Photovoltaic chain type photoetching production system
The photovoltaic chain lithography production system solves the problems of low capacity and high cost of semiconductor lithography machines, realizes efficient and low-damage photovoltaic production, improves the photoelectric conversion efficiency and patterning accuracy of cells, and solves the leakage problem of BC cells.
Patent Information
- Application Number
- CN202422774151.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-11-14
AI Technical Summary
Existing semiconductor lithography machines have low production capacity, high equipment costs, and high maintenance costs, making it difficult to meet the high-efficiency production needs of the photovoltaic industry.
A photovoltaic chain lithography production system is adopted, including a chain roller coating module, a laser marking module, an exposure module, a developing module, a water washing system, a resist removal module, and a drying module. Combined with a computer controller, it realizes efficient lithography processing of silicon wafers.
It enables low-cost, high-capacity photovoltaic production, improves the photoelectric conversion efficiency of cells, solves the leakage problem of BC cells, and achieves non-destructive, high-precision, and near-the theoretical limit of single-cell cell efficiency in the patterning process.
Smart Images
Figure CN223692639U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the field of photoetching technique, specifically a photovoltaic chain type photoetching production system. BACKGROUND
[0002] Photoetching technique is widely used in semiconductor and is a precise micro-nano processing technology, which transfers the designed micro-pattern to the photosensitive material surface. Its core is to transfer the accurate pattern to the substrate by photoetching machine, so as to realize the accurate manufacturing of micro-structure.
[0003] The existing semiconductor photoetching machine includes step scanning photoetching technology, dry photoetching technology, immersion type photoetching technology, electron beam photoetching technology, ion beam photoetching technology, laser direct writing photoetching technology, grating exposure technology and nano-imprint technology.
[0004] The problems of the application of semiconductor photoetching machine in photovoltaic are as follows: 1. low production capacity, the production capacity of semiconductor photoetching machine is less than 100-200 pieces / h, and the production capacity of photovoltaic laser pattern is more than 7000 pieces / h;
[0005] 2. high equipment cost, the selling price of a single device is as high as hundreds of millions of dollars, in the process of processing chip, the photoetching machine transmits the light beam through the mask drawing the circuit diagram through a series of light source energy and shape control means, compensates various optical errors through the objective lens, maps the circuit diagram to the silicon wafer after proportional reduction, and then develops by using the chemical method to obtain the circuit diagram engraved on the silicon wafer. The more complex the chip is, the more layers of the circuit diagram are, and the more precise the exposure control process is required;
[0006] 3. high maintenance cost, mainly because the device is complex and a large number of high-precision optical system accessories are used. CONTENT OF THE UTILITY MODEL
[0007] In order to make up for the deficiency of the prior art and solve the above technical problems, the utility model provides a photovoltaic chain type photoetching production system, which can replace the IBC (full back cross-shaped back contact cell) laser patterning technology, realize the functions of low cost, high production capacity and high cell photoelectric conversion efficiency, and the specific embodiments are as follows.
[0008] A photovoltaic chain type photoetching production system comprises:
[0009] A chain type roller coating module is used for coating the silicon wafer photoresist.
[0010] A laser positioning point forming module is used for forming the positioning point of the silicon wafer.
[0011] An exposure module is used for grabbing the positioning point of the silicon wafer.
[0012] A developing module is used for alkali washing of the silicon wafer.
[0013] a water washing system for cleaning the surface of the silicon wafer;
[0014] a degumming module for degumming the surface of the silicon wafer;
[0015] a drying module for drying the surface of the silicon wafer;
[0016] a computer controller for controlling the operation of the above modules.
[0017] Preferably, the chain roller coating module comprises at least twelve coating stations, and a single coating station is arranged for a single silicon wafer.
[0018] upper rollers and lower rollers, which are correspondingly arranged and horizontally arranged with the coating stations.
[0019] The upper roller is internally provided with a pipeline structure, and the photoresist is transmitted and moved in the upper roller. The upper roller is provided with a glue outlet on the surface.
[0020] Preferably, the surface of the upper roller is coated with a cylindrical sponge, and the lower roller is made of PP or PVDF material.
[0021] Preferably, the laser positioning point module comprises a single laser and a marble platform. The single laser is used to mark 2-4 points on the surface of the silicon wafer, and the shape of the points is a cross-shaped or circular point. The marble platform and the coating station are connected through a transmission mechanism to transmit the silicon wafer.
[0022] Preferably, the exposure module comprises a CCD camera for capturing the cross-shaped or circular points on the surface of the silicon wafer to realize the positioning of the silicon wafer.
[0023] A screen printing plate, the screen printing plate comprises quartz glass, borosilicate glass or other optical glass, and the surface of the screen printing plate is provided with an exposure pattern, a hollow area and a non-hollow area.
[0024] A rotating platform for adjusting the accuracy of the position of the silicon wafer.
[0025] A light source, the light source is an LED light source, a single-wavelength light source with a wavelength range of 100-500nm, and a square light spot with a side length of 182mm-230mm is formed on the screen printing plate.
[0026] An exposure platform for carrying the rotating platform.
[0027] Preferably, the developing module comprises a chain roller alkali washing tank, and the chain roller alkali washing tank and the exposure platform are connected through a belt transmission system. The silicon wafer is corroded in the chain roller alkali washing tank through the alkali washing roller.
[0028] Preferably, the water washing system comprises a first water washing tank and a second water washing tank.
[0029] Preferably, the degumming module comprises a chain type alkali washing tank, a chain type roller alkali washing tank, and a cleaning water jet is arranged above the chain type alkali washing tank and the chain type roller alkali washing tank, and is used for washing the silicon wafer after corrosion.
[0030] Preferably, the drying module comprises a drying tank, and the chain type roller alkali washing tank, the first water washing tank, the chain type alkali washing tank, the second water washing tank and the drying tank are connected through alkali washing rollers, and the surface of the alkali washing roller is provided with anti-skid lines.
[0031] The beneficial effects of the utility model are as follows:
[0032] 1. Non-destructive patterning: compared with laser opening film, high-power laser irradiation is adopted to heat the film surface to high temperature, thermal damage is caused to the passivation film itself, and photolithography technology realizes mask through photoresist development and exposure, so that non-destructive patterning is realized, and the passivation performance of p+-poly-Si and n+-poly-Si is not damaged.
[0033] 2. High-precision patterning: photolithography is derived from semiconductor technology, and has higher patterning precision and can realize smaller pitch (p+ / gap / n+), and with the improvement of BC battery efficiency, the pitch will gradually develop to be smaller, and laser will limit further development.
[0034] 3. High potential of battery photoelectric conversion efficiency: combining non-destructive mask patterning poly-Si / Si / n-Si, high-precision patterning and narrower pitch, the battery conversion efficiency further approaches the theoretical limit of single-cell battery efficiency, and it is estimated that the efficiency is improved by 0.10%-0.20% compared with laser technology.
[0035] 4. Solve the BC leakage difficulty: the BC battery has p-n junction on the back and interdigital alternating structure, which causes battery leakage, mainly because laser technology cannot completely remove the film, so that the diffusion junction cannot be completely etched in the wet process. The BC battery leakage is 50 times that of TOPCon battery (industry published data, there are more than 200 leakage points), and the weak light response is poor in outdoor power generation. Therefore, relying on the chain photolithography process to solve the leakage of BC is one of the important advantages. BRIEF DESCRIPTION OF DRAWINGS
[0036] The utility model will be further described in connection with the drawings.
[0037] Figure 1 It is the overall equipment structure diagram of the utility model.
[0038] In the figure: glue applying station 1, upper roller 101, lower roller 102, single laser 2, marble platform 3, screen 4, rotating platform 5, exposure platform 51, light source 6, chain roller alkali washing tank 7, belt conveying system 8, alkali washing roller 9, first water washing tank 10, second water washing tank 11, chain alkali washing tank 12, silicon wafer 13, cleaning water knife 14, drying tank 15. DETAILED DESCRIPTION
[0039] In order to make the technical means, creative features, purposes and effects realized by the utility model easy to understand, the utility model is further described below in combination with specific embodiments.
[0040] Embodiment 1: as shown in the utility model provides a kind of photovoltaic chain photoetching production system, comprising: Figure 1 A chain roller coating module is used for coating of photoresist of silicon wafer 13;
[0041] A laser positioning point forming module is used for forming positioning points of the silicon wafer 13;
[0042] An exposure module is used for grabbing positioning points of the silicon wafer 13;
[0043] A developing module is used for alkali washing of the silicon wafer 13;
[0044] A water washing system is used for cleaning of the surface of the silicon wafer 13;
[0045] A gum removing module is used for gum removing of the surface of the silicon wafer 13;
[0046] A drying module is used for drying of the surface of the silicon wafer 13;
[0047] A computer controller is used for controlling the operation of the above module.
[0048] Embodiment 2: on the basis of embodiment 1, the chain roller coating module in the utility model comprises: at least twelve glue applying stations 1, and a single glue applying station 1 is placed with a single silicon wafer 13;
[0049] Upper roller 101 and lower roller 102 are correspondingly arranged, and both are horizontally arranged with glue applying station 1;
[0050]
[0051] The upper roller 101 is internally provided with a pipeline structure, photoresist is transmitted and moved in the upper roller 101, the upper roller 101 is provided with a glue outlet on the surface, the upper roller 101 and the lower roller 102 are driven by a motor and are connected through a worm and a gear, the upper roller 101 and the lower roller 102 rotate at the same speed with the motor, of course, gear transmission, belt transmission and the like can be used to realize the transmission connection of the upper roller 101 and the lower roller 102, so that the synchronous rotation of the upper roller 101 and the lower roller 102 is realized, that is, the upper roller 101 and the lower roller 102 are not limited to be driven by a certain mode, as long as the movement and the glue coating of the silicon wafer 13 in the utility model can be realized.
[0052] Specifically, the upper roller 101 is coated with a columnar sponge, and the lower roller 102 is made of PP or PVDF material, wherein the columnar sponge is used for adsorbing photoresist and rolling the photoresist on the surface of the silicon wafer 13 through the columnar sponge to realize the glue coating of the silicon wafer 13, the columnar sponge plays a wrapping role, at the same time, the contact surface of the upper roller 101 and the silicon wafer 13 is increased, and the pressure of the upper roller 101 on the silicon wafer 13 is reduced, specifically, the aperture of the glue outlet on the surface of the upper roller 101 is 0.8 mm, the number of glue outlets is more than one, and the glue outlets are arranged at intervals of 1-10 cm in the circumferential direction of the upper roller 101, and the photoresist enters the columnar sponge through the glue outlet on the surface of the upper roller 101.
[0053] It should be noted that when it is necessary to supplement photoresist to the upper roller 101, the glue supplementing valve arranged on the upper roller 101 can be used for supplementing, the glue supplementing mode can be electric, and the specific mode is that a corresponding glue supplementing container is arranged, a glue supplementing pump is arranged in the glue supplementing container, the glue supplementing container and the glue supplementing valve are communicated through a glue supplementing pipe, and the glue supplementing pump is used to bring the photoresist into the upper roller 101 when it is necessary to supplement the glue, and it should be noted that, in order not to affect the glue supplementing pipe when the upper roller 101 rotates, the glue supplementing pipe and the glue supplementing valve can be arranged in a rotary sealing connection, or the glue supplementing pipe and the glue supplementing valve are communicated again when it is necessary to supplement the glue, which is a manual glue supplementing.
[0054] Specifically, the laser positioning point module comprises a single laser 2 and a marble platform 3, the single laser 2 is used for marking 2-4 points on the surface of the silicon wafer 13, the shape of the points is a cross or a circular point, and the marble platform 3 is transmitted between the silicon wafer 13 and the gluing station 1 through a transmission mechanism. Wherein, the single laser 2 emits laser for completing the dot marking on the surface of the silicon wafer 13, wherein the angle change of the laser emission is adjusted in real time through a galvanometer, thereby changing the position of the dot marking on the surface of the silicon wafer 13, and the accuracy of the dot marking position, the distance between the single laser 2 and the silicon wafer 13 is greater than the radius of the silicon wafer 13, that is, 100-200 mm, further, the transmission mechanism between the marble platform 3 and the fixed gluing station 1 is used for bearing and fixing the marble platform 3 and the fixed gluing station 1, preventing the silicon wafer 13 from vibrating during transmission, wherein the transmission mechanism comprises a conveying belt, a chain conveyor and the like.
[0055] In the utility model, the exposure module comprises a CCD camera, which is used for capturing the cross or circular points on the surface of the silicon wafer 13, so as to realize the positioning of the silicon wafer 13.
[0056] The screen 4 comprises quartz glass, borosilicate glass or other optical glass, and the surface of the screen 4 has an exposure pattern, a hollow area and a non-hollow area.
[0057] The rotating platform 5 is used for realizing the accuracy adjustment of the position of the silicon wafer 13.
[0058] The light source 6 is an LED light source, a single-wavelength light source with a wavelength range of 100-500 nm, and a square light spot with a side length of 182-230 mm is formed on the screen 4.
[0059] The exposure platform 51 is used for bearing the rotating platform 5.
[0060] Specifically, the rotating platform 5 has a leveling function, when the silicon wafer 13 is located on the surface of the rotating platform 5, the X coordinate axis, the Y coordinate axis and the angle rotation R of the rotating platform 5 can be changed by using a gas cylinder, an oil cylinder and a level instrument, thereby ensuring that the silicon wafer 13 is located in a horizontal position.
[0061] Secondly, the cross-shaped or circular points on the surface of the silicon wafer 13 are captured by a CCD camera, and then the captured information is entered into the computer controller. Specifically, first, the CCD camera is used to take an image of the silicon wafer 13, and an image containing the silicon wafer 13 is obtained. The image is ensured to be clear and the target object is visible. An image processing software is used to process the position of the obtained silicon wafer 13 image, including steps such as denoising, filtering, and binarization, so as to enhance the quality of the image and extract the features of the silicon wafer 13. Through image processing technology, the features of the silicon wafer 13, i.e. the shape of the cross-shaped or circular points on the surface of the silicon wafer 13, are extracted. These features will be used for subsequent coordinate positioning. According to the extracted features, image recognition technology is used to search for the target object in the image of the silicon wafer 13 and determine its coordinate position. Specifically, this can be achieved by techniques such as comparing the target features with the features in the image. When the coordinate position of the target object in the image is determined, the result can be output as coordinate data by the computer controller.
[0062] Then, it is judged whether the screen 4 needs to move up and down in the vertical direction by using the coordinate data. If it needs to move, the screen 4 is driven to move up and down in the vertical direction by using the telescopic components such as air cylinders and oil cylinders. The purpose of the up and down movement of the screen 4 is to fix the exposure pattern on the surface of the silicon wafer 13 at a fixed position. After the exposure pattern is fixed on the surface of the silicon wafer 13, the exposure of the silicon wafer 13 is completed by using the light source 6, i.e. the exposure pattern in the screen 4 is printed on the surface of the silicon wafer 13.
[0063] In the embodiment 3, the developing module includes a chain roller alkali washing tank 7. The chain roller alkali washing tank 7 and the exposure platform 51 are connected by a belt conveying system 8. The silicon wafer 13 is corroded in the chain roller alkali washing tank 7 by an alkali washing roller 9.
[0064] After the silicon wafer 13 is exposed in the exposure module, it is conveyed to the surface of the alkali washing roller 9 by the belt conveying system 8. The belt conveying system 8 includes a belt conveyor and other conveying structures. The specific belt conveying system 8 is not limited in the utility model. The chain roller alkali washing tank 7 is arranged with an alkaline solution. When the alkali washing roller 9 conveys the silicon wafer 13, the silicon wafer 13 is brought into the alkaline solution to etch the surface of the silicon wafer 13. The liquid level of the alkaline solution can be adjusted, for example, by supplementing the alkali washing solution in the chain roller alkali washing tank 7 from the outside. The alkali washing roller 9 is immersed in the alkaline solution or half-immersed in the alkaline solution to corrode the silicon wafer 13 and develop the silicon wafer 13, i.e. to etch the photoresist in the non-exposed area of the silicon wafer 13.
[0065] It should be noted that the power source of the alkali washing roller 9 is a motor, and adjacent alkali washing rollers 9 are driven through a belt or a transmission chain or other transmission components, that is, one of the alkali washing rollers 9 is driven to rotate by the motor, and then the other alkali washing rollers 9 are driven to rotate through a belt drive or the like, and the transmission speed is controlled at 0-6 m / min.
[0066] In the utility model, the washing system comprises a first washing tank 10 and a second washing tank 11.
[0067] The desmear module comprises a chain type alkali washing tank 12 and a chain type roller alkali washing tank 7, and cleaning water knives 14 are arranged above the chain type alkali washing tank 12 and the chain type roller alkali washing tank 7, and are used for washing the etched silicon wafer 13.
[0068] The drying module comprises a drying tank 15, and the chain type roller alkali washing tank 7, the first washing tank 10, the chain type alkali washing tank 12, the second washing tank 11 and the drying tank 15 are connected in transmission through alkali washing rollers 9, and the alkali washing rollers 9 are provided with anti-skid lines on surfaces.
[0069] When the silicon wafer 13 is etched in the chain type roller alkali washing tank 7, the silicon wafer 13 is brought into the first washing tank 10 by the alkali washing roller 9, and before entering the first washing tank 10, the surface of the etched silicon wafer 13 is washed by the cleaning water knife 14, and at the same time, the alkali solution adhered to the surface of the alkali washing roller 9 is cleaned, so that the pollution of the cleaning water in the washing tank is reduced, and then the silicon wafer 13 is fully washed in the first washing tank 10, the alkali washing roller 9 is immersed in the cleaning water or half-immersed in the cleaning water, and the washing of the silicon wafer 13 is completed, then the washed silicon wafer 13 is brought into the chain type alkali washing tank 12 by the alkali washing roller 9, the cleaning water knife 14 is arranged above the chain type alkali washing tank 12, and the chain type alkali washing tank 12 has the same working principle as the chain type roller alkali washing tank 7, and the utility model will not be described in detail, when the silicon wafer 13 is etched in the chain type alkali washing tank 12, the silicon wafer 13 is brought into the second washing tank 11 by the alkali washing roller 9, and is further washed, and after washing, the silicon wafer 13 is brought into the drying tank 15 by the alkali washing roller 9, and drying is completed, and the drying mode can be hot air drying, natural drying, nitrogen blowing drying, hot plate drying and rotary drying, and the utility model will not be described in detail.
[0070] In summary, the screen 4 is divided into hollow and non-hollow areas, and the purpose is to realize the PSG (phosphor silicon glass film) / silicon wafer 13 structure patterning on the surface of the silicon wafer 13, has high precision, low damage patterning advantage, and the working principle of the overall system is photoetching patterning principle, that is, a negative photoresist is used to protect the patterning area, and other non-exposed pattern areas are removed by alkali washing.
[0071] In the description of the utility model, it is necessary to explain, the term "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "internal", "external" and so on indicate the orientation or positional relationship is based on the attached Figure 1 The orientation or positional relationship indicated by the above-mentioned is only for the convenience of describing the utility model and simplifying the description, and is not indicative or suggestive of the device or element indicated must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the utility model, in addition, the terms "first", "second", "third" and the like are only used to distinguish the description, and cannot be understood as indicative or suggestive of relative importance.
[0072] The basic principles, main features and advantages of the utility model are shown and described above. Those skilled in the art should understand that the utility model is not limited by the above-mentioned examples, and the above-mentioned examples and descriptions in the specification are only illustrative of the principles of the utility model, and various changes and improvements can be made to the utility model without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The scope of protection of the utility model is defined by the appended claims and their equivalents.
Claims
1. A photovoltaic chain photolithography production system, characterized by: The application relates to a computer-controlled photoetching system for silicon wafer, which comprises the following modules: a chain roller coating module for coating photoresist on a silicon wafer; a laser positioning point forming module for forming positioning points on the silicon wafer; an exposure module for grabbing the positioning points on the silicon wafer; a developing module for alkali washing of the silicon wafer; a water washing system for cleaning the surface of the silicon wafer; a photoresist removing module for removing photoresist on the surface of the silicon wafer; a drying module for drying the surface of the silicon wafer; and a computer controller for controlling the operation of the above modules. The chain roller coating module comprises at least twelve coating stations, and a single coating station is arranged for a single silicon wafer. The upper roller and the lower roller are arranged correspondingly and horizontally relative to the coating station. The inner part of the upper roller is in a pipe type structure, photoresist is transmitted and moved in the inner part of the upper roller, and a photoresist outlet is formed on the surface of the upper roller. The surface of the upper roller is coated with a columnar sponge, and the lower roller is made of PP or PVDF material. The laser positioning point forming module comprises a single laser and a marble platform, the single laser is used for forming 2-4 points on the surface of the silicon wafer, the points are in the shape of a cross or a circular point, and the marble platform is used for transmitting the silicon wafer between the coating station and the laser positioning point forming module through a transmission mechanism. The exposure module comprises a CCD camera, which is used for grabbing the cross or circular points on the surface of the silicon wafer to realize the positioning of the silicon wafer. The screen plate comprises quartz glass, borosilicate glass or optical glass, and the surface of the screen plate is provided with an exposure pattern, a hollow area and a non-hollow area. The rotating platform is used for realizing the precision adjustment of the position of the silicon wafer.
2. A photovoltaic chain lithography production system as claimed in claim 1, characterized in that: The light source is an LED light source, the wavelength range is 100-500 nm single-wavelength light source, a square light spot with a side length of 182 mm-230 mm is formed, and the square light spot is used for irradiation on the screen plate. The exposure platform is used for bearing the rotating platform. The developing module comprises a chain roller alkali washing tank, the chain roller alkali washing tank and the exposure platform are connected through a belt transmission system, and the silicon wafer is corroded in the chain roller alkali washing tank through an alkali washing roller.
3. A photovoltaic chain lithography production system as claimed in claim 2, characterized in that: The water washing system comprises a first water washing tank and a second water washing tank.
4. A photovoltaic chain lithography production system as claimed in claim 1, characterized in that: The photoresist removing module comprises a chain alkali washing tank, and cleaning water knives are arranged above the chain roller alkali washing tank and the chain alkali washing tank to flush the corroded silicon wafer.
5. A photovoltaic chain lithography production system as claimed in claim 1, characterized in that: The drying module comprises a drying tank, and the chain roller alkali washing tank, the first water washing tank, the chain alkali washing tank, the second water washing tank and the drying tank are connected through the alkali washing roller, and an anti-skid pattern is arranged on the surface of the alkali washing roller. 6. A photovoltaic chain lithography production system as claimed in claim 1, characterized in that: 7. A photovoltaic chain lithography production system as claimed in claim 6, characterized in that: 8. A photovoltaic chain lithography production system as claimed in claim 7, characterized in that: 9. A photovoltaic chain lithography production system as claimed in claim 8, characterized in that: