Driving power supply of patch packaging structure

Abstract

The utility model discloses a driving power supply of a surface-mounted packaging structure. The driving power supply comprises special-shaped surface-mounted pins, a carrier plate, a plastic packaging material and a device. The shapes of the special-shaped surface-mounted pins can be in various shapes (such as an I shape), the special-shaped surface-mounted pins can be made of materials such as a PCB or a resin plated metal structural part or a metal part, and the required number of metal bonding pads are manufactured on the two faces of the special-shaped surface-mounted pins according to application requirements and are communicated. The overall thickness of the special-shaped surface-mounted pins is required to be larger than that of the highest device; the metal bonding pad C 303 of the first surface 301 of the special-shaped surface-mounted pin is welded on the second surface 202 of the carrier plate, and the metal bonding pad D 304 of the second surface 302 of the special-shaped surface-mounted pin is exposed. According to the driving power supply manufactured through the patch packaging manufacturing method of the driving power supply, the flat and small design of the patch power supply is achieved, and the problem that the board arrangement space of high-density small-space equipment is insufficient is well solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of switching power supply, concretely relates to a driving power supply of patch encapsulation structure. BACKGROUND

[0002] With the development of science and technology, many modern electronic products, motor equipment are more and more functional, and more and more miniaturization, since which the internal power device space is bound to reduce, and the manufacturing difficulty of power device is further increased, and the reliability is reduced.

[0003] The existing power device has the following defects: (1) the whole machine assembly part is much, and the encapsulation structure volume is big (2) the connecting terminal is PIN needle, adopts SMD mode, cannot be welded with patch device together, and the customer installation efficiency is low;(3) the connecting terminal uses single copper column pin patch, and there are problems such as big patch difficulty, patch offset, low strength, low production efficiency. UTILITY MODEL CONTENT

[0004] The existing process has the defects of big patch difficulty, patch offset and low strength in single copper column pin patch, and low production efficiency;The product in the market uses buried magnetic technology, and the encapsulation substrate is thick, and there is the problem of poor reliability.

[0005] In order to solve the above problems, the utility model adopts the following technical scheme:

[0006] A driving power supply of patch encapsulation structure, including circuit board and transformer installed on the circuit board, further including the pin carrier plate provided with surface mounting pin, the pin carrier plate includes the hollow area of two open frame edges, for exposing the electronic device on the circuit board;The transformer includes a magnetic core and two windings, the magnetic core is square structure, adopts ferrite material integrated molding, forms four edge columns, and the two windings are symmetrically wound on the magnetic core;The transformer is encapsulated on the upper surface of the circuit board through the plastic encapsulation process, the pin carrier plate is installed on the lower surface of the circuit board, the circuit and the pin are formed by the circuit board and the pin carrier plate two plate assembly and are arranged on the plate, and the patch encapsulation structure is formed.

[0007] Preferably, the pin carrier plate is in an I-shaped structure, including a middle region for strengthening the primary and secondary side isolation and four extending arms for setting the surface mounting pin pads;Or in a T-shaped structure, including a middle region for strengthening the primary and secondary side isolation and two extending arms for setting the surface mounting pin pads.

[0008] Preferably, the entire upper surface of the circuit board is wrapped and encapsulated by plastic encapsulation material.

[0009] Preferably, the thickness of the circuit board is less than that of the pin carrier plate, the circuit board is a double-sided board, and the upper surface and the lower surface both have metal pads, which are PCB boards, lead frames or MIS boards.

[0010] Preferably, the circuit board is double-sided assembled, one side of which is provided with metal pads corresponding to the surface-mounted pins, the height of the metal pads being lower than the electronic devices.

[0011] Preferably, the thickness of the pin carrier plate is greater than the height of the highest electronic device on the lower surface of the circuit board, or the height of the superimposed assembly surface formed by welding the pin carrier plate to the lower surface of the circuit board is higher than the highest electronic device exposed by the hollowed-out area of the pin carrier plate on the lower surface of the circuit board.

[0012] Preferably, the thickness of the pin carrier plate is greater than 0.5 mm.

[0013] Preferably, the pin pads provided on each of the extending arms of the pin carrier plate are the same in number.

[0014] Preferably, the pin pads provided on each of the extending arms of the pin carrier plate are two in number.

[0015] Preferably, the pin pads of the pin carrier plate are recessed arc-shaped structures that communicate with the upper and lower surfaces thereof, or are recessed arc-shaped structures that communicate with the upper and lower surfaces thereof and are provided with side walls.

[0016] Preferably, the surface-mounted package structure composed of the circuit board and the pin carrier plate has a length greater than 5 mm, a width greater than 5 mm, and a thickness greater than 2 mm.

[0017] Preferably, the thickness of the circuit board is less than 1 mm.

[0018] Preferably, the driving power supply is cut and formed.

[0019] The driving power supply of the surface-mounted package structure has the following advantages:

[0020] 1. Using special-shaped surface-mounted pins:

[0021] ① Providing support and electrical connection while protecting the bottom devices;

[0022] ② High pin mounting precision, improving mounting efficiency (about 2-3 times);

[0023] ③ Increasing the mechanical strength of the pins to improve reliability;

[0024] ④ Improving the processing stability of the customer application driving power supply during SMT welding;

[0025] ⑤ The special-shaped pins span the original secondary side, increasing the creepage distance and improving overall performance;

[0026] 2. Using transformer packaging technology to reduce the thickness of the packaging substrate, which has the following advantages:

[0027] ① Transformer is spot-welded on PCB and then plastic-encapsulated, which can improve internal insulation capacity of transformer;

[0028] ② Reducing substrate thickness (from 4mm to below 1mm), which can improve reliability abnormality caused by PCB thickness problem. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a perspective exploded structure diagram of the driving power supply of the patch packaging structure before plastic-encapsulation;

[0030] Figure 2 It is a perspective view of bottom surface view angle of the driving power supply of the patch packaging structure after plastic-encapsulation;

[0031] Figure 3 It is a perspective view of top surface view angle of the driving power supply of the patch packaging structure after plastic-encapsulation;

[0032] Figure 4 It is a perspective view of the surface-mounted pin carrier plate of the driving power supply of the patch packaging structure.

[0033] In the above drawings, the reference signs are as follows:

[0034] 10. Transformer, 11. Magnetic core, 13. Winding, 102. Device, 20. Circuit board, 201. Upper surface of circuit board, 202. Lower surface of circuit board, 203. Metal pin pad A, 204. Metal pin B, 30. Surface-mounted pin carrier plate, 301. Upper surface of surface-mounted pin carrier plate, 302. Lower surface of surface-mounted pin carrier plate, 303. Metal pin C, 304. Metal pin D, 305. Metal pin E, 31. Hollowed-out area, 33. Middle area, 35. Extended arm, 40. Plastic-encapsulation layer DETAILED DESCRIPTION

[0035] The utility model / invention and its beneficial effects will be described in further detail below in combination with specific embodiments and the drawings of the specification. However, the specific embodiments of the utility model / invention are not limited thereto.

[0036] Reference Figures 1-2 The utility model provides a kind of patch packaging manufacturing method of driving power supply, by cutting forming into single product patch packaging structure driving power supply of entire circuit board, specific manufacturing method includes the following steps,

[0037] Preparation, provide the transformer made by winding processed on magnetic core, and the PCB carrier plate with surface-mounted pin of two hollowed-out areas processed.

[0038] The upper surface of the circuit board is plastic-sealed, including transformer welding and plastic sealing, that is, the transformer is welded on the upper surface 201 of the circuit board by spot welding and then is packaged on the upper surface of the circuit board by a plastic sealing process, so that the thickness of the substrate can be reduced, the reliability can be improved, and the withstand voltage performance of the transformer can be improved.

[0039] The electronic devices on the lower surface of the circuit board are surface-mounted.

[0040] The PCB carrier board with surface-mounted pins is welded on the lower surface of the circuit board, that is, the metal pads C 303 on the upper surface 301 of the surface-mounted pin carrier board are welded on the corresponding metal pads on the lower surface 202 of the circuit board, and the metal pads D 304 on the lower surface 302 of the surface-mounted pin carrier board are exposed as external pins of the driving power supply; in this way, the surface-mounted pin carrier board can not only provide support and electrical connection, but also protect the electronic devices that are not plastic-sealed on the bottom surface, improve the mounting efficiency, improve the reliability and welding stability, and increase the creepage distance through the shape and thickness of the surface-mounted pin carrier board, thereby improving the overall performance of the driving power supply.

[0041] The driving power supply is cut and formed into a single finished surface-mount package structure.

[0042] The driving circuit manufactured by the surface-mount package manufacturing method of the utility model comprises a circuit board and a transformer installed on the circuit board, further comprises a pin carrier board (i.e., a surface-mounted pin carrier board) provided with surface-mounted pins, the transformer is packaged on the upper surface of the circuit board by a plastic sealing process, the pin carrier board is installed on the lower surface of the circuit board, the circuit and the pin carrier board are arranged separately, and the surface-mount package structure is composed of the circuit board and the pin carrier board; in the embodiment, the transformer preferably comprises a magnetic core and two windings, the magnetic core is in a square structure and is integrally formed by using ferrite material, four edge columns are formed, and the two windings are symmetrically wound on the magnetic core; the pin carrier board comprises two hollow areas for exposing the electronic devices on the circuit board.

[0043] Preferably, the surface mount lead carrier 30 has an irregular shape, which can be formed into various shapes, such as "I" or "T", by two cut-out areas. It can be replaced by carrier board functional components similar to those on a PCB, such as resin-plated metal structural components or metal components. The required number of metal pads are made on both sides of the irregular surface mount lead according to the application requirements. The two cut-out areas can be symmetrically arranged to set up a central area that can strengthen the isolation between the primary and secondary sides and to set up multiple protruding arms for the surface mount lead pads. The cut-out area can be a cut-out structure with a cut-out frame. The overall thickness of the surface mount lead carrier 30 is required to be greater than the highest device mounted on the lower surface of the circuit board 20. A surface-mount lead carrier 30 is soldered to the lower surface of the circuit board. The metal pads C303 on the upper surface 301 of the surface-mount lead carrier 30 are soldered onto the lower surface 202 of the carrier. The metal pads D304 on the lower surface 302 of the surface-mount lead carrier 30 are exposed as external pins for the drive power supply. In other embodiments, the lead pads of the surface-mount lead carrier 30 may also be recessed arc-shaped structures extending through its upper and lower surfaces, formed only on the sidewalls. The surface-mount lead carrier 30 is used for double-sided assembly. Thus, the surface-mount lead carrier 30 provides support and electrical connection while protecting the electronic components on the bottom surface of the circuit board. It also improves mounting efficiency, reliability, soldering stability, and creepage distance, thereby enhancing the overall performance of the drive power supply.

[0044] The carrier board is used for double-sided assembly and serves as an electrical connection carrier. The material can be PCB, frame, or MIS; both the upper surface 201 and the lower surface 202 have metal pads.

[0045] Preferably, the entire upper surface of the circuit board is encapsulated with molding compound.

[0046] Preferably, the thickness of the circuit board is less than that of the lead carrier board, and the circuit board is a double-sided board with metal pads on both the upper and lower surfaces. It is a PCB board, lead frame, or MIS board. In this embodiment, the thickness of the circuit board is less than 1 mm.

[0047] Preferably, the circuit board is double-sided assembled, with one side having metal pads corresponding to surface mount pins, and the height of the metal pads being lower than that of the electronic components.

[0048] Preferably, the thickness of the lead carrier is greater than the height of the tallest electronic device on the lower surface of the circuit board, or the height of the superimposed assembly surface formed by soldering the lead carrier to the lower surface of the circuit board is higher than the tallest electronic device exposed by the cutout area of ​​the lead carrier on the lower surface of the circuit board. In this embodiment, the thickness of the lead carrier is greater than 0.5 mm.

[0049] Preferably, each lead arm of the lead carrier has the same number of pins. In this embodiment, each lead arm of the lead carrier has two pins.

[0050] Preferably, the pin pads of the pin carrier are groove-shaped arc-shaped structures that connect its upper and lower surfaces, or groove-shaped arc-shaped structures that penetrate its upper and lower surfaces and are only opened on the sidewalls.

[0051] Preferably, the surface mount package structure, which is assembled from two boards, a circuit board and a lead carrier board, has an overall length greater than 5 mm, a width greater than 5 mm, and an overall thickness greater than 2 mm.

[0052] The drive power supply manufactured by the surface mount packaging method of this utility model realizes the flat and miniaturized design of the surface mount power supply, which effectively solves the problem of insufficient board space in high-density small space equipment. At the same time, the connection terminal adopts the "I" shaped substrate design, which avoids the problems of difficult surface mount, mounting misalignment and low strength of copper pillar pin mounting, thus improving the production efficiency of the product.

[0053] The above are merely preferred embodiments of the utility model. It should be noted that the above preferred embodiments should not be considered as limitations on the present utility model, and its protection scope should be determined by the scope defined in the claims. For those skilled in the art, several improvements and modifications can be made without departing from the spirit and scope of the application of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A driving power source of a patch package structure comprising a circuit board and a transformer mounted on the circuit board, characterized in that: The pin carrier provided with surface-mounted pins includes two hollowed-out areas of open frame for exposing electronic devices on the circuit board. The transformer includes a magnetic core and two windings, the magnetic core is a square structure and is integrally formed by ferrite material, and the two windings are symmetrically wound on the magnetic core. The transformer is packaged on the upper surface of the circuit board through a plastic packaging process, the pin carrier is installed on the lower surface of the circuit board, the circuit and the pin carrier are arranged separately, and the surface-mounted packaging structure is formed by assembling the circuit board and the pin carrier.

2. The driving power source of the patch package structure according to claim 1, characterized in that: The pin carrier has an I-shaped structure and includes a middle area for strengthening the isolation of the primary winding and the secondary winding and four extending arms for arranging the surface-mounted pin pads, or has a T-shaped structure and includes a middle area for strengthening the isolation of the primary winding and the secondary winding and two extending arms for arranging the surface-mounted pin pads.

3. The driving power supply of the patch package structure according to claim 1, wherein: The entire upper surface of the circuit board is wrapped and packaged by plastic packaging material.

4. The driving power supply of the patch package structure according to claim 1, wherein: The thickness of the circuit board is less than that of the pin carrier, the circuit board is a double-sided board, and the upper surface and the lower surface of the circuit board are provided with metal pads.

5. The driving power supply of the patch package structure according to claim 1, wherein: The circuit board is a double-sided assembly, one side of the circuit board is provided with metal pads corresponding to the surface-mounted pins, and the height of the metal pads is lower than that of the electronic devices.

6. The driving power supply of the patch package structure according to claim 1, wherein: The thickness of the pin carrier is greater than the height of the highest electronic device on the lower surface of the circuit board, or the height of the superimposed assembly surface formed by welding the pin carrier to the lower surface of the circuit board is higher than that of the highest electronic device exposed by the hollowed-out area of the pin carrier on the lower surface of the circuit board.

7. The driving power supply of the patch package structure according to claim 1, wherein: The thickness of the pin carrier is greater than 0.5 mm.

8. The driving power supply of the patch package structure according to claim 1, characterized in that: The pin carrier has the same number of pin pads arranged on each extending arm.

9. The driving power supply of the patch package structure according to claim 1, wherein: The pin carrier has two pin pads arranged on each extending arm.

10. The driving power supply of the patch package structure according to claim 1, wherein: The pin pads of the pin carrier have a groove-shaped arc structure that communicates with the upper and lower surfaces thereof, or a groove-shaped arc structure that communicates with the upper and lower surfaces thereof and is only provided with a side wall.

11. The driving power supply of the patch package structure according to claim 1, characterized in that: The surface-mounted packaging structure formed by assembling the circuit board and the pin carrier has a length greater than 5 mm, a width greater than 5 mm, and a thickness greater than 2 mm.

12. The driving power supply of the patch package structure according to claim 1, wherein: The thickness of the circuit board is less than 1 mm.

13. The driving power supply of the patch package structure according to claim 1, characterized in that: The driving power supply is cut and formed.

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