Cooling circulation heat dissipation piece and electronic device with cooling circulation heat dissipation piece
By using a design that encloses the flow channel together with the housing and heat-conducting components, the problem of poor heat dissipation caused by the large space occupied by the cooling circulation module is solved, and efficient heat dissipation is achieved in a limited space.
Patent Information
- Application Number
- CN202423258589.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-12-19
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Existing cooling circulation modules suffer from poor heat dissipation due to the difficulty in reducing the thickness of components such as flow channels and pumps, which occupy internal space in laptops.
The flow channel is sealed by both the housing and the heat-conducting component. The housing directly serves as the housing for the electronic device, while the heat-conducting component dissipates heat inwards. The thickness of the heat-conducting component is reduced, and heat is dissipated through the circulation of the working fluid, which is driven by a pump.
Without increasing the thickness of the device, the heat dissipation efficiency of the electronic device is improved, the internal space occupied is reduced, and the heat dissipation effect is enhanced.
Smart Images
Figure CN223712092U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation module, especially a cooling circulation heat dissipation piece which can help electronic device maintain proper working temperature and electronic device with the cooling circulation heat dissipation piece. BACKGROUND
[0002] Nowadays, electronic devices such as notebook computers have excellent performance and are always advancing towards thin and light trend. However, electronic devices are prone to generate a large amount of waste heat when operating, which leads to the temperature rise of electronic devices, increasing the thermal failure rate and consumption rate of electronic devices. Therefore, the heat generated by heat sources such as chips in electronic devices is usually introduced into a cooling circulation module with better heat dissipation efficiency. However, the existing cooling circulation module has a flow channel for the flow of working liquid and elements such as pumps for driving the flow of working liquid, so the thickness is difficult to reduce, which greatly occupies the internal space of the notebook computer, making the spacing between the internal elements of the notebook computer too close, and thus leading to poor heat dissipation effect on the internal elements of the notebook computer. SUMMARY
[0003] To solve the above problems, the purpose of the utility model is to provide a cooling circulation heat dissipation piece and an electronic device with the cooling circulation heat dissipation piece, which can reduce the internal space occupied by the electronic device.
[0004] The directionality or its approximate language described in the whole text of the utility model, such as "front", "back", "left", "right", "up (top)", "down (bottom)", "inside", "outside", "side" and the like, mainly refers to the direction of the attached drawings, and each directionality or its approximate language is only used to assist in describing and understanding each embodiment of the utility model, and is not used to limit the utility model.
[0005] The quantifier "one" or "a" used for the elements and components described in the whole text of the utility model is only for the convenience of use and provides the general meaning of the scope of the utility model; in the utility model, it should be interpreted as including one or at least one, and the single concept also includes multiple cases, unless it obviously means other meanings.
[0006] The approximate language such as "combination", "combination" or "assembly" described in the whole text of the utility model mainly includes the state that the components can be separated without damaging the components after being connected, or the components cannot be separated after being connected, and the person skilled in the art can select according to the material quality of the components to be connected or the assembly requirements.
[0007] The cooling circulation heat dissipation piece of the utility model comprises: a shell having a first surface and a second surface opposite to each other, the first surface having at least one supporting part; and a heat conduction piece having a combination surface and a heat conduction surface opposite to each other, the combination surface of the heat conduction piece being combined with the second surface of the shell, and the heat conduction piece and the shell forming a flow channel together.
[0008] Therefore, the cooling circulation heat dissipation member can reduce the thickness of the heat conduction member to reduce the space occupied by the heat conduction member in the electronic device, improve the heat dissipation efficiency of the electronic device, and achieve the effect of improving the heat dissipation efficiency in a limited space.
[0009] The at least one support portion is a plurality of support portions, and the plurality of support portions are symmetrically distributed on the first surface. In this way, the shell can be placed horizontally on the placement surface.
[0010] The at least one support portion is continuously adjacent to the periphery of the shell. In this way, the shell can be placed horizontally on the placement surface.
[0011] The second surface has a groove recessed from the second surface toward the first surface, so that the groove protrudes from the first surface. In this way, the groove can protrude from the first surface to form a larger space.
[0012] The groove is located within the range surrounded by the at least one support portion. In this way, when the groove protrudes from the first surface, the support effect of the at least one support portion on the shell can be avoided.
[0013] The at least one support portion is a plurality of support portions, and the groove is located between the plurality of support portions. In this way, when the groove protrudes from the first surface, the support effect of the at least one support portion on the shell can be avoided.
[0014] The first distance by which the groove protrudes from the first surface is not more than a second distance by which the at least one support portion protrudes from the first surface. In this way, the shell can stably contact the placement surface through the at least one support portion.
[0015] The heat conduction member is located in the groove, and the protruding distance of the heat conduction member from the second surface through the groove is less than or equal to 5 mm. In this way, the heat conduction member will not excessively protrude from the second surface of the shell.
[0016] The flow channel is recessed in the bonding surface of the heat conduction member. In this way, the flow channel can be closed by the shell.
[0017] The area of the second surface of the shell is greater than the area of the bonding surface of the heat conduction member. In this way, the area occupied by the heat conduction member can be reduced.
[0018] The cooling circulation heat-dissipation member of the utility model, further include a pump, the pump drives a working liquid to circulate flow in the flow channel. Thus, the working liquid can circulate flow to carry out the heat dissipation effect.
[0019] The electronic device of the utility model, include: a host computer body, the host computer body has a heat source inside;And the cooling circulation heat-dissipation member of above-mentioned, the casing is combined in the host computer body, make the second surface towards the inside of the host computer body, the heat conduction surface directly or indirectly thermal contact the heat source. Thus, the thickness of the heat conduction member can be reduced to reduce the occupation space of the heat conduction member to the inside of the electronic device, to improve the heat dissipation efficiency of the inside of the electronic device effect.
[0020] Wherein, the heat source is through a heat pipe thermal contact to the heat conduction surface. Thus, the heat source can be through the heat dissipation effect of the heat conduction member. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 The exploded perspective view of a preferred embodiment of the utility model;
[0022] Figure 2 The combined front view of a preferred embodiment of the utility model;
[0023] Figure 3 The partial sectional view of cooling circulation heat-dissipation member along the A-A line section of B; Figure 2
[0024] Figure 4 As shown in the partial structure enlarged view of B. Figure 3
[0025] REFERENCE SIGNS:
[0026] 1: casing
[0027] 1a: first surface
[0028] 1b: second surface
[0029] 11: support portion
[0030] 12: slot
[0031] 2: heat conduction member
[0032] 2a: combined surface
[0033] 2b: heat conduction surface
[0034] 21: flow channel
[0035] 21a: liquid outlet portion
[0036] 21b: liquid inlet portion
[0037] 22: Pump
[0038] 23: Liquid inlet
[0039] 24: Liquid outlet
[0040] G: Cooling circulation heat sink
[0041] E: Electronic device
[0042] E1: Main body
[0043] D1: First distance
[0044] D2: Second distance
[0045] D3: Protruding distance
[0046] H: Heat source
[0047] T: Heat pipe DETAILED DESCRIPTION
[0048] In order to make the above and other objects, features and advantages of the present application more comprehensible, preferred embodiments of the present application will be described below in detail with reference to the accompanying drawings. In addition, the same reference numerals are used to denote the same components throughout the drawings, and the description thereof will be omitted.
[0049] Please refer to Figure 1 , which is a preferred embodiment of the cooling circulation heat sink G of the present application, comprising a housing 1 and a heat conduction member 2. The heat conduction member 2 is combined with the housing 1.
[0050] The housing 1 can be used to form a housing of an electronic device E. For example, the electronic device E can have a main body E1, and the electronic device E can be a notebook computer or a tablet computer. The housing 1 can form a bottom plate of the main body E1. The housing 1 can be made of a high-thermal-conductivity material. The housing 1 can be combined with the main body E1 by, for example, locking, clamping, or gluing. In the present embodiment, the housing 1 has a first surface 1a and a second surface 1b. The first surface 1a is opposite to the second surface 1b. The first surface 1a can have at least one support portion 11. The at least one support portion 11 can be, for example, a protruding column, a protruding block, or a protruding rib. The at least one support portion 11 can protrude from the first surface 1a. The housing 1 can be stably placed on a placement surface (for example, a table top) by the at least one support portion 11.
[0051] Please refer to Figure 1 , Figure 4As shown, for example, the at least one support portion 11 can be a plurality of support portions 11, which can be symmetrically distributed on the first surface la. For example, the plurality of support portions 11 can be four protruding columns or protruding blocks, which are respectively located at four corners of the first surface la. Alternatively, the at least one support portion 11 can be continuously extended adjacent to the periphery of the shell 1. For example, the support portion 11 can be two long protruding ribs, which are respectively located on two symmetric sides of the first surface la, or can be a continuously extended protruding rib, which is located around the periphery adjacent to the first surface la. The plurality of support portions 11 can enable the shell 1 to be horizontally placed on the placement surface, and the utility model does not limit the number or relative positional relationship of the plurality of support portions 11. The second surface lb can be used to face the interior of the host body E1. In the embodiment, the second surface lb can have a groove 12, which can be recessed from the second surface lb towards the first surface la, so that the groove 12 can protrude from the first surface la. The groove 12 can be located within the range surrounded by the at least one support portion 11. It is worth noting that a first distance D1 by which the groove 12 protrudes from the first surface la is preferably not more than a second distance D2 by which the at least one support portion 11 protrudes from the first surface la. In this way, the shell 1 can stably contact the placement surface through the at least one support portion 11.
[0052] As shown in Figure 1 、 Figure 2 The heat-conducting member 2 can be made of copper, aluminum, titanium, stainless steel or other heat-conducting materials. The heat-conducting member 2 can have a substantially thin plate shape. The heat-conducting member 2 can be combined with the second surface lb of the shell 1, for example, by hot pressing, welding or locking. Further, the heat-conducting member 2 can have a combination surface 2a, and the heat-conducting member 2 is combined with the second surface lb of the shell 1 through the combination surface 2a. Preferably, the area of the second surface lb of the shell 1 is greater than the area of the combination surface 2a of the heat-conducting member 2, so that the heat-conducting member 2 can be located in the groove 12. For example, when the heat-conducting member 2 is located in the groove 12, a protruding distance D3 by which the heat-conducting member 2 protrudes from the second surface lb of the groove 12 can be less than or equal to 5 mm. Further, the protruding distance D3 can be the distance by which the heat-conducting member 2 protrudes from the second surface lb outside the groove 12. In this way, the heat-conducting member 2 can not excessively protrude from the second surface lb of the shell 1 (relative to the part outside the groove 12). In addition, the heat-conducting member 2 has a heat-conducting surface 2b, which is used to directly or indirectly contact a heat source H inside the host body E1. In the embodiment, the heat source H can be in thermal contact with the heat-conducting surface 2b through a heat pipe T, so as to dissipate heat through the heat-conducting member 2.
[0053] Please refer toFigure 2 、 Figure 3 As shown in FIG. 2, more specifically, the heat-conducting member 2 and the shell 1 can jointly form a flow channel 21, which can be used for circulating flow of a working liquid, thereby taking away the heat energy of the heat source H. The flow channel 21 can be recessed in the heat-conducting member 2, or the flow channel 21 can be recessed in the second surface 1b of the shell 1, or the heat-conducting member 2 and the second surface 1b are recessed to form a part of the flow channel 21, respectively. The flow channel 21 can extend the length of the flow channel 21 by forming a plurality of straight channels and a plurality of curved channels, and the flow channel 21 can almost cover the heat-conducting member 2 and the shell 1. Preferably, the circulating flow of the working liquid can be driven by a pump 22, which can be located outside the heat-conducting member 2, or the pump 22 can be located in the heat-conducting member 2, or the flow channel 21 can pass through the pump 22, and the utility model is not limited. In the embodiment, the pump 22 can be located in the heat-conducting surface 2b, the pump 22 has a liquid inlet 23 connected to a liquid outlet 21a of the flow channel 21, and the pump 22 has a liquid outlet 24 connected to a liquid inlet 21b of the flow channel 21. In this way, the heat energy of the heat source H can be dissipated through the shell 1 by the circulating flow of the working liquid in the flow channel 21.
[0054] In summary, the cooling and circulating heat-dissipating member of the utility model, by the shell and the heat-conducting member jointly enclosing the flow channel, without additional plate combined with the heat-conducting member to enclose the flow channel, thereby the thickness of the heat-conducting member can be reduced. The shell can be directly used as the shell of the electronic device, so that the heat-conducting member is directed to the inside of the electronic device to dissipate heat from the heat source, thus the thickness of the heat-conducting member can be reduced to reduce the space occupied by the heat-conducting member in the inside of the electronic device, so as to improve the heat-dissipating efficiency of the inside of the electronic device, and the heat-dissipating efficiency in the limited space can be improved.
[0055] Although the utility model has been disclosed by the above preferred embodiments, it is not intended to limit the utility model, and any person skilled in the art can make various changes and modifications to the above embodiments without departing from the spirit and scope of the utility model, and the changes and modifications are still within the technical scope protected by the utility model, therefore the protection scope of the utility model should include the meaning recorded in the appended claims and all changes within the equivalent scope.
Claims
1. A cooling circulation heat sink, characterized by, Comprising: a housing having a first surface and a second surface opposite to the first surface, the first surface having at least one support portion; and a heat conducting member having a coupling surface and a heat conducting surface opposite to the coupling surface, the coupling surface of the heat conducting member being coupled to the second surface of the housing, the heat conducting member and the housing together forming a flow channel.
2. The cooling circulation heat sink of claim 1, wherein The at least one support portion is a plurality of support portions, the plurality of support portions being symmetrically distributed on the first surface.
3. The cooling circulation heat sink of claim 1, wherein The at least one support portion is a plurality of support portions, the plurality of support portions being continuously extended adjacent to a periphery of the housing.
4. The cooling circulation heat sink according to claim 2 or 3, wherein The second surface has a groove recessed from the second surface toward the first surface, the groove being protruded on the first surface.
5. The cooling circulation heat sink of claim 4, wherein, The groove is located within a range surrounded by the at least one support portion.
6. The cooling circulation heat sink of claim 4, wherein, The groove is located between the plurality of support portions.
7. The cooling circulation heat sink of claim 4, wherein A first distance by which the groove is protruded on the first surface is not more than a second distance by which the at least one support portion is protruded from the first surface.
8. The cooling circulation heat sink of claim 4, wherein, A protruding distance by which the heat conducting member is protruded from the second surface is less than or equal to 5 mm.
9. The cooling circulating heat radiating member as claimed in Claim 1, wherein The flow channel is recessed on the coupling surface of the heat conducting member.
10. The cooling circulating heat radiating member as claimed in Claim 1, wherein An area of the second surface of the housing is greater than an area of the coupling surface of the heat conducting member.
11. The cooling circulating heat radiating member as claimed in claim 1, wherein Further comprising a pump driving a working liquid to circulate in the flow channel.
12. An electronic device, comprising: Comprising: a main body having a heat source inside the main body; and a cooling circulation heat sink as claimed in any one of claims 1 to 11, the housing being coupled to the main body such that the second surface faces toward the inside of the main body, and the heat conducting surface directly or indirectly thermally contacts the heat source. 13.The electronic device of claim 12, wherein, The heat source is thermally contacted to the heat conducting surface through a heat pipe.