Efficient vapor chamber
By optimizing the structure of the capillary guide column and the support column, the problem of high flow resistance of gaseous heat transfer medium in existing heat exchange plates was solved, and the heat dissipation efficiency was improved.
Patent Information
- Application Number
- CN202520008144.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-02
AI Technical Summary
The existing heat spreader has a circular cross-section for the capillary guide column, which results in high flow resistance of the gaseous heat transfer medium and affects its heat dissipation capacity.
The capillary guide column is designed with a cross-sectional length greater than its width, and the flow direction is consistent with the flow direction of the gaseous heat transfer medium. It adopts a spindle-shaped or elliptical cross-sectional structure, and the cross-section of the support column is also designed to be streamlined to reduce resistance. The capillary guide column and the support column are fixed by plug-in connection.
This effectively reduces the resistance of the capillary guide columns and support columns to the gaseous heat transfer medium, thereby improving the heat dissipation capacity of the heat spreader.
Smart Images

Figure CN223691571U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a uniform temperature plate, especially a high -efficient uniform temperature plate. BACKGROUND
[0002] Electronic equipment such as mobile phone usually adopts uniform temperature plate to radiate heat, and some existing uniform temperature plates include a plate body, a support column, a heat transfer working medium and a capillary flow guide column, the accommodating cavity of the plate body has two oppositely arranged heat conduction cavity walls, the support column supports the two heat conduction cavity walls, the cavity wall of the accommodating cavity is provided with a capillary layer, the heat transfer working medium is filled in the accommodating cavity, and the capillary flow guide column is connected between the capillary layers of the two heat conduction cavity walls. When working, the heat source contacts the plate body, the liquid heat transfer working medium in the capillary layer of the partial area of the heat conduction cavity wall of the evaporation side is vaporized, and then the gaseous heat transfer working medium flows, disperses and contacts the capillary layer of the heat conduction cavity wall of the condensation side in the accommodating cavity to be liquefied and release heat, and the liquefied heat transfer working medium flows to the evaporation side through the capillary layer. At present, the cross section of the capillary flow guide column is circular, which generates great resistance to the flow of the gaseous heat transfer working medium, and affects the heat dissipation capacity of the uniform temperature plate. SUMMARY
[0003] The utility model discloses at least one of the technical problems existing in the prior art. To this end, the utility model provides a high -efficient uniform temperature plate, which can reduce the influence of the capillary flow guide column on the flow of the gaseous heat transfer working medium.
[0004] The high -efficient uniform temperature plate according to the utility model embodiment, including plate body, support column, heat transfer working medium and capillary flow guide column. The plate body is provided with the accommodating cavity, and the accommodating cavity has two oppositely arranged heat conduction cavity walls, and the cavity wall of the accommodating cavity is provided with a capillary layer;The support column is arranged in the plate body and located in the accommodating cavity, and the support column is located between the two heat conduction cavity walls, and the two ends of the support column are connected with the two heat conduction cavity walls one by one;The heat transfer working medium is arranged in the accommodating cavity;The capillary flow guide column is arranged in the plate body and located in the accommodating cavity, and the capillary flow guide column is located between the two heat conduction cavity walls, and the two ends of the capillary flow guide column are connected with the capillary layer on the two heat conduction cavity walls one by one, and the cross section length size of the capillary flow guide column is greater than the width size, and the cross section length direction of at least part of the capillary flow guide column is the flow direction of the gaseous heat transfer working medium.
[0005] The high -efficient uniform temperature plate according to the utility model embodiment has at least the following beneficial effects: the cross section length size of the capillary flow guide column is greater than the width size, and the cross section length direction of the capillary flow guide column is the flow direction of the gaseous heat transfer working medium, so that when the gaseous heat transfer working medium flows and disperses in the accommodating cavity, the resistance of the capillary flow guide column to the gaseous heat transfer working medium can be reduced, and the heat dissipation capacity of the uniform temperature plate can be improved.
[0006] According to some embodiments of the present application, the cross-sectional width dimension of the capillary flow guide column first increases and then decreases along the length direction thereof, and the cross-section of the capillary flow guide column is in the shape of a shuttle or an ellipse.
[0007] According to some embodiments of the present application, the plate body is provided with a first plug-in part, the first plug-in part is located on one of the heat conduction cavity walls, one end of the capillary flow guide column is provided with a first matching part, the first plug-in part is plug-in matched with the first matching part, and the other end of the capillary flow guide column is abutted on the capillary layer on the other heat conduction cavity wall.
[0008] According to some embodiments of the present application, the capillary flow guide column is in the shape of a cone, and one end of the capillary flow guide column away from the first plug-in part is a small end.
[0009] According to some embodiments of the present application, a plurality of capillary flow guide columns are arranged, and all the capillary flow guide columns are uniformly arranged around the central axis of the accommodating cavity, and the cross-sectional length direction of the capillary flow guide column is towards the central axis of the accommodating cavity.
[0010] According to some embodiments of the present application, the cross-sectional length dimension of the support column is greater than the width dimension, and the cross-sectional length direction of at least part of the support column is the flow direction of the gaseous heat transfer working medium.
[0011] According to some embodiments of the present application, the cross-sectional width dimension of the support column first increases and then decreases along the length direction thereof, and the cross-section of the capillary flow guide column is in the shape of a shuttle or an ellipse.
[0012] According to some embodiments of the present application, the two ends of the support column are respectively provided with a second plug-in part, and the two heat conduction cavity walls are provided with a second matching part, and the second plug-in part is plug-in matched with the second matching part.
[0013] According to some embodiments of the present application, a plurality of support columns are arranged and spaced apart.
[0014] According to some embodiments of the present application, the plate body comprises two side plates, the outer periphery of the two side plates is connected and enclosed to form the accommodating cavity, and the two heat conduction cavity walls are respectively located on the two side plates.
[0015] Additional aspects and advantages of the present application will be given in part in the following description, some will become apparent from the following description, or will be understood through practice of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0016] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
[0017] Figure 1 A three-dimensional schematic view of the high-efficiency vapor chamber of the embodiment of the present application is shown in the figure.
[0018] Figure 2 A three-dimensional schematic view of the high-efficiency vapor chamber of the embodiment of the present application is shown in the figure. Figure 1 A cross-sectional view of the A-A direction of the high-efficiency vapor chamber of the embodiment of the present application is shown in the figure.
[0019] Figure 3 A three-dimensional schematic view of the high-efficiency vapor chamber of the embodiment of the present application is shown in the figure. Figure 2 A local enlarged schematic view of the B of the high-efficiency vapor chamber of the embodiment of the present application is shown in the figure.
[0020] Figure 4 A cross-sectional schematic view of the high-efficiency vapor chamber of the embodiment of the present application is shown in the figure.
[0021] Reference signs:
[0022] The plate body 100, the accommodating cavity 110, the heat-conducting cavity wall 111, the capillary layer 120, the first plug-in part 130, the second matching part 140, the side plate 150.
[0023] The support column 200, the second plug-in part 210.
[0024] The capillary flow guide column 300, the first matching part 310.
[0025] The central axis of the accommodating cavity 400. DETAILED DESCRIPTION
[0026] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.
[0027] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application.
[0028] In the description of the present application, the plural means more than two. If there is a description of first, second, etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implying indicating the number of indicated technical features or implying indicating the sequence of indicated technical features.
[0029] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installing, connecting should be understood broadly, and the skilled person in the art can determine the specific meaning of the above words in the utility model in combination with the specific content of the technical scheme.
[0030] Reference Figures 1 to 4 For the high-efficiency uniform plate of the utility model embodiment, the plate body 100 is provided with the accommodating cavity 110, the accommodating cavity 110 has two oppositely arranged heat conduction cavity walls 111, the cavity wall of the accommodating cavity 110 is provided with the capillary layer 120;The support column 200 is arranged in the plate body 100 and is located in the accommodating cavity 110, the support column 200 is located between the two heat conduction cavity walls 111, and the two ends of the support column 200 are connected with the two heat conduction cavity walls 111 one by one;The heat transfer working medium is arranged in the accommodating cavity 110;The capillary flow guide column 300 is arranged in the plate body 100 and is located in the accommodating cavity 110, the capillary flow guide column 300 is located between the two heat conduction cavity walls 111, and the two ends of the capillary flow guide column 300 are connected with the capillary layer 120 on the two heat conduction cavity walls 111 one by one, the cross-sectional length dimension of the capillary flow guide column 300 is greater than the width dimension, and the cross-sectional length direction of part or all of the capillary flow guide column 300 is the flow direction of the gaseous heat transfer working medium.
[0031] The cross-sectional length dimension of the capillary flow guide column 300 is greater than the width dimension, and the cross-sectional length direction of the capillary flow guide column 300 is the flow direction of the gaseous heat transfer working medium, so that when the gaseous heat transfer working medium flows and disperses in the accommodating cavity 110, the resistance of the capillary flow guide column 300 to the gaseous heat transfer working medium can be reduced, thereby improving the heat dissipation capacity of the uniform plate.
[0032] Specifically, the support column 200 is used for supporting the two heat conduction cavity walls 111 of the accommodating cavity 110, reducing the risk of damage of the uniform plate in the production and use process. The capillary layer 120 has a conveying effect on the liquid heat transfer working medium.
[0033] In the embodiment, the cross-sectional width dimension of the capillary flow guide column 300 increases first and then decreases along the length direction, and the cross section of the capillary flow guide column 300 is shuttle-shaped or elliptical. The above structure, the cross section of the capillary flow guide column 300 is approximately streamline-shaped, so that when the gaseous heat transfer working medium flows, the capillary flow guide column 300 can further reduce the resistance to the heat transfer working medium, thereby further improving the heat dissipation capacity of the uniform plate;In the case that the horizontal cross-sectional area of the capillary flow guide column 300 is the same, the volume of the capillary flow guide column 300 is reduced.
[0034] In the embodiment, the plate body 100 is provided with a first plug-in part 130 located on one of the heat-conducting cavity walls 111, one end of the capillary flow guide column 300 is provided with a first matching part 310, the first plug-in part 130 is plug-in matched with the first matching part 310, and the other end of the capillary flow guide column 300 abuts against the capillary layer 120 on the other heat-conducting cavity wall 111. One end of the capillary flow guide column 300 is fixed to one of the heat-conducting cavity walls 111 of the plate body 100 in a plug-in matched manner, and the other end of the capillary flow guide column 300 abuts against the capillary layer 120 on the other heat-conducting cavity wall 111, so that the capillary flow guide column 300 can be installed and fixed, and the installation structure is relatively simple and convenient to assemble.
[0035] Specifically, the first plug-in part 130 is a plug-in column, and the first matching part 310 is a plug-in hole. It can be imagined that in other embodiments, the first plug-in part 130 can also be a plug-in hole, and the first matching part 310 is a plug-in column, which can be specifically configured according to actual needs by those skilled in the art.
[0036] Specifically, the first plug-in part 130 is a plug-in column with a prismatic cross section, and the first matching part 310 is a plug-in hole with an elliptical cross section, which facilitates the accurate length direction of the cross section of the capillary flow guide column 300 during installation.
[0037] In the embodiment, the capillary flow guide column 300 is conical, and the end of the capillary flow guide column 300 far from the first plug-in part 130 is a small end. Since one end of the capillary flow guide column 300 close to the first plug-in part 130 is plug-in matched with the first matching part 310, the first plug-in part 130 reduces the contact area of one end of the capillary flow guide column 300 close to the first plug-in part 130 with the capillary layer 120; if the contact areas of the two ends of the capillary flow guide column 300 with the capillary layer 120 are quite different, the end of the capillary flow guide column 300 with a smaller contact area with the capillary layer 120 will limit the efficiency of transporting the liquid heat transfer medium. Therefore, the capillary flow guide column 300 is arranged to be conical, and the small end is the end far from the first plug-in part 130, at this time, the contact areas of the two ends of the capillary flow guide column 300 with the capillary layer 120 are quite small, which is beneficial to improve the efficiency of transporting the liquid heat transfer medium, and can reduce the volume of the capillary flow guide column 300.
[0038] In the embodiment, four capillary flow guide columns 300 are arranged, all the capillary flow guide columns 300 are uniformly arranged around the central axis of the containing cavity 110, and the length direction of the cross section of the capillary flow guide column 300 is towards the central axis of the containing cavity 110. Generally, the heat source has a small volume and is attached to the plate body 100 on the evaporation side close to the central axis, so that the gaseous heat transfer medium in the containing cavity 110 flows from the center to the periphery, and therefore the above-mentioned capillary flow guide column 300 layout can significantly reduce the resistance to the liquid heat transfer medium.
[0039] It can be imagined that in other embodiments, the number of capillary flow guide columns 300 can also be other numbers, such as three, five or more, which can be specifically configured by those skilled in the art according to actual needs; the cross-sectional length direction of the capillary flow guide column 300 can also be other layout modes.
[0040] In embodiments, the cross-sectional length dimension of the support column 200 is greater than the width dimension, and the cross-sectional length direction of part or all of the support column 200 is the flow direction of the gaseous heat transfer working medium. When the gaseous heat transfer working medium flows and disperses in the accommodation cavity 110, the resistance of the support column 200 to the gaseous heat transfer working medium can be reduced, thereby further improving the heat dissipation capacity of the uniform temperature plate.
[0041] In embodiments, the cross-sectional width dimension of the support column 200 increases first and then decreases along the length direction thereof, and the cross-section of the capillary flow guide column 300 is in the shape of a shuttle or an ellipse. The above structure makes the cross-section of the support column 200 approximately in the shape of a streamline, so that when the gaseous heat transfer working medium flows, the support column 200 can further reduce the resistance to the heat transfer working medium, thereby further improving the heat dissipation capacity of the uniform temperature plate; and under the condition that the outer surface area of the support column 200 is the same, the volume of the support column 200 is reduced.
[0042] In embodiments, the two ends of the support column 200 are respectively provided with second plug-in parts 210, and the two heat conduction cavity walls 111 are each provided with a second matching part 140, and the second plug-in part 210 is plug-in matched with the second matching part 140. The support column 200 is installed in a plug-in manner, which is simple in structure and easy to implement. Specifically, the second plug-in part 210 is a plug-in column, the second matching part 140 is a plug-in hole, and the two ends of the support column 200 are inserted into the plug-in holes of the two heat conduction cavity walls 111 through the plug-in column. It can be imagined that in other embodiments, the second plug-in part 210 can also be a plug-in hole, and the corresponding second matching part 140 is a plug-in column, which can be specifically configured by those skilled in the art according to actual needs.
[0043] Further, the second plug-in part 210 is an elliptical plug-in column in cross-section, and the second matching part 140 is an elliptical plug-in hole in cross-section, which is beneficial to the accurate length direction of the cross-section of the support column 200 during installation, and further sealing connection between the plug-in column and the plug-in hole through welding.
[0044] In embodiments, the support column 200 is provided with a plurality of and arranged at intervals, which is beneficial to relatively uniform support of each part of the heat conduction cavity wall 111, and the overall support effect is good. Specifically, the number of support columns 200 can be two, three, four or more, which can be specifically configured by those skilled in the art according to actual needs.
[0045] In the embodiment, the plate body 100 comprises two side plates 150, outer peripheries of the two side plates 150 are connected and enclosed to form the accommodating cavity 110, and the two heat-conducting cavity walls 111 are respectively located at the two side plates 150. The accommodating cavity 110 is formed by connecting the outer peripheries of the two side plates 150, and the manufacturing mode of the accommodating cavity 110 is simple. Specifically, the outer peripheries of the two plate bodies 100 are connected and sealed by welding.
[0046] Specifically, the outer peripheral surface of the support column 200 also has the capillary layer 120, and the capillary layer 120 can transport the liquid heat transfer working medium between the two heat-conducting cavity walls 111.
[0047] Specifically, the capillary layer 120 and the capillary structure column are both formed by copper powder sintering to form a multi-micropore structure, and the multi-micropore structure can transport the liquid heat transfer working medium by the capillary principle.
[0048] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0049] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.
Claims
1. A high-performance vapor chamber, characterized by, The application relates to a heat transfer device, comprising: a plate body (100) provided with a containing cavity (110), wherein the containing cavity (110) is provided with two oppositely arranged heat-conducting cavity walls (111), and the cavity wall of the containing cavity (110) is provided with a capillary layer (120); a support column (200) arranged in the plate body (100) and located in the containing cavity (110), wherein the support column (200) is located between the two heat-conducting cavity walls (111), and the two ends of the support column (200) are connected with the two heat-conducting cavity walls (111) in one-to-one correspondence; a heat transfer working medium arranged in the containing cavity (110); a capillary flow guide column (300) arranged in the plate body (100) and located in the containing cavity (110), wherein the capillary flow guide column (300) is located between the two heat-conducting cavity walls (111), the two ends of the capillary flow guide column (300) are connected with the capillary layer (120) on the two heat-conducting cavity walls (111) in one-to-one correspondence, the cross-sectional length dimension of the capillary flow guide column (300) is greater than the cross-sectional width dimension, and the cross-sectional length direction of at least part of the capillary flow guide column (300) is the flow direction of the gaseous heat transfer working medium.
2. The high efficiency vapor chamber of claim 1, wherein: The cross-sectional width dimension of the capillary flow guide column (300) increases first and then decreases along the length direction of the capillary flow guide column (300), and the cross section of the capillary flow guide column (300) is in the shape of a shuttle or an ellipse.
3. The high efficiency vapor chamber of claim 1, wherein: The plate body (100) is provided with a first plug-in part (130) located in one of the heat-conducting cavity walls (111), one end of the capillary flow guide column (300) is provided with a first matching part (310), the first plug-in part (130) is plug-in matched with the first matching part (310), and the other end of the capillary flow guide column (300) abuts against the capillary layer (120) on the other heat-conducting cavity wall (111).
4. The high efficiency vapor chamber of claim 3, wherein: The capillary flow guide column (300) is in the shape of a cone, and the end of the capillary flow guide column (300) far away from the first plug-in part (130) is a small end.
5. The high efficiency vapor chamber of claim 1, wherein: A plurality of capillary flow guide columns (300) are arranged, and all the capillary flow guide columns (300) are uniformly arranged around the central axis of the containing cavity (110), and the cross-sectional length direction of the capillary flow guide column (300) is towards the central axis of the containing cavity (110).
6. The high efficiency vapor chamber of claim 1, wherein: The cross-sectional length dimension of the support column (200) is greater than the cross-sectional width dimension, and the cross-sectional length direction of at least part of the support column (200) is the flow direction of the gaseous heat transfer working medium.
7. The high efficiency vapor chamber of claim 6, wherein: The cross-sectional width dimension of the support column (200) increases first and then decreases along the length direction of the support column (200), and the cross section of the support column (200) is in the shape of a shuttle or an ellipse.
8. The high efficiency vapor chamber of claim 1, wherein: The two ends of the support column (200) are respectively provided with second plug-in parts (210), and the two heat-conducting cavity walls (111) are respectively provided with second matching parts (140), and the second plug-in parts (210) are plug-in matched with the second matching parts (140).
9. The high efficiency vapor chamber of claim 1, wherein: A plurality of support columns (200) are arranged and spaced apart from each other.
10. The high efficiency vapor chamber of claim 1, wherein: The plate body (100) comprises two side plates (150), the outer periphery of the two side plates (150) is connected and enclosed to form the accommodating cavity (110), and the two heat-conducting cavity walls (111) are respectively located at the two side plates (150).