Thermal management module for oxygen generator and oxygen generator thereof

Abstract

The utility model discloses an oxygen generator's heat management module and oxygen generator, the oxygen generator is equipped with heat dissipation fan, humidification cup, compressor, heat management module includes heat dissipation air duct, heating / refrigeration module, heat dissipation air duct is provided between heat dissipation fan and compressor, heating / refrigeration module includes semiconductor cooler, refrigeration part, heating part, semiconductor cooler, refrigeration part, heating part. The semiconductor cooler is provided with a cooling surface and a heating surface, the cooling surface of the semiconductor cooler is connected with the cooling part, and at least part of the cooling part is arranged in the heat dissipation air duct; the heating surface of the semiconductor cooler is connected with the heating part, and at least part of the heating part acts on the humidifying cup. The service life of the compressor can be prolonged, formation of condensate water of the system is reduced, the service life of the molecular sieve is prolonged, humidification and heating of oxygen are achieved, user experience is improved at the low using temperature, heat is not wasted, and energy is saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of oxygen generator, specifically relates to heat management module for oxygen generator and oxygen generator thereof. BACKGROUND

[0002] In the field of modern medical treatment and family health care, oxygen generator as an important medical equipment is increasingly widely used. Among them, the molecular sieve oxygen generator is outstanding with its high efficiency and energy saving characteristics, and becomes one of the mainstream ways of making high-purity oxygen. In the working process of the compressor of the traditional oxygen generator, the air temperature at the outlet of the compressor is high, and in order to improve the oxygen production efficiency, the heat dissipation coil is increased before the compressor and the molecular sieve barrel to reduce the temperature of the air entering the molecular sieve barrel. Because the air humidity is greatly affected by temperature, that is, when the air humidity source is stable, the temperature rises and the humidity increases, therefore, when the compressed air enters the heat dissipation coil to be cooled, the water vapor in the air will be precipitated to form water droplets, and the water droplets will eventually enter the molecular sieve barrel, thereby affecting the selective adsorption capacity of the molecular sieve, and too much condensate will cause damage to the molecular sieve structure, and have a great adverse effect on the service life and performance of the molecular sieve.

[0003] The existing oxygen generator uses a heat dissipation fan to directly blow the surface of the compressor in the heat dissipation part of the compressor, and the fan heat dissipation is directly extracted from the air in the oxygen generator environment, so that the temperature of the air supplied to the compressor for heat dissipation is generally equal to or higher than the temperature of the oxygen generator environment, so that the compressor cannot be efficiently cooled, and there is a certain limitation, thereby adversely affecting the service life and performance of the oxygen generator.

[0004] Therefore, how to solve the problem that the use of the existing oxygen generator heat dissipation module has an adverse effect on the service life and performance of the molecular sieve and the oxygen generator has become a research topic of the utility model. SUMMARY

[0005] The utility model aims at providing heat management module for oxygen generator and oxygen generator thereof to improve the heat dissipation efficiency and the service life and performance of the molecular sieve and the oxygen generator.

[0006] In order to achieve the above-mentioned purpose, the utility model discloses a heat management module for oxygen generator, which is arranged in the oxygen generator and has a heat dissipation fan, a humidification cup and a compressor, and the utility model has the following advantages:

[0007] The heat management module comprises a heat dissipation air duct and a heating / cooling module.

[0008] The heat dissipation air duct is arranged between the heat dissipation fan and the compressor.

[0009] The heat / cooling module comprises a semiconductor cooler, a cooling part and a heating part, the semiconductor cooler has a cold surface and a hot surface, the cold surface of the semiconductor cooler is connected with the cooling part, at least part of the cooling part is arranged in the heat dissipation air duct to form a heat dissipation air flow path from the heat dissipation fan to the compressor through the cooling part; the hot surface of the semiconductor cooler is connected with the heating part, and at least part of the heating part acts on the humidifying cup.

[0010] To achieve the above-mentioned purpose, the second aspect of the present application provides an oxygen generator, which has a heat dissipation fan, a humidifying cup, a compressor and the heat management module for the oxygen generator according to the first aspect of the present application.

[0011] The relevant contents of the present application are explained as follows:

[0012] 1. In the above technical solution of the present application, the heat management module for the oxygen generator and the oxygen generator using the heat management module are innovatively designed to solve the problem that the use of the existing oxygen generator heat dissipation module has adverse effects on the service life and performance of the molecular sieve and the oxygen generator itself. The oxygen generator has a heat dissipation fan, a humidifying cup and a compressor. The heat management performance optimization heat management module comprises a heat dissipation air duct and a heat / cooling module. The heat dissipation air duct is arranged between the heat dissipation fan and the compressor. The heat / cooling module comprises a semiconductor cooler, a cooling part and a heating part. The cold surface of the semiconductor cooler is connected with the cooling part. At least part of the cooling part is arranged in the heat dissipation air duct to form a heat dissipation air flow path from the heat dissipation fan to the compressor through the cooling part. The air in the heat dissipation air duct is heat-exchanged after passing through the cooling part to promote rapid cooling of the heat dissipation air. Finally, part of the cold air in the heat dissipation air duct is blown onto the heat dissipation fins of the compressor, and part of the cold air is sucked into the compressor by the compressor heat dissipation fan and then blown onto the heat-generating core components of the compressor. Finally, the compressor is effectively cooled to increase the service life of the compressor, reduce the formation of system condensate and increase the service life of the molecular sieve. The hot surface of the semiconductor cooler is connected with the heating part. At least part of the heating part acts on the humidifying cup. The heat generated by the hot surface is quickly conducted out by the heating part. The humidifying cup is installed on the heating part. The heat is conducted into the humidifying cup by the heating part. Finally, the water in the humidifying cup is heated. When the humidifying cup is working, the oxygen enters the humidifying cup from the humidifying cup inlet, enters the warm water in the humidifying cup and is then discharged from the humidifying cup outlet, so as to realize humidification and heating of the oxygen. The user experience is improved at a lower use temperature. The heat is not wasted, and energy is saved.

[0013] 2. In the above technical solution, the refrigeration part includes a refrigeration base and refrigeration fins, one side surface of the refrigeration base is in contact with the cold surface of the semiconductor refrigerator, and the other side surface of the refrigeration base is arranged with a plurality of refrigeration fins, and the refrigeration fins are placed in the heat dissipation air duct. In this way, a larger heat exchange area is increased, and the heat exchange efficiency is increased.

[0014] 3. In the above technical solution, the heating part includes a heating base and a heating body, one side surface of the heating base is in contact with the heating surface of the semiconductor refrigerator, and the other side surface of the heating base is provided with a heating body.

[0015] 4. In the above technical solution, the heating body includes a first heat conducting member for wrapping the body of the humidification cup and a second heat conducting member arranged on the side of the first heat conducting member, and the first heat conducting member and the second heat conducting member are directly connected with the heating base, so as to improve the heat conduction efficiency.

[0016] 5. In the above technical solution, the first heat conducting member is in a semi-circular ring structure, the second heat conducting member is a sheet structure arranged vertically on the outer circumferential side of the semi-circular ring structure, and the horizontal cross-sectional area of the sheet structure increases from top to bottom to the connection with the heating base. The first heat conducting member in the semi-circular ring structure facilitates the taking and placing of the humidification cup, and the arrangement of the first heat conducting member in the semi-circular ring structure and the second heat conducting member in the sheet structure improves the heating effect.

[0017] 6. In the above technical solution, the cold surface of the semiconductor refrigerator is in direct contact with the refrigeration part, or the cold surface of the semiconductor refrigerator is in contact with the refrigeration part through heat-conducting silicone grease; the heating surface of the semiconductor refrigerator is in direct contact with the heating part, or the heating surface of the semiconductor refrigerator is in contact with the heating part through heat-conducting silicone grease. In this way, the thermal conductivity is increased, and the use effect of the heating / cooling module is improved.

[0018] 7. In the above technical solution, the semiconductor refrigerator is provided with a heat insulation pad on the side, and the refrigeration part and the heating part are isolated by the heat insulation pad. In this way, the heat conduction of the refrigeration part and the heating part is avoided, and the refrigeration effect and the heating effect are offset.

[0019] 8. In the above technical solution, the heat insulation pad has a circumferential side plate and an intermediate opening, in the assembled state of the semiconductor refrigerator and the heat insulation pad, the cold surface of the semiconductor refrigerator is exposed downward and connected with the refrigeration part, the heat surface of the semiconductor refrigerator is exposed upward and connected with the heating part, and the circumferential side plate at least partially covers the part of the refrigeration part and the heating part that exceeds the cold surface and the heat surface in the vertical projection. With this design, the assembly design of the heating / cooling module is more reasonable, and the isolation effect of the refrigeration part and the heating part is very good. As a further preferred, the circumferential side plate completely covers the part of the refrigeration part and the heating part that exceeds the cold surface and the heat surface in the vertical projection, and most preferably, the coverage area of the circumferential side plate exceeds the part of the refrigeration part and the heating part that exceeds the cold surface and the heat surface in the vertical projection.

[0020] 9. In the above technical solution, a temperature sensor is arranged between the semiconductor refrigerator and the heating part, so as to realize adjustable and controllable humidifying cup heating temperature, increase the service life of the TEC semiconductor refrigerator (sheet), and prevent burning.

[0021] 10. In the present application, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication between two elements or the interaction relationship between two elements, unless otherwise specified. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0022] 11. In the present application, the terms "center", "upper", "lower", "axial", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore it cannot be understood as a limitation on the present application.

[0023] 12. In addition, the terms "first", "second", etc. are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0024] Due to the use of the above scheme, the present application has the following advantages and effects compared with the prior art:

[0025] 1. The above-mentioned scheme of the utility model discloses the use of the existing oxygen generator heat dissipation module exists to the molecular sieve and the service life of oxygen generator itself, the use performance produces the problem of adverse effect, and the heat management module for oxygen generator and the oxygen generator using the heat management module of innovative design, the oxygen generator has the heat dissipation fan, humidification cup, compressor, the heat management performance optimization heat management module includes the heat dissipation air duct, heating / cooling module, and the heat dissipation air duct is located between the heat dissipation fan and the compressor, and the heating / cooling module includes semiconductor refrigerator, refrigeration part, heating part, the cold face of semiconductor refrigerator is connected with refrigeration part, and at least part of refrigeration part is placed in the heat dissipation air duct, to form the heat dissipation air flow circulation path from the heat dissipation fan into the heat dissipation air duct and blow to the compressor after heat exchange of refrigeration part, and the air in the heat dissipation air duct is exchanged after refrigeration part, to promote the rapid cooling of heat dissipation air, and finally a part of cold air after the heat dissipation air duct is blown to the heat dissipation fin of compressor, and a part is inhaled by the heat dissipation fan of compressor, and finally blown to the heat generation core component of compressor, finally plays the role of effective cooling of compressor, to increase the service life of compressor, reduce the formation of system condensate, increase the service life of molecular sieve.

[0026] 2. The above-mentioned scheme of the utility model, the heat of heating part is introduced into humidification cup, finally plays the role of heating the water in humidification cup, when humidification cup works, oxygen enters from humidification cup air inlet, and after entering warm water in humidification cup interior, is discharged from humidification cup air outlet, thereby realizing the humidification and heating of oxygen, improving user experience under lower use temperature, and the heat is not wasted, saving energy. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is system schematic diagram of the heat management module for oxygen generator of the utility model embodiment;

[0028] Figure 2 It is three-dimensional schematic diagram of the heat management module for oxygen generator of the utility model embodiment;

[0029] Figure 3 It is the explosion schematic diagram of the heat management module for oxygen generator of the utility model embodiment;

[0030] Figure 4 It is the explosion schematic diagram of the heating / cooling module in the heat management module for oxygen generator of the utility model embodiment;

[0031] Figure 5 It is the section view of the heat management module for oxygen generator of the utility model embodiment;

[0032] Figure 6 It is the three-dimensional schematic diagram of the oxygen generator of the utility model embodiment;

[0033] Figure 7The explosion schematic view of the oxygen generator in the embodiment of the utility model.

[0034] The parts of the above drawings are shown as follows:

[0035] 1 heating / cooling module

[0036] 11 temperature sensor

[0037] 2 semiconductor refrigerator

[0038] 21 cold emitting surface

[0039] 22 heat emitting surface

[0040] 3 refrigeration part

[0041] 31 refrigeration base body

[0042] 32 refrigeration fin

[0043] 4 heating part

[0044] 41 heating base body

[0045] 42 heating action body

[0046] 421 first heat conducting member

[0047] 422 second heat conducting member

[0048] 5 heat insulation pad

[0049] 51 circumferential side plate

[0050] 52 middle opening

[0051] 6 heat dissipation air duct

[0052] 61 air inlet

[0053] 62 air outlet

[0054] 7 heat dissipation fan

[0055] 8 humidification cup

[0056] 81 air inlet

[0057] 82 air outlet

[0058] 9 compressor

[0059] 91 compressor fan DETAILED DESCRIPTION

[0060] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0061] This invention aims to solve the problem that the use of existing oxygen generator heat dissipation modules has an adverse effect on the service life and performance of molecular sieves and oxygen generators themselves. It innovatively designs a heat management module for oxygen generators and an oxygen generator using the heat management module, thereby increasing the compressor life, reducing the formation of condensate in the system, and increasing the service life of molecular sieves.

[0062] Example 1, as Figures 1 to 5 As shown, Embodiment 1 of this utility model discloses a thermal management module for an oxygen concentrator. The oxygen concentrator includes a cooling fan 7, a humidification cup 8, and a compressor 9. The thermal management module includes a heat dissipation duct 6 and a heating / cooling module 1. The heat dissipation duct 6 is located between the cooling fan 7 and the compressor 9. The heating / cooling module 1 includes a semiconductor cooler 2, a cooling section 3, and a heating section 4. The semiconductor cooler 2 has a cooling surface 21 and a heating surface 22. The cooling surface 21 of the semiconductor cooler 2 is connected to the cooling section 3. At least a portion of the cooling section 3 is placed in the heat dissipation duct 6, thus forming a heat dissipation airflow path from the cooling fan 7 into the heat dissipation duct 6, where it is heat-exchanged by the cooling section 3 and then blown towards the compressor 9. The heating surface 22 of the semiconductor cooler 2 is connected to the heating section 4, and at least a portion of the heating section 4 acts on the humidification cup 8.

[0063] Through the implementation of the embodiment one of the utility model, in the heat management performance optimization heat management module, including heat dissipation air duct 6, heat / refrigeration module 1, heat dissipation air duct 6 is located between heat dissipation fan 7 and compressor 9, heat / refrigeration module 1 includes semiconductor refrigerator 2, refrigeration part 3, heating part 4, the cold face 21 of semiconductor refrigerator 2 is connected with refrigeration part 3, at least part of refrigeration part 3 is placed in heat dissipation air duct 6, to form the heat dissipation air flow circulation path that enters from heat dissipation fan 7 into heat dissipation air duct 6 and is blown to compressor 9 after heat exchange by refrigeration part 3, the air in heat dissipation air duct 6 is heat exchanged after passing through refrigeration part 3, to promote the rapid cooling of heat dissipation air, finally a part of cold air after heat dissipation air duct 6 is blown to the heat dissipation fin of compressor 9, a part is inhaled by heat dissipation fan 7 of compressor 9, is finally blown to the heat generation core component of compressor 9, finally plays the role of effective cooling of compressor 9, to increase the service life of compressor 9, reduce system condensate formation, increase the service life of molecular sieve;The heating face 22 of semiconductor refrigerator 2 is connected with heating part 4, at least part of heating part 4 acts on humidifying cup 8, the heat generated by heating face 22 is quickly exported by heating part 4, and humidifying cup 8 is installed on heating part 4, the heat is imported into humidifying cup 8 by heating part 4, finally plays the role of heating water in humidifying cup 8, when humidifying cup 8 works, oxygen enters from humidifying cup 8 air inlet 81, is discharged from humidifying cup 8 air outlet 82 after entering warm water in humidifying cup 8 interior, to realize the humidification and heating of oxygen.

[0064] In the above-mentioned embodiment one of the utility model, the refrigeration part 3 includes refrigeration base body 31, refrigeration fin 32, one side surface of the refrigeration base body 31 is in contact with the cold face 21 of the semiconductor refrigerator 2, a plurality of refrigeration fins 32 are arranged on the other side surface of the refrigeration base body 31, and the refrigeration fin 32 is placed in the heat dissipation air duct 6. To increase the larger heat exchange area, increase the heat exchange efficiency.

[0065] In the above-mentioned embodiment one of the utility model, the heating part 4 includes heating base body 41, heating action body 42, one side surface of the heating base body 41 is in contact with the heating face 22 of the semiconductor refrigerator 2, and the heating action body 42 is arranged on the other side surface of the heating base body 41.

[0066] In the above-mentioned embodiment one of the utility model, the heating action body 42 includes a first heat-conducting member 421 for wrapping a cup body of the humidifying cup 8 and a second heat-conducting member 422 arranged on a circumferential side of the first heat-conducting member 421, and the first heat-conducting member 421 and the second heat-conducting member 422 are directly connected with the heating base body 41, so as to improve the heat conduction efficiency.

[0067] Specifically, the first heat-conducting member 421 is in a semi-circular ring structure, the second heat-conducting member 422 is in a sheet structure vertically arranged on the outer circumferential side of the semi-circular ring structure, and the horizontal cross-sectional area of the sheet structure gradually increases from the top to the connecting position of the heating base 41. The first heat-conducting member 421 in the semi-circular ring structure facilitates the taking and placing of the humidification cup 8, and the arrangement of the first heat-conducting member 421 in the semi-circular ring structure and the second heat-conducting member 422 in the sheet structure improves the heating effect.

[0068] In the above embodiment one of the utility model, the cold emitting surface 21 of the semiconductor refrigerator 2 is directly in contact with the refrigeration part 3, or the cold emitting surface 21 of the semiconductor refrigerator 2 is in contact with the refrigeration part 3 through heat-conducting silicone grease;The heating surface 22 of the semiconductor refrigerator 2 is directly in contact with the heating part 4, or the heating surface 22 of the semiconductor refrigerator 2 is in contact with the heating part 4 through heat-conducting silicone grease. The heat-conducting rate is increased by this arrangement, and the use effect of the heating / cooling module 1 is improved.

[0069] In the above embodiment one of the utility model, the circumferential side of the semiconductor refrigerator 2 is provided with the heat insulation pad 5, and the refrigeration part 3 and the heating part 4 are isolated by the heat insulation pad 5. In this way, the heat conduction of the refrigeration part 3 and the heating part 4 is avoided, and the refrigeration effect and the heating effect are not offset.

[0070] Further, the heat insulation pad 5 has a circumferential plate 51 and an intermediate aperture 52, in the assembled state of the semiconductor refrigerator 2 and the heat insulation pad 5, the cold emitting surface 21 of the semiconductor refrigerator 2 is exposed downward and connected with the refrigeration part 3, the heating surface 22 of the semiconductor refrigerator 2 is exposed upward and connected with the heating part 4, and the circumferential plate 51 at least partially covers the parts of the refrigeration part 3 and the heating part 4 that project beyond the cold emitting surface 21 and the heating surface 22 in vertical projection. This design makes the assembly design of the heating / cooling module 1 more reasonable, and the isolation effect of the refrigeration part 3 and the heating part 4 is also very good. As a further preferred, the circumferential plate 51 completely covers the parts of the refrigeration part 3 and the heating part 4 that project beyond the cold emitting surface 21 and the heating surface 22 in vertical projection, and most preferably, the coverage area of the circumferential plate 51 exceeds the parts of the refrigeration part 3 and the heating part 4 that project beyond the cold emitting surface 21 and the heating surface 22 in vertical projection.

[0071] In the above embodiment one of the utility model, the temperature sensor 11 is arranged between the semiconductor refrigerator 2 and the heating part 4, so that the heating temperature of the humidification cup 8 can be adjusted and controlled, the service life of the TEC semiconductor refrigerator 2 is increased, and the burning of the TEC semiconductor refrigerator 2 is prevented.

[0072] In the above embodiment one of the utility model, the temperature sensor 11 is arranged between the semiconductor refrigerator 2 and the heating part 4, so that the heating temperature of the humidification cup 8 can be adjusted and controlled, the service life of the TEC semiconductor refrigerator 2 is increased, and the burning of the TEC semiconductor refrigerator 2 is prevented. Figure 6 , Figure 7The utility model discloses a kind of oxygen generator, the oxygen generator has heat dissipation fan 7, humidification cup 8, compressor 9 and the heat management module of the oxygen generator described in utility model embodiment one in it, the heat management module includes heat dissipation air duct 6, heating / cooling module 1, the outlet of the heat dissipation air duct 6 of the heat management module is towards the compressor 9.

[0073] Embodiment three, the utility model discloses a kind of oxygen generator, the oxygen generator has heat dissipation fan 7, humidification cup 8, compressor 9 and heat management module, the heat management module includes heat dissipation air duct 6, heating / cooling module 1, the outlet of the heat dissipation air duct 6 of the heat management module is towards the compressor 9.

[0074] Heating / cooling module 1 includes semiconductor refrigerator 2, refrigeration part 3, heating part 4.

[0075] Semiconductor refrigerator 2, semiconductor refrigerator 2 uses TEC semiconductor refrigerating sheet, the semiconductor refrigerator 2 has cold face 21 located below and heating face 22 located below, temperature sensor 11 is provided on heating face 22.

[0076] Refrigeration part 3, refrigeration part 3 includes refrigeration base body 31, refrigeration fin 32, one side surface of the refrigeration base body 31 is in contact with the cold face 21 of the semiconductor refrigerator 2, another side surface of the refrigeration base body 31 is arranged with a plurality of refrigeration fins 32, and the refrigeration fin 32 is placed in the heat dissipation air duct 6. The cold face 21 of the semiconductor refrigerator 2 is directly in contact with the refrigeration part 3.

[0077] Heating part 4, the heating part 4 includes heating base body 41, heating action body 42, one side surface of the heating base body 41 is in contact with the heating face 22 of the semiconductor refrigerator 2, another side surface of the heating base body 41 is provided with heating action body 42;The heating action body 42 includes first heat-conducting member 421 for wrapping the cup body of humidification cup 8 and second heat-conducting member 422 arranged on the circumferential side of the first heat-conducting member 421, and the first heat-conducting member 421 and the second heat-conducting member 422 are directly connected with the heating base body 41;The first heat-conducting member 421 is semicircular ring structure, the second heat-conducting member 422 is sheet structure arranged vertically on the outer circumferential side of semicircular ring structure, and the horizontal cross-sectional area of the sheet structure increases from top to the connection with the heating base body 41 in turn. The heating face 22 of the semiconductor refrigerator 2 is directly in contact with the heating part 4.

[0078] Specific assembly and working process refer to the following:

[0079] The heating / cooling module 1 is assembled with the heat dissipation air duct 6 through screw fasteners, the heat dissipation fan 7 is assembled with the heat dissipation air duct 6 through buckles on the heat dissipation air duct 6, and the heat dissipation air duct 6 is assembled with the sound insulation cavity through screw fasteners. The air inlet 61 of the heat dissipation air duct 6 is communicated with the heat dissipation fan 7, and the air outlet 62 is opposite to the compressor 9. The heat dissipation fan 7 blows air into the heat dissipation air duct 6, and the air in the heat dissipation air duct 6 is cooled by the refrigeration part 3 and then blown to the upper side of the compressor 9. Part of the cold air directly blows on the heat dissipation fins of the compressor 9, and part of the cold air is sucked into the compressor 9 by the compressor fan 91 to cool the core heat generating components of the compressor 9.

[0080] In the heating / cooling module 1, the temperature sensor 11 is arranged between the semiconductor refrigerator 2 (TEC semiconductor refrigeration sheet) and the heating sheet module to monitor the temperature of the heat generating surface 22 of the TEC semiconductor module in real time. When the temperature reaches the set gear temperature, the TEC semiconductor module is powered off to stop heating, otherwise the TEC semiconductor module continues to heat, thereby realizing stable control of different gears and different temperatures.

[0081] The humidification cup 8 is placed in the groove of the whole machine shell, the inner wall of the groove is the heating part 4, and the outer side is fixed with the humidification cup 8 through the elastic band to prevent falling off. When the whole machine works, the water in the humidification cup 8 is heated directly by the heating part 4. When the humidification cup 8 works, oxygen enters the humidification cup 8 from the air inlet 81 of the humidification cup 8, enters the warm water in the humidification cup 8, and then is discharged from the air outlet 82 of the humidification cup 8, so as to realize humidification and heating of oxygen.

[0082] Through the implementation of the above detailed embodiments, the following advantages are achieved:

[0083] 1. The semiconductor refrigerator 2 (TEC semiconductor refrigeration sheet) can efficiently and quickly refrigerate, and the effect is remarkable.

[0084] 2. The refrigeration surface of the semiconductor refrigerator 2 (TEC semiconductor refrigeration sheet) is used to manufacture cold air flow heat dissipation, and the heating surface is used for heating the humidification cup 8.

[0085] 3. The temperature sensor 11 is added to adjust the cooling / heating temperature according to the requirement, and the semiconductor refrigerator 2 (TEC semiconductor refrigeration sheet) is prevented from being burned due to poor heat dissipation of the heating surface, and the service life is increased.

[0086] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A heat management module for an oxygen generator, configured for an oxygen generator having a heat dissipation fan (7), a humidification cup (8), and a compressor (9), characterized in that: the heat management module comprises a heat dissipation air duct (6) and a heating / cooling module (1); the heat dissipation air duct (6) is arranged between the heat dissipation fan (7) and the compressor (9); the heating / cooling module (1) comprises a semiconductor cooler (2), a cooling part (3), and a heating part (4), the semiconductor cooler (2) has a cold face (21) and a hot face (22), the cold face (21) of the semiconductor cooler (2) is connected with the cooling part (3), at least part of the cooling part (3) is arranged in the heat dissipation air duct (6), thereby forming a heat dissipation air flow path from the heat dissipation fan (7) into the heat dissipation air duct (6), heat exchanged by the cooling part (3), and then blown to the compressor (9); the hot face (22) of the semiconductor cooler (2) is connected with the heating part (4), and at least part of the heating part (4) acts on the humidification cup (8). the cooling part (3) comprises a cooling base (31) and a plurality of cooling fins (32), one side surface of the cooling base (31) is in contact with the cold face (21) of the semiconductor cooler (2), and the other side surface of the cooling base (31) is arranged with the plurality of cooling fins (32), and the cooling fins (32) are arranged in the heat dissipation air duct (6). the heating part (4) comprises a heating base (41) and a heating acting body (42), one side surface of the heating base (41) is in contact with the hot face (22) of the semiconductor cooler (2), and the other side surface of the heating base (41) is provided with the heating acting body (42). the heating acting body (42) comprises a first heat conducting member (421) for wrapping a cup body of the humidification cup (8) and a second heat conducting member (422) arranged on a side of the first heat conducting member (421), and the first heat conducting member (421) and the second heat conducting member (422) are directly connected with the heating base (41).

2. The thermal management module for an oxygen generator of claim 1, wherein: the first heat conducting member (421) has a semi-circular ring structure, the second heat conducting member (422) has a sheet structure arranged vertically on an outer circumferential side of the semi-circular ring structure, and a horizontal cross-sectional area of the sheet structure gradually increases from top to a connection position with the heating base (41).

3. The thermal management module for an oxygen generator of claim 1, wherein: the cold face (21) of the semiconductor cooler (2) is in direct abutting contact with the cooling part (3), or the cold face (21) of the semiconductor cooler (2) is in contact with the cooling part (3) through heat-conducting silicone grease; the hot face (22) of the semiconductor cooler (2) is in direct abutting contact with the heating part (4), or the hot face (22) of the semiconductor cooler (2) is in contact with the heating part (4) through heat-conducting silicone grease.

4. The thermal management module for an oxygen generator of claim 3, wherein: a heat insulation pad (5) is arranged on a side of the semiconductor cooler (2), and the cooling part (3) and the heating part (4) are isolated by the heat insulation pad (5).

5. The thermal management module for an oxygen generator of claim 4, wherein: ​ 6. The thermal management module for an oxygen generator of claim 1, wherein: ​ 7. The thermal management module for an oxygen generator of claim 1, wherein: ​ 8. The thermal management module for an oxygen generator of claim 7, wherein: The heat insulation pad (5) has a peripheral side plate (51) and an intermediate opening (52), in the assembled state of the semiconductor refrigerator (2) and the heat insulation pad (5), the cold emitting surface (21) of the semiconductor refrigerator (2) is connected to the refrigeration part (3) after being exposed downward, the heat emitting surface (22) of the semiconductor refrigerator (2) is connected to the heating part (4) after being exposed upward, and the peripheral side plate (51) at least partially covers the parts of the refrigeration part (3) and the heating part (4) which project beyond the cold emitting surface (21) and the heat emitting surface (22) in the vertical projection.

9. The thermal management module for an oxygen generator of claim 1, wherein: A temperature sensor (11) is arranged between the semiconductor refrigerator (2) and the heating part (4).

10. An oxygen generator, characterized by: The oxygen generator has a heat dissipation fan (7), a humidifying cup (8), a compressor (9), and the heat management module for the oxygen generator according to any one of claims 1 to 9, and the outlet of the heat dissipation air duct (6) of the heat management module faces the compressor (9).

Images