Tail gas cooling device and system for chemical vapor deposition reaction cavity
By designing an exhaust gas cooling device, which combines a cooling object input pipe and an exhaust gas cooling input pipe, the problem of excessively high exhaust gas temperature was solved, achieving efficient exhaust gas cooling and improving equipment safety and efficiency.
Patent Information
- Application Number
- CN202520165980.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2035-01-24
AI Technical Summary
In existing technologies, it is difficult to effectively reduce the temperature of high-temperature exhaust gas. This paper solves the problem that existing technologies cannot effectively reduce the temperature of exhaust gas in the chemical vapor deposition reaction chamber, thus avoiding its negative impact on the equipment.
Design an exhaust gas cooling device, including a cooling object input pipe, an exhaust gas input cooling pipe, a first connecting pipe and a second connecting pipe, and achieve efficient cooling of exhaust gas through the combination of the cooling object input pipe and the exhaust gas input cooling pipe.
It effectively reduces exhaust gas temperature, avoids negative impacts on equipment caused by high-temperature exhaust gas, and improves equipment safety and efficiency.
Smart Images
Figure CN223705730U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chemical gas phase deposition equipment's tail gas treatment technical field especially, relates to a kind of tail gas cooling device and system of chemical gas phase deposition reaction cavity. BACKGROUND
[0002] In the process of growing silicon carbide on substrate by chemical vapor deposition (CVD) method, the temperature in the reaction cavity is as high as 1600 degrees Celsius, and a large amount of high-temperature tail gas needs to be discharged from the reaction cavity to the tail end.
[0003] Therefore, it is urgent to design an efficient tail gas pipeline cooling device to avoid the negative effects caused by the excessively high temperature of the discharged tail gas. UTILITY MODEL CONTENT
[0004] The utility model provides a kind of tail gas cooling device and system of chemical gas phase deposition reaction cavity, can efficiently cool tail gas pipeline, avoid the negative effects caused by the excessively high temperature of the discharged tail gas.
[0005] In the first aspect, the utility model embodiment provides a kind of tail gas cooling device of chemical gas phase deposition reaction cavity, for the tail gas cooling in the tail gas pipeline of the chemical gas phase deposition reaction cavity;
[0006] The tail gas pipeline includes at least two tail gas input ports, at least one tail gas output port, and a tail gas pipeline connecting the tail gas input ports and the tail gas output port.
[0007] The tail gas pipeline includes at least one tail gas intersection for converging the tail gas input by the adjacent two tail gas input ports.
[0008] The tail gas cooling device of the chemical gas phase deposition reaction cavity includes a cooling object input pipeline, an input tail gas cooling pipeline with the same number of tail gas input ports, a first connecting pipeline, and at least one second connecting pipeline.
[0009] The cooling object input pipeline is externally sleeved on the tail gas pipeline at the end of the tail gas output port, and the input tail gas cooling pipeline is externally sleeved on the tail gas pipeline at the end of the tail gas output port.
[0010] The first connecting pipeline connects the cooling object input pipeline and one input tail gas cooling pipeline, and the second connecting pipeline connects the adjacent two input tail gas cooling pipelines.
[0011] Optionally, the cooling object input pipeline is provided with a cooling object input port, and the input tail gas cooling pipeline farthest from the cooling object input pipeline is provided with a cooling object output port.
[0012] Optionally, the tail gas cooling device further comprises a cooling object output device.
[0013] The first end of the cooling object output device is in communication with the cooling object input port, and the second end of the cooling object output device is in communication with the cooling object output port.
[0014] Optionally, the flow direction of the cooling object output by the first end of the cooling object output device is opposite to the flow direction of the tail gas input by the tail gas input port.
[0015] Optionally, the first preset distance exists between the end of the cooling object input pipeline away from the cooling object input port and the tail gas intersection.
[0016] Optionally, the second preset distance exists between the end of the input tail gas cooling pipeline away from the tail gas output port and the tail gas intersection.
[0017] Optionally, the first communication pipeline communicates the cooling object input pipeline and the input tail gas cooling pipeline closest to the cooling object input pipeline.
[0018] Optionally, the first end of the second communication pipeline communicates the side of the input tail gas cooling pipeline close to the tail gas input port, and the second end of the second communication pipeline communicates the side of the adjacent tail gas cooling pipeline close to the tail gas intersection.
[0019] Optionally, the cooling liquid flows in the tail gas cooling device of the chemical vapor deposition reaction chamber.
[0020] In a second aspect, the utility model embodiment further provides a tail gas cooling system of a chemical vapor deposition reaction chamber, which comprises the tail gas cooling device of the chemical vapor deposition reaction chamber and the tail gas pipeline of the chemical vapor deposition reaction chamber according to any one of the first aspect.
[0021] The utility model embodiment provides a kind of tail gas cooling device and system of chemical vapor deposition reaction cavity, for the tail gas cooling of tail gas pipeline in chemical vapor deposition reaction cavity;Tail gas pipeline includes: at least two tail gas input, at least one tail gas output and the tail gas pipeline that communicates tail gas input and tail gas output;Tail gas pipeline includes at least one tail gas intersection for converging the tail gas input of adjacent two tail gas inputs;The tail gas cooling device of chemical vapor deposition reaction cavity includes: cooling object input pipeline, the input tail gas cooling pipeline same as the number of tail gas input, first communication pipeline and at least one second communication pipeline;Cooling object input pipeline is sleeved in the outside of tail gas pipeline in tail gas output one end, and input tail gas cooling pipeline is sleeved in the outside of tail gas pipeline in tail gas output one end;First communication pipeline communicates cooling object input pipeline and one input tail gas cooling pipeline, and second communication pipeline communicates adjacent two input tail gas cooling pipelines.The utility model embodiment is connected by being provided with first communication pipeline cooling object input pipeline and one input tail gas cooling pipeline, and is connected by being provided with second communication pipeline adjacent two input tail gas cooling pipelines, to be able to realize the cooling object of single channel input to multiple tail gas cooling.
[0022] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the utility model, and is not used to limit the scope of the utility model. Other features of the utility model will become easy to understand through the following description. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiment description will be simply introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creating labor.
[0024] Figure 1 The structure diagram of the tail gas cooling device of chemical vapor deposition reaction cavity provided by the utility model embodiment is shown;
[0025] Figure 2 The structure diagram of another tail gas cooling device of chemical vapor deposition reaction cavity provided by the utility model embodiment is shown. DETAILED DESCRIPTION
[0026] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the present application.
[0027] It should be noted that the terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0028] Figure 1 A structural schematic view of a tail gas cooling device of a chemical vapor deposition reaction cavity provided by the embodiments of the present application is used for cooling the tail gas in the tail gas pipeline 100 of the chemical vapor deposition reaction cavity; the tail gas pipeline 100 includes: at least two tail gas input ports 110 (only two tail gas input ports 110 are shown in the figure), at least one tail gas output port 120 (only one tail gas output port 120 is shown in the figure) and a tail gas pipeline 130 connecting the tail gas input port 110 and the tail gas output port 120; the tail gas pipeline 130 includes at least one tail gas intersection 131 for converging the tail gas input by adjacent two tail gas input ports 110. Figure 1
[0029] It should be noted that the shape of the tail gas pipeline 130 is not limited to the shape shown in the figure, and can also be other shapes.
[0030] Continuing to refer to Figure 1 The tail gas cooling device 200 of the chemical vapor deposition reaction cavity comprises a cooling object input pipe 210, as many input tail gas cooling pipes 220 as the tail gas input ports 110, a first communication pipe 230, and at least one second communication pipe 240; the cooling object input pipe 210 is sleeved outside the tail gas pipe 130 at one end of the tail gas output port 120, and the input tail gas cooling pipe 220 is sleeved outside the tail gas pipe 130 at one end of the tail gas output port 120; the first communication pipe 230 communicates the cooling object input pipe 210 and one input tail gas cooling pipe 220, and the second communication pipe 240 communicates two adjacent input tail gas cooling pipes 220.
[0031] It can be understood that the tail gas output by the chemical vapor deposition reaction cavity enters the tail gas pipeline 100 through the tail gas input port 110. Figure 1 In the figure, two-way output tail gas enters the tail gas pipe 130 from two tail gas input ports 110. After the high-temperature tail gas enters the tail gas pipe 130 from the tail gas input port 110, it flows in the inner layer of the tail gas pipe 130 in the direction close to the tail gas output port 120 (direction of the blue arrow in the figure). Figure 1 Since the cooling object input pipe 210 is sleeved outside the tail gas pipe 130 at one end of the tail gas output port 120, the cooling object input into the cooling object input pipe 210 flows in the direction close to the tail gas input port 110 (direction of the black arrow in the figure) and flows into the next input tail gas cooling pipe 220 through the second communication pipe 240, so that a large amount of heat of the tail gas in the inner layer of the tail gas pipe 130 can be continuously taken away, thereby achieving the purpose of cooling. Figure 1 The number of the tail gas input ports 110 is not limited to two in the figure, and can be more, and as long as the corresponding input tail gas cooling pipes 220 are increased and the second communication pipes 240 are increased to communicate two adjacent input tail gas cooling pipes 220, the single-channel input cooling object can be used for multi-way tail gas cooling. Figure 1
[0032] The first communication pipe 230 communicates the cooling object input pipe 210 and one input tail gas cooling pipe 220, and the second communication pipe 240 communicates two adjacent input tail gas cooling pipes 220, so that the single-channel input cooling object can be used for multi-way tail gas cooling.
[0033] Optionally, on the basis of the above-mentioned embodiments, further referring to Figure 1 The cooling object input pipe 210 is provided with a cooling object input port 211, and the input tail gas cooling pipe 220 farthest from the cooling object input pipe 210 is provided with a cooling object output port 212.
[0034] Figure 2 Another structure schematic view of the tail gas cooling device of the chemical vapor deposition reaction cavity is provided in the embodiment of the utility model, optionally, on the basis of the above embodiment, reference is made to Figure 2 The tail gas cooling device 200 further comprises a cooling object output device 250; a first end of the cooling object output device 250 is in communication with the cooling object input port 211, and a second end of the cooling object output device 250 is in communication with the cooling object output port 212.
[0035] It can be understood that the first end of the cooling object output device 250 is in communication with the cooling object input port 211, the first end of the cooling object output device 250 is used for inputting cooling objects into the tail gas cooling device 200, the second end of the cooling object output device 250 is in communication with the cooling object output port 212, and the second end of the cooling object output device 250 is used for recycling cooling objects.
[0036] The cooling objects can comprise cooling liquids or low-temperature gases, and adjusting the flow speed of the cooling objects by the cooling object output device 250 can adapt to the cooling of tail gases in different states, and different types of cooling objects can be used to achieve the cooling effect.
[0037] Optionally, on the basis of the above embodiment, reference is made to Figure 2 The flow direction of the cooling objects output by the first end of the cooling object output device 250 is opposite to the flow direction of the tail gas input into the tail gas input port 110.
[0038] Optionally, on the basis of the above embodiment, reference is made to Figure 1 The end of the cooling object input pipeline 210, which is away from the cooling object input port 211, is at a first preset distance from the tail gas intersection 131.
[0039] The first preset distance can be freely set by a user, and it is only required that the cooling object input pipeline 210 does not cover the tail gas intersection 131.
[0040] It can be understood that different tail gases need to be converged at the tail gas intersection 131, and the end of the cooling object input pipeline 210, which is away from the cooling object input port 211, is at a first preset distance from the tail gas intersection 131, so that the condensation of a large amount of tail gas at the tail gas intersection 131 can be avoided to prevent blockage.
[0041] Optionally, on the basis of the above embodiment, reference is made to Figure 1 The end of the input tail gas cooling pipeline 220, which is away from the tail gas output port 120, is at a second preset distance from the tail gas intersection 131.
[0042] The second preset distance can be freely set by a user, and it is only required that the input tail gas cooling pipeline 220 does not cover the tail gas intersection 131.
[0043] It can be understood that different tail gas needs to be mixed at the tail gas intersection 131 and then enter the tail gas output port 120, and the end of the input tail gas cooling pipeline 220 away from the tail gas output port 120 is provided with a second preset distance from the tail gas intersection 131, which can further avoid the blockage caused by the condensation of a large amount of tail gas at the tail gas intersection 131.
[0044] Optionally, on the basis of the above embodiment, further referring to Figure 1 The first communication pipeline 230 communicates the cooling object input pipeline 210 and the input tail gas cooling pipeline 220 closest to the cooling object input pipeline 210.
[0045] Optionally, on the basis of the above embodiment, further referring to Figure 1 The first end of the second communication pipeline 240 communicates the side of the input tail gas cooling pipeline 220 close to the tail gas input port 110, and the second end of the second communication pipeline 240 communicates the side of the adjacent tail gas cooling pipeline close to the tail gas intersection 131.
[0046] In the embodiment of the utility model, the first end of the second communication pipeline 240 communicates the side of the input tail gas cooling pipeline 220 close to the tail gas input port 110, and the second end of the second communication pipeline 240 communicates the side of the adjacent tail gas cooling pipeline close to the tail gas intersection 131, which can maximize the cooling of the tail gas.
[0047] Optionally, on the basis of the above embodiment, the cooling liquid flows in the tail gas cooling device 200 of the chemical vapor deposition reaction cavity.
[0048] In summary, the embodiment of the utility model can realize the cooling of multiple tail gases by a single-channel input of cooling objects by communicating the cooling object input pipeline 210 and one input tail gas cooling pipeline 220 through the first communication pipeline 230 and communicating two adjacent input tail gas cooling pipelines 220 through the second communication pipeline 240. In addition, the embodiment of the utility model can realize the cooling of multiple tail gases by a single-channel input of cooling objects by communicating the cooling object input pipeline 210 and one input tail gas cooling pipeline 220 through the first communication pipeline 230 and communicating two adjacent input tail gas cooling pipelines 220 through the second communication pipeline 240. The end of the input tail gas cooling pipeline 220 away from the tail gas output port 120 is provided with a second preset distance from the tail gas intersection 131, which can further avoid the blockage caused by the condensation of a large amount of tail gas at the tail gas intersection 131. The first end of the second communication pipeline 240 communicates the side of the input tail gas cooling pipeline 220 close to the tail gas input port 110, and the second end of the second communication pipeline 240 communicates the side of the adjacent tail gas cooling pipeline close to the tail gas intersection 131, which can maximize the cooling of the tail gas.
[0049] The utility model embodiment further provides a kind of tail gas cooling system of chemical vapor deposition reaction cavity, including the tail gas cooling device 200 of any one embodiment of the above and the tail gas pipeline 100 of chemical vapor reaction cavity.
[0050] Wherein, the length and shape of tail gas pipeline 100 can be freely set.
[0051] The utility model embodiment provides a kind of tail gas cooling system of chemical vapor deposition reaction cavity, including the tail gas cooling device 200 of any one embodiment of the above of chemical vapor reaction cavity, therefore have same beneficial effect, the content not in the embodiment of the application detailedly described, can refer to the tail gas cooling device of the above embodiment provided chemical vapor deposition reaction cavity.
[0052] The above specific embodiment does not constitute the limitation to the protection scope of the utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be carried out according to design requirements and other factors. Any modification, equivalent substitution and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.
Claims
1. A tail gas cooling device for a chemical vapor deposition reaction chamber, characterized in that, The application discloses a tail gas cooling device for a chemical vapor deposition reaction chamber. The tail gas pipeline comprises at least two tail gas input ports, at least one tail gas output port and a tail gas pipeline connecting the tail gas input ports and the tail gas output port. The tail gas pipeline comprises at least one tail gas intersection for converging tail gas input by two adjacent tail gas input ports. The tail gas cooling device for the chemical vapor deposition reaction chamber comprises a cooling object input pipeline, input tail gas cooling pipelines equal in number to the tail gas input ports, a first connecting pipeline and at least one second connecting pipeline. The cooling object input pipeline is sleeved outside the tail gas pipeline at one end of the tail gas output port, and the input tail gas cooling pipelines are sleeved outside the tail gas pipeline at one end of the tail gas output port. The first connecting pipeline connects the cooling object input pipeline and one input tail gas cooling pipeline, and the second connecting pipeline connects two adjacent input tail gas cooling pipelines.
2. The exhaust cooling apparatus of a chemical vapor deposition reaction chamber according to claim 1, wherein The cooling object input pipeline is provided with a cooling object input port, and the input tail gas cooling pipeline farthest from the cooling object input pipeline is provided with a cooling object output port.
3. The exhaust cooling apparatus of a chemical vapor deposition reaction chamber according to claim 2, wherein The tail gas cooling device further comprises a cooling object output device. A first end of the cooling object output device is connected to the cooling object input port, and a second end of the cooling object output device is connected to the cooling object output port.
4. The exhaust cooling apparatus of a chemical vapor deposition reaction chamber according to claim 3, wherein The cooling object output by the first end of the cooling object output device flows in a direction opposite to the flow direction of the tail gas input by the tail gas input port.
5. The exhaust cooling apparatus of a chemical vapor deposition reaction chamber according to claim 2, wherein An end of the cooling object input pipeline far from the cooling object input port is provided with a first preset distance from the tail gas intersection.
6. The exhaust gas cooling apparatus of a chemical vapor deposition reaction chamber according to claim 5, wherein An end of the input tail gas cooling pipeline far from the tail gas output port is provided with a second preset distance from the tail gas intersection.
7. The exhaust cooling apparatus of a chemical vapor deposition reaction chamber according to claim 1, wherein The first connecting pipeline connects the cooling object input pipeline and the input tail gas cooling pipeline closest to the cooling object input pipeline.
8. The exhaust cooling apparatus of a chemical vapor deposition reaction chamber according to claim 2, wherein A first end of the second connecting pipeline is connected to one side of the input tail gas cooling pipeline close to the tail gas input port, and a second end of the second connecting pipeline is connected to one side of the adjacent input tail gas cooling pipeline close to the tail gas intersection.
9. The exhaust cooling apparatus of a chemical vapor deposition reaction chamber according to claim 1, wherein The tail gas cooling device for the chemical vapor deposition reaction chamber circulates cooling liquid.
10. An exhaust cooling system for a chemical vapor deposition reaction chamber, comprising: The tail gas cooling device for the chemical vapor deposition reaction chamber and the tail gas pipeline of the chemical vapor deposition reaction chamber are disclosed.