Circuit board and power supply module

Abstract

The utility model relates to the technical field of circuit board heat dissipation, and discloses a circuit board and a power module, and the circuit board comprises a substrate and a plurality of electronic assemblies arranged on the substrate. The plurality of electronic components includes a switching heat sink, a first resonant element, a bus capacitor, a rectifier heat sink component, a second resonant element, and a transformer component. The first resonance element, the bus capacitor and the switch radiator are arranged along a first direction to form a first column, and the second resonance element, the transformer assembly and the rectification radiator assembly are arranged along the first direction to form a second column. In the first direction, a first air channel extending in the second direction is formed between every two adjacent electronic assemblies in the first longitudinal column, a second air channel extending in the second direction is formed between every two adjacent electronic assemblies in the second longitudinal column, the second air channels are communicated with the first air channels, and the first direction is perpendicular to the second direction. According to the embodiment of the invention, the arrangement mode of the plurality of resistor assemblies on the circuit board is beneficial to improving the heat dissipation effect of the heat dissipation fan on the electronic assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board heat dissipation, in particular to a circuit board and a power module. BACKGROUND

[0002] The DC-DC circuit board of the power module is used to convert the input DC voltage into the required output voltage. A plurality of electronic components that generate a large amount of heat during operation are arranged on the DC-DC circuit board. In order to meet the heat dissipation requirements of the electronic components, the power module is also provided with a heat dissipation fan for dissipating heat from the electronic components on the DC-DC circuit board.

[0003] The arrangement of the electronic components on the DC-DC circuit board affects the circulation of the gas, which in turn has an important influence on the heat dissipation effect. If the electronic components are simply arranged according to the circuit connection sequence, there may be a problem of low heat dissipation efficiency.

[0004] Therefore, how to provide a DC-DC circuit board with a better arrangement of electronic components to improve the efficient circulation of gas is a problem that needs to be solved by those skilled in the art. Invention content

[0005] In view of the problems in the background art, the purpose of the present application is to provide a circuit board and a power module, which overcome the above problems or at least partially solve the above problems.

[0006] According to a first aspect of the present application, a circuit board is provided, comprising: a substrate and a plurality of electronic components arranged on the substrate. The plurality of electronic components includes a switching heat sink, a first resonant element, a bus capacitor, a rectifier heat sink assembly, a second resonant element and a transformer assembly. The first resonant element, the bus capacitor and the switching heat sink are arranged in a first column along a first direction, and the second resonant element, the transformer assembly and the rectifier heat sink assembly are arranged in a second column along the first direction. Along the first direction, between two adjacent electronic components in the first column, a first air duct extending in a second direction is formed, and between two adjacent electronic components in the second column, a second air duct extending in the second direction is formed, and the second air duct communicates with the first air duct, wherein the first direction is perpendicular to the second direction.

[0007] In one or more optional embodiments above, the number of switching heat sinks is at least two, and at least two switching heat sinks are arranged at intervals along the first direction, and the first resonant element is arranged between the two adjacent switching heat sinks.

[0008] In one or more optional embodiments above, the number of the first resonant elements is less than the number of the switching heat sinks, and at most one first resonant element is disposed in the gap between each pair of adjacent switching heat sinks.

[0009] In one or more optional embodiments above, in the second column, the rectifying heat sink assembly comprises two rectifying heat sink groups, and the second resonant element is disposed between the two rectifying heat sink groups. Each rectifying heat sink group comprises at least one rectifying heat sink.

[0010] In one or more optional embodiments above, the number of the transformer assemblies is two, and the second resonant element is disposed between and spaced apart from the two transformer assemblies.

[0011] In one or more optional embodiments above, each transformer assembly comprises one or more transformers. When the transformer assembly comprises a plurality of transformers, the plurality of transformers are arranged in sequence along the second direction.

[0012] In one or more optional embodiments above, the number of the second resonant elements is one or more. When the number of the second resonant elements is more than one, the plurality of second resonant elements are arranged in sequence along the second direction.

[0013] In one or more optional embodiments above, the plurality of electronic assemblies further comprises an auxiliary power supply, the auxiliary power supply is located in the second column, and the auxiliary power supply is located on the side of one of the rectifying heat sink groups away from the transformer assembly and spaced apart from the rectifying heat sink group.

[0014] In one or more optional embodiments above, the first resonant element is a resonant capacitor, and the second resonant element is a resonant inductor; or, the first resonant element is a resonant inductor, and the second resonant element is a resonant capacitor.

[0015] In one or more optional embodiments above, the first resonant element comprises at least one resonant capacitor, and the at least one resonant capacitor is mounted on a capacitor plate and connected to the substrate through the capacitor plate. The second resonant element is a resonant inductor.

[0016] In one or more optional embodiments above, the switching heat sink surface is provided with a switching device, and the switching device is located in the first air duct. The rectifying heat sink is provided with a rectifying device, and the rectifying device is located in the second air duct.

[0017] In one or more optional embodiments above, the plurality of electronic components further include a filter circuit, an output capacitor, and an anti-reverse diode heat sink, and the filter circuit, the output capacitor, and the anti-reverse diode heat sink are arranged in a third column along the first direction. In the third column, two adjacent electronic components are spaced apart to form a fifth air duct extending along the second direction, and the fifth air duct is in communication with the second air duct.

[0018] In one or more optional embodiments above, the first column, the second column, and the third column are spaced apart along the second direction.

[0019] According to a second aspect of the present application, a power module is provided, which includes the circuit board and the heat dissipation fan as described above. The heat dissipation fan is configured to drive air flow along the second direction.

[0020] The circuit board provided by the embodiments of the present application has the following advantages. The first air duct and the second air duct are arranged to facilitate the formation of natural convection or forced convection, thereby enhancing the heat dissipation effect. The switch heat sink, the first resonant element, and the bus capacitor are arranged in the first column, and the second resonant element, the transformer assembly, and the rectifier heat sink assembly are arranged in the second column. When the circuit board is applied to a power module that uses a heat dissipation fan to force air cooling, compared with a conventional circuit board that sequentially arranges a switch heat sink, a first resonant element, a bus capacitor, a second resonant element, a transformer, and a rectifier heat sink assembly according to the circuit layout in multiple columns, when the heat dissipation fan drives air flow along the second direction, the air flow has a shorter path through the first air duct and the second air duct, and the flow rate of the air flow through the array formed by the first column and the second column has less attenuation, thereby facilitating the improvement of the heat dissipation effect of the switch heat sink, the first resonant element, the bus capacitor, the second resonant element, the transformer assembly, and the rectifier heat sink assembly. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the specific embodiments or the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference signs. In the drawings, the elements or parts are not necessarily drawn according to the actual proportions.

[0022] Figure 1 A layout schematic diagram of a circuit board provided by the embodiments of the present application;

[0023] Figure 2 A perspective view of a circuit board provided by the embodiments of the present application;

[0024] Figure 3 A schematic diagram of a circuit board provided by the embodiments of the present application when viewed along a direction perpendicular to the first direction;

[0025] Figure 4 is Figure 2 enlarged view of A in the middle;

[0026] Figure 5 is Figure 2 enlarged view of B in the middle;

[0027] Figure 6 is Figure 2 enlarged view of C in the middle;

[0028] Figure 7 is a perspective view of a power module provided by an embodiment of the present application;

[0029] Figure 8 is a partial exploded view of a power module provided by an embodiment of the present application. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present application, the present application will be described in more detail below in conjunction with the drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer" and similar expressions used in the present specification are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used in the present specification are the same as those commonly understood by those skilled in the art to which the present application belongs. The terms used in the description of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the present specification includes any and all combinations of one or more related listed items.

[0032] In the description of the present specification, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict between them.

[0034] Please refer to Figures 1-3 The circuit board 100 comprises the substrate 1 and a plurality of electronic components arranged on the substrate 1. The plurality of electronic components comprises a switch heat sink 2, a first resonant element 3, a bus capacitor 7, a rectifier heat sink component 4, a second resonant element 5 and a transformer component 6. The first resonant element 3, the bus capacitor 7 and the switch heat sink 2 are arranged in a first direction X to form a first column, and the second resonant element 5, the transformer component 6 and the rectifier heat sink component 4 are arranged in the first direction X to form a second column. In the first direction X, a gap between two adjacent electronic components in the first column forms a first air duct a extending in a second direction Y, and a gap between two adjacent electronic components in the second column forms a second air duct b extending in the second direction Y, the second air duct b being in communication with the first air duct a, wherein the first direction X is perpendicular to the second direction Y.

[0035] The circuit board 100 provided by the embodiments of the present application is beneficial to the formation of natural convection or forced convection to enhance the heat dissipation effect by arranging the first air duct a and the second air duct b. The switch heat sink 2, the first resonant element 3 and the bus capacitor 7 are located in the first column, and the second resonant element 5, the transformer component 6 and the rectifier heat sink component 4 are located in the second column. When applied to a power module using a forced air cooling fan 200, compared with a conventional circuit board 100 which sequentially arranges the switch heat sink 2, the first resonant element 3, the bus capacitor 7, the second resonant element 5, the transformer component 6 and the rectifier heat sink component 4 according to the circuit layout in multiple columns, when the air flow driven by the cooling fan 200 flows in the second direction Y, the air flow flows through the first air duct a and the second air duct b for a shorter distance, and the flow rate of the air flow flowing through the array formed by the first column and the second column attenuates less, which is beneficial to improving the heat dissipation effect of the switch heat sink 2, the first resonant element 3, the bus capacitor 7, the second resonant element 5, the transformer component 6 and the rectifier heat sink component 4.

[0036] In some embodiments, the number of switch heat sinks 2 is at least two, and the at least two switch heat sinks 2 are arranged at intervals in the first direction X. The first resonant element 3 is arranged between the two adjacent switch heat sinks 2.

[0037] In some embodiments, the first resonant element 3 is a resonant capacitor, and the second resonant element 5 is a resonant inductor.

[0038] In some embodiments, the first resonant element 3 is a resonant inductor, and the second resonant element 5 is a resonant capacitor 31.

[0039] In some embodiments, the first resonant element 3 comprises at least one resonant capacitor 31, and the at least one resonant capacitor 31 is mounted on a capacitor plate 32 and connected to the substrate 1 through the capacitor plate 32.

[0040] In some embodiments, the capacitive plate 32 is vertically arranged on the substrate 1, and the thickness direction of the capacitive plate 32 is the first direction X.

[0041] In some embodiments, the number of the first resonant elements 3 is less than the number of the switch heat sinks 2, and at most one first resonant element 3 is arranged in the gap between each two adjacent switch heat sinks 2. In the embodiments in which the first resonant element 3 is the resonant capacitor 31, the heat generated by the resonant capacitor 31 is generally lower than the heat generated by the switch heat sink 2 when the circuit board 100 is working, and arranging one first resonant element 3 in the gap between the two adjacent switch heat sinks 2 is conducive to reducing the temperature between the two adjacent switch heat sinks 2.

[0042] In some embodiments, each two switch heat sinks 2 are aligned with each other along the first direction X.

[0043] In some embodiments, each two first resonant elements 3 are aligned with each other along the first direction X.

[0044] In some embodiments, the switch heat sink 2 is provided with a switch device 21, and the switch heat sink 2 is used for dissipating heat of the switch device 21. The type of the switch device 21 can be selected according to the voltage, current and power level of the specific circuit. For example, the switch device 21 includes but is not limited to a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), a silicon controlled rectifier (SCR), etc.

[0045] In some embodiments, the switch device 21 is located in the first air duct a.

[0046] Please refer to Figures 2-4 In some embodiments, the switch heat sink 2 is provided with a third air duct c, and the third air duct c penetrates through the switch heat sink 2 along the second direction Y. The third air duct c is conducive to guiding the airflow to flow through the switch heat sink 2 along the second direction Y, so as to improve the heat dissipation effect of the switch heat sink 2. Meanwhile, the third air duct c penetrates through the switch heat sink 2 along the second direction Y, and the airflow driven by the heat dissipation fan 200 can flow to the second column after passing through the third air duct c along the second direction Y, which is conducive to improving the air volume entering the second column after passing through the first column, and further improving the heat dissipation effect of the second column.

[0047] In some embodiments, the switch heat sink 2 is provided with a plurality of first heat dissipation fins 22, and the first heat dissipation fins 22 are arranged in extension along the second direction Y, and the gap between each two adjacent first heat dissipation fins 22 forms the third air duct c.

[0048] In some embodiments, along the second direction Y, an opening of a second air duct b near an end of the first column at least partially overlaps with an opening of a first air duct a near an end of the second column; and / or along the second direction Y, an opening of a second air duct b near an end of the first column at least partially overlaps with an opening of at least one third air duct c near an end of the second column. In this way, when the air flow driven by the heat dissipation fan 200 flows along the second direction Y, each second air duct b can obtain the air flow provided by the first air duct a or the third air duct c flowing along the second direction Y without being blocked or diverted, which is conducive to improving the flow rate of the air flow in the second air duct b.

[0049] In some embodiments, in the second column, the rectifier heat sink assembly 4 includes two rectifier heat sink groups 41, and the second resonant element 5 and the transformer assembly 6 are arranged between the two rectifier heat sink groups 41. The rectifier heat sink group 41 includes at least one rectifier heat sink 411.

[0050] In some embodiments, in the rectifier heat sink group 41, each rectifier heat sink 411 is arranged in sequence and spaced apart along the first direction X.

[0051] In some embodiments, along the first direction X, each rectifier heat sink 411 is aligned with each other.

[0052] In some embodiments, the rectifier heat sink 411 is provided with a rectifier device 4111, and the rectifier heat sink 411 is used for dissipating heat of the rectifier device 4111. The type of the rectifier device 4111 can be selected according to the voltage, current and power level of the specific circuit. For example, the rectifier device 4111 includes but is not limited to diodes, metal oxide semiconductor field effect transistors (MOSFETs), etc. The number of the rectifier device 4111 can be one or more than one according to the actual specification of the rectifier device 4111.

[0053] In some embodiments, the rectifier device 4111 is located in the second air duct b.

[0054] Please refer to Figure 2 , Figure 3 and Figure 5 In some embodiments, the rectifier heat sink 411 is provided with a fourth air duct d, and the fourth air duct d penetrates through the rectifier heat sink 411 along the second direction Y. The fourth air duct d is conducive to guiding the air flow to flow through the rectifier heat sink 411 along the second direction Y, so as to improve the heat dissipation efficiency, and the fourth air duct d can be used for the air flow to flow through, so as to dissipate heat of other devices arranged on the side of the second column facing away from the first column.

[0055] In some embodiments, the rectifier heat sink 411 is provided with a plurality of second heat dissipation fins 4112, and the second heat dissipation fins 4112 are arranged in extension along the second direction Y, and the gaps between adjacent second heat dissipation fins 4112 form the fourth air duct d.

[0056] Referring to Figures 1-3 In some embodiments, the number of transformer assemblies 6 is two, and the second resonant element 5 is arranged between and spaced apart from the two transformer assemblies 6.

[0057] In some embodiments, each transformer assembly 6 includes one or more transformers 61. When the transformer assembly 6 includes multiple transformers 61, the multiple transformers 61 are arranged in sequence along the second direction Y.

[0058] In some embodiments, the number of second resonant elements 5 is one or more. When the number of second resonant elements 5 is multiple, the multiple second resonant elements 5 are arranged in sequence along the second direction Y.

[0059] In some embodiments, each second resonant element 5 is aligned along the second direction Y, and each transformer 61 in each transformer assembly 6 is aligned along the second direction Y.

[0060] In some embodiments, the number of second resonant elements 5 is three, the number of transformer assemblies 6 is two, each transformer assembly 6 includes three transformers 61, along the first direction X, a transformer assembly 6, three second resonant elements 5 arranged in sequence along the second direction Y, and another transformer assembly 6 are arranged in sequence and spaced apart, a transformer assembly 6 and three second resonant elements 5 arranged in sequence along the second direction Y form a second air duct b, and three second resonant elements 5 arranged in sequence along the second direction Y and another transformer assembly 6 form another second air duct b.

[0061] In some embodiments, the primary side coils of the six transformers 61 in the two transformer assemblies 6 are connected in series in pairs, and the secondary side coils of the six transformers 61 are arranged alternately, for outputting alternating current with a phase difference of 120 degrees.

[0062] In some embodiments, the number of rectifier heat sink groups 41 is two, each rectifier heat sink group 41 includes two rectifier heat sinks 411, the two rectifier heat sink groups 41 are arranged in sequence and spaced apart along the first direction X, the four rectifier heat sinks 411 are arranged in sequence and spaced apart along the first direction X, along the first direction X, three second resonant elements 5 arranged in sequence along the second direction Y and two transformer assemblies 6 are arranged in the gap between the two rectifier heat sink groups 41. The gap between the four rectifier heat sinks 411, the two transformer assemblies 6, and the three second resonant elements 5 arranged in sequence along the second direction Y forms six second air ducts b arranged in sequence and spaced apart along the first direction X. The rectifier devices 4111 provided in the four rectifier heat sinks 411 are used to form a rectifier circuit to rectify the alternating current output by the six transformers 61 to form direct current.

[0063] In some embodiments, the number of switch heat sinks 2 is six, each switch heat sink 2 is arranged in sequence along the first direction X, the first resonant element 3 is a resonant capacitor, and the number of first resonant elements 3 is three. Along the first direction X, the second switch heat sink 2 to the fifth switch heat sink 2 are arranged in sequence alternately with the three first resonant elements 3. The gaps between the six switch heat sinks 2 and the three first resonant elements 3 form eight first air ducts a arranged in sequence along the first direction X.

[0064] In some embodiments, the three first resonant elements 3 correspond to the three second resonant elements 5 respectively, and together with the six transformers 61 form a three-phase interleaved LLC circuit. Each switch heat sink 2 is provided with a switch device 21, and among the six switch devices 21 on the six switch heat sinks 2, every two switch devices 21 correspond to one phase of the LLC circuit.

[0065] It can be understood that the number of rectifier devices 4111, the number of second resonant elements 5, the number of transformers 61, the number of switch devices 21, and the number of first resonant elements 3 can be set according to actual circuit design. For example, in some other embodiments, the first resonant element 3 is a resonant capacitor, the second resonant element 5 is a resonant inductor, the number of second resonant elements 5 is two, the number of first resonant elements 3 is one, the number of transformers 61 is one, the number of switch heat sinks 2 is two, one switch heat sink 2 is provided with one switch device 21, two second resonant elements 5, one first resonant element 3, one transformer 61, and two switch devices 21 form a single-phase LLC resonant circuit. Correspondingly, the number of rectifier devices 4111 is reduced, and the number of rectifier heat sinks 411 in each rectifier heat sink group 41 is reduced. Specifically, taking one rectifier heat sink 411 in each rectifier heat sink group 41 as an example, in the first column, along the first direction X, one switch heat sink 2, one first resonant element 3, and another switch heat sink 2 are arranged in sequence, and in the second column, along the first direction X, one rectifier heat sink 411, one transformer 61, and another rectifier heat sink 411 arranged in sequence along the second direction Y are arranged in sequence.

[0066] In some embodiments, along the first direction X, the bus capacitor 7 is arranged on one side of the whole formed by the switch heat sinks 2 and the first resonant elements 3 arranged in columns. The bus capacitor 7 is used to stabilize the input voltage of the circuit composed of the switch device 21, the first resonant element 3, the rectifier device 4111, the second resonant element 5, and the transformer 61 in the above embodiments.

[0067] In some embodiments, the plurality of electronic components further comprises an auxiliary power supply 8, the auxiliary power supply 8 is located in the second column, and the auxiliary power supply 8 is located on one side of the rectifier heat sink group 41 away from the transformer component 6 and is spaced apart from the rectifier heat sink group 41.

[0068] In some embodiments, the plurality of electronic components further comprises a filter circuit 10, an output capacitor 11, and a reverse prevention diode heat sink 9, the filter circuit 10, the output capacitor 11, and the reverse prevention diode heat sink 9 are spaced apart along the first direction to form a third column. Along the first direction, two adjacent electronic components in the third column are spaced apart to form a fifth air duct (not shown in the figure) extending along the second direction, and the fifth air duct is in communication with the second air duct b.

[0069] In some embodiments, the first column, the second column, and the third column are spaced apart along the second direction.

[0070] In some embodiments, the reverse prevention diode heat sink 9 is provided with a reverse prevention diode (not shown in the figure) on the surface thereof, the reverse prevention diode heat sink 9 is used for dissipating heat of the reverse prevention diode, and the reverse prevention diode is used for preventing external current from flowing reversely into the circuit of the circuit board 100. The number of the reverse prevention diodes can be set to one or more than one according to the size of the output current of the circuit board 100.

[0071] Referring to Figure 2 and Figure 6 , in some embodiments, the reverse prevention diode heat sink 9 is provided with a sixth air duct e penetrating through the reverse prevention diode heat sink 9 along the second direction Y. The sixth air duct e is beneficial to guiding the airflow to flow through the reverse prevention diode heat sink 9 along the second direction Y.

[0072] In some embodiments, the surface of the reverse prevention diode heat sink 9 is provided with a plurality of third heat dissipation fins 91, the third heat dissipation fins 91 are arranged along the second direction Y, and gaps between adjacent third heat dissipation fins 91 form the sixth air duct e.

[0073] In some embodiments, the number of the reverse prevention diode heat sinks 9 is at least two, and the at least two reverse prevention diode heat sinks 9 are spaced apart along the first direction X.

[0074] Referring to Figure 1 , Figure 3 , Figure 7 and Figure 8 , based on the same inventive concept, the embodiments of the present application further provide a power supply module 1000 comprising the circuit board 100 and the heat dissipation fan 200 in any of the above embodiments. The heat dissipation fan 200 is used to drive the airflow to flow along the second direction Y.

[0075] In some embodiments, the heat dissipation fan 200 is arranged at one side of the first column away from the second column, and the air outlet of the heat dissipation fan 200 faces the opening of the first air duct a away from the one end of the second column.

[0076] In some embodiments, along the second direction Y, the opening of each first air duct a away from the one end of the second column falls within the range of the air outlet of the heat dissipation fan 200, that is to say, along the second direction Y, the opening of each first air duct a away from the one end of the second column completely overlaps the air outlet of the heat dissipation fan 200.

[0077] It can be understood that the number of heat dissipation fans 200 can be one or more than one according to the model of the heat dissipation fan 200 and the total area of the air outlet required.

[0078] In some embodiments, the at least two heat dissipation fans 200 are arranged in sequence along the first direction X.

[0079] In some embodiments, the heat dissipation fan 200 is arranged on the substrate 1.

[0080] In some embodiments, the power module 1000 includes a housing 300, a circuit board 100 and a heat dissipation fan 200. The circuit board 100 and the heat dissipation fan 200 are arranged in the housing 300.

[0081] In some embodiments, the housing 300 is provided with a receiving cavity (not shown), and the receiving cavity is arranged to extend along the second direction Y. Along the second direction Y, the two ends of the housing 300 are respectively provided with an air inlet hole 301 and an air outlet hole 302 which communicate with the receiving cavity. The substrate 1 is arranged in the receiving cavity. Along the second direction Y, the air inlet of the heat dissipation fan 200 faces the air inlet hole 301, and the air outlet of the heat dissipation fan 200 faces the air outlet hole 302.

[0082] Based on the same inventive concept, the embodiments of the present application also provide a charging pile, which includes the power module 1000 in any of the above embodiments.

[0083] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation based on the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A circuit board, characterized by, The circuit board comprises: a substrate; a plurality of electronic components arranged on the substrate, the plurality of electronic components comprising a switching heat sink, a first resonant element, a bus capacitor, a rectifying heat sink component, a second resonant element, and a transformer component; the first resonant element, the bus capacitor, and the switching heat sink are arranged in a first column along a first direction, the second resonant element, the transformer component, and the rectifying heat sink component are arranged in a second column along the first direction, and the first column and the second column are arranged adjacently along a second direction; in the first column, a first air duct extending along the second direction is formed between any two adjacent electronic components along the first direction, and in the second column, a second air duct extending along the second direction is formed between any two adjacent electronic components along the first direction, and the second air duct is in communication with the first air duct, wherein the first direction is perpendicular to the second direction.

2. The circuit board of claim 1, wherein: the number of the switching heat sinks is at least two, and at least two of the switching heat sinks are arranged spaced apart along the first direction, and the first resonant element is arranged between any two adjacent switching heat sinks.

3. The circuit board of claim 2, wherein: the number of the first resonant elements is less than the number of the switching heat sinks, and at most one first resonant element is arranged in the gap between any two adjacent switching heat sinks.

4. The circuit board of claim 1, wherein: in the second column, the rectifying heat sink component comprises two rectifying heat sink groups, and the second resonant element and the transformer component are arranged between the two rectifying heat sink groups; and the rectifying heat sink group comprises at least one rectifying heat sink.

5. The circuit board of claim 4, wherein: the number of the transformer components is two, and the second resonant element is arranged between and spaced apart from the two transformer components.

6. The circuit board of claim 4, wherein: each of the transformer components comprises one or more transformers; and when the transformer component comprises a plurality of transformers, the plurality of transformers are arranged in sequence along the second direction.

7. The circuit board of claim 4, wherein: the number of the second resonant elements is one or more; and when the number of the second resonant elements is more than one, the plurality of second resonant elements are arranged in sequence along the second direction.

8. The circuit board of claim 4, wherein: the plurality of electronic components further comprises an auxiliary power supply, the auxiliary power supply is arranged in the second column, and the auxiliary power supply is arranged on the side of one of the rectifying heat sink groups away from the transformer component and spaced apart from the rectifying heat sink group.

9. The circuit board of any one of claims 1 to 8, wherein: the first resonant element is a resonant capacitor, and the second resonant element is a resonant inductor; or the first resonant element is a resonant inductor, and the second resonant element is a resonant capacitor.

10. The circuit board of any one of claims 1 to 8, wherein: ​ The first resonant element includes at least one resonant capacitor, and the at least one resonant capacitor is mounted on a capacitor plate and connected to the substrate through the capacitor plate; The second resonant element is a resonant inductor.

11. The circuit board of claim 4, wherein: The switch heat sink surface is provided with a switch device, and the switch device is located in the first air duct; The rectifier heat sink is provided with a rectifier device, and the rectifier device is located in the second air duct.

12. The circuit board of claim 1, wherein: The plurality of electronic components further include a filter circuit, an output capacitor, and an anti-reverse diode heat sink, and the filter circuit, the output capacitor, and the anti-reverse diode heat sink are arranged in a third column in the first direction; In the first direction, the third column is spaced apart from the second column to form a fifth air duct extending in the second direction, and the fifth air duct is in communication with the second air duct.

13. The circuit board of claim 12, wherein: The first column, the second column, and the third column are spaced apart in the second direction.

14. A power module, characterized by including: The circuit board of any one of claims 1-13; A heat dissipation fan is used to drive air flow to circulate in the second direction.

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