Package structure

Abstract

A packaging structure comprises a substrate structure, a photoelectric module, a heat dissipation piece and an optical communication unit. The heat dissipation piece and the photoelectric module are arranged on the substrate structure, the heat dissipation piece is provided with a slot, the photoelectric module is provided with a photon chip, and the slot is used for allowing the optical communication unit to penetrate through and be connected with the photon chip, so that the heat dissipation efficiency is improved, and the signal transmission distance is shortened.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of semiconductor devices, especially a packaging structure for optical communication. BACKGROUND

[0002] With the vigorous development of electronic industry, electronic products also gradually move towards the trend of multi-functional, high-performance. The application of the fifth generation (5G) communication technology has been extended to Internet of Things (Internet of Things, referred to as IoT), Industrial Internet of Things (Industrial Internet of Things, referred to as IIoT), Cloud, artificial intelligence (artificial intelligence, referred to as AI), Autonomous Car (Autonomous Car) and Medical (Medical) fields, and with the expansion of application level in the process, a very large amount of data will be generated, which needs to be transmitted, calculated and stored efficiently. Therefore, in recent years, the transmission demand of large data center and cloud server for data is large, and the industry enters the optical communication field, using "light" instead of "electricity" as the carrier of data transmission. Under this background, co-packaged optics (Co-Package Optic) has become the development trend of future semiconductor and packaging technology.

[0003] Figure 1 It is a cross-sectional view of the existing co-packaged optics semiconductor package 1. The substrate 10 of the semiconductor package 1 is respectively provided with an electronic element 11, an electronic integrated circuit (Electronic IC, referred to as EIC) element 12 and a photonic integrated circuit (Photonic IC, referred to as PIC) element 13, and one side end of the photonic integrated circuit element 13 is connected with an optical fiber 14.

[0004] The electronic element 11 and the electronic integrated circuit element 12 are placed on the substrate 10 through the first line structure 15, and the photonic integrated circuit element 13 is placed on the substrate 10 through the second line structure 16. In other words, the electronic element 11 and the electronic integrated circuit element need to be electrically connected to the photonic integrated circuit element 13 through the first line structure 15, the substrate 10 and the second line structure 16.

[0005] However, the path of the electrical signal transmission of the aforementioned co-packaged optics semiconductor package has the problem of being too long, causing signal loss, which cannot meet the rapid and large data transmission demand of future technology and products. In addition, considering the large amount of data transmission demand, if the heat generated during operation cannot be effectively dissipated, the operation efficiency and service life will be affected.

[0006] How to overcome the problems of the prior art, has become the industry to be solved. Utility model content

[0007] The utility model provides a package structure, include: substrate structure, photoelectric module is located on the substrate structure, and has photon element, heat dissipation piece is located on the substrate structure, and forms with the slot, and optical communication unit is located on the substrate structure, and is connected with the photon element through the slot.

[0008] As the package structure, the photoelectric module is electrically connected with the substrate structure through a plurality of conductive bumps.

[0009] As the package structure, the photoelectric module includes wiring structure, semiconductor element and electronic element located on one side of the wiring structure, and the photon element located on the other side of the wiring structure.

[0010] As the package structure, the semiconductor element is an electronic integrated circuit chip, which is placed on the first side of the wiring structure and electrically connected with the wiring structure.

[0011] As the package structure, the photon element is a photon integrated circuit chip, which is placed on the second side of the wiring structure and electrically connected with the wiring structure.

[0012] As the package structure, the heat dissipation piece includes a cover part and a support part, the support part is located at the periphery of the cover part, so that the cover part and the support part form a containing space.

[0013] As the package structure, the heat dissipation piece is erected on the substrate structure through the support part, and the cover part covers the photoelectric module, and the photoelectric module is accommodated in the containing space.

[0014] As the package structure, the optical communication unit is an optical fiber array unit for connecting optical fibers.

[0015] As the package structure, the plane size of the slot of the heat dissipation piece is greater than the plane size of the optical communication unit.

[0016] As the package structure, it further includes a plurality of conductive elements located on the bottom side of the substrate structure.

[0017] As the package structure, the optical communication unit passes through the slot to connect the photon element.

[0018] As the package structure, the photon element and the optical communication unit both extend into the slot to be connected with each other.

[0019] Therefore, the packaging structure of this utility model mainly includes a substrate structure and an optoelectronic module, a heat sink, and an optical communication unit disposed on the substrate structure. The optoelectronic module has a wiring structure, a semiconductor element and an electronic element disposed on a first side of the wiring structure, and a photonic element disposed on a second side of the wiring structure, so that the semiconductor element and the electronic element can be directly electrically connected to the photonic element through the wiring structure to shorten the signal transmission distance. At the same time, the heat sink has a slot for the optical communication unit to pass through and connect to the photonic chip, which can improve the connection efficiency between the optical communication element and the photonic chip and improve the heat dissipation efficiency. Attached Figure Description

[0020] Figure 1 This is a cross-sectional schematic diagram of a semiconductor package for existing common-package optics.

[0021] Figure 2 This is a cross-sectional schematic diagram of the first embodiment of the packaging structure of this utility model.

[0022] Figure 3 This is a partial cross-sectional schematic diagram of the packaging structure of this utility model.

[0023] Figure 4 This is a cross-sectional schematic diagram of the second embodiment of the packaging structure of this utility model.

[0024] Explanation of reference numerals in the attached figures

[0025] 1 Semiconductor package

[0026] 10 substrate

[0027] 11 Electronic components

[0028] 12 Electronic integrated circuit components

[0029] 13 Photonic integrated circuit elements

[0030] 14 optical fibers

[0031] 15 First Line Structure

[0032] 16 Second Line Structure

[0033] 2,3 Packaging Structure

[0034] 20. Substrate Structure

[0035] 201 Insulation Layer

[0036] 202 Line Layer

[0037] 21 Optoelectronic Modules

[0038] 210 Wiring Structure

[0039] 210a first side

[0040] 210b second side

[0041] 211 semiconductor element

[0042] 212 electronic element

[0043] 213 photonic element

[0044] 214 conductive bump

[0045] 22 heat dissipation member

[0046] 221 covering portion

[0047] 222 supporting portion

[0048] 220 thermally conductive interface material

[0049] 2220 slot

[0050] 223 accommodation space

[0051] 23 optical communication unit

[0052] 24 conductive element

[0053] S, W width DETAILED DESCRIPTION

[0054] The implementation of the present application will be described below by specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present specification.

[0055] It should be understood that the structures, proportions, sizes, etc. shown in the drawings attached to the present specification are only used to understand and read the content disclosed in the present specification by those skilled in the art, and are not used to limit the implementation conditions of the present application, so they do not have technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "first", "second", "at least one" and "one" used in the present specification are only for the convenience of clear description, and are not used to limit the scope of the implementation of the present application. The change or adjustment of the relative relationship without substantially changing the technical content is also considered as the scope of the implementation of the present application.

[0056] Please refer to Figure 2As shown in the figure, the packaging structure 2 comprises a substrate structure 20, an optoelectronic module 21 disposed on the substrate structure 20, a heat dissipation member 22 disposed on the substrate structure 20, and an optical communication unit 23 disposed on the substrate structure 20 and connected to the optoelectronic module 21.

[0057] The substrate structure 20 is, for example, a packaging substrate with a core layer or a coreless packaging substrate, which comprises an insulating layer 201 and a circuit layer 202 combined with the insulating layer 201. The material of the insulating layer 201 is, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. The material forming the circuit layer 202 can be copper or other conductive materials.

[0058] The optoelectronic module 21 comprises a wiring structure 210, a semiconductor element 211 and an electronic element 212 disposed on one side of the wiring structure, and a photonic element 213 disposed on the other side of the wiring structure 210. The optoelectronic module 21 can be electrically connected to the substrate structure 20 by a plurality of conductive bumps 214 such as solder bumps, copper bumps, etc.

[0059] The wiring structure 210 has opposite first and second sides 210a and 210b, and comprises an insulating layer and a wiring layer, such as a redistribution layer (RDL) specification, disposed on the insulating layer.

[0060] The semiconductor element 211, for example, an electronic integrated circuit (EIC) chip, is disposed on the first side 210a of the wiring structure 210 and electrically connected to the wiring structure 210.

[0061] The electronic element 212, for example, a switch chip, a system on chip (SOC), a high bandwidth memory (HBM) chip, or other functional chips, is disposed on the first side 210a of the wiring structure 210 and electrically connected to the wiring structure 210. It can also be a passive element such as a resistor, a capacitor, or an inductor.

[0062] The photonic element 213, for example, a photonic integrated circuit (PIC) chip, is disposed on the second side 210b of the wiring structure 210 and electrically connected to the wiring structure 210, so that the semiconductor element 211 and the electronic element 212 can be directly electrically connected to the photonic element 213 through the wiring structure 210.

[0063] The heat dissipation member 22 is disposed on the substrate structure 20 and covers the optoelectronic module 21.

[0064] The heat dissipation member 22 comprises a cover portion 221 and a support portion 222. The support portion 222 is arranged at the periphery of the cover portion 221, so that the cover portion 221 and the support portion 222 bound a containing space 223. The heat dissipation member 22 can be vertically arranged on the substrate structure 20 by the support portion 222, and the photovoltaic module 21 is covered by the cover portion 221, and the photovoltaic module 21 is contained in the containing space 223. In addition, the support portion 222 is provided with a slot 2220 corresponding to the position of the photonic element 213 of the photovoltaic module 21, which serves as an optical signal channel.

[0065] In addition, the cover portion 221 of the heat dissipation member 22 can be arranged on the semiconductor element 211 and the electronic element 212 through a conductive interface layer (TIM), so as to effectively dissipate the heat generated by the semiconductor element 211 and the electronic element 212 during operation.

[0066] The optical communication unit 23 is arranged on the substrate structure 20 and connected to the photonic element 213 of the photovoltaic module 21 through the slot 2220 of the heat dissipation member 22. The optical communication unit 23 is, for example, a fiber array unit (FAU) for connecting optical fibers.

[0067] Please refer to Figure 3 The plane size of the slot 2220 of the heat dissipation member 22 is greater than the plane size of the optical communication unit 23, so that the optical communication unit 23 can easily pass through the slot 2220 and be connected to the photonic element 213.

[0068] In the embodiment, the width W of the optical communication unit 23 and the width S of the slot 2220 of the heat dissipation member 22, wherein the difference between the width W and the width S is less than 10 um, which is beneficial to the alignment of the optical communication unit 23 and the photonic element 213, and improves the connection efficiency.

[0069] In addition, a plurality of conductive elements 24 such as solder balls can be arranged on the bottom side of the substrate structure 20, so as to be arranged in other electronic devices (not shown).

[0070] Please refer to Figure 4 is a cross-sectional view of the second embodiment of the packaging structure of the utility model.

[0071] The embodiment is basically same as the foregoing embodiment, and the main difference is that in the packaging structure 3, the photonic element 213 extends into the slot 2220 of the heat dissipation member 22 from the inner side (accommodation space 223) of the heat dissipation member 22, and the optical communication unit 23 extends into the slot 2220 of the heat dissipation member 22 from the outer side of the heat dissipation member 22 to be connected with the photonic element 213. That is, the photonic element 213 and the optical communication unit 23 both extend into the slot 2220, which is beneficial to the alignment and connection of the photonic element 213 and the optical communication unit 23.

[0072] In summary, the packaging structure mainly comprises a substrate structure, an optoelectronic module, a heat dissipation member and an optical communication unit arranged on the substrate structure, wherein the optoelectronic module has a wiring structure, semiconductor elements and electronic elements arranged on the first side of the wiring structure, and a photonic element arranged on the second side of the wiring structure, so that the semiconductor elements and electronic elements can be directly electrically connected to the photonic element through the wiring structure, thereby shortening the signal transmission distance, and the heat dissipation member is provided with a slot for the optical communication unit to pass through and be connected with the photonic chip, thereby improving the connection efficiency of the optical communication unit and the photonic chip and improving the heat dissipation efficiency.

[0073] The above embodiments are used to illustrate the principles and effects of the present application, and are not used to limit the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be as listed in the claims.

Claims

1. A packaging structure, characterized in that, include: Substrate structure; An optoelectronic module is disposed on the substrate structure and includes a wiring structure, a semiconductor element and an electronic element disposed on one side of the wiring structure, and a photonic element disposed on the other side of the wiring structure, wherein the semiconductor element and the electronic element are electrically connected to the photonic element through the wiring structure. A heat sink is disposed on the substrate structure and includes a cover portion that is connected to the semiconductor element and the electronic element through a conductive interface layer, and the heat sink has a slot formed thereon; and An optical communication unit is disposed on the substrate structure and connected to the photonic element through the slot.

2. The packaging structure as described in claim 1, characterized in that, The optoelectronic module is electrically connected to the substrate structure via multiple conductive bumps.

3. The packaging structure as described in claim 1, characterized in that, The semiconductor element is an electronic integrated circuit chip, which is placed on the first side of the wiring structure and electrically connected to the wiring structure.

4. The packaging structure as described in claim 1, characterized in that, The photonic element is a photonic integrated circuit chip, which is placed on the second side of the wiring structure and electrically connected to the wiring structure.

5. The packaging structure as described in claim 1, characterized in that, The heat sink further includes a support portion located around the cover portion, so that the cover portion and the support portion enclose and form an accommodating space.

6. The packaging structure as described in claim 5, characterized in that, The heat sink is erected on the substrate structure by the support portion and the photoelectric module is covered by the cover portion, so that the photoelectric module is housed in the accommodating space.

7. The packaging structure as described in claim 1, characterized in that, This optical communication unit is a fiber optic array unit used to connect optical fibers.

8. The packaging structure as described in claim 1, characterized in that, The planar dimensions of the slot in the heat sink are larger than the planar dimensions of the optical communication unit.

9. The packaging structure as described in claim 1, characterized in that, The packaging structure also includes multiple conductive elements disposed on the bottom side of the substrate structure.

10. The packaging structure as described in claim 1, characterized in that, The optical communication unit passes through the slot to connect to the photonic element.

11. The packaging structure as described in claim 1, characterized in that, Both the photonic element and the optical communication unit extend into the slot to be interconnected.

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