Computer heat dissipation mechanism

Abstract

The utility model discloses a computer heat dissipation mechanism, and belongs to the technical field of computer heat dissipation. Comprising a case side plate, a rectangular groove is formed in the case side plate, a heat dissipation hole plate is embedded and clamped in the rectangular groove, arc-shaped embedding plates are arranged at the four corners in the rectangular groove, and arc-shaped embedding grooves are formed in the four ends of the heat dissipation hole plate. The limiting blocks slide to the side away from the heat dissipation hole plate along the cavities, the positioning balls are extruded, the limiting plates leave the clamping grooves, the front side of the heat dissipation hole plate loses limitation, fingers are buckled into the buckling grooves, the heat dissipation hole plate can be rapidly detached from the outer side of the side plate of the case, the film body mainly prevents large-particle impurities and dust from entering, and the dustproof effect is achieved; the arc-shaped embedding plate is matched with the arc-shaped embedding groove, so that the heat dissipation hole plate and the case side plate can be completely matched, the flatness and the strength of the structure are improved, the limiting plate can be limited by transversely sliding, and the assembly operation of the heat dissipation hole plate is relatively simple.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of computer heat dissipation, in particular to a computer heat dissipation mechanism. BACKGROUND

[0002] Integrated circuits are widely used in computer components, and high temperature of the computer can not only cause unstable system operation and shortened service life, but also can even burn some internal components of the computer, and the high temperature is caused by the computer, and the role of the heat sink is to absorb the heat and then dissipate the heat to the case or outside the case to ensure the normal temperature of the computer components.

[0003] The patent with the authorized announcement number CN219143408U provides a computer heat dissipation mechanism and relates to the technical field of computers, which comprises a heat dissipation fan, one end of the heat dissipation fan is fixedly connected with a heat dissipation assembly, and the heat dissipation fan comprises a heat dissipation frame, a motor, a mounting frame and a temperature sensor. The heat dissipation mechanism can increase the contact area through the heat dissipation frame, the heat conduction paste filled between the adjacent heat conduction pieces can replace the air with low heat conductivity, the heat resistance is reduced, the heat conduction performance of the heat dissipation mechanism is enhanced, when the temperature of the heat conduction piece reaches a certain value, the hydraulic drive drives the elastic connecting rod to move downward, thereby driving the plurality of dustproof pieces to rotate downward, the flow area of the heat dissipation groove is increased, and the heat dissipation of the computer is accelerated, when the computer is not used at high frequency, the hydraulic drive controls the dustproof pieces to rotate upward, the flow area of the heat dissipation groove is reduced, the dustproof effect is achieved, and the use effect of the heat dissipation mechanism is enhanced.

[0004] The existing computer case heat dissipation groove is directly arranged on the shell, although the heat is absorbed through the increase of the fan, water cooling and other means, but mainly relies on the air rapid exchange of the heat dissipation groove inside and outside the case, and since the plate body where the heat dissipation groove is arranged cannot be quickly disassembled and cleaned, dust is blocked in the heat dissipation groove for a long time, and the heat dissipation effect is affected.

[0005] In view of this, the application provides a computer heat dissipation mechanism. Content of the utility model

[0006] 1. Technical problem to be solved

[0007] The application aims to provide a computer heat dissipation mechanism, and solves the technical problem that the existing computer case heat dissipation groove is directly arranged on the shell, although the heat is absorbed through the increase of the fan, water cooling and other means, but mainly relies on the air rapid exchange of the heat dissipation groove inside and outside the case, and since the plate body where the heat dissipation groove is arranged cannot be quickly disassembled and cleaned, dust is blocked in the heat dissipation groove for a long time, and the heat dissipation effect is affected, and the technical effect that the heat dissipation hole plate can be quickly disassembled while the structural strength is ensured is achieved.

[0008] 2. Technical solution

[0009] The application provides a computer heat dissipation mechanism, which comprises a case side plate, a rectangular groove is formed in the case side plate, a heat dissipation hole plate is embedded in the rectangular groove, arc-shaped embedded plates are arranged at four corners in the rectangular groove, arc-shaped embedded grooves are formed at four ends of the heat dissipation hole plate, and clamping grooves are symmetrically formed at four sides of the heat dissipation hole plate.

[0010] Limiting assemblies are symmetrically arranged at positions on both sides of the rectangular groove of the case side plate, the limiting assembly comprises a cavity which is formed in the case side plate and extends towards the inside of the rectangular groove, a limiting plate is slidably arranged in the cavity, and the limiting plate can be inserted into the clamping groove.

[0011] Preferably, a through groove is in communication with the front of the case side plate, a limiting block is arranged on one side of the limiting plate, and the limiting block slides in the cavity.

[0012] Preferably, a positioning ball is elastically arranged on one side of the limiting plate.

[0013] Preferably, honeycomb grooves are uniformly formed in the heat dissipation hole plate.

[0014] Preferably, buckle grooves are symmetrically formed in the heat dissipation hole plate, a film body is fixedly arranged in the buckle groove, and a cross groove is formed in the film body.

[0015] Preferably, the thickness of the side of the case side plate is 1.2 mm, and the case side plate and the heat dissipation hole plate are made of aluminum profiles.

[0016] 3. Beneficial effects

[0017] One or more technical solutions provided in the embodiments of the application have at least the following technical effects or advantages:

[0018] (1) The limiting assemblies are arranged, the limiting blocks are respectively slid along the cavities to the side away from the heat dissipation hole plate, the positioning balls are pressed, the limiting plate is away from the clamping groove, the front side of the heat dissipation hole plate is not limited, the heat dissipation hole plate can be quickly disassembled from the outside of the case side plate by being buckled into the buckle groove, the film body mainly prevents large-particle impurities and dust from entering, and the effect of dust prevention is achieved, the arc-shaped embedded plates and the arc-shaped embedded grooves are matched, the heat dissipation hole plate and the case side plate are completely matched, the flatness and strength of the structure are increased, the limiting plate is limited by transverse sliding, the heat dissipation hole plate is also relatively simple to assemble, and the case can be stably cooled by regularly cleaning the heat dissipation hole plate.

[0019] (2) The application is provided with honeycomb grooves and heat dissipation hole plates, and the honeycomb grooves are arranged in a hexagonal shape, so that the heat dissipation performance is improved while the structural strength of the case is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a first three-dimensional structure schematic view of the utility model;

[0021] Figure 2 It is a second three-dimensional structure schematic view of the utility model;

[0022] Figure 3 It is a three-dimensional structure schematic view of the separation state of the utility model;

[0023] Figure 4 It is a three-dimensional structure schematic view of the heat dissipation hole plate of the utility model;

[0024] Figure 5 It is a Figure 3 It is a local structure enlarged schematic view of A place of the utility model.

[0025] Explanation of reference numerals in the drawing: 110, case side plate; 111, arc-shaped embedded plate; 120, heat dissipation hole plate; 121, honeycomb groove; 122, film body; 123, clamping groove; 124, arc-shaped embedded groove; 125, buckling groove; 200, limiting assembly; 210, cavity; 211, through groove; 212, limiting block; 213, limiting plate; 214, positioning ball. DETAILED DESCRIPTION

[0026] The application will be further described in detail in combination with the drawing of the specification.

[0027] Example 1

[0028] Please refer to Figures 1-5The utility model provides a kind of computer heat dissipation mechanism of an embodiment: computer heat dissipation mechanism, including cabinet side plate 110, rectangular groove is opened in the inside of cabinet side plate 110, rectangular groove inside is embedded and is clamped with heat dissipation hole plate 120, four corners inside rectangular groove is provided with arc inlaying plate 111, heat dissipation hole plate 120 four ends are provided with arc inlaying groove 124, heat dissipation hole plate 120 four sides are provided with clamping groove 123 symmetrically;Limiting component 200, four limiting components 200 are symmetrically distributed in the position of the both sides of rectangular groove of cabinet side plate 110, limiting component 200 includes the cavity 210 being opened in the inside of cabinet side plate 110 along rectangular groove, limiting plate 213 is slidably arranged in the inside of cavity 210, limiting plate 213 can be inserted into the inside of clamping groove 123, cavity 210 is communicated with through slot 211 from the front of cabinet side plate 110, limiting block 212 is provided on one side of limiting plate 213, limiting block 212 is slid in the inside of cavity 210, positioning ball 214 is elastically provided on one side of limiting plate 213, heat dissipation hole plate 120 is provided with buckle groove 125 symmetrically, wherein buckle groove 125 is fixedly provided with membrane 122 inside, and cross groove is opened in the inside of membrane 122.Limiting block 212 is slid to the side away from heat dissipation hole plate 120 along cavity 210 respectively, positioning ball 214 is extruded, limiting plate 213 leaves clamping groove 123, so that the front side of heat dissipation hole plate 120 loses limit, by finger buckling into buckle groove 125, heat dissipation hole plate 120 can be quickly disassembled from the outside of cabinet side plate 110, membrane 122 is mainly prevented that large particle impurities dust enters, plays the effect of dust prevention, arc inlaying plate 111 and arc inlaying groove 124 cooperate, convenient heat dissipation hole plate 120 and cabinet side plate 110 are completely matched, increase the flatness and strength of structure, limiting plate 213 is limited by transverse sliding, and heat dissipation hole plate 120 assembly operation is also relatively simple.

[0029] Further, the honeycomb groove 121 is evenly opened in the inside of heat dissipation hole plate 120, and the shape and arrangement of the heat dissipation hole are optimized: the hexagonal honeycomb arrangement improves the heat dissipation performance while ensuring the structural strength of the cabinet.

[0030] In summary, the computer heat dissipation mechanism disclosed in the embodiments of the application is used to slide the limiting blocks 212 along the cavities 210 to the side away from the heat dissipation hole plate 120, so that the positioning balls 214 are pressed, the limiting plates 213 are separated from the clamping grooves 123, the front side of the heat dissipation hole plate 120 is not limited, the heat dissipation hole plate 120 can be quickly disassembled from the outside of the case side plate 110 by clamping the clamping grooves 125 with fingers, the film body 122 mainly prevents large-particle impurities and dust from entering, and plays a dustproof effect, the arc-shaped embedded plates 111 and the arc-shaped embedded grooves 124 are matched, so that the heat dissipation hole plate 120 and the case side plate 110 are completely matched, the flatness and strength of the structure are increased, the limiting plates 213 are limited by transverse sliding, and the heat dissipation hole plate 120 is also relatively simple to assemble and operate.

[0031] Optimize the shape and arrangement of the heat dissipation holes: hexagonal honeycomb arrangement, while ensuring the strength of the case structure, improve the heat dissipation performance. Aluminum has good thermal conductivity, high thermal conductivity, can quickly transfer heat, ensure that the case material has a suitable thickness, both ensure the structural strength, and facilitate heat dissipation.

[0032] The standard parts used in the utility model can be purchased from the market, and the special-shaped parts can be ordered according to the description and the drawings, and the specific connection mode of each part adopts the conventional means such as bolts, rivets and welding in the prior art, the mechanical parts and equipment adopt conventional models in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, which will not be described in detail, and the contents not described in detail in the specification belong to the prior art known to those skilled in the art.

[0033] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A computer heat dissipation mechanism, characterized in that: Comprising The cabinet side plate (110) is internally provided with a rectangular slot, and a heat dissipation hole plate (120) is embedded and clamped in the rectangular slot. Four corners of the rectangular slot are provided with arc-shaped embedded plates (111). Four ends of the heat dissipation hole plate (120) are provided with arc-shaped embedded grooves (124). Four sides of the heat dissipation hole plate (120) are symmetrically provided with clamping grooves (123). Four limiting assemblies (200) are symmetrically distributed on both sides of the rectangular slot of the cabinet side plate (110). The limiting assembly (200) comprises a cavity (210) which is internally provided along the rectangular slot and extends into the cabinet side plate (110). A limiting plate (213) is slidably arranged in the cavity (210). The limiting plate (213) can be inserted into the clamping groove (123).

2. The computer heat dissipation mechanism of claim 1, wherein: The cavity (210) is communicated with a through groove (211) from the front of the cabinet side plate (110). A limiting block (212) is arranged on one side of the limiting plate (213). The limiting block (212) slides in the cavity (210).

3. The computer heat dissipation mechanism of claim 1, wherein: A positioning ball (214) is elastically arranged on one side of the limiting plate (213).

4. The computer heat dissipation mechanism of claim 1, wherein: The heat dissipation hole plate (120) is uniformly provided with a honeycomb groove (121) inside.

5. The computer heat dissipation mechanism of claim 1, wherein: The heat dissipation hole plate (120) is symmetrically provided with a buckle groove (125). A film body (122) is fixedly arranged in the buckle groove (125). The film body (122) is internally provided with a cross groove.

6. The computer heat dissipation mechanism of claim 1, wherein: The thickness of the side of the cabinet side plate (110) is 1.2 mm. The cabinet side plate (110) and the heat dissipation hole plate (120) are made of aluminum profile.

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