 111 can also be evenly distributed, resulting in a more uniform temperature field.

[0096] Optionally, the hot wire 1119 can be a shorter hot wire 1119, which reduces the distance between adjacent hot wire fixing components 111, makes the hot wire fixing components 111 and the hot wire 1119 more closely arranged, and further makes the temperature field more uniform.

[0097] Alternatively, the shorter hot wire 1119 can be U-shaped to prevent the hot wire 1119 from drooping.

[0098] like Figure 2 As shown, in an optional embodiment, the hot wire fixing assembly 111 further includes: a ceramic insulating block 1113; the ceramic insulating block 1113 is hollow; the ceramic insulating block 1113 is sleeved on the hot wire conductive block 1111, and the bottom of the hot wire conductive block 1111 extends from the bottom of the ceramic insulating block 1113; an insulating pad 1114 is provided on the top surface of the hot wire conductive block 1111, and the insulating pad 1114 is disposed inside the ceramic insulating block 1113; a fixing screw 1115 is provided on the top surface of the insulating pad 1114, part of the fixing screw 1115 is located inside the ceramic insulating block 1113, and part extends from the top surface of the ceramic insulating block 1113.

[0099] Preferably, the ceramic insulating block 1113 can prevent the hot wire conductive block 1111 from discharging to the outside.

[0100] The insulating block 1114 can insulate the hot-wire conducting block 1111 from the fixing screw 1115, so as to avoid the discharge of the fixing screw 1115 to the first upper cover 12.

[0101] The fixing screw 1115 can be connected with the first upper cover 12, so as to fix the ceramic insulating block 1113.

[0102] In an optional embodiment, a ring groove 1116 is formed on the outer wall of the hot-wire conducting block 1111, and a spring contact finger 1117 is arranged in the ring groove 1116; the spring contact finger 1117 is arranged in the ceramic insulating block 1113; a fastening screw 1118 is arranged on the part of the hot-wire conducting block 1111 extending out of the ceramic insulating block 1113; the fastening screw 1118 is arranged radially along the hot-wire conducting block 1111; and the fastening screw 1118 is configured to fix the hot wire 1119 in the hot-wire fixing hole 1112.

[0103] The spring contact finger 1117 is used to stabilize the conduction current.

[0104] One fastening screw 1118 can simultaneously fasten the hot wires 1119 in two hot-wire fixing holes 1112; one half of the fastening screw 1118 is located in one of the hot-wire fixing holes 1112, and the other half is located in the other hot-wire fixing hole 1112.

[0105] As shown in Figure 3 , the disclosure also provides a hot-wire process cavity 1 adopting the above hot-wire mechanism 11, which comprises a first cavity and a first upper cover 12 arranged on the top of the first cavity; a fixing plate 121 is arranged on the bottom surface of the first upper cover 12, and the bottom surface of the fixing plate 121 is provided with the hot-wire mechanism 11; the hot-wire fixing assemblies 111 in the hot-wire mechanism 11 are connected in series and arranged in a continuous S shape; and the hot-wire mechanism 11 is suitable for heating in the first cavity.

[0106] The fixing screw 1115 can be connected with the fixing plate 121, so that the hot-wire fixing assemblies 111 are mounted on the fixing plate 121.

[0107] As shown in Figure 4 , the series-connected hot-wire fixing assemblies 111 can be better and more uniformly arranged, so that the hot wires 1119 are uniformly arranged; and the continuous S-shaped arrangement can meet the requirement of uniform arrangement of the hot wires 1119.

[0108] Referring to Figure 7 , the overall structural layout of the hot-wire process cavity 1 can be the same as that of the film feeding cavity 5, for example, the first cavity is arranged on the corresponding support 53, and an inlet and outlet are formed on the sidewall of the first cavity to facilitate the entry and exit of the carrier plate 9.

[0109] Continuing to refer to Figure 3In an alternative embodiment, the first upper cover 12 is provided with a process gas inlet 13 and a cleaning gas inlet 14; the process gas inlet 13 is connected with a first pipeline 131, which is in communication with the interior of the first chamber, so as to facilitate the process gas to enter the first chamber.

[0110] Specifically, the cleaning gas inlet 14 is connected with a second pipeline 141, which is in communication with the interior of the first chamber, so as to facilitate the cleaning gas to enter the first chamber.

[0111] Referring to Figure 3 , the first pipeline 131 and the second pipeline 141 are arranged on the first upper cover 12.

[0112] The first upper cover 12 is provided with a cooling water outlet 15 and a cooling water inlet 151; the cooling water outlet 15 and the cooling water inlet 151 are connected through a third pipeline 152; the third pipeline 152 is arranged on the first upper cover 12; the cooling water is circulated in the third pipeline 152 through the cooling water outlet 15 and the cooling water inlet 151, so that the cooling water can cool the first upper cover 12, preventing the first upper cover 12 from being damaged by the high temperature of the hot wire 1119.

[0113] The first chamber is provided with a conveying assembly to convey the carrier plate 9 conveyed into the first chamber; the conveying assembly can be a magnetic fluid conveying device 74 to realize the conveying of the carrier plate 9 in the first chamber.

[0114] As shown in Figure 5 , the first upper cover 12 can be provided with a plurality of hot wire connection terminals 16, which are connected with the hot wire conductive blocks 1111 in the corresponding hot wire fixing assembly 111; the hot wire connection terminals 16 are connected with the power supply to complete the electrification of the hot wire 1119, so that the hot wire 1119 can be heated.

[0115] As shown in Figure 6 , the present disclosure further provides a coating equipment adopting the above-mentioned hot wire process chamber 1, which comprises a feeding mechanism 2, a discharging mechanism 21, and a first deposition part 3, a second deposition part 31 and a third deposition part 32 arranged in sequence between the feeding mechanism 2 and the discharging mechanism 21; a first sheet turning mechanism 4 is arranged between the first deposition part 3 and the second deposition part 31; a second sheet turning mechanism 42 is arranged between the second deposition part 31 and the third deposition part 32; a sheet inlet chamber 5, a sheet outlet chamber 6 and a plurality of groups of preheating chambers 7 and hot wire process chambers 1 are arranged between the first deposition part 3, the second deposition part 31 and the third deposition part 32; the preheating chamber 7 is closer to the sheet inlet chamber 5 than the hot wire process chamber 1; the preheating chamber 7 in the next group is connected with the hot wire process chamber 1 in the previous group;

[0116] The loading mechanism 2 transports the carrier plate 9 carrying the silicon wafer 91 to the wafer inlet cavity 5 of the first deposition part 3, and after the carrier plate 9 passes through each group of preheating cavities 7 and hot wire process cavities 1 of the first deposition part 3, the carrier plate 9 is output to the wafer outlet cavity 6 of the first deposition part 3 and then transported to the first wafer turning mechanism 4. The first wafer turning mechanism 4 turns over the silicon wafer 91 on the carrier plate 9 and then transports the carrier plate 9 to the wafer inlet cavity 5 of the second deposition part 31. After the carrier plate 9 passes through each group of preheating cavities 7 and hot wire process cavities 1 of the second deposition part 31, the carrier plate 9 is output to the wafer outlet cavity 6 of the second deposition part 31 and then transported to the second wafer turning mechanism 42. The second wafer turning mechanism 42 turns over the silicon wafer 91 on the carrier plate 9 and then transports the carrier plate 9 to the wafer inlet cavity 5 of the third deposition part 32. After the carrier plate 9 passes through each group of preheating cavities 7 and hot wire process cavities 1 of the third deposition part 32, the carrier plate 9 is output to the wafer outlet cavity 6 of the third deposition part 32 and then transported to the unloading mechanism 21.

[0117] Different numbers of preheating cavities 7 and hot wire process cavities 1 can be arranged in each deposition part. Before the carrier plate 9 enters the hot wire process cavities 1 in a group, the carrier plate 9 needs to enter the preheating cavity 71 in the group first to preheat the silicon wafer 91 on the carrier plate 9 by the preheating cavity 71.

[0118] In an optional embodiment, a vacuum door valve 8 is arranged between the wafer inlet cavity 5 and the preheating cavity 7, and between the wafer outlet cavity 6 and the hot wire process cavity 1. The wafer inlet cavity 5 provided with the vacuum door valve 8 is provided with an atmospheric door valve 81 on the other side. The wafer outlet cavity 6 provided with the vacuum door valve 8 is provided with an atmospheric door valve 81 on the other side.

[0119] The coating cycle is optimized, and the vacuum environment of the preheating cavity 7 and the hot wire process cavity 1 is ensured, which is not affected by the wafer inlet and outlet. After the wafer inlet and outlet, only the wafer inlet cavity 5 and the wafer outlet cavity 6 need to be vacuumized, the atmospheric door valve 81 is closed, and the vacuum door valve 8 is vacuumized.

[0120] As shown in the drawings, Figure 7 In an optional embodiment, the wafer inlet cavity 5 and the wafer outlet cavity 6 are the same in structure and each include a second upper cover 51, a second cavity 52, and a support 53. The second cavity 52 is arranged on the support 53. The second upper cover 51 is arranged on the top of the second cavity 52. The carrier plate 9 is transported into the second cavity 52.

[0121] The overall structure and layout of the wafer inlet cavity 5 and the wafer outlet cavity 6 are the same, and the specific structures inside are different.

[0122] An inlet and outlet for the carrier plate 9 to enter and exit is formed in the side wall of the second cavity 52.

[0123] A transport assembly is arranged in the second chamber 52 for conveying the carrier plate 9, so that the carrier plate 9 can move in the second chamber 52 and be moved out of the second chamber 52 of the sheet feeding chamber 5 into the corresponding preheating chamber 71 in communication.

[0124] The transport assembly in the second chamber 52 can be a magnetic fluid conveying device 74 and a corresponding driving motor 77 connected thereto.

[0125] As shown in Figure 8 and Figure 9 , in an alternative embodiment, the preheating chamber 7 comprises a preheating chamber 71; a corresponding second upper cover 51 is arranged on the top of the preheating chamber 71; a plurality of infrared lamp tubes 72 are arranged in the preheating chamber 71, and the wiring ends 73 of the infrared lamp tubes 72 extend from the side wall of the preheating chamber 71; a corresponding transport assembly is arranged in the preheating chamber 71 to convey the carrier plate 9 conveyed into the preheating chamber 71; the infrared lamp tubes 72 are located below the carrier plate 9 conveyed in the preheating chamber 71; and the infrared lamp tubes 72 are equidistantly arranged along the conveying direction of the carrier plate 9.

[0126] The transport assembly in the preheating chamber 71 can be a magnetic fluid conveying device 74 and a corresponding driving motor 77 connected thereto.

[0127] The infrared lamp tubes 72 are connected to a power source through the wiring ends 73.

[0128] The preheating chamber 71 has a pair of opposite side wall openings for the infrared lamp tubes 72, and the opening positions are located below the magnetic fluid conveying devices 74 on the side wall, so that the infrared lamp tubes 72 preheat the silicon wafer 91 from below the carrier plate 9.

[0129] As shown in Figure 10 and Figure 11 , in an alternative embodiment, the preheating chamber 7 comprises a preheating chamber 71; a corresponding second upper cover 51 is arranged on the top of the preheating chamber 71; a plurality of magnetic fluid conveying devices 74 are arranged on the outer wall of the preheating chamber 71; one end of the magnetic fluid conveying device 74 extends into the preheating chamber 71, and a bearing wheel 75 is arranged on the part of the magnetic fluid conveying device 74 extending into the preheating chamber 71; the top of the bearing wheel 75 bears the carrier plate 9; a heating aluminum plate 76 is arranged in the preheating chamber 71, and the heating aluminum plate 76 is located below the carrier plate 9 in the preheating chamber 71; a driving motor 77 is arranged on the outer wall of the preheating chamber 71, and the driving motor 77 connects all the magnetic fluid conveying devices 74 through a synchronous belt 78; and preheating is performed by the heating aluminum plate 76.

[0130] The magnetic fluid conveying device 74 is arranged in the film feeding cavity 5, the film discharging cavity 6, the preheating cavity 7 and the hot wire process cavity 1, and the amorphous silicon deposition and plating process of the heterojunction solar cell can be completed through the magnetic fluid conveying device 74 and the bearing wheel 75.

[0131] The driving motor 77, the power supply connected with the wiring end 73 of the infrared lamp tube 72 and the hot wire wiring end 16 and the like can be electrically connected with the control module and controlled by the control module.

[0132] As shown in Figure 12 The top surface of the carrier plate 9 is grid-shaped and can place a plurality of silicon wafers 91.

[0133] In conclusion, the hot wire mechanism 11 comprises: a plurality of series-connected hot wire fixing assemblies 111; the hot wire fixing assembly 111 comprises: a hot wire conductive block 1111; the bottom surface of the hot wire conductive block 1111 is provided with two hot wire fixing holes 1112; one end of a hot wire 1119 is fixed in one of the hot wire fixing holes 1112 of one hot wire conductive block 1111, and the other end of the hot wire 1119 is fixed in one of the hot wire fixing holes 1112 of another hot wire conductive block 1111, so that the two hot wire conductive blocks 1111 are connected in series; the lengths of the hot wires 1119 connected between adjacent hot wire conductive blocks 1111 in all series-connected hot wire conductive blocks 1111 are the same, so that the hot wire conductive blocks 1111 are uniformly distributed, the series-connected hot wire conductive blocks 1111 make the arrangement of the hot wires 1119 more uniform, the lengths of the hot wires 1119 between adjacent hot wire conductive blocks 1111 are the same, so that the formed temperature field is more uniform, and the process gas can be fully pyrolyzed when passing through the temperature field, thereby improving the quality of the plating film.

[0134] In the description of the embodiments of the utility model, unless there is definite and limited provision and limitation, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixed connection, can also be detachable connection, or integrally connected, can be mechanical connection, can also be electrical connection, can be directly connected, can also be indirectly connected through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0135] In the description of the utility model, it is necessary to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, a particular orientation and operation, therefore, it cannot be understood as a limitation on the utility model. In addition, terms such as "first", "second" and other numerical terms are used in this paper, and no sequence or order is implied, unless the text indicates explicitly. Therefore, the above-discussed first element, component, area, layer or section can be referred to as the second element, component, area, layer or section without departing from the teachings of the example embodiments.

[0136] Spatially relative terms, such as "inner", "outer", "below", "below", "lower", "above", "upper" and the like, can be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the drawings. In addition to the orientation depicted in the drawings, the spatially relative terms can be intended to cover different orientations of the device in use or operation. For example, if the device in the drawing is turned over, the element described as "below" or "under" the other element or feature will be oriented "above" the other element or feature. Therefore, the example term "below" can cover the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0137] With the above ideal embodiments according to the utility model as the inspiration, through the above description, relevant staff can make various changes and modifications without deviating from the scope of the technical idea of the utility model. The technical scope of the utility model is not limited to the content in the specification, and the technical scope must be determined according to the scope of claims.

Claims

1. A hot wire mechanism, characterized by, The hot wire mechanism comprises: a plurality of hot wire fixing assemblies (111) connected in series; the hot wire fixing assembly (111) comprises a hot wire conducting block (1111); the bottom surface of the hot wire conducting block (1111) is provided with two hot wire fixing holes (1112); one end of a hot wire (1119) is fixed in one of the hot wire fixing holes (1112) of one hot wire conducting block (1111), and the other end of the hot wire (1119) is fixed in one of the hot wire fixing holes (1112) of another hot wire conducting block (1111), so that the two hot wire conducting blocks (1111) are connected in series; in all the hot wire conducting blocks (1111) connected in series, the hot wires (1119) connected between adjacent hot wire conducting blocks (1111) have the same length.

2. The hot wire mechanism according to claim 1, wherein: the hot wire fixing assembly (111) further comprises a ceramic insulating block (1113); the ceramic insulating block (1113) is hollow; the ceramic insulating block (1113) is sleeved on the hot wire conducting block (1111), and the bottom of the hot wire conducting block (1111) extends from the bottom of the ceramic insulating block (1113); an insulating pad (1114) is arranged on the top surface of the hot wire conducting block (1111) and is arranged in the ceramic insulating block (1113); a fixing screw (1115) is arranged on the top surface of the insulating pad (1114), and part of the fixing screw (1115) is arranged in the ceramic insulating block (1113) and part of the fixing screw (1115) extends from the top surface of the ceramic insulating block (1113).

3. The hot wire mechanism according to claim 2, wherein: a ring groove (1116) is arranged on the outer wall of the hot wire conducting block (1111), and a spring contact finger (1117) is arranged in the ring groove (1116); the spring contact finger (1117) is arranged in the ceramic insulating block (1113); a fastening screw (1118) is arranged on the part of the hot wire conducting block (1111) extending out of the ceramic insulating block (1113); the fastening screw (1118) is arranged radially along the hot wire conducting block (1111); the fastening screw (1118) is configured to fix the hot wire (1119) in the hot wire fixing hole (1112).

4. A hot wire process chamber employing the hot wire mechanism of claim 1, wherein, The hot wire mechanism comprises: a first chamber and a first upper cover (12) arranged on the top of the first chamber; a fixing plate (121) is arranged on the bottom surface of the first upper cover (12), and a hot wire mechanism (11) is arranged on the bottom surface of the fixing plate (121); the hot wire fixing assemblies (111) in the hot wire mechanism (11) are connected in series and arranged in a continuous S shape; the hot wire mechanism (11) is suitable for heating the first chamber.

5. The hot wire process chamber according to claim 4, wherein: a process gas inlet (13) and a cleaning gas inlet (14) are arranged on the first upper cover (12); the process gas inlet (13) is connected with a first pipeline (131), and the first pipeline (131) is in communication with the inside of the first chamber. The cleaning gas inlet (14) is connected with the second pipeline (141), and the second pipeline (141) is in communication with the inside of the first chamber; The first pipeline (131) and the second pipeline (141) are arranged on the first upper cover (12); The first upper cover (12) is provided with a cooling water outlet (15) and a cooling water inlet (151); The cooling water outlet (15) and the cooling water inlet (151) are connected through a third pipeline (152); The third pipeline (152) is arranged on the first upper cover (12); A conveying assembly is arranged in the first chamber to convey the carrier plate (9) conveyed into the first chamber.

6. A coating apparatus employing the hot wire process chamber of claim 4, wherein It comprises: A feeding mechanism (2), a discharging mechanism (21), and a first deposition part (3), a second deposition part (31) and a third deposition part (32) arranged between the feeding mechanism (2) and the discharging mechanism (21) in sequence; A first sheet turning mechanism (4) is arranged between the first deposition part (3) and the second deposition part (31); A second sheet turning mechanism (41) is arranged between the second deposition part (31) and the third deposition part (32); An entering sheet cavity (5), an exiting sheet cavity (6), and a plurality of groups of preheating cavities (7) and hot wire process cavities (1) are arranged between the first deposition part (3), the second deposition part (31) and the third deposition part (32); The preheating cavities (7) are closer to the entering sheet cavity (5) than the hot wire process cavities (1); The preheating cavities (7) in the next group are connected with the hot wire process cavities (1) in the previous group; The feeding mechanism (2) conveys the carrier plate (9) carrying the silicon wafer (91) to the entering sheet cavity (5) of the first deposition part (3), and after the carrier plate (9) passes through each group of preheating cavities (7) and hot wire process cavities (1) of the first deposition part (3), it is output to the first sheet turning mechanism (4) through the exiting sheet cavity (6) of the first deposition part (3), and after the first sheet turning mechanism (4) turns over the silicon wafer (91) on the carrier plate (9), it is conveyed to the entering sheet cavity (5) of the second deposition part (31), and after the carrier plate (9) passes through each group of preheating cavities (7) and hot wire process cavities (1) of the second deposition part (31), it is output to the second sheet turning mechanism (41) through the exiting sheet cavity (6) of the second deposition part (31), and after the second sheet turning mechanism (41) turns over the silicon wafer (91) on the carrier plate (9), it is conveyed to the entering sheet cavity (5) of the third deposition part (32), and after the carrier plate (9) passes through each group of preheating cavities (7) and hot wire process cavities (1) of the third deposition part (32), it is output through the exiting sheet cavity (6) of the third deposition part (32), and then the carrier plate (9) is taken off by the discharging mechanism (21).

7. The coating equipment of claim 6, wherein: Vacuum door valves (8) are arranged between the entering sheet cavity (5) and the preheating cavity (7), and between the exiting sheet cavity (6) and the hot wire process cavity (1); The entering sheet cavity (5) provided with the vacuum door valve (8) is provided with an atmospheric door valve (81) on the other side; The exiting sheet cavity (6) provided with the vacuum door valve (8) is provided with an atmospheric door valve (81) on the other side.

8. The coating equipment according to claim 6, characterized in that: the sheet feeding chamber (5) and the sheet discharging chamber (6) are identical in structure and each comprises a second upper cover (51), a second chamber (52) and a support (53); the second chamber (52) is arranged on the support (53); the second upper cover (51) is arranged on the top of the second chamber (52); the carrier plate (9) is conveyed into the second chamber (52).

9. The coating equipment according to claim 6, characterized in that: the preheating chamber (7) comprises a preheating chamber (71); the top of the preheating chamber (71) is provided with a corresponding second upper cover (51); a plurality of infrared lamp tubes (72) are arranged in the preheating chamber (71), and the wiring ends (73) of the infrared lamp tubes (72) extend from the side wall of the preheating chamber (71); a corresponding conveying assembly is arranged in the preheating chamber (71) to convey the carrier plate (9) conveyed into the preheating chamber (71); the infrared lamp tubes (72) are located below the carrier plate (9) conveyed in the preheating chamber (71); the infrared lamp tubes (72) are equidistantly arranged along the conveying direction of the carrier plate (9).

10. The coating equipment according to claim 6, characterized in that: the preheating chamber (7) comprises a preheating chamber (71); the top of the preheating chamber (71) is provided with a corresponding second upper cover (51); a plurality of magnetic fluid conveying devices (74) are arranged on the outer wall of the preheating chamber (71); one end of the magnetic fluid conveying device (74) extends into the preheating chamber (71), and a bearing wheel (75) is arranged on the part of the magnetic fluid conveying device (74) extending into the preheating chamber (71); the top of the bearing wheel (75) bears the carrier plate (9); a heating aluminum plate (76) is arranged in the preheating chamber (71) and located below the carrier plate (9) conveyed in the preheating chamber (71); a driving motor (77) is arranged on the outer wall of the preheating chamber (71), and the driving motor (77) is connected to all the magnetic fluid conveying devices (74) through a synchronous belt (78).

Images