Target component and electronic equipment
By employing a unibody construction of the target component in electronic devices, combining a high-strength first component with a low-strength second component, the problem of high-strength structural components in electronic devices is solved, achieving the effect of reducing costs and processing difficulty.
Patent Information
- Application Number
- CN202423200889.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-24
AI Technical Summary
In electronic devices, internal structural components require high strength but are difficult to manufacture, especially when they are external surfaces. Existing technologies struggle to effectively reduce manufacturing difficulty and control costs.
The target component adopts an integrated construction, in which the first component has a higher material strength than the second component. It is formed into one piece through processes such as diffusion welding or hot isostatic pressing. The target structure is processed on the second component. The use of the lower-strength second component reduces the processing difficulty and lowers the cost.
It achieves an effective combination of high-strength exposed surfaces and internal structural components, reducing processing difficulty and cost, while meeting the support and fixation requirements of electronic equipment.
Smart Images
Figure CN223693924U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic equipment, and in particular to a target assembly and an electronic device. BACKGROUND
[0002] In an electronic device, some structural members have a surface inside the electronic device and a surface that needs to be the outer surface of the electronic device. For example, the middle frame structure of a mobile phone. This makes the strength requirement of these structural members higher. However, the surface inside the electronic device also needs to be processed with a corresponding structure to support and install the parts inside the electronic device, and it is difficult to process the corresponding structure of the structural member made of high-strength material. CONTENT OF THE UTILITY MODEL
[0003] Therefore, the present application provides a target assembly. The present application also provides an electronic device with the target assembly.
[0004] To achieve the above object, the present application provides the following technical solutions:
[0005] A target assembly comprises:
[0006] A first component has different first and second surfaces, and the first surface is an exposed surface facing the outside of an electronic device.
[0007] A second component is located on the second surface and is integrally formed with the first component, and the second component has a target structure.
[0008] The material strength of the first component is higher than that of the second component, and the target structure is a structure processed on the second component integrally formed with the first component.
[0009] Optionally, in the target assembly, the first component is arranged along the outer periphery of the second component.
[0010] Optionally, in the target assembly, the first surface is the surface of the first component facing away from the second component.
[0011] Optionally, in the target assembly, the first component is a ring structure and surrounds the outside of the second component.
[0012] Optionally, in the target assembly, the first projection area of the first component along a first direction covers the second projection area of the second component along the first direction.
[0013] The first direction is perpendicular to the second surface.
[0014] Optionally, in the target assembly, the first direction is perpendicular to the first surface.
[0015] The first surface is parallel to the second surface, and the first projection area is aligned with the first surface.
[0016] Optionally, in the target assembly, the target structure is processed by a machine tool.
[0017] The target structure has a support part for supporting a component and / or a fixing part for fixing a component. Optionally, in the target assembly, the first component has a positioning surface for positioning with a processing position of the machine tool.
[0018] Optionally, in the target assembly, the first component and the second component are integrally formed by diffusion welding or hot isostatic pressing.
[0019] The application further provides an electronic device comprising a target assembly and an electronic component, wherein the target assembly comprises:
[0020] a first component having different first and second surfaces, the first surface being an exposed surface facing outside the electronic device;
[0021] a second component located on the second surface and integrally formed with the first component, the second component having a target structure, and the electronic component being connected with the target structure.
[0022] wherein the material strength of the first component is higher than that of the second component, and the target structure is a structure processed on the second component integrally formed with the first component. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.
[0024] Figure 1 a first structure schematic diagram of a target assembly provided by the embodiments of the present application;
[0025] Figure 2 a second structure schematic diagram of a target assembly provided by the embodiments of the present application;
[0026] Figure 3 a first processing state schematic diagram of a target assembly provided by the embodiments of the present application;
[0027] Figure 4 A second processing state schematic diagram of a target assembly provided by an embodiment of the present application is shown in FIG. 2.
[0028] In the embodiment of the present application,
[0029] A first component 100, a first surface 110, and a second surface 120.
[0030] A second component 200, and a target structure 210.
[0031] A first profile 001, a second profile 002, and a target assembly 003. DETAILED DESCRIPTION
[0032] The present application discloses a target assembly. The present application also provides an electronic device having the target assembly.
[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0034] As shown in FIGS. 1 and 2, Figure 1 and Figure 2 The present application provides a target assembly, which includes a first component 100 and a second component 200. The first component 100 has a first surface 110 and a second surface 120, which are different. The first surface 110 is an exposed surface facing the outside of an electronic device. In a state where the target assembly is assembled in the electronic device as a component of the electronic device, the first surface 110 can serve as an exposed surface of the electronic device, i.e., an outer surface of the electronic device. Since the first surface 110 and the second surface 120 are different, the second surface 120 can not serve as an exposed surface. In the state where the target assembly is assembled in the electronic device, the second surface 120 can be hidden in the electronic device and cannot be observed from the outside of the electronic device. The first surface 110 and the second surface 120 can be adjacent, opposite, or opposite to each other, as long as the first surface 110 and the second surface 120 are not in the same plane.
[0035] The second component 200 is located on the second surface 120 and is in an integral structure with the first component 100. That is, the first component 100 and the second component 200 are designed as an integral structure that cannot be separated. The first component 100 and the second component 200 can be in an integral structure by integral processing or can be directly fixed and connected as an integral structure by corresponding processing methods. The second component 200 has a target structure 210, which can be all or part of the functional structure of the target assembly and at least can play a role in supporting, positioning, or connecting.
[0036] The material strength of the first component 100 is higher than that of the second component 200, and the target structure 210 is a structure processed on the second component 200 in an integral structure with the first component 100. Because the material strength of the first component 100 is higher than that of the second component 200, the first surface 110 belonging to the first component 100 is formed of a material with higher material strength, so that it has stronger strength to effectively protect the structure inside the electronic device. The material strength of the second component 200 is lower than that of the first component 100, which can effectively reduce the processing difficulty of the target structure 210 in the process of processing the target structure 210.
[0037] In addition, the target structure 210 is a structure processed on the second component 200 in an integral structure with the first component 100, that is, the target structure 210 is processed on the second component 200 on the basis of the first component 100 and the second component 200 forming an integral structure. The first component 100 and the second component 200 can be separately processed first, and then linked by integral forming (such as diffusion welding or hot isostatic pressing) to form an integral structure, and then the target assembly is processed on the second component 200 to form the target assembly of the present application. The material block for processing the first component 100 and the material block for processing the second component 200 can be integrally formed into a processing assembly first, and then cut into a to-be-processed assembly 003 including at least the first component 100 and the second component 200 by cutting such as wire cutting, and the target structure 210 is processed on the second component 200 in the to-be-processed assembly 003 to form the target assembly of the present application.
[0038] In addition, the material strength of the first component 100 is higher than that of the second component 200, and the material of the first component 100 can be selected from titanium alloy, damascus steel, or stainless steel, etc. with high cost to meet the material strength requirement of the first component 100 and meet the appearance effect requirement of the first surface 110 as the exposed surface of the electronic device. The material of the second component 200 can be selected from 5 / 6 aluminum or recycled aluminum, which can effectively reduce the cost on the basis of meeting the requirement of reducing the processing difficulty of the target structure 210.
[0039] The reduction of processing difficulty is reflected in that the material strength of the second component 200 is lower than that of the first component 100, so that the second component 200 with lower strength is convenient to process. The reduction of cost is reflected in that the material with lower strength is used as the second component 200, that is, the strength requirement of the material for manufacturing the second component 200 is reduced, so that cheaper material can be selected to manufacture the second component 200. In addition, the use of recycled metal can further reduce the cost. In addition, the same processing technology is used to process the target structure 210 of the second component 200 with lower strength, which can further reduce the processing time of the target structure 210, and further reduce the processing difficulty and cost.
[0040] In some embodiments, the first component 100 is arranged along the outer periphery of the second component 200. Through the above arrangement, the second component 200 can be placed in the middle of the target assembly, so as to facilitate the first component 100 with the first surface 110 to be close to the outside of the electronic device, and the second component 200 to be located inside the electronic device, in the state that the target assembly is assembled in the electronic device as a component part of the electronic device. Of course, the first component 100 and the second component 200 can also be arranged in a straight line.
[0041] The first surface 110 is the surface of the first component 100 facing away from the second component 200. That is, the first surface 110 and the second surface 120 are two opposite surfaces of the first component 100. Since the second component 200 is located on the second surface 120, the second component 200 is located on the side of the first component 100 facing away from the first surface 110, that is, the second component 200 is located on the side of the first component 100 away from the exposed surface of the electronic device, so as to arrange the second component 200 inside the electronic device. The first surface 110 and the second surface 120 can also be adjacent, for example, the first surface 110 and the second surface 120 are connected at a certain angle.
[0042] The first component 100 is arranged along the outer periphery of the second component 200, so that the number of the first component 100 can be multiple, so as to arrange multiple first components 100 along the outer periphery of the second component 200. Adjacent two first components 100 can be connected relative to each other, or can be spaced apart by a predetermined gap.
[0043] The number of the first component 100 can also be one. In order to realize the arrangement of the first component 100 along the outer periphery of the second component 200, the first component 100 can be arranged at least around the second component 200.
[0044] As Figure 1As shown, the first component 100 can be a ring structure, and surrounds the outside of the second component 200. Through the above arrangement, the first component 100 surrounds the periphery of the second component 200, and then the periphery of the target assembly is the first component 100.
[0045] In combination with the first surface 110 being the surface of the first component 100 facing away from the second component 200, the periphery of the target assembly is the first surface 110. In the state that the target assembly is assembled in the electronic device, the end surface (such as the surface shown in the figure) of the target assembly can be shielded by other components or structures in the electronic device (such as the front panel or back cover in the mobile phone), so that the target assembly only has the first surface 110 as the exposed surface of the electronic device. Among them, the arrangement direction of the two end surfaces of the target assembly is perpendicular to the direction in which the first component 100 surrounds the second component 200. Figure 1
[0046] The first component 100 can also have a groove structure, and the second component 200 can be embedded in the groove structure to realize that the first component 100 has a part (including the side wall of the groove structure) arranged along the periphery of the second component 200.
[0047] As shown in Figure 3 and Figure 4 , a specific processing process of the target assembly is as follows:
[0048] The first profile 001 for forming the first component 100 and the second profile 002 for forming the second component 200 are respectively processed. In the embodiment that the first component 100 can be a ring structure and surrounds the outside of the second component 200, the first profile 001 can be a sleeve structure, and the second profile 002 can be a block structure. Among them, the second profile 002 of the block structure and the first profile 001 of the sleeve structure can be extruded profiles, or other profiles.
[0049] The first profile 001 and the second profile 002 are combined together. Specifically, the sleeve structure (first profile 001) and the block structure (second profile 002) can be sleeved together, and then placed in a vacuum or protective atmosphere furnace, heated to a temperature of 70%-90% of the metal melting point, and then subjected to isotropic force. After a predetermined time, the atomic interdiffusion of the bonding layer of the first profile 001 and the second profile 002 forms a reliable connection as a whole, and finally the first profile 001 and the second profile 002 are combined together to form a profile combination structure with an integrated structure.
[0050] The profile assembly structure is cut by a line cutting or the like. The cutting direction can be perpendicular to the axial direction of the sleeve structure, so that the to-be-processed assembly 003 formed by cutting the profile assembly structure is a structure in which the first component 100 is annular and surrounds the outside of the second component 200. It should be noted that the structure after cutting can directly form the to-be-processed assembly 003, or can be a structure block, which is deformed by stamping, stretching or the like while keeping the relative positions of the first component 100 and the second component 200 unchanged, for example, the first profile 001 surrounds the outside of the second profile 002 in the structure block, and the first component 100 (the first profile 001) is always annular and surrounds the outside of the second component 200 (the second profile 002) through the structural deformation of the structure block.
[0051] The second component 200 of the to-be-processed assembly 003 is processed to form the target structure 210, so as to complete the processing of the target assembly.
[0052] The first surface 110 can be the outer surface of the first profile 001, and the outer surface of the first component 100 is the first surface 110 through cutting or the like. Alternatively, the corresponding position of the first component 100 of the to-be-processed assembly 003 can be processed (such as turning or cutting) by an additional processing method, so as to form the first surface 110.
[0053] In order to avoid the second component 200 being exposed when the target assembly is assembled in the electronic device as a component of the electronic device, the first projection area of the first component 100 along the first direction covers the second projection area of the second component 200 along the first direction, and the first direction is perpendicular to the second surface 120. As shown in Figure 1 and Figure 2 The first direction is the horizontal direction or the vertical direction of the view shown in Figure 1 and Figure 2
[0054] The target assembly processed according to the above specific processing process is formed by cutting the first component 100 and the second component 200, so that the edges of the first component 100 and the second component 200 are aligned in the second direction, and the second direction is perpendicular to the first direction. Moreover, the second direction is also perpendicular to the direction of the view shown in Figure 1 and Figure 2
[0055] In some embodiments, the first direction is perpendicular to the first surface 110; the first surface 110 is parallel to the second surface 120, and the first projection region is aligned with the first surface 110. In this embodiment, the first surface 110 and the second surface 120 are two surfaces opposite to each other of the first component 100. In the embodiment where the first component 100 is a ring structure, the first surface 110 can be the outer surface of the ring structure, and the second surface 120 can be the inner surface of the ring structure. Since the first projection region is aligned with the first surface 110, the first surface 110 can have the same structure and area as the first projection region. The second projection region of the second component 200 is the projection of the second component 200 along the first direction to the first surface 110. The edge of the second projection region can coincide with the edge of the first projection region, or the edge of the second projection region can be located within the first projection region.
[0056] In the target assembly provided by the embodiments of the present application, the target structure 210 is processed by a machine tool. The machine tool processing can be CNC (Computer Numerical Control) processing, or other machine tool processing methods can be selected.
[0057] The target structure 210 has a support part for supporting components and / or a fixing part for fixing components. The support part can be used to support components such as circuit boards, antennas, or batteries that belong to electronic devices, and the support part can have a support plane and / or a matching structure capable of positioning the above-mentioned components. The fixing part can be a buckle structure or a threaded hole structure, which directly positions and cooperates with the components through the buckle structure to fix the components, or connects the components with the threaded hole through a bolt to achieve the fixing effect of the components. Since the target structure 210 is located in the electronic device and has a low probability of being subjected to external extrusion force or impact force, the target structure 210 can meet the support and fixing requirements of the above-mentioned components and does not affect the layout requirements of the components and the performance (such as antenna design requirements) of the components.
[0058] In addition, nano-injection molding process can also be used to process the target assembly, which is not limited herein and is within the protection scope.
[0059] Specifically, the first component 100 has a positioning surface for positioning with the machining position of the machine tool. Since the material strength of the first component 100 is higher than that of the second component 200, the positioning surface of the first component 100 is positioned with the machining position of the machine tool, which can effectively improve the positioning effect of the assembly to be machined 003 on the machine tool. The above-mentioned positioning surface can be the first surface 110, or a third surface connecting the first surface 110 and the second surface 120 (the first surface 110 and the second surface 120 are opposite to each other), and the third surface can be the outer surface of the first component 100 in the ring structure. Figure 1The positioning surface can be in contact with the clamp of the machine tool and clamped by the clamp to achieve the positioning effect, or the workbench of the machine tool can have the function of adsorbing the positioning surface, and the to-be-processed assembly 003 is adsorbed on the workbench of the machine tool under the action of magnetic attraction and the like when the machine tool starts the positioning action.
[0060] The second component 200 can also have a positioning surface for positioning with a machining position of the machine tool, which is not specifically limited here and is within the protection scope.
[0061] In some specific embodiments, the first component 100 and the second component 200 are integrally formed by diffusion welding or hot isostatic pressing. The diffusion welding process refers to that the surfaces of the materials in contact with each other are close to each other under the action of temperature and pressure, local plastic deformation occurs, interatomic diffusion occurs, a new diffusion layer is formed at the interface, and reliable connection is achieved. The hot isostatic pressing process refers to that the product is placed in a sealed container, the product is subjected to isotropic pressure, and high temperature is applied at the same time. Under the action of high temperature and high pressure, the product is sintered and densified. After the first component 100 and the second component 200 are integrally formed by diffusion welding or hot isostatic pressing, the second surface 120 of the first component 100 can be fused with the second component 200, so that the second surface 120 does not exist.
[0062] Of course, other processes can also be used to integrally form the first component 100 and the second component 200, which will not be described in detail here and are within the protection scope.
[0063] The embodiment of the application also provides an electronic device, which includes a target assembly and an electronic component.
[0064] The first component 100 has different first and second surfaces 110 and 120, the first surface 110 is an exposed surface facing the outside of the electronic device, and the second component 200 is located on the second surface 120 and integrally formed with the first component 100. The second component 200 has a target structure 210, and the electronic component is connected with the target structure 210. The electronic component can be a battery, an antenna, or a circuit board, etc. The material strength of the first component 100 is higher than that of the second component 200, and the target structure 210 is a structure machined on the second component 200 integrally formed with the first component 100.
[0065] It should be noted that the material strength of the first component 100 is higher than that of the second component 200. The material strength is the ability of the material to resist damage under external force. The material of the first component 100 can have higher rigidity (hardness) than that of the second component 200.
[0066] The various embodiments described in this specification are intended to be illustrative only and in no way limit the scope of the application. Changes and modifications can be made by those skilled in the art, which employ the principles of the application, without departing from the scope of the application. Accordingly, the application is not limited to the embodiments described herein, but instead has scope to encompass any choice whatsoever that is dependent on, or can be substituted in, the principal features of the application as recited in any issued claims.
[0067] The above description of disclosed embodiments is intended to be illustrative only and not limiting of the application. Numerous modifications to these embodiments can be made by those skilled in the art without departing from the spirit or scope of the application. The scope of the application is not limited to the embodiments described herein, but rather is intended to encompass any and all changes and modifications that are within the scope of the claims.
Claims
1. A target assembly, comprising: The first component has different first and second surfaces, the first surface being an exposed surface facing the outside of the electronic device. The second component is located on the second surface and is integrally formed with the first component, and the second component has a target structure. The material strength of the first component is higher than that of the second component, and the target structure is a structure machined on the second component integrally formed with the first component. The first component is arranged along the outer periphery of the second component.
2. The target assembly of claim 1, wherein, The first surface is the surface of the first component facing away from the second component.
3. The target assembly of claim 2, wherein, The first component is a ring structure and surrounds the outside of the second component.
4. The target assembly of claim 2 or 3, wherein, The first projection area of the first component along the first direction covers the second projection area of the second component along the first direction.
5. The target assembly of claim 1, wherein, The first direction is perpendicular to the second surface. The first direction is perpendicular to the first surface.
6. The target assembly of claim 5, wherein, The first surface is parallel to the second surface, and the first projection area is aligned with the first surface. The target structure is machined by a machine tool.
7. The target assembly of claim 1, wherein The target structure has a support part for supporting components and / or a fixing part for fixing components. The first component has a positioning surface for positioning with the machining position of the machine tool.
8. The target assembly of claim 7, wherein, The first component and the second component are integrally formed by diffusion welding or hot isostatic pressing.
9. The target assembly of claim 1, wherein, The target assembly includes:
10. An electronic device comprising a target component and an electronic part, characterized by comprising: The first component has different first and second surfaces, the first surface being an exposed surface facing the outside of the electronic device. The second component is located on the second surface and is integrally formed with the first component, and the second component has a target structure, and the electronic component is connected with the target structure. The material strength of the first component is higher than that of the second component, and the target structure is a structure machined on the second component integrally formed with the first component.