Image sensor packaging structure with heat dissipation structure

Abstract

The utility model provides an image sensor packaging structure with a heat dissipation structure, which relates to the field of semiconductor packaging and comprises a substrate, an image sensor, a TEC module and a heat dissipation piece. A plurality of through holes from top to bottom are formed in the substrate; the heat dissipation piece comprises a first plate body, a second plate body and a plurality of connecting pieces; the lower plate surface of the first plate body clings to the upper plate surface of the substrate; the upper plate surface of the second plate body clings to the lower plate surface of the substrate; the connecting piece penetrates through the through hole; the top end of the connecting piece is fixed with the first plate body; the bottom end of the connecting piece is fixed with the second plate body; the TEC module is located between the first plate body and the image sensor; the cold end of the TEC module is attached to the image sensor; the hot end of the TEC module is attached to the first plate body. According to the technical scheme of the utility model, the problem that in the prior art, when a heat conduction assembly is arranged between the cold end of the TEC and the image sensor, if the heat conduction efficiency of the heat conduction assembly is poor, the heating image sensor cannot be effectively refrigerated by the cold end of the TEC, so that the normal operation of the image sensor is affected can be solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor packaging especially relates to an image sensor packaging structure with heat dissipation structure. BACKGROUND

[0002] The image sensor is the image equipment core component of optical sensing signal conversion for electronic signal, and the image sensor is electrically connected with the substrate during the packaging of the image sensor, and the image sensor is generally connected with the external circuit through the way of wire bonding, and the solder pad or other electrically connected point electrically connected with the external electronic circuit is arranged on the substrate to realize the signal sensing, processing and interaction of the image sensor and the external circuit.

[0003] And the image sensor usually generates heat during work, thereby affecting the normal work of the image sensor, for this, the patent with the patent application number 202122792422.5 discloses an industrial camera thermoelectric refrigeration device, which comprises a shell assembly, the shell assembly is connected and matched with the lower heat sink assembly to form a sealed cavity, the image sensor is installed and fixed in the cavity, dry protective gas is filled in the cavity, a TEC is arranged above the heat sink assembly and is attached to the hot end of the TEC, the cold end of the TEC is tightly attached to a heat conduction assembly, the heat conduction assembly is wrapped and limited by a bushing around, and the bushing is installed and fixed in the cavity, a second heat conduction pad is further arranged above the bushing, the lower surface of the second heat conduction pad is tightly attached to the heat conduction assembly, and the upper surface is tightly attached to the back of the image sensor, the above patent discloses a scheme of using TEC to conduct heat and refrigerate the image sensor.

[0004] In the above patent, the cold end of the TEC is spaced apart from the image sensor by the heat conduction assembly, and the heat conduction efficiency is affected by the heat conduction assembly, if the heat conduction efficiency of the heat conduction assembly is poor, the heated image sensor cannot be effectively cooled by the cold end of the TEC, thereby affecting the normal work of the image sensor. Utility model content

[0005] In view of the above problems, the image sensor packaging structure with heat dissipation structure provided by the utility model can solve the problem that if the heat conduction efficiency of the heat conduction assembly is poor, the heated image sensor cannot be effectively cooled by the cold end of the TEC, thereby affecting the normal work of the image sensor when the heat conduction assembly is arranged between the cold end of the TEC and the image sensor in the prior art, and effectively cools the image sensor.

[0006] To achieve the above purpose, the technical scheme adopted by the utility model is:

[0007] The image sensor packaging structure with heat dissipation structure provided by the utility model comprises a substrate, an image sensor, a TEC module and a heat dissipation piece.

[0008] If the substrate is horizontally arranged, a plurality of through holes are formed in the substrate from top to bottom;

[0009] The heat dissipation member comprises a first plate body, a second plate body and a plurality of connecting members; the lower plate surface of the first plate body is in close contact with the upper plate surface of the substrate; the upper plate surface of the second plate body is in close contact with the lower plate surface of the substrate; the connecting members pass through the through holes; one connecting member corresponds to one through hole; the top end of the connecting member is fixed with the lower plate surface of the first plate body; the bottom end of the connecting member is fixed with the upper plate surface of the second plate body; the first plate body, the second plate body and the connecting members are all heat conductive members;

[0010] The TEC module is located between the first plate body and the image sensor; the cold end of the TEC module is in close contact with the image sensor; and the hot end of the TEC module is in close contact with the first plate body;

[0011] The image sensor and the substrate are electrically connected through lead wires; and the TEC module and the substrate are electrically connected.

[0012] The image sensor packaging structure with the heat dissipation structure provided by the utility model, preferably, a space for the image sensor to sense light is arranged above the image sensor;

[0013] The fixed outer wall is arranged around the space; and the fixed outer wall is fixedly connected with the image sensor, the TEC module, the heat dissipation member and the substrate.

[0014] The image sensor packaging structure with the heat dissipation structure provided by the utility model, preferably, the fixed outer wall is filled glue; and the fixed outer wall is adhered to the connecting position between the image sensor, the TEC module, the heat dissipation member and the substrate.

[0015] The fixed outer wall covers the lead wires between the image sensor and the substrate.

[0016] The image sensor packaging structure with the heat dissipation structure provided by the utility model, preferably, a fixed inner wall is arranged on the inner side wall of the fixed outer wall; and the fixed inner wall is arranged around the space;

[0017] The glass cover plate is fixedly connected with the top of the fixed inner wall; the top of the fixed inner wall is lower than the top of the fixed outer wall; the side edge of the glass cover plate is in close contact with the inner side wall of the fixed outer wall; and the glass cover plate is fixedly connected with the fixed outer wall.

[0018] The image sensor packaging structure with the heat dissipation structure provided by the utility model, preferably, the fixed inner wall is filled glue; and the fixed inner wall adheres the glass cover plate and the fixed outer wall.

[0019] The image sensor packaging structure with the heat dissipation structure has the advantages that the cold end of the TEC module is directly attached to the image sensor, and the cold end of the TEC module can directly act on the body of the image sensor to directly cool the image sensor, thereby improving the working efficiency of the image sensor and avoiding the reduction of the working efficiency of the image sensor due to heat generation.

[0020] The above technical solution has the following advantages or beneficial effects:

[0021] The image sensor packaging structure with the heat dissipation structure has the advantages that the cold end of the TEC module is directly attached to the image sensor, and the cold end of the TEC module can directly act on the body of the image sensor to directly cool the image sensor, thereby improving the working efficiency of the image sensor and avoiding the reduction of the working efficiency of the image sensor due to heat generation.

[0022] The image sensor packaging structure with the heat dissipation structure has the advantages that the cold end of the TEC module is directly attached to the image sensor, and the cold end of the TEC module can directly act on the body of the image sensor to directly cool the image sensor, thereby improving the working efficiency of the image sensor and avoiding the reduction of the working efficiency of the image sensor due to heat generation. BRIEF DESCRIPTION OF DRAWINGS

[0023] The present application and its features, shapes and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the attached drawings. The same reference numbers in all the drawings indicate the same parts. The drawings have not been drawn to scale, and the emphasis is on illustrating the main idea of the present application.

[0024] Figure 1It is a main view cross-section structure schematic diagram of the image sensor packaging structure with the heat dissipation structure provided by the embodiment 1 of the utility model. DETAILED DESCRIPTION

[0025] The utility model makes further explanation in combination with specific embodiments and the accompanying drawings, but not as the limitation of the utility model.

[0026] Embodiment 1

[0027] As Figure 1 Indicated, the utility model embodiment 1 provides an image sensor packaging structure with heat dissipation structure, including substrate 1, image sensor 2, TEC module 3 and heat dissipation piece 4;

[0028] If substrate 1 is horizontally arranged, a plurality of from top to bottom through holes 11 are set up on substrate 1;

[0029] Heat dissipation piece 4 includes first plate body 41, second plate body 42 and a plurality of connecting pieces 43;The lower plate face of first plate body 41 is close to the upper plate face of substrate 1;The upper plate face of second plate body 42 is close to the lower plate face of substrate 1;Connecting piece 43 passes through through hole 11;One connecting piece 43 corresponds one through hole 11;The top end of connecting piece 43 is fixed with the lower plate face of first plate body 41;The bottom end of connecting piece 43 is fixed with the upper plate face of second plate body 42;First plate body 41, second plate body 42 and connecting piece 43 are all heat conducting pieces;

[0030] TEC module 3 is located between first plate body 41 and image sensor 2;The cold end of TEC module 3 is pasted with image sensor 2;The hot end of TEC module 3 is pasted with first plate body 41;

[0031] Image sensor 2 and substrate 1 are electrically connected by lead;TEC module 3 and substrate 1 are electrically connected.

[0032] When using the image sensor packaging structure with heat dissipation structure provided by the embodiment 1 of the utility model, image sensor 2 and substrate 1 are connected by wire, TEC module 3 and substrate 1 are electrically connected, and external controller and substrate 1 are electrically connected;External controller uses image sensor 2 through substrate 1, when image sensor 2 generates heat, external power supply and substrate 1 are connected, TEC module 3 is powered and started through substrate 1, and the cold end of TEC module 3 absorbs heat from image sensor 2, reduces the temperature of image sensor 2;Meanwhile, the hot end of TEC module 3 transmits heat to first plate body 41, heat is transmitted along the order of first plate body 41, connecting piece 43 and second plate body 42, and second plate body 42 is cooled by air or other cooling methods.

[0033] The image sensor packaging structure with the heat dissipation structure provided by the embodiment 1 of the present application is characterized in that the cold end of the TEC module 3 is attached to the image sensor 2, at this time, the cold end of the TEC module 3 can directly act on the body of the image sensor 2 to directly cool the image sensor 2, thereby improving the working efficiency of the image sensor 2 and avoiding the reduction of the working efficiency of the image sensor 2 due to heat generation; further, the hot end of the TEC module 3 generates heat, in order to conduct the heat generated by the TEC module 3, the hot end of the TEC module 3 is attached to the heat dissipation member 4, and the heat generated by the hot end of the TEC module 3 is dissipated from the inside of the image sensor packaging structure through the heat dissipation member 4; more specifically, the image sensor 2 needs to be electrically connected to the substrate 1, but the heat dissipation member 4 needs to contact the outside to dissipate heat, if the heat dissipation member 4 is only arranged between the substrate 1 and the hot end of the TEC module 3, the heat cannot be effectively transferred, for this, a plurality of through holes 11 penetrating from top to bottom are formed in the substrate 1, the specific structure of the heat dissipation member 4 comprises a first plate body 41, a second plate body 42 and a plurality of connecting members 43, the lower plate surface of the first plate body 41 is attached to the upper plate surface of the substrate 1, the upper plate surface of the second plate body 42 is attached to the lower plate surface of the substrate 1, the connecting members 43 penetrate through the through holes 11, the heat from the hot end of the TEC module 3 is transferred through the first plate body 41, the heat from the first plate body 41 is transferred through the connecting members 43, and the heat from the connecting members 43 is transferred to the outside through the second plate body 42, thereby achieving the dissipation of the heat from the hot end of the TEC module 3 to the outside while allowing the cold end of the TEC module 3 to directly cool the image sensor 2;

[0034] The prior art sets a heat conduction component between the cold end of the TEC module 3 and the image sensor 2, if the heat conduction efficiency of the heat conduction component is poor, the image sensor 2 generating heat cannot be effectively cooled by the cold end of the TEC module 3, thereby affecting the normal working of the image sensor 2; by using the image sensor packaging structure with the heat dissipation structure provided by the embodiment 1 of the present application, the cold end of the TEC module 3 is attached to the image sensor 2, at this time, the cold end of the TEC module 3 can directly act on the body of the image sensor 2 to directly cool the image sensor 2, thereby achieving the effective cooling of the image sensor 2.

[0035] The image sensor packaging structure with the heat dissipation structure provided by the embodiment 1 of the present application is preferably characterized in that the top of the image sensor 2 is provided with a light sensing area, in order to allow the image sensor 2 to normally sense light, a space for the image sensor 2 to sense light is arranged above the image sensor 2;

[0036] Specifically, in order to divide the space for the image sensor 2 to sense light, a fixed outer wall 5 is further arranged, and the fixed outer wall 5 is arranged around the space; further, the fixed outer wall 5 is fixedly connected to the image sensor 2, the TEC module 3, the heat dissipation member 4 and the substrate 1, thereby achieving the fixed packaging of the image sensor 2, the TEC module 3, the heat dissipation member 4 and the substrate 1.

[0037] The image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model, preferably, the fixed outer wall 5 is filled glue; the fixed outer wall 5 is adhered to the connecting place between the image sensor 2, the TEC module 3, the heat dissipation piece 4 and the substrate 1, the fixed outer wall 5 is formed by allowing the filled glue to solidify, and meanwhile the filled glue can adhere the image sensor 2, the TEC module 3, the heat dissipation piece 4 and the substrate 1, so that the image sensor 2, the TEC module 3, the heat dissipation piece 4 and the substrate 1 are fixed and packaged;

[0038] More specifically, in order to protect and fix the lead wire between the image sensor 2 and the substrate 1, the filled glue can be used to cover the lead wire between the image sensor 2 and the substrate 1, and the lead wire can be fixed and protected when the filled glue solidifies.

[0039] The image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model, preferably, in order to protect the image sensor 2, a glass cover plate 7 needs to be arranged above the image sensor 2, and the glass cover plate 7 can effectively protect the image sensor 2 without affecting the photosensitivity of the image sensor 2.

[0040] In order to fix the glass cover plate 7, a fixed inner wall 6 is arranged on the inner side wall of the fixed outer wall 5, and the fixed inner wall 6 is arranged around the space; the bottom of the glass cover plate 7 is fixed to the top of the fixed inner wall 6, at this time, the top of the fixed inner wall 6 is lower than the top of the fixed outer wall 5, so that the side edge of the glass cover plate 7 can be in contact with the fixed outer wall 5, the side edge of the glass cover plate 7 is close to the inner side wall of the fixed outer wall 5, the glass cover plate 7 is fixed to the fixed outer wall 5, the glass cover plate 7 and the fixed outer wall 5 form a sealed protection environment, and the image sensor 2 can be effectively protected.

[0041] The image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model, preferably, the fixed inner wall 6 is filled glue, the fixed inner wall 6 is formed by allowing the filled glue to solidify, and meanwhile the filled glue can adhere the glass cover plate 7 and the fixed outer wall 5, so that the glass cover plate 7 and the fixed outer wall 5 are fixed.

[0042] The image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model has preferably, the recess 11 for placing the first plate body 41 is set on the upper plate surface of the substrate 1, the first plate body 41 is embedded in the recess 11, the substrate 1 also generates certain heat when working, and the close contact of the first plate body 41 with the substrate 1 can make the heat of the substrate 1 be transferred to the first plate body 41, realize the cooling of the substrate 1, and thus the service life of the substrate 1 can be improved; compared with the ordinary image sensor packaging structure, the image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model is additionally provided with the TEC module 3 and the heat dissipation piece 4, the volume of the image sensor packaging structure is increased, the volume of the image sensor packaging structure can be reduced by embedding the first plate body 41 in the recess 11, and the universality of the image sensor packaging structure is improved.

[0043] The image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model has preferably, the recess 11 for placing the first plate body 41 is set on the upper plate surface of the substrate 1, the first plate body 41 is embedded in the recess 11, the substrate 1 also generates certain heat when working, and the close contact of the first plate body 41 with the substrate 1 can make the heat of the substrate 1 be transferred to the first plate body 41, realize the cooling of the substrate 1, and thus the service life of the substrate 1 can be improved; compared with the ordinary image sensor packaging structure, the image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model is additionally provided with the TEC module 3 and the heat dissipation piece 4, the volume of the image sensor packaging structure is increased, the volume of the image sensor packaging structure can be reduced by embedding the first plate body 41 in the recess 11, and the universality of the image sensor packaging structure is improved.

[0044] The image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model has preferably, the recess 11 for placing the first plate body 41 is set on the upper plate surface of the substrate 1, the first plate body 41 is embedded in the recess 11, the substrate 1 also generates certain heat when working, and the close contact of the first plate body 41 with the substrate 1 can make the heat of the substrate 1 be transferred to the first plate body 41, realize the cooling of the substrate 1, and thus the service life of the substrate 1 can be improved; compared with the ordinary image sensor packaging structure, the image sensor packaging structure with the heat dissipation structure provided in the embodiment 1 of the utility model is additionally provided with the TEC module 3 and the heat dissipation piece 4, the volume of the image sensor packaging structure is increased, the volume of the image sensor packaging structure can be reduced by embedding the first plate body 41 in the recess 11, and the universality of the image sensor packaging structure is improved.

[0045] Those skilled in the art should understand that the skilled in the art can realize the change example in combination with the prior art and the above-mentioned embodiments, which is not described here. Such change example does not affect the essential content of the utility model, which is not described here.

[0046] The preferred embodiments of the utility model are described above. It should be understood that the utility model is not limited to the above-mentioned specific embodiments, and the devices and structures not described in detail should be understood as being implemented in the ordinary way in the art; any skilled in the art can make many possible changes and modifications, or modify equivalent embodiments without departing from the technical scheme of the utility model, which does not affect the essential content of the utility model. Therefore, any simple modification, equivalent change and modification made to the above-mentioned embodiments according to the technical essence of the utility model without departing from the technical scheme of the utility model, all still belong to the protection range of the technical scheme of the utility model.

Claims

1. An image sensor package structure having a heat dissipation structure, characterized by, The application relates to a substrate, an image sensor, a TEC module and a heat sink. If the substrate is horizontally arranged, a plurality of through holes are arranged on the substrate from top to bottom. The heat sink comprises a first plate body, a second plate body and a plurality of connecting pieces; the lower plate surface of the first plate body is tightly attached to the upper plate surface of the substrate; the upper plate surface of the second plate body is tightly attached to the lower plate surface of the substrate; the connecting pieces pass through the through holes; one connecting piece corresponds to one through hole; the top end of the connecting piece is fixed to the lower plate surface of the first plate body; the bottom end of the connecting piece is fixed to the upper plate surface of the second plate body; the first plate body, the second plate body and the connecting pieces are all heat-conducting pieces. The TEC module is located between the first plate body and the image sensor; the cold end of the TEC module is attached to the image sensor; the hot end of the TEC module is attached to the first plate body. The image sensor and the substrate are electrically connected through lead wires; the TEC module and the substrate are electrically connected. The upper plate surface of the substrate is provided with a groove for placing the first plate body; the first plate body is embedded in the groove.

2. The image sensor package structure having a heat dissipation structure according to claim 1, wherein, A space for the image sensor to sense light is arranged above the image sensor. A fixed outer wall is further arranged; the fixed outer wall surrounds the space; the fixed outer wall is fixedly connected to the image sensor, the TEC module, the heat sink and the substrate.

3. The image sensor package structure having a heat dissipation structure according to claim 2, wherein, The fixed outer wall is filled glue; the fixed outer wall is adhered to the connecting position between the image sensor, the TEC module, the heat sink and the substrate. The fixed outer wall covers the lead wires between the image sensor and the substrate.

4. The image sensor package structure having a heat dissipation structure according to claim 3, wherein, A fixed inner wall is arranged on the inner side wall of the fixed outer wall; the fixed inner wall surrounds the space. A glass cover plate is further arranged; the bottom of the glass cover plate is fixed to the top of the fixed inner wall; the top of the fixed inner wall is lower than the top of the fixed outer wall; the side edge of the glass cover plate is tightly attached to the inner side wall of the fixed outer wall; the glass cover plate is fixed to the fixed outer wall.

5. The image sensor package structure having a heat dissipation structure according to claim 4, wherein, The fixed inner wall is filled glue; the fixed inner wall adheres the glass cover plate and the fixed outer wall.

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