Cooling device for semiconductor processing

Abstract

The utility model discloses a cooling device for semiconductor processing, relates to the technical field of semiconductor processing, and solves the problems that dust attached to a semiconductor due to processing falls down when the cooling device sprays water to the semiconductor, the adhesive force of the dust is enhanced after the dust meets water, the dust is accumulated after long-term use, and the service life of the semiconductor is prolonged. The cooling device comprises a U-shaped seat and a conveying belt, the conveying belt is installed in the U-shaped seat through a driving pipe, the position of the conveying belt is obliquely arranged, a second installation frame is fixedly installed at the upper end of the U-shaped seat, the second installation frame is in a U shape, and the second installation frame is arranged on the U-shaped seat. The positions of a conveying belt and an aluminum filter plate are inclined, so that when a semiconductor is movably cooled and a spraying pipe is used for spraying, sprayed water can enter a water tank through the conveying belt, and meanwhile, a scraping plate can scrape off dust and other impurities attached to the surface of the conveying belt.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, specifically is cooling device for semiconductor processing. BACKGROUND

[0002] Semiconductor refers to the material that the electric performance is between conductor and insulator at normal temperature, needs to carry out cooling work after processing, searches, and the patent of Chinese patent announcement No.

[0003] But this cooling device through the water spray to the semiconductor, will make the dust that the semiconductor is attached because of processing fall down, make the dust after water's adhesion force enhance, long -term use can form the accumulation, thereby reduced the use efficiency of this cooling device. UTILITY MODEL CONTENTS

[0004] In view of the prior art deficiency, the utility model provides a cooling device for semiconductor processing, solves the problem that the cooling device through the water spray to the semiconductor, will make the dust that the semiconductor is attached because of processing fall down, make the dust after water's adhesion force enhance, long -term use can form the accumulation, thereby reduced the use efficiency of this cooling device.

[0005] In order to achieve the above object, the utility model discloses a cooling device for semiconductor processing, including U-shaped seat and conveyer belt, the conveyer belt is installed in the inside of U-shaped seat through drive pipe, and the position of conveyer belt is inclined and is arranged, the upper end fixed mounting of U-shaped seat has the second mounting bracket, the second mounting bracket is U-shaped, the upper end fixed mounting of second mounting bracket has the connecting pipe in the inside, the connecting pipe is connected with the water source outside, the inside fixed mounting of second mounting bracket has the water inlet pipe, the lower end fixed connection of connecting pipe is through the inside of the side wall of second mounting bracket and the upper end of water inlet pipe, the inside equal interval fixed mounting of the bottom surface of water inlet pipe has a plurality of sprinkling pipes, the left end side wall fixed mounting of U-shaped seat has the water tank, the upper end of water tank is the opening, and the left end inside fixed mounting of U-shaped seat has the scraper, the scraper is inclined, the right end side wall of scraper is attached with the left end side wall of conveyer belt, and the right end of scraper is in the inside of the opening of water tank.

[0006] Preferably, the upper end of the U-shaped seat is fixedly installed with a first mounting bracket, the first mounting bracket is U-shaped, the upper end of the first mounting bracket is fixedly installed with an air cooler, the inside of the first mounting bracket is fixedly installed with an air inlet pipe, the inside of the bottom surface of the air inlet pipe is fixedly installed with a plurality of exhaust pipes at equal intervals, the upper end of the air inlet pipe is fixedly installed with a fixed pipe, and the upper end of the fixed pipe is fixedly connected with the air outlet of the air cooler through the inside of the first mounting bracket, so that the semiconductor passing below can be conveniently cooled by blowing.

[0007] Preferably, the inside of the U-shaped seat is slidably connected with a filter plate, and the filter plate is arranged above the conveyer belt, the top surface of the filter plate is fixedly installed with a threaded pipe, the inside of the top surface of the first mounting bracket is rotatably connected with a screw rod, and the lower end of the screw rod is threadedly connected in the inside of the threaded pipe, so that the position of the filter plate can be adjusted, and the position of the semiconductor can be prevented from deviating when the semiconductor is cooled by blowing.

[0008] Preferably, the position of the filter plate is inclined and parallel to the position of the conveyer belt, and the positions of the threaded pipe and the screw rod are both perpendicular to the first mounting bracket, so that the filter plate after position adjustment can be prevented from hindering the movement of the semiconductor.

[0009] Preferably, the right end of the U-shaped seat is fixedly installed with a storage frame, and the top surface of the storage frame is horizontal with the right side bottom surface of the conveyer belt, so that the semiconductor after cooling can enter into the inside of the storage frame, and collection can be facilitated.

[0010] Preferably, the top surface of the U-shaped seat is higher than the top surface of the conveyer belt, so that the semiconductor can be completely protected.

[0011] The utility model provides a cooling device for semiconductor processing. Have the following beneficial effect:

[0012] 1. The cooling device for semiconductor processing, when the cooling device for semiconductor processing is used, the position of the transmission belt and the aluminum filter plate is inclined, when the semiconductor is moved and cooled, the sprayed water can enter the inside of the water tank through the transmission belt, and the scraper can scrape the dust and impurities attached to the surface of the transmission belt.

[0013] 2. The cooling device for semiconductor processing, when the cooling device for semiconductor processing is used, the position height of the filter plate can be adjusted by the cooperation between the filter plate and the air cooler, so that the position of the placed semiconductor is prevented from being offset when the semiconductor is blown by the cold air. BRIEF DESCRIPTION OF DRAWINGS

[0014] Fig. 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Fig. 2 It is a side view of the utility model;

[0016] Fig. 3 It is a schematic diagram of the air cooler structure of the utility model.

[0017] In the figure, 1-U-shaped seat, 2-first mounting frame, 3-filter plate, 4-conveying belt, 5-water tank, 6-scraper, 7-screw, 8-air cooler, 9-second mounting frame, 10-water inlet pipe, 11-connection pipe, 12-spraying pipe, 13-storage frame, 14-threaded pipe, 15-air inlet pipe, 16-exhaust pipe, 17-fixed pipe. DETAILED DESCRIPTION

[0018] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0019] Embodiment 1

[0020] Please refer to Figs. 1-3The utility model embodiment provides cooling device for semiconductor processing, including U shape seat 1 and conveyer belt 4, conveyer belt 4 passes through drive pipe and is installed in the inside of U shape seat 1, and the position of conveyer belt 4 is inclined setting, the upper end fixed mounting of U shape seat 1 has second mounting bracket 9, and second mounting bracket 9 is U shape, and the upper end inside fixed mounting of second mounting bracket 9 has connecting pipe 11, and connecting pipe 11 is connected with the water source of outside, and the inside fixed mounting of second mounting bracket 9 has inlet pipe 10, and the lower end of connecting pipe 11 is fixedly connected with the upper end of inlet pipe 10 through the side wall inside of second mounting bracket 9, and the bottom surface inside equal interval fixed mounting of inlet pipe 10 has a plurality of spray pipes 12, and the left end side wall of U shape seat 1 is fixedly installed with water tank 5, and the upper end of water tank 5 is open, and the left end inside fixed mounting of U shape seat 1 has scraper 6, and scraper 6 is inclined, and the right end side wall of scraper 6 is attached with the left end side wall of conveyer belt 4, and the right end of scraper 6 is in the inside of the opening of water tank 5, and the right end fixed mounting of U shape seat 1 has storage frame 13, and the top surface of storage frame 13 is horizontal with the right side bottom surface of conveyer belt 4, and the top surface of U shape seat 1 is higher than the top surface of conveyer belt 4, when carrying out cooling work to semiconductor, place semiconductor on conveyer belt 4 one by one, then, make conveyer belt 4 rotate through drive device, can make semiconductor move on conveyer belt 4, and connecting pipe 11 and the drain pipe of water source have been connected at this time, make water source enter to the inside of inlet pipe 10 through connecting pipe 11, and make water enter to the inside of spray pipe 12 using inlet pipe 10, make spray pipe 12 spray water to semiconductor moving below simultaneously, can carry out cooling work, because the position of conveyer belt 4 is inclined, can make water flow through conveyer belt 4 and scraper 6 and enter to the inside of water tank 5, then, when conveyer belt 4 rotates, can make scraper 6 scrape the side wall, can prevent dust and impurities generated and adhere on the side wall of conveyer belt 4.

[0021] Example 2

[0022] In order to facilitate the blowing cooling work of semiconductor, in the embodiment, as shown in Figs. 2-3As shown, the upper end of the U-shaped seat 1 is fixedly installed with a first mounting frame 2, the first mounting frame 2 is U-shaped, the upper end of the first mounting frame 2 is fixedly installed with a cold air machine 8, the inside of the first mounting frame 2 is fixedly installed with an air inlet pipe 15, the bottom surface of the air inlet pipe 15 is fixedly installed with a plurality of air outlet pipes 16 at equal intervals, the upper end of the air inlet pipe 15 is fixedly installed with a fixed pipe 17, the upper end of the fixed pipe 17 is fixedly connected with the air outlet of the cold air machine 8 through the inside of the first mounting frame 2, the inside of the U-shaped seat 1 is slidably connected with a filter plate 3, and is arranged above the conveying belt 4, the top surface of the filter plate 3 is fixedly installed with a threaded pipe 14, the inside of the top surface of the first mounting frame 2 is rotatably connected with a screw rod 7, the lower end of the screw rod 7 is threadedly connected with the inside of the threaded pipe 14, the position of the filter plate 3 is inclined and parallel to the position of the conveying belt 4, and the positions of the threaded pipe 14 and the screw rod 7 are both perpendicular to the first mounting frame 2, the position of the filter plate 3 is adjusted according to the position of the top surface of the semiconductor placed on the conveying belt 4, the screw rod 7 is rotated to drive the threaded pipe 14 to adjust up and down, the distance between the bottom surface of the filter plate 3 and the conveying belt 4 is matched with the thickness of the semiconductor, then the cold air machine 8 is turned on, the blown cold air enters the inside of the air outlet pipe 16 through the fixed pipe 17, so that the semiconductor can be cooled by the air outlet pipe 16.

[0023] It should be noted that in this embodiment, when the cooling device for semiconductor processing is used, as shown, Figs. 1-3 the semiconductor is placed on the conveying belt 4 one by one, the position of the filter plate 3 is adjusted according to the position of the top surface of the semiconductor placed on the conveying belt 4, the screw rod 7 is rotated to drive the threaded pipe 14 to adjust up and down, the distance between the bottom surface of the filter plate 3 and the conveying belt 4 is matched with the thickness of the semiconductor, then the conveying belt 4 is rotated by the driving device, so that the semiconductor can move on the conveying belt 4, then the cold air machine 8 is turned on, the blown cold air enters the inside of the air outlet pipe 16 through the fixed pipe 17, so that the semiconductor can be cooled by the air outlet pipe 16, and at this time the connecting pipe 11 is connected with the drain pipe of the water source, so that the water source enters the inside of the water inlet pipe 10 through the connecting pipe 11, and the water inlet pipe 10 makes the water enter the inside of the spray pipe 12, at the same time the spray pipe 12 sprays water on the semiconductor below to cool it, because the position of the conveying belt 4 is inclined, the water flow can enter the inside of the water tank 5 through the conveying belt 4 and the scraper 6, then when the conveying belt 4 rotates, the scraper 6 can scrape the side wall to prevent dust and impurities from adhering to the side wall of the conveying belt 4, and the cooled semiconductor enters the inside of the storage frame 13 through the conveying belt 4, so that it can be collected.

[0024] The basic principle and main features of the present application and the advantages of the present application are shown and described above. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

[0025] In addition, it should be understood that, although the present application is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand.

Claims

1. A cooling device for semiconductor processing, characterized in that: Includes a U-shaped base (1) and a conveyor belt (4). The conveyor belt (4) is installed inside the U-shaped base (1) via a drive pipe, and the position of the conveyor belt (4) is inclined. A second mounting bracket (9) is fixedly installed at the upper end of the U-shaped base (1). The second mounting bracket (9) is U-shaped. A connecting pipe (11) is fixedly installed inside the upper end of the second mounting bracket (9). The connecting pipe (11) is connected to an external water source. A water inlet pipe (10) is fixedly installed inside the second mounting bracket (9). The lower end of the connecting pipe (11) is connected through a through-hole. The upper end of the water inlet pipe (10) is fixedly connected to the inside of the side wall of the second mounting bracket (9). Multiple spray pipes (12) are fixedly installed at equal intervals inside the bottom surface of the water inlet pipe (10). A water tank (5) is fixedly installed on the left side wall of the U-shaped seat (1). The upper end of the water tank (5) is open. A scraper (6) is fixedly installed inside the left end of the U-shaped seat (1). The scraper (6) is inclined. The right side wall of the scraper (6) is in contact with the left side wall of the conveyor belt (4). The right end of the scraper (6) is inside the opening of the water tank (5).

2. The cooling device for semiconductor processing according to claim 1, characterized in that: The upper end of the U-shaped base (1) is fixedly installed with a first mounting bracket (2). The first mounting bracket (2) is U-shaped. The upper end of the first mounting bracket (2) is fixedly installed with a cooler (8). The inside of the first mounting bracket (2) is fixedly installed with an air inlet pipe (15). The bottom surface of the air inlet pipe (15) is fixedly installed with multiple exhaust pipes (16) at equal intervals. The upper end of the air inlet pipe (15) is fixedly installed with a fixing pipe (17). The upper end of the fixing pipe (17) is fixedly connected to the air outlet of the cooler (8) through the inside of the first mounting bracket (2).

3. The cooling device for semiconductor processing according to claim 2, characterized in that: The U-shaped seat (1) is slidably connected to a filter plate (3) and is positioned above the conveyor belt (4). A threaded tube (14) is fixedly installed on the top surface of the filter plate (3). A screw (7) is rotatably connected to the top surface of the first mounting bracket (2). The lower end of the screw (7) is threadedly connected to the inside of the threaded tube (14).

4. The cooling device for semiconductor processing according to claim 3, characterized in that: The filter plate (3) is tilted and parallel to the position of the conveyor belt (4), and the positions of the threaded tube (14) and the screw (7) are both perpendicular to the first mounting frame (2).

5. The cooling device for semiconductor processing according to claim 1, characterized in that: A storage frame (13) is fixedly installed on the right end of the U-shaped seat (1), and the top surface of the storage frame (13) is horizontal to the bottom right side of the conveyor belt (4).

6. The cooling apparatus for semiconductor processing according to claim 1, characterized in that: The top surface of the U-shaped seat (1) is higher than the top surface of the conveyor belt (4).

Images