Ventilation and heat dissipation device for electronic component

Abstract

The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a ventilation and heat dissipation device for an electronic component. The utility model relates to a ventilation and heat dissipation device for an electronic component, which mainly comprises end covers including a first end cover and a second end cover. The first end cover and the second end cover are fixedly connected to form a closed cavity; the electronic assembly comprises a circuit board and a component; the components are arranged on the circuit board; the heat dissipation assembly comprises fins, an air blower and a flow equalizing plate; the fins are arranged on the outer surface of the second end cover; the blower is arranged on the outer surface of the second end cover; the flow equalizing plate is arranged in a closed cavity formed by the first end cover and the second end cover; and the flow equalizing plate is fixed on the circuit board. The ventilation and heat dissipation device for the electronic component can dissipate heat efficiently, is convenient to maintain and replace, can be adjusted according to the heat productivity of different electronic components, and improves the application universality and flexibility.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of heat dissipation device, specifically relates to a kind of electronic component ventilation heat dissipation device. BACKGROUND

[0002] The performance of electronic product is more and more powerful, which leads to the integration and power of electronic components such as chips on internal circuit board are continuously improved, so that the power consumption and heat generation during its working process increase sharply. According to statistics, material failure caused by heat concentration accounts for 70% to 80% of total failure rate, and thermal management technology is a key factor for electronic product consideration, therefore, it is necessary to strengthen the heat control of electronic components. The efficient heat dissipation of electronic components is influenced by the principles of heat transfer and fluid mechanics, and the heat dissipation modes of electronic components are various, including natural heat dissipation and forced heat dissipation, and the forced heat dissipation mode using heat sink for electronic components is the most common.

[0003] The heat dissipation of electrical device is to control the operating temperature of electronic equipment, so as to ensure the temperature and safety of its work. The heat sink of existing electronic components on the market is installed on the inner side of electrical shell, and the heat sink needs to be operated after the electrical shell is opened during maintenance and replacement, which is complicated and inconvenient. Moreover, the heat dissipation structure is fixed, and cannot be adjusted according to the heat dissipation requirements of different power modules, so that electronic components with different heat dissipation cannot achieve the best heat dissipation effect. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of prior art, the utility model provides an electronic component ventilation heat dissipation device, which aims to provide an electronic component ventilation heat dissipation device with high efficiency and convenient maintenance and replacement, and the heat dissipation device can be adjusted according to the heat generation of different electronic components, to improve the universality and flexibility of electronic component ventilation heat dissipation device application.

[0005] In order to achieve the above purpose, the utility model provides an electronic component ventilation heat dissipation device, which comprises an end cover, the end cover comprises a first end cover and a second end cover, the first end cover and the second end cover are fixedly connected to form a closed chamber, an electronic assembly is arranged in the closed chamber formed by the first end cover and the second end cover, the electronic assembly comprises a circuit board and components, the components are arranged on the circuit board, a heat dissipation assembly comprises fins, a blower and a flow equalizing plate, the fins are arranged on the outer surface of the second end cover, the blower is arranged on the outer surface of the second end cover, the flow equalizing plate is arranged in the closed chamber formed by the first end cover and the second end cover, and the flow equalizing plate is fixed on the circuit board.

[0006] The utility model provides an electronic component ventilation and heat dissipation device, which comprises an end cover, an electronic assembly and a heat dissipation assembly, the end cover comprises a first end cover and a second end cover, and the two can form a closed chamber, and the electronic assembly is arranged in the closed chamber. Heat is generated during use of the electronic assembly, and the accumulation of heat is not conducive to use of the electronic assembly and can cause failure of the electronic assembly, and the heat dissipation assembly can process the generated heat to achieve the effect of heat dissipation. The heat dissipation assembly comprises fins, a blower and a flow uniformizing plate, the fins are main components for achieving heat dissipation; the blower can generate airflow, the airflow is first subjected to heat dissipation through the fins and then enters the closed chamber formed by the first end cover and the second end cover to take away heat generated by the electronic assembly in the closed chamber, thereby achieving heat dissipation; the flow uniformizing plate is fixed to the circuit board, and the airflow passes through the flow uniformizing plate after entering the closed chamber formed by the first end cover and the second end cover, and the flow uniformizing plate can ensure uniform heat dissipation of the entire electronic assembly.

[0007] Further, the second end cover comprises a side cover and a bottom cover; the side cover and the bottom cover are integrally connected; the bottom cover is fixedly connected with the circuit board; the fins comprise first fins and second fins; the first fins are arranged on the side cover; and the second fins are arranged on the bottom cover.

[0008] The fins comprise first fins and second fins, the first fins are arranged on the side cover of the second end cover, the airflow generated by the blower is first subjected to heat dissipation through the first fins before entering the closed chamber formed by the first end cover and the second end cover, and then enters the closed chamber. The second fins are arranged on the bottom cover of the second end cover, and the bottom cover is fixedly connected with the circuit board, heat generated by the electronic assembly is transmitted to the bottom cover of the second end cover, and the second fins can play a heat dissipation function.

[0009] Further, the side cover is provided with an air inlet and an air outlet.

[0010] The side cover is provided with an air inlet and an air outlet, the airflow generated by the blower enters the closed chamber formed by the first end cover and the second end cover from the air inlet, and is discharged into the air from the air outlet after taking away heat generated by the electronic assembly in the closed chamber.

[0011] Further, the heat dissipation assembly further comprises a connecting pipeline; the connecting pipeline comprises an air pipe, an air inlet pipeline and an air outlet pipeline; one end of the air pipe is connected with an output end of the blower, and the other end is connected with the air inlet pipeline; the air inlet pipeline passes through the first fins; one end of the air inlet pipeline is connected with the air pipe, and the other end is connected with the air inlet; the air outlet pipeline passes through the second fins; and the air outlet pipeline is connected with the air outlet.

[0012] The heat dissipation assembly further comprises a connecting pipeline which is a main component for realizing airflow circulation, the connecting pipeline comprising an air pipe, an air inlet pipeline and an air outlet pipeline, the airflow generated by the air blower first flows to the air pipe, and then flows from the air pipe to the air inlet pipeline, the air inlet pipeline being in communication with the air inlet, the airflow entering the sealed chamber formed by the first end cover and the second end cover, and then being discharged from the air outlet to the air outlet pipeline after taking away the heat generated by the electronic components in the sealed chamber, and then flowing through the air outlet pipeline and to the air.

[0013] Further, the side of the flow uniformizing plate close to the air inlet is a slope, a plurality of through holes are arranged on the slope of the flow uniformizing plate, and the plurality of through holes are arranged perpendicularly to the slope of the flow uniformizing plate.

[0014] The plurality of through holes are arranged on the slope of the flow uniformizing plate, the airflow enters from the air inlet and passes through the plurality of through holes on the slope of the flow uniformizing plate, and then flows to the electronic components, so that the entire electronic components can be evenly cooled.

[0015] Further, the circuit board and the bottom cover are provided with heat-conducting glue.

[0016] The circuit board and the bottom cover are provided with heat-conducting glue, the heat-conducting glue has good heat-conducting performance, and can transmit the heat on the circuit board to the bottom cover for heat dissipation through the second fins.

[0017] Further, the first end cover and the second end cover are provided with a sealing gasket.

[0018] The first end cover and the second end cover are provided with a sealing gasket, the sealing gasket can ensure that the sealed chamber formed by the first end cover and the second end cover is free of dust and water, meet the dustproof and waterproof requirements of the electronic components, so that the electronic components can be normally used, and the airflow of the air blower entering the sealed chamber will not leak, which is conducive to heat dissipation.

[0019] Further, the air blower is connected with an adjusting device.

[0020] The air blower is connected with an adjusting device, the adjusting device can adjust the airflow generated by the air blower according to the heat generated by different electronic components, and improve the universality and flexibility of the electronic component ventilation and heat dissipation device.

[0021] Further, the outer surface of the first end cover is provided with a signal feedback interface.

[0022] The signal feedback interface can be connected with a signal feedback component, and the working condition of the electronic component can be adjusted through the output condition.

[0023] Further, the outer surface of the first end cover is provided with an input power interface, and the outer surface of the bottom cover is provided with an output power interface.

[0024] The input power interface can connect the electronic component with the power supply, and provide energy source for starting the electronic component; and the output power interface can connect the electronic component with other electrical appliances, so that the electronic component serves as a controller of the other electrical appliances.

[0025] Advantages

[0026] 1. The electronic component ventilation and heat dissipation device has the blower, the fins and the heat-conducting glue, and can realize efficient heat dissipation.

[0027] 2. The electronic component ventilation and heat dissipation device has the multiple through holes on the inclined surface of the flow uniformizing plate, which can ensure uniform heat dissipation of the entire electronic assembly.

[0028] 3. The electronic component ventilation and heat dissipation device has the blower arranged on the outer surface of the second end cover and connected with the air inlet pipeline on the second end cover through the air pipe, which is convenient to maintain and replace.

[0029] 4. The electronic component ventilation and heat dissipation device can adjust the blower according to the heat generation of different electronic components, and improve the universality and flexibility of the electronic component ventilation and heat dissipation device.

[0030] 5. The electronic component ventilation and heat dissipation device has the sealing gasket between the first end cover and the second end cover, the air inlet pipeline is sealingly connected with the air pipe, and the air outlet pipeline is a multi-segment curved surface, which effectively ensures the dustproof and waterproof requirements of the electronic assembly. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 Fig. 1 is a structural schematic view of the electronic component ventilation and heat dissipation device;

[0032] Figure 2 Fig. 2 is a sectional view of the electronic component ventilation and heat dissipation device;

[0033] Figure 3 Fig. 3 is a rear view of the electronic component ventilation and heat dissipation device;

[0034] Figure 4 Fig. 4 is a lower view of the electronic component ventilation and heat dissipation device.

[0035] In the drawings: 11, first end cover; 12, second end cover; 13, sealing gasket; 14, signal feedback interface; 15, input power interface; 16, output power interface; 21, circuit board; 22, components; 23, heat-conducting glue; 31, fin; 32, air blower; 33, flow equalization plate; 34, connecting pipeline; 121, side cover; 122, bottom cover; 311, first fin; 312, second fin; 331, through hole; 341, air pipe; 342, air inlet pipeline; 343, air outlet pipeline; 1211, air inlet; 1212, air outlet. DETAILED DESCRIPTION

[0036] Example 1

[0037] As shown in Figure 1 and Figure 2 , an electronic component ventilation and heat dissipation device includes an end cover, the end cover including a first end cover 11 and a second end cover 12; the first end cover 11 and the second end cover 12 are fixedly connected by a circumferential row of bolts to form a sealed chamber; an electronic assembly, the electronic assembly being disposed within the sealed chamber formed by the first end cover 11 and the second end cover 12; the electronic assembly including a circuit board 21 and components 22; the components 22 including chips, capacitors, resistors, and being disposed on the circuit board 21; a heat dissipation assembly, the heat dissipation assembly including a fin 31, an air blower 32, and a flow equalization plate 33; the fin 31 being disposed on an outer surface of the second end cover 12; the air blower 32 being disposed on the outer surface of the second end cover 12; the flow equalization plate 33 being disposed within the sealed chamber formed by the first end cover 11 and the second end cover 12; the flow equalization plate 33 being fixedly disposed perpendicularly on the circuit board 21.

[0038] An electronic component ventilation and heat dissipation device includes an end cover, an electronic assembly, and a heat dissipation assembly, the end cover including a first end cover 11 and a second end cover 12, the two forming a sealed chamber, the electronic assembly being disposed within the sealed chamber. The electronic assembly generates heat during use, and the accumulation of heat is not conducive to the use of the electronic assembly, which can cause it to fail. The heat dissipation assembly can process the generated heat to achieve the effect of heat dissipation. The heat dissipation assembly includes a fin 31, an air blower 32, and a flow equalization plate 33, the fin 31 being the main component for achieving heat dissipation; the air blower 32 can generate an air current, which first passes through the fin 31 to dissipate heat, and then enters the sealed chamber formed by the first end cover 11 and the second end cover 12 to carry away the heat generated by the electronic assembly within the sealed chamber, thereby achieving heat dissipation; the flow equalization plate 33 is fixedly disposed on the circuit board 21, and the air current passes through the flow equalization plate 33 after entering the sealed chamber formed by the first end cover 11 and the second end cover 12, the flow equalization plate 33 ensuring that the entire electronic assembly is evenly cooled.

[0039] The second end cover 12 comprises a side cover 121 and a bottom cover 122; the side cover 121 and the bottom cover 122 are integrally connected; the bottom cover 122 is fixedly connected with the circuit board 21 by bolts; the fin 31 comprises a first fin 311 and a second fin 312; the first fin 311 is arranged on the side cover 121; the second fin 312 is arranged on the bottom cover 122.

[0040] The fin 31 comprises the first fin 311 and the second fin 312; the first fin 311 is arranged on the side cover 121 of the second end cover 12; the airflow generated by the air blower 32 is first radiated by the first fin 311 before entering the closed chamber formed by the first end cover 11 and the second end cover 12, and then enters the closed chamber. The second fin 312 is arranged on the bottom cover 122 of the second end cover 12, and the bottom cover 122 is fixedly connected with the circuit board 21; the heat generated by the electronic components is transmitted to the bottom cover 122 of the second end cover 12, and the second fin 312 can play a heat dissipation function.

[0041] As shown in Figure 3 , the side cover 121 is provided with an air inlet 1211 and an air outlet 1212; the air inlet 1211 and the air outlet 1212 are circular holes.

[0042] The side cover 121 is provided with an air inlet 1211 and an air outlet 1212; the airflow generated by the air blower 32 enters the closed chamber formed by the first end cover 11 and the second end cover 12 from the air inlet 1211, and is discharged into the air from the air outlet 1212 after taking away the heat generated by the electronic components in the closed chamber.

[0043] As shown in Figure 1 , the heat dissipation assembly further comprises a connecting pipeline 34; the connecting pipeline 34 is a circular pipe, comprising an air pipe 341, an air inlet pipeline 342 and an air outlet pipeline 343; one end of the air pipe 341 is connected with the output end of the air blower 32, and the other end is connected with the air inlet pipeline 342; the air inlet pipeline 342 passes through the first fin 311; one end of the air inlet pipeline 342 is sealingly connected with the air pipe 341, and the other end is connected with the air inlet 1211; the air outlet pipeline 343 passes through the second fin 312; the air outlet pipeline 343 is a multi-segment curved surface; the air outlet pipeline 343 is connected with the air outlet 1212.

[0044] The heat dissipation assembly further comprises a connecting pipeline 34, which is a main component for realizing air flow circulation. The connecting pipeline 34 comprises an air pipe 341, an air inlet pipeline 342 and an air outlet pipeline 343. The air flow generated by the air blower 32 flows to the air pipe 341 first, and then flows from the air pipe 341 to the air inlet pipeline 342. The air inlet pipeline 342 is in communication with the air inlet 1211. The air flow enters the sealed chamber formed by the first end cover 11 and the second end cover 12, takes away the heat generated by the electronic components in the sealed chamber, and is then discharged from the air outlet 1212 to the air outlet pipeline 343, and then flows through the air outlet pipeline 343 to the air.

[0045] As shown in Figure 2 , the side of the flow uniformizing plate 33 close to the air inlet 1211 is a slope; a plurality of through holes 331 are arranged on the slope of the flow uniformizing plate 33; the plurality of through holes 331 are circular holes; and the plurality of through holes 331 are arranged perpendicularly to the slope of the flow uniformizing plate 33.

[0046] The plurality of through holes 331 are arranged on the slope of the flow uniformizing plate 33. After the air flow enters from the air inlet 1211, the air flow passes through the plurality of through holes 311 on the slope of the flow uniformizing plate 33 and flows to the electronic components, so that the entire electronic components can be evenly cooled.

[0047] The circuit board 21 and the bottom cover 122 are provided with a heat-conducting glue 23.

[0048] The circuit board 21 and the bottom cover 122 are provided with the heat-conducting glue 23. The heat-conducting glue 23 has good heat-conducting performance, can transfer the heat on the circuit board 21 to the bottom cover 122, and dissipate heat through the second fins 312.

[0049] As shown in Figure 4 , a sealing gasket 13 is arranged between the first end cover 11 and the second end cover 12.

[0050] The sealing gasket 13 is arranged between the first end cover 11 and the second end cover 12. The sealing gasket 13 can ensure that the sealed chamber formed by the first end cover 11 and the second end cover 12 is dust-free and water-free, meet the dustproof and waterproof requirements of the electronic components, so that the electronic components can be normally used, and the air flow of the air blower 32 entering the sealed chamber will not leak, which is conducive to heat dissipation.

[0051] The air blower 32 is connected with an adjusting device.

[0052] The air blower 32 is connected with the adjusting device. The adjusting device can adjust the air flow generated by the air blower 32 according to the heat generated by different electronic components, improve the universality and flexibility of the electronic component ventilation and heat dissipation device.

[0053] As shown in Figure 3 , a signal feedback interface 14 is arranged on the outer surface of the first end cover 11.

[0054] The signal feedback interface 14 can be connected with the signal feedback component, and the working condition of the electronic component can be adjusted through the output condition.

[0055] As shown in Figure 1 and Figure 3 , the outer surface of the first end cover 11 is provided with an input power interface 15, and the outer surface of the bottom cover 122 is provided with an output power interface 16.

[0056] The input power interface 15 can connect the electronic component with the power supply, and provide the energy source for the electronic component to start working; the output power interface 16 can connect the electronic component with other electrical appliances, so that the electronic component serves as the controller of other electrical appliances.

Claims

1. An electronic component ventilation and heat dissipation device, characterized by: The utility model relates to an electronic device, including: End cover, the end cover includes first end cover (11) and second end cap (12), first end cover (11) and second end cap (12) fixed connection, form closed chamber, Electronic assembly, the electronic assembly sets up in the closed chamber formed by first end cover (11) and second end cap (12), the electronic assembly includes circuit board (21) and component (22), component (22) sets up on circuit board (21), Heat dissipation subassembly, the heat dissipation subassembly includes fin (31), air blower (32) and uniform flow board (33), fin (31) sets up on the outer surface of second end cap (12), air blower (32) sets up on the outer surface of second end cap (12), uniform flow board (33) sets up in the closed chamber formed by first end cover (11) and second end cap (12), uniform flow board (33) is fixed on circuit board (21).

2. The electronic component ventilation and heat dissipation device of claim 1, wherein: Second end cap (12) includes side cover (121) and bottom cover (122), side cover (121) and bottom cover (122) are integrally connected, bottom cover (122) is fixedly connected with circuit board (21), fin (31) includes first fin (311) and second fin (312), first fin (311) sets up on side cover (121), second fin (312) sets up on bottom cover (122).

3. The electronic component cooling device of claim 2, wherein: Side cover (121) is equipped with air inlet (1211) and air outlet (1212).

4. The electronic component cooling device of claim 3, wherein: The heat dissipation subassembly further includes connecting pipeline (34), the connecting pipeline (34) includes air pipe (341), air inlet pipeline (342) and exhaust pipeline (343), one end of air pipe (341) is connected with the output end of air blower (32), the other end is connected with air inlet pipeline (342), air inlet pipeline (342) passes through first fin (311), one end of air inlet pipeline (342) is connected with air pipe (341), the other end is connected with air inlet (1211), exhaust pipeline (343) passes through second fin (312), exhaust pipeline (343) is connected with air outlet (1212).

5. The electronic component cooling device of claim 3, wherein: The side of uniform flow board (33) close to air inlet (1211) is inclined plane, a plurality of through holes (331) are arranged on the inclined plane of uniform flow board (33), and the plurality of through holes (331) are arranged vertically to the inclined plane of uniform flow board (33).

6. The electronic component cooling device of claim 2, wherein: Thermal conductive adhesive (23) is arranged between the circuit board (21) and the bottom cover (122).

7. The electronic component cooling device of claim 1, wherein: Sealing gasket (13) is arranged between the first end cover (11) and the second end cover (12).

8. The electronic component cooling device of claim 1, wherein: The air blower (32) is connected with an adjusting device.

9. The electronic component cooling device of claim 1, wherein: The outer surface of the first end cover (11) is provided with a signal feedback interface (14).

10. The electronic component cooling device of claim 2, wherein: The outer surface of the first end cover (11) is provided with an input power interface (15), and the outer surface of the bottom cover (122) is provided with an output power interface (16).

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