Heat dissipation module with semiconductor chilling plate
By combining a copper block, a heat-conducting plate, and a semiconductor cooling chip into a heat dissipation module, the heat dissipation problem of laptops in a limited space is solved, achieving efficient heat dissipation and improving the laptop's operational stability and user experience.
Patent Information
- Application Number
- CN202520065959.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-13
AI Technical Summary
In existing technologies for laptop coolers, the heat dissipation modules of existing laptops have limited forced heat exchange capacity within a limited space, resulting in increased noise and space constraints.
The heat sink employs a heat dissipation module with a semiconductor cooling chip, including a main bracket, a heat sink for the host, a heat sink for the main bracket, a heat conduction plate, the heat dissipation capacity of the main bracket, the heat dissipation component of the main bracket, the heat dissipation component of the main bracket, a heat sink combining a copper block and a semiconductor cooling chip, and a heat conduction plate, achieving efficient heat dissipation through the combination of the heat conduction plate and heat pipe.
Without increasing the size of the fan, the forced heat exchange capacity of the cooling module is improved to ensure the stability of the laptop's operation and the user experience, while meeting the requirements of compact installation.
Smart Images
Figure CN223692716U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation module technical field, concretely is a heat dissipation module with semiconductor refrigeration piece. BACKGROUND
[0002] Because the demand of the market to the game is higher and higher to the power consumption, and also guarantee light weight, the challenge of notebook computer radiator comes, and the basic heat dissipation of notebook computer mainly relies on two ways of conduction and convection, the former is chip heat conduction to copper block - heat pipe - heat dissipation fin, the latter is through the fan forced convection blows out the heat.
[0003] At present, the conduction is done better and better in the market, and the heat problem is solved, and the convection is mainly solved by the fan blowing the larger heat dissipation area, and the wind volume is increased, and the fan volume and the fan speed are increased, and the fan volume is increased, and the larger space is needed, and the fan speed is increased, and the noise is increased, and the experience of the consumer is poor, and the notebook computer space is limited, and the heat dissipation area is limited, and how to improve the forced heat exchange capacity of the heat dissipation module in the limited space of the notebook computer is a problem to be solved in the prior art, and the application provides a heat dissipation module with semiconductor refrigeration piece to solve the above problems. UTILITARIAN CONTENT
[0004] (I) the technical problem solved
[0005] In view of the defects of the prior art, the utility model provides a heat dissipation module with semiconductor refrigeration piece, which has the advantages of further improving the forced heat exchange capacity of the heat dissipation module without increasing the fan volume, and solves the problem of limited forced heat exchange capacity of the existing heat dissipation module.
[0006] (II) technical scheme
[0007] In order to realize the above purpose of further improving the forced heat exchange capacity of the heat dissipation module without increasing the fan volume, the utility model provides the following technical scheme: a heat dissipation module with semiconductor refrigeration piece, including main support, the bottom of the main support is provided with and fixedly installed copper block, the outer side of the main support is provided with heat dissipation assembly for cooling copper block;
[0008] The heat dissipation assembly includes heat conduction sheet fixed on the outer side of the main support, first heat pipe fixedly installed on the bottom of the main support, second heat pipe fixedly installed on the bottom of the main support, third heat pipe fixedly installed on the bottom of the main support, fourth heat pipe fixedly installed on the bottom of the main support, four semiconductor refrigeration piece main bodies fixedly installed on the outer side of the top of the main support, heat dissipation fin fixedly installed on the top of the semiconductor refrigeration piece main body, two heat dissipation fans fixedly installed on the top of the main support.
[0009] Further, the top of the main support is provided with two mounting holes extending to the top of the copper block, the bottom of the heat conduction sheet is provided with clamping holes arranged on the left and right sides, and one end of the fourth heat pipe extends to the inner side of the clamping hole and is fixedly connected therewith.
[0010] Further, the top of the first heat pipe, the second heat pipe, the third heat pipe and the fourth heat pipe is fixedly connected with the bottom of the copper block.
[0011] Further, the first heat pipe, the second heat pipe, the third heat pipe and the fourth heat pipe are located in the same transverse horizontal plane.
[0012] Further, the four semiconductor refrigeration sheet bodies are respectively located at the top of the first heat pipe, between the top of the first heat pipe and the second heat pipe, between the top of the first heat pipe and the third heat pipe, and between the top of the third heat pipe and the fourth heat pipe.
[0013] Further, the top of the semiconductor refrigeration sheet body is a heating surface, and the outer side of each heat dissipation fan is provided with two heat dissipation fins.
[0014] Further, the four heat dissipation fins are respectively located at the air outlet end of the two heat dissipation fans.
[0015] (Three) beneficial effects
[0016] Compared with the prior art, the utility model provides a heat dissipation module with semiconductor refrigeration sheet, has the following beneficial effects:
[0017] The heat dissipation module with semiconductor refrigeration sheet, through the cooperation between main support, copper block and heat dissipation assembly, can further improve the forced heat exchange capacity of heat dissipation module under the condition that the fan volume is not increased, so that the heat of the chip can be more efficiently discharged, thereby guaranteeing the operation stability of notebook, and also can satisfy the compact installation demand in the effective space inside notebook, simultaneously, also can not excessively increase actual occupied area and noise, so that the user can comfortably use it, has good experience feeling, so that this heat dissipation module with semiconductor refrigeration sheet has greater popularization space. ACCOUT OF DRAWINGS
[0018] Figure 1 It is the structure schematic diagram of the utility model;
[0019] Figure 2 It is the structure Figure 1 of the utility model and the bottom view schematic diagram;
[0020] Figure 3 It is the structure Figure 2 of the utility model and the front view schematic diagram.
[0021] In the figure: 1 main support, 2 copper block, 301 heat conduction sheet, 302 first heat pipe, 303 second heat pipe, 304 third heat pipe, 305 fourth heat pipe, 306 semiconductor refrigeration sheet main body, 307 heat dissipation fin, 308 heat dissipation fan. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0023] Please refer to Figures 1 to 3 The present application provides a technical solution: a heat dissipation module with semiconductor refrigeration sheets, comprising a main support 1, a copper block 2 is provided on the bottom of the main support 1 and fixedly installed, and a heat dissipation assembly for cooling the copper block 2 is installed on the outer side of the main support 1. Through the cooperation between the main support 1, the copper block 2 and the heat dissipation assembly, the forced heat exchange capacity of the heat dissipation module can be further improved without increasing the volume of the fan, so that the heat of the chip can be more efficiently discharged, thereby ensuring the running stability of the notebook computer, and also meeting the compact installation requirement in the effective space inside the notebook computer. At the same time, the actual occupied area and noise will not be excessively increased, so that the user can use it comfortably, has a good experience, and makes the heat dissipation module with semiconductor refrigeration sheets have a large popularization space.
[0024] The heat dissipation assembly in the embodiment is a structure for efficiently dissipating heat from the chip.
[0025] As shown in Figure 1 , Figure 2 and Figure 3 , the heat dissipation assembly comprises a heat conduction sheet 301 fixed on the outer side of the main support 1, a first heat pipe 302 fixedly installed on the bottom of the main support 1, a second heat pipe 303 fixedly installed on the bottom of the main support 1, a third heat pipe 304 fixedly installed on the bottom of the main support 1, a fourth heat pipe 305 fixedly installed on the bottom of the main support 1, four semiconductor refrigeration sheet main bodies 306 fixedly installed on the outer side of the top of the main support 1, heat dissipation fins 307 fixedly installed on the top of the semiconductor refrigeration sheet main body 306, and two heat dissipation fans 308 fixedly installed on the top of the main support 1.
[0026] It should be noted that the top of the main support 1 is provided with two mounting holes extending to the top of the copper block 2, which can be used for installing notebook chips, so that the notebook chips can be installed through the mounting holes and can be attached to the top of the copper block 2, so that the copper block 2 can conduct the heat of the notebook chips. The main support 1 is a metal piece, which can be an aluminum alloy piece and can have certain heat conduction effect, thereby assisting the heat transfer through the heat conduction sheet 301. The bottom of the heat conduction sheet 301 is provided with clamping holes which are open on the left and right sides. One end of the fourth heat pipe 305 extends to the inside of the clamping hole and is fixedly connected thereto, so that the heat conduction sheet 301 and the fourth heat pipe 305 can conduct heat.
[0027] In addition, the top of the first heat pipe 302, the second heat pipe 303, the third heat pipe 304 and the fourth heat pipe 305 is fixedly connected with the bottom of the copper block 2, so that the heat on the copper block 2 can be transferred to the first heat pipe 302, the second heat pipe 303, the third heat pipe 304 and the fourth heat pipe 305. The first heat pipe 302, the second heat pipe 303, the third heat pipe 304 and the fourth heat pipe 305 are located in the same horizontal plane and adjacent two are attached to each other. Specifically, the opposite sides of the first heat pipe 302 and the second heat pipe 303 are attached to each other, the opposite sides of the third heat pipe 304 and the fourth heat pipe 305 are attached to each other, and the opposite sides of the first heat pipe 302 and the third heat pipe 304 are attached to each other. The opposite sides of the second heat pipe 303 and the fourth heat pipe 305 are attached to each other, so that the heat between the first heat pipe 302, the second heat pipe 303, the third heat pipe 304 and the fourth heat pipe 305 can be efficiently transferred.
[0028] At the same time, the four semiconductor refrigeration sheet bodies 306 are respectively located at the top of the first heat pipe 302, between the top of the first heat pipe 302 and the second heat pipe 303, between the top of the first heat pipe 302 and the third heat pipe 304, and between the top of the third heat pipe 304 and the fourth heat pipe 305. The cold end of the four semiconductor refrigeration sheet bodies 306 can be attached to the corresponding first heat pipe 302, second heat pipe 303, third heat pipe 304 and fourth heat pipe 305, so that forced heat exchange cooling can be achieved.
[0029] In addition, the top of the semiconductor refrigeration piece body 306 is a heating surface, and the outer side of each heat dissipation fan 308 is provided with two heat dissipation fins 307. Four heat dissipation fins 307 are respectively located at the air outlet end of the two heat dissipation fans 308, so that the heat dissipation fan 308 can blow out the heat inside the heat dissipation fin 307. Specifically, the bottom of the heat dissipation fan 308 is the air inlet end, and the principle is similar to that of the centrifugal fan. The existing disclosed heat dissipation fan technology enables the heat dissipation fan 308 to suck air at the bottom and blow it out through the air outlet end to cool the heat dissipation fin 307, thereby cooling the heating surface of the semiconductor refrigeration piece body 306, enabling the cooling surface to work efficiently. At the same time, the notebook computer is also integrated with a temperature control device, which can monitor the temperature of the outside environment and control the temperature of the cooling surface of the semiconductor refrigeration piece body 306.
[0030] The working principle of the above embodiment is as follows:
[0031] When the notebook computer chip is cooled, the semiconductor refrigeration piece body 306 is started to forcibly cool the first heat pipe 302, the second heat pipe 303, the third heat pipe 304 and the fourth heat pipe 305. The heat generated by the notebook computer chip is exchanged through the copper block 2 and the heat dissipation piece 301 and the first heat pipe 302, the second heat pipe 303, the third heat pipe 304 and the fourth heat pipe 305, thereby realizing the cooling effect of the notebook computer chip. The heat dissipation fan 308 is started to cool the first heat pipe 302, the second heat pipe 303, the third heat pipe 304 and the fourth heat pipe 305 through the corresponding heat dissipation fin 307, so that they can be used stably, thereby effectively improving the forced cooling effect of the notebook computer chip, and meeting the demand for long-term stable use.
[0032] Compared with the prior art, the heat dissipation module with the semiconductor refrigeration piece can further improve the forced heat exchange capacity of the heat dissipation module without increasing the volume of the fan by cooperating the main bracket 1, the copper block 2 and the heat dissipation assembly, so that the heat of the chip can be more efficiently discharged, thereby ensuring the running stability of the notebook computer, and meeting the compact installation demand in the effective space inside the notebook computer. At the same time, it will not increase the actual occupied area and noise too much, so that the user can use it comfortably, has a good experience, and the heat dissipation module with the semiconductor refrigeration piece has a large popularization space, solving the problem of limited forced heat exchange capacity of the existing heat dissipation module.
[0033] The electrical components appearing in the text are all electrically connected with the master controller and the power supply, and the provision of the power supply is a common knowledge in the art, wherein the power supply in the application is the built-in power supply inside the notebook computer, the master controller can be a conventional known device such as a notebook computer chip which can be controlled by simple programming of the person skilled in the art, and all are existing disclosed power connection technologies, which will not be described herein.
[0034] It should be noted that the terms "comprising", "containing" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or device. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of other identical elements in the process, method, article or device including the element.
[0035] Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application.
Claims
1. A heat dissipation module with semiconductor refrigeration sheet, comprising a main support (1), characterized in that: The copper block (2) is arranged and fixed at the bottom of the main support (1), and a heat dissipation assembly for cooling the copper block (2) is arranged at the outer side of the main support (1). The heat dissipation assembly comprises a heat conduction sheet (301) fixed at the outer side of the main support (1), a first heat pipe (302) fixed at the bottom of the main support (1), a second heat pipe (303) fixed at the bottom of the main support (1), a third heat pipe (304) fixed at the bottom of the main support (1), a fourth heat pipe (305) fixed at the bottom of the main support (1), four semiconductor refrigeration sheet bodies (306) fixed at the outer side of the top of the main support (1), heat dissipation fins (307) fixed at the top of the semiconductor refrigeration sheet bodies (306), and two heat dissipation fans (308) fixed at the top of the main support (1).
2. The heat dissipation module with semiconductor refrigeration sheet according to claim 1, characterized in that: Two installation holes extending to the top of the copper block (2) are formed at the top of the main support (1), and a clamping hole is formed at the bottom of the heat conduction sheet (301) and is open at both sides.
3. The heat dissipation module with semiconductor refrigeration sheet according to claim 1, characterized in that: The top of each of the first heat pipe (302), the second heat pipe (303), the third heat pipe (304) and the fourth heat pipe (305) is fixedly connected with the bottom of the copper block (2).
4. The heat dissipation module with semiconductor refrigeration sheet according to claim 1, characterized in that: The first heat pipe (302), the second heat pipe (303), the third heat pipe (304) and the fourth heat pipe (305) are located in the same horizontal plane.
5. The heat dissipation module with semiconductor refrigeration sheet according to claim 1, characterized in that: The four semiconductor refrigeration sheet bodies (306) are respectively located at the top of the first heat pipe (302), between the top of the first heat pipe (302) and the second heat pipe (303), between the top of the first heat pipe (302) and the third heat pipe (304), and between the top of the third heat pipe (304) and the fourth heat pipe (305).
6. The heat dissipating module with semiconductor refrigeration sheet according to claim 1, wherein: The top of each of the semiconductor refrigeration sheet bodies (306) is a heating surface, and two heat dissipation fins (307) are arranged at the outer side of each of the heat dissipation fans (308).
7. The heat dissipating module with semiconductor refrigeration sheet according to claim 1, wherein: The four heat dissipation fins (307) are respectively located at the air outlet ends of the two heat dissipation fans (308).