Chip aging test connection structure

Abstract

The utility model relates to the related technical field of chip testing, in particular to a chip aging test connection structure, which comprises an aging oven, and a replacement connection mechanism is arranged on the inner side surface of the aging oven. According to the chip aging test connecting structure, through the arrangement of the replacement connecting mechanism, when the chip aging test connecting structure is used, the semicircular clamping block is pressed, the semicircular clamping block is separated from the semicircular clamping groove, locking constraint on the interface board is relieved, then a new interface board is pushed into the fixing plate, and when the interface board is pushed to the semicircular clamping groove and corresponds to the semicircular clamping block in position, the interface board is fixed to the fixing plate. Under the action of resilience force of the spring, the semicircular clamping block is rapidly clamped into the semicircular clamping groove, firm locking of the interface board on the fixing plate is achieved, the replacement action can be rapidly completed, reliable connection is re-established, it is guaranteed that aging test work is flexible and efficient, connection operation is easy and convenient, flexible adjustment and replacement can be achieved according to requirements, and the test efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the chip test related technical field especially, relates to a chip aging test connecting structure. BACKGROUND

[0002] Chip is the semiconductor element product's general name, it is a kind of miniaturization in electronics The way of circuit, and often be made on semiconductor wafer surface, chip as the core component of modern electronic equipment, its performance and reliability are vital, aging test is the key link of simulating the working condition of chip in long-term use, screening out potential defective product, therefore, especially need a kind of chip aging test connecting structure.

[0003] But the existing chip aging test connecting structure, for different models of chip needs to replace different test board, and the replacement operation of test interface board is complicated, affects test efficiency. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of chip aging test connecting structure, to solve the problem that the existing chip aging test connecting structure is proposed in above background technology, for different models of chip needs to replace different test board, and the replacement operation of test interface board is complicated, affects test efficiency.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of chip aging test connecting structure, including aging cabinet, the outside surface of the aging cabinet is rotatably connected with hinge, the side surface of the hinge is rotatably connected with cabinet door, the inside surface of the aging cabinet is provided with replacement connecting mechanism, the inside surface of the aging cabinet is provided with stabilizing mechanism;

[0006] The replacement connecting mechanism includes fixed plate, sliding slot, sliding block, spring, semicircle clamping block, interface plate, semicircle clamping slot and metal sheet, the inside surface of the aging cabinet is fixedly connected with fixed plate, the inside surface of the fixed plate is equipped with sliding slot, the inside surface of the sliding slot is slidably connected with sliding block, the end surface of the sliding block is fixedly connected with spring, the end surface of the sliding block is fixedly connected with semicircle clamping block, the outside surface of the semicircle clamping block is slidably connected with interface plate, the side surface of the interface plate is equipped with semicircle clamping slot, the inside surface of the interface plate is fixedly connected with metal sheet.

[0007] Preferably, the hinge is provided with two groups on the side surface of the cabinet door, and the surface of the cabinet door is provided with an observation glass window.

[0008] Preferably, the inside dimension of the sliding slot is consistent with the outside dimension of the sliding block, and the semicircle clamping block constitutes a telescopic structure through the sliding block and the spring.

[0009] Preferably, the outer size of the semicircular clamping block is consistent with the inner size of the semicircular clamping groove, and the inner surface of the interface plate is provided with a plurality of groups of metal sheets at equal intervals.

[0010] Preferably, the stabilizing mechanism comprises a fixing rod, a moving groove, a limiting groove, a limiting block, a moving block, a test plate, a placing groove and a connecting plug plate, the inner surface of the aging box is fixedly connected with the fixing rod, the inner surface of the fixing rod is provided with the moving groove, the inner surface of the moving groove is provided with the limiting groove, the outer surface of the limiting groove is slidably connected with the limiting block, one side surface of the limiting block is fixedly connected with the moving block, one side surface of the moving block is fixedly connected with the test plate, the upper surface of the test plate is provided with the placing groove, and one side surface of the test plate is fixedly connected with the connecting plug plate.

[0011] Preferably, the inner size of the limiting groove is consistent with the outer size of the limiting block, and the limiting block is provided with two groups of the moving block in the central axis.

[0012] Preferably, the placing groove is provided with a plurality of groups at equal intervals on the upper surface of the test plate, and the connecting plug plate is clamped and connected with the interface plate.

[0013] Compared with the prior art, the chip aging test connecting structure has the advantages that when the interface plate needs to be replaced, such as switching different test function interface plates, repairing fault interface plates and the like, the semicircular clamping block is manually pressed to overcome the elastic force of the spring and retract into the sliding groove, the semicircular clamping block is separated from the semicircular clamping groove to release the locking constraint on the interface plate, at this time, the interface plate is no longer limited and can be smoothly pulled out of the fixed plate, then, the new interface plate is pushed into the fixed plate, the semicircular clamping block is slid inwards along the sliding groove through the sliding block under the extrusion of the interface plate, when the interface plate is pushed to the position corresponding to the semicircular clamping groove and the semicircular clamping block, the semicircular clamping block is quickly clamped into the semicircular clamping groove under the rebound force of the spring to achieve firm locking of the interface plate on the fixed plate, the replacement action is quickly completed, reliable connection is re-established, the aging test work is flexibly and efficiently carried out, the connection operation is simple, the test efficiency is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a side view appearance structure schematic view of the utility model;

[0015] Figure 2 It is a sliding block and sliding groove mutual cooperation structure schematic view of the utility model;

[0016] Figure 3 It is a stabilizing mechanism structure schematic view of the utility model;

[0017] Figure 4 The replacement connecting mechanism sectional view structure schematic view of the utility model is shown in the figure.

[0018] Figure 5 The sliding groove and the sliding block mutual cooperation structure schematic view of the utility model is shown in the figure.

[0019] In the figure: 1, the aging box; 2, the hinge; 3, the cabinet door; 4, the replacement connecting mechanism; 401, the fixed plate; 402, the sliding groove; 403, the sliding block; 404, the spring; 405, the semicircle clamping block; 406, the interface plate; 407, the semicircle clamping groove; 408, the metal sheet; 5, the stabilizing mechanism; 501, the fixed rod; 502, the moving groove; 503, the limiting groove; 504, the limiting block; 505, the moving block; 506, the test plate; 507, the placing groove; 508, the connecting plugboard. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the scope of protection of the utility model.

[0021] Please refer to Figures 1-5 The utility model provides a kind of technical scheme: a chip aging test connecting structure, including aging box 1, the outer surface of aging box 1 is rotatably connected with hinge 2, the side surface of hinge 2 is rotatably connected with cabinet door 3, the inner surface of aging box 1 is provided with replacement connecting mechanism 4, the inner surface of aging box 1 is provided with stabilizing mechanism 5;

[0022] The replacement connecting mechanism 4 comprises a fixed plate 401, a sliding groove 402, a sliding block 403, a spring 404, a semicircular clamping block 405, an interface plate 406, a semicircular clamping groove 407 and a metal sheet 408. The inner side surface of the aging box 1 is fixedly connected with the fixed plate 401. The inner side surface of the fixed plate 401 is provided with the sliding groove 402. The inner side surface of the sliding groove 402 is slidably connected with the sliding block 403. One end surface of the sliding block 403 is fixedly connected with the spring 404. One end surface of the sliding block 403 is fixedly connected with the semicircular clamping block 405. The outer side surface of the semicircular clamping block 405 is slidably connected with the interface plate 406. One side surface of the interface plate 406 is provided with the semicircular clamping groove 407. The inner side surface of the interface plate 406 is fixedly connected with the metal sheet 408. Through the arrangement of the fixed plate 401, the sliding groove 402, the sliding block 403, the spring 404, the semicircular clamping block 405, the interface plate 406, the semicircular clamping groove 407 and the metal sheet 408, when it is necessary to replace the interface plate 406, such as switching different test function interface plates 406, repairing faulty interface plates 406 and the like, the semicircular clamping block 405 is manually pressed to overcome the elastic force of the spring 404 and retract into the sliding groove 402. The semicircular clamping block 405 is detached from the semicircular clamping groove 407 to release the locking constraint on the interface plate 406. At this time, the interface plate 406 is no longer limited and can be smoothly pulled out of the fixed plate 401. Then, the new interface plate 406 is pushed into the fixed plate 401. The semicircular clamping block 405 is pressed by the interface plate 406 and slides inwards along the sliding groove 402 through the sliding block 403. When the interface plate 406 is pushed to the position corresponding to the semicircular clamping groove 407 and the semicircular clamping block 405, the semicircular clamping block 405 is quickly clamped into the semicircular clamping groove 407 under the rebounding force of the spring 404 to achieve firm locking of the interface plate 406 on the fixed plate 401. The replacement action is quickly completed to reestablish reliable connection and ensure flexible and efficient aging test work.

[0023] Further, the hinges 2 are arranged on one side surface of the cabinet door 3. The surface of the cabinet door 3 is provided with an observation glass window. Through the arrangement of the hinges 2, in use, the two groups of hinges 2 share the weight of the cabinet door 3 and the torsion when opening and closing, so that the cabinet door 3 is more stable and smooth when opening and closing.

[0024] Further, the inner side dimension of the sliding groove 402 matches the outer side dimension of the sliding block 403. The semicircular clamping block 405 constitutes a telescopic structure through the sliding block 403 and the spring 404. Through the arrangement of the sliding groove 402 and the sliding block 403, in use, the sliding groove 402 limits the sliding block 403, so that the semicircular clamping block 405 fixedly connected with the sliding block 403 is more stable when moving.

[0025] Further, the outer side size of the semicircular clamping block 405 is consistent with the inner side size of the semicircular clamping groove 407, and the inner side surface of the interface plate 406 is provided with a plurality of groups of metal sheets 408 at equal intervals. Through the arrangement of the semicircular clamping block 405 and the semicircular clamping groove 407, the semicircular clamping groove 407 limits the semicircular clamping block 405 during use, so that the interface plate 406 is stably positioned at the working position, and the stable electrical path for the chip aging test is built.

[0026] Further, the stable mechanism 5 includes a fixed rod 501, a moving groove 502, a limiting groove 503, a limiting block 504, a moving block 505, a test plate 506, a placing groove 507 and a connecting plug plate 508. The inner side surface of the aging box 1 is fixedly connected with the fixed rod 501. The inner side surface of the fixed rod 501 is provided with the moving groove 502. The inner side surface of the moving groove 502 is provided with the limiting groove 503. The outer side surface of the limiting groove 503 is slidably connected with the limiting block 504. One side surface of the limiting block 504 is fixedly connected with the moving block 505. One side surface of the moving block 505 is fixedly connected with the test plate 506. The upper surface of the test plate 506 is provided with the placing groove 507. One side surface of the test plate 506 is fixedly connected with the connecting plug plate 508. Through the arrangement of the fixed rod 501, the moving groove 502, the limiting groove 503, the limiting block 504, the moving block 505, the test plate 506, the placing groove 507 and the connecting plug plate 508, the moving block 505 is pushed during use, so that the test plate 506 is driven to slide along the moving groove 502 of the fixed rod 501. The limiting block 504 moves synchronously along the limiting groove 503. When the test plate 506 reaches the appropriate position, the connecting plug plate 508 accurately engages with the corresponding interface plate 406. The chip is stably placed in the placing groove 507, and then the aging test process is started. The whole process ensures the stability of the chip during the test and the reliability of the electrical connection.

[0027] Further, the inner side size of the limiting groove 503 is consistent with the outer side size of the limiting block 504. Two groups of limiting blocks 504 are symmetrically arranged about the central axis of the moving block 505. Through the arrangement of the limiting block 504, the two groups of symmetric limiting blocks 504 simultaneously and accurately position and guide the moving block 505 during use, so that the test plate 506 can be stably and accurately moved to the appropriate position.

[0028] Further, a plurality of groups of placing grooves 507 are arranged at equal intervals on the upper surface of the test plate 506. The connecting plug plate 508 is engaged with the interface plate 406. Through the arrangement of the placing groove 507, a plurality of groups of placing grooves 507 can accommodate more chips during use, so that the test efficiency is greatly improved.

[0029] Working principle: push the moving block 505, make it drive test board 506 along the fixed rod 501 along the moving groove 502, limit block 504 along the limit groove 503 synchronous movement, test board 506 reaches the appropriate position, connect the plug-in board 508 and the corresponding interface board 406 accurate card, chip stable placement in the placement groove 507, and then start the aging test process, the whole process ensures the stability of the chip in the test and the reliability of the electrical connection, when you need to replace the interface board 406, such as switching different test function interface board 406, repair the fault interface board 406 and so on, manually press the semicircle clamp block 405, make it overcome the elastic force of the spring 404 to retract inside the sliding groove 402, the semicircle clamp block 405 from the semicircle clamp groove 407 out, remove the locking constraint to the interface board 406, at this time, the interface board 406 is no longer limited, can be smoothly pulled out from the fixed plate 401, then, the new interface board 406 is pushed into the fixed plate 401, the semicircle clamp block 405 is extruded by the interface board 406, and slides inwards along the sliding groove 402 through the sliding block 403, when the interface board 406 is pushed to the position corresponding to the semicircle clamp groove 407 and the semicircle clamp block 405, the semicircle clamp block 405 is quickly clamped into the semicircle clamp groove 407 under the rebound force of the spring 404, the interface board 406 is firmly locked on the fixed plate 401, that is, the replacement action can be quickly completed, the reliable connection is reestablished, and the aging test work is flexibly and efficiently carried out.

[0030] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip aging test connection structure, comprising an aging chamber (1), characterized in that: The outer surface of the aging chamber (1) is rotatably connected to a hinge (2), and one side surface of the hinge (2) is rotatably connected to a cabinet door (3). The inner surface of the aging chamber (1) is provided with a replacement connection mechanism (4), and the inner surface of the aging chamber (1) is provided with a stabilizing mechanism (5). The replacement connection mechanism (4) includes a fixed plate (401), a sliding groove (402), a sliding block (403), a spring (404), a semi-circular locking block (405), an interface plate (406), a semi-circular locking groove (407), and a metal sheet (408). The fixed plate (401) is fixedly connected to the inner surface of the aging chamber (1). The inner surface of the fixed plate (401) is provided with a sliding groove (402). The inner surface of the sliding groove (402) slides. A sliding block (403) is connected, a spring (404) is fixedly connected to one end surface of the sliding block (403), a semi-circular locking block (405) is fixedly connected to one end surface of the sliding block (403), an interface plate (406) is slidably connected to the outer surface of the semi-circular locking block (405), a semi-circular slot (407) is opened on one side surface of the interface plate (406), and a metal sheet (408) is fixedly connected to the inner surface of the interface plate (406).

2. The chip aging test connection structure according to claim 1, characterized in that: The hinge (2) is provided in two sets on one side surface of the cabinet door (3), and the surface of the cabinet door (3) is provided with an observation glass window.

3. The chip aging test connection structure according to claim 1, characterized in that: The inner dimension of the sliding groove (402) matches the outer dimension of the sliding block (403), and the semi-circular locking block (405) forms a telescopic structure through the sliding block (403) and the spring (404).

4. The chip aging test connection structure according to claim 1, characterized in that: The outer dimensions of the semicircular card block (405) match the inner dimensions of the semicircular card slot (407), and multiple sets of metal sheets (408) are arranged at equal intervals on the inner surface of the interface plate (406).

5. The chip aging test connection structure according to claim 1, characterized in that: The stabilizing mechanism (5) includes a fixed rod (501), a moving groove (502), a limiting groove (503), a limiting block (504), a moving block (505), a test plate (506), a placement groove (507), and a connecting plate (508). The fixed rod (501) is fixedly connected to the inner surface of the aging chamber (1). The moving groove (502) is opened on the inner surface of the fixed rod (501). The limiting groove (503) is opened on the inner surface of the moving groove (502). The limiting block (504) is slidably connected to the outer surface of the limiting groove (503). The moving block (505) is fixedly connected to one side surface of the limiting block (504). The test plate (506) is fixedly connected to one side surface of the moving block (505). The placement groove (507) is opened on the upper surface of the test plate (506). The connecting plate (508) is fixedly connected to one side surface of the test plate (506).

6. The chip aging test connection structure according to claim 5, characterized in that: The inner dimension of the limiting groove (503) matches the outer dimension of the limiting block (504), and two sets of the limiting blocks (504) are symmetrically arranged around the central axis of the moving block (505).

7. The chip aging test connection structure according to claim 5, characterized in that: The placement slots (507) are arranged in multiple sets at equal intervals on the upper surface of the test plate (506), and the connecting plate (508) is engaged with the interface plate (406).

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