LED display system-level packaging structure
By using a control chip with a vertical packaging structure and a double-sided electrode design, combined with a rewiring layer to replace the carrier board, the problem of large space occupation in LED display system-level packaging structures is solved, achieving miniaturization and thickness reduction.
Patent Information
- Application Number
- CN202423323978.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing LED display system-level packaging structures occupy a large space when laid out horizontally, making miniaturization difficult.
By adopting a vertical packaging structure, the control chip is vertically stacked with the LED display structure by replacing the traditional carrier board function with a double-sided electrode design and a rewiring layer, and then encapsulated with insulating material to form a single package.
Miniaturization of LED display system-level packaging structure has been achieved, avoiding excessive space occupation, and the thickness of the packaging structure has been further reduced by using thin control chips and insulating protective materials.
Smart Images
Figure CN223712770U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, especially relate to a LED display system level package structure. BACKGROUND
[0002] For the LED this kind of semiconductor device, the package link is the intermediate link of connecting upstream chip and downstream application, has mechanical protection, electric signal connection, optical parameter control and heat dissipation and other key functions. The quality of the package link directly decides the final optical performance and reliability of LED product.
[0003] In the related art, the LED display system level package structure is arranged horizontally when packaging, and specifically, as shown in the figure, the LED display structure 10 and the control wafer 20 are fixed horizontally on the same carrier plate 30, and then the gold wire 40 is used to connect the LED display structure 10 and the control wafer 20. Figure 1
[0004] In this packaging mode, a large horizontal space is occupied, so that the overall structure is large in size. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a LED display system level package structure, which can be miniaturized as a whole through vertical packaging and avoid occupying too much space.
[0006] To achieve the above utility model purposes, the utility model provides the following technical scheme:
[0007] A LED display system level package structure is provided, which comprises:
[0008] A control wafer, the first surface and the second surface of the control wafer are respectively provided with a first electrode and a second electrode;
[0009] A control wafer layer insulating material, which covers the control wafer;
[0010] A first rewiring layer, which is stacked on the control wafer and the control wafer layer insulating material, and is connected to the first electrode of the first surface of the control wafer;
[0011] An LED display structure, which is stacked on the first rewiring layer, and the first rewiring layer is also connected to the third electrode of the surface of the LED display structure.
[0012] In a possible implementation, the first re-wiring layer comprises: at least one first circuit layer, and insulating material surrounding the at least one first circuit layer.
[0013] The at least one first circuit layer is in contact with the third electrode of the LED display structure close to the one side surface of the control wafer and the first electrode of the first surface of the control wafer respectively.
[0014] In a possible implementation, the second surface of the control wafer is in contact with the second re-wiring layer, and the second surface is a surface arranged opposite to the first surface.
[0015] In a possible implementation, the second re-wiring layer comprises: at least one second circuit layer, and insulating material surrounding the at least one second circuit layer.
[0016] The at least one second circuit layer is in contact with the second electrode of the second surface of the control wafer close to one side of the control wafer.
[0017] In a possible implementation, the at least one second circuit layer is also in contact with the fourth electrode away from one side of the control wafer.
[0018] In a possible implementation, the thickness of the first re-wiring layer is not greater than the thickness of the insulating material of the control wafer layer.
[0019] And / or,
[0020] The thickness of the second re-wiring layer is not greater than the thickness of the insulating material of the control wafer layer.
[0021] In a possible implementation, the LED display structure is wrapped with a surface protection material.
[0022] In a possible implementation, the LED display structure comprises:
[0023] A single LED wafer; or,
[0024] An array of LED wafers; or,
[0025] An LED package.
[0026] Compared with the prior art, the present application has the following beneficial effects:
[0027] The control wafer, the first surface and the second surface of the control wafer are provided with electrodes; the control wafer layer insulation material covers the control wafer; the first re-wiring layer is stacked on the control wafer and the control wafer layer insulation material, and the first re-wiring layer is connected with the electrodes on the first surface of the control wafer; the LED display structure is stacked on the first re-wiring layer, and the first re-wiring layer is also connected with the electrodes on the surface of the LED display structure; the LED display structure and the control wafer are packaged in a packaging body, so that the LED display can be realized by a single packaging body, the whole can be miniaturized by the vertical packaging structure, the large space is avoided, and the control wafer is designed to have electrodes on the double surfaces, so that the thickness of the control wafer is thinner, and the thickness of the packaging structure is further reduced.
[0028] Further, the first re-wiring layer and the second re-wiring layer replace the function of the traditional carrier board, so that the whole is further miniaturized.
[0029] It should be noted that the utility model only needs to realize at least one of the above technical effects. BRIEF DESCRIPTION OF DRAWINGS
[0030] Figure 1 is a structure schematic view of an LED display system-level packaging structure provided in the related art;
[0031] Figure 2 is a structure schematic view of an LED display system-level packaging structure provided in the embodiment of the application;
[0032] Figure 3 is a structure schematic view of another LED display system-level packaging structure provided in the embodiment of the application;
[0033] Figure 4 is a structure schematic view of another LED display system-level packaging structure provided in the embodiment of the application;
[0034] Figure 5 is a method flow chart of a preparation method of an LED display system-level packaging structure provided in the embodiment of the application.
[0035] Marked in the figure: 10-LED display structure, 11-surface protection material, 12-third electrode, 20-control wafer, 21-control wafer layer insulation material, 22-first electrode, 23-second electrode, 30-carrier board, 40-gold wire, 50-first re-wiring layer, 60-second re-wiring layer, 61-fourth electrode. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.
[0037] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "vertical", "upper", "lower", "top", "side", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.
[0038] In the description of the utility model, it should be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected, it can be mechanical connection, or electrical connection, it can be directly connected, or indirectly connected through intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0039] In order to solve the problem that the packaging structure of horizontal mode in the related art affects miniaturization, in the embodiment of the application, a vertical packaging packaging structure is provided, which can make the whole miniaturization and avoid occupying too much space.
[0040] Next, the technical scheme provided by the embodiment of the application will be introduced and described.
[0041] In combination with reference Figures 2 to 4 The embodiment of the application provides an LED display system-level packaging structure, which comprises:
[0042] The control wafer 20 has a first surface and a second surface, and the first surface and the second surface are respectively provided with a first electrode 22 and a second electrode 23. The control wafer layer insulation material 21 is used for covering the control wafer 20. The first re-wiring layer 50 is stacked on the control wafer 20 and the control wafer layer insulation material 21, and the first re-wiring layer 50 is connected to the first electrode 22 of the first surface of the control wafer 20. The LED display structure 10 is stacked on the first re-wiring layer 50, and the first re-wiring layer 50 is further connected to the third electrode 12 of the surface of the LED display structure 10.
[0043] In the present application, the control wafer 20 and the LED display structure 10 form a vertical packaging structure, and the two surfaces of the control wafer 20 are provided with electrodes. Therefore, one of the surfaces of the control wafer 20 (i.e. the first surface) can be connected to the first re-wiring layer 50, and the first re-wiring layer 50 can be further connected to the LED display structure 10, so as to complete the vertical packaging of the control wafer 20 and the LED display structure 10.
[0044] The control wafer layer insulation material 21 is used for insulating and protecting the control wafer 20, and the bottom of the control wafer layer insulation material 21 can be lower than the bottom of the control wafer 20 or flush with the bottom of the control wafer 20. The top of the control wafer layer insulation material 21 can be higher than the top of the control wafer 20 or flush with the top of the control wafer 20. Further, the control wafer layer insulation material 21 can be made of one or more of the following materials: resin, silicone, rubber, silicon dioxide, silicon nitride, and aluminum oxide.
[0045] The first re-wiring layer 50 is arranged between the control wafer 20 and the LED display structure 10, and the first re-wiring layer 50 is used for connecting the electrodes of the LED display structure 10 and the control wafer 20.
[0046] Further, the first re-wiring layer 50 includes at least one first circuit layer and an insulation material surrounding the at least one first circuit layer. The at least one first circuit layer is in contact with the third electrode 12 of the surface of the LED display structure 10 close to the control wafer 20 and the first electrode 22 of the first surface of the control wafer 20. The first re-wiring layer 50 is used for connecting the control wafer 20 and the LED display structure 10.
[0047] Further, the thickness of the first re-wiring layer 50 is not greater than the thickness of the control wafer layer insulation material 21. The thickness of the first re-wiring layer 50 is controlled, so as to avoid the problem of excessive thickness of the overall structure.
[0048] In one possible implementation, the second surface of the control chip 20 is in contact with the second redistribution layer 60, and the second surface is a surface disposed opposite to the first surface.
[0049] like Figures 2 to 4 As shown, the two surfaces of the control chip 20 that are disposed opposite each other have electrodes. The control chip 20 has upper and lower electrodes. Therefore, in addition to the top being connected to the first redistribution layer 50, the bottom of the control chip 20 is provided with a second redistribution layer 60. This second redistribution layer 60 is used to replace the function of the carrier board 30 in the prior art and is connected to the second electrode 23 on the side surface of the control chip 20 away from the LED display structure 10 (i.e., the second surface). This second redistribution layer 60 is located below the control chip 20 and not higher than the control chip 20.
[0050] It is understood that the second electrode 23 on the second surface of the control chip 20 is mainly used to receive or send control signals to realize communication between the control chip 20 and the main control circuit outside the package, or communication between different control chips 20. The first electrode 22 on the first surface of the control chip 20 is mainly used to output power to the LED display structure 10, and can also be used to control the brightness function of the LED display structure 10.
[0051] Furthermore, the second redistribution layer 60 includes at least one second circuit layer and an insulating material surrounding the at least one second circuit layer; the side of the at least one second circuit layer adjacent to the control chip 20 is in contact with the electrodes on the second surface of the control chip 20. Through this second redistribution layer 60, the second electrodes 23 on the second surface of the control chip 20 are electrically connected.
[0052] Furthermore, at least one side of the second wiring layer away from the control chip 20 is in contact with the fourth electrode 61. This fourth electrode 61 can be specifically implemented as a surface mount technology (SMT) electrode, and through this second redistribution layer 60, it can also be used for electrical connection of electrodes in the SMT process.
[0053] Furthermore, the thickness of the second redistribution layer 60 is no greater than the thickness of the insulating material 21 of the control wafer layer. By controlling the thickness of the second redistribution layer 60, the problem of excessive thickness of the overall structure is avoided.
[0054] It can be understood that the first rewiring layer 50 or the second rewiring layer 60 can be prepared by the following method: applying an insulating material on a package or a wafer, making a hole at the electrode, then plating a conductive material on the electrode by electroplating, and then etching the circuit by exposure and development, then applying a conductive material and making a hole, then plating a conductive material on the lower circuit layer by electroplating, and then etching the circuit by exposure and development, and so on, to make a multi-layer circuit. In addition, the hole making process can be performed by development exposure or mask.
[0055] In one possible implementation, the outer periphery of the LED display structure 10 is wrapped with a surface protection material 11.
[0056] The surface protection material 11 is used for insulating protection of the LED display structure 10 and for optical function, which can be transparent or colored protection material, the bottom of which can be lower than or flush with the bottom of the LED display structure 10, and the top of which can be higher than or flush with the top of the LED display structure 10. Further, the surface protection material 11 can specifically use one or more of epoxy resin, silicone, polyurethane glue, acrylic glue, polyvinyl chloride glue, etc.
[0057] For example, referring to Figure 2 The LED display structure 10 can be an LED wafer array.
[0058] For example, referring to Figure 3 The LED display structure 10 can be a single LED wafer.
[0059] For example, referring to Figure 4 The LED display structure 10 can be an LED package.
[0060] In summary, the technical scheme provided by the embodiment of the present application, the LED display system-level packaging structure comprises: a control wafer, the first surface and the second surface of the control wafer are provided with electrodes; a control wafer layer insulating material, the control wafer layer insulating material covers the control wafer; a first re-wiring layer, the first re-wiring layer is stacked on the control wafer and the control wafer layer insulating material, and the first re-wiring layer is connected to the electrodes on the first surface of the control wafer; an LED display structure, the LED display structure is stacked on the first re-wiring layer, and the first re-wiring layer is also connected to the electrodes on the surface of the LED display structure; the LED display structure and the control wafer are packaged in a package body, the display of the LED can be realized in a single package body, the whole can be miniaturized through the vertical packaging structure, the occupation of a large space is avoided, and the control wafer is designed to have electrodes on the double surfaces, so that the thickness of the control wafer is relatively thin, and the thickness of the packaging structure is further reduced.
[0061] Further, on the basis of the above structure, the present application further provides a preparation method of an LED display system-level packaging structure, as shown in Figure 5 The method comprises the following steps:
[0062] S1: preparing a control wafer, the first surface and the second surface of the control wafer are respectively provided with first electrodes and second electrodes.
[0063] The first surface and the second surface can be two surfaces arranged opposite to each other, that is, the upper and lower surfaces of the control wafer are both provided with electrode structures.
[0064] S2: preparing a control wafer layer insulating material for wrapping the control wafer around the outer periphery of the control wafer.
[0065] The control wafer is insulated and protected by the prepared control wafer layer insulating material.
[0066] S3: preparing a first re-wiring layer on the first surface of the control wafer and the surface on the same side of the first surface of the control wafer layer insulating material, and the first re-wiring layer is in electrical contact with the control wafer.
[0067] A re-wiring layer (that is, the first re-wiring layer) is applied on the same side surface of the control wafer and the control wafer layer insulating material to connect the control wafer.
[0068] In a possible implementation, before the first re-wiring layer is prepared, the following step is further included: preparing a second re-wiring layer on the second surface of the control wafer and the surface on the same side of the second surface of the control wafer layer insulating material, and the second re-wiring layer is in electrical contact with the control wafer.
[0069] On the other side surface of the control wafer and the control wafer layer insulating material, a rewiring layer (i.e., a second rewiring layer) is prepared to connect the control wafer and serve as an electrode for the underlying component.
[0070] S4: An LED display structure is prepared on the first rewiring layer, and the LED display structure is in electrical contact with the first rewiring layer.
[0071] The LED display structure is prepared on the other side surface of the first rewiring layer away from the control wafer. The LED display structure is not limited to a single LED wafer or an LED wafer array or an LED package.
[0072] For example, the first rewiring layer and the LED display structure can be connected through a solder pad, so that the LED display structure is arranged on the first rewiring layer, and the first rewiring layer and the LED display structure are in electrical contact.
[0073] In a possible implementation, after the LED display structure is prepared, a step of preparing a surface protection material wrapping the LED display structure around the outer periphery of the LED display structure is further included. The surface protection material is prepared to insulate and protect the LED display structure and to achieve an optical function.
[0074] In summary, the technical scheme provided by the embodiments of the present application includes the following steps: a control wafer is prepared, the first surface and the second surface of the control wafer are provided with electrodes; a control wafer layer insulating material wrapping the control wafer is prepared around the outer periphery of the control wafer; a first rewiring layer is prepared on the first surface of the control wafer and the surface of the control wafer layer insulating material on the same side as the first surface, the first rewiring layer is in electrical contact with the control wafer; an LED display structure is prepared on the first rewiring layer, the LED display structure is in electrical contact with the first rewiring layer; and the LED display structure and the control wafer are jointly encapsulated in a package, so that the LED display can be realized in a single package, the overall miniaturization can be achieved through the vertical encapsulation structure, the occupation of a large space is avoided, and the control wafer is designed to have electrodes on both surfaces, and the thickness of the control wafer is relatively thin, so that the thickness of the encapsulation structure is further reduced.
[0075] All the optional technical schemes described above can be combined to form optional embodiments of the present application, that is, any number of embodiments can be combined to meet the needs of different application scenarios, which are all within the protection scope of the present application and will not be described one by one here.
[0076] It should be noted that the above only the preferred embodiments of the present application, and not to limit the present application, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of protection of the present application.
Claims
1. An LED display system-in-package structure, characterized in that, The LED display system-in-package structure comprises: a control wafer, a first surface and a second surface of the control wafer are respectively provided with a first electrode and a second electrode; a control wafer layer insulating material, the control wafer layer insulating material covers the control wafer; a first re-wiring layer, the first re-wiring layer is stacked on the control wafer and the control wafer layer insulating material, and the first re-wiring layer is connected to the first electrode on the first surface of the control wafer; an LED display structure, the LED display structure is stacked on the first re-wiring layer, and the first re-wiring layer is also connected to a third electrode on a surface of the LED display structure.
2. The package structure according to claim 1, wherein: the first re-wiring layer comprises at least one first circuit layer and an insulating material surrounding the at least one first circuit layer; the at least one first circuit layer is respectively in contact with the third electrode on the surface of the LED display structure close to the control wafer and the first electrode on the first surface of the control wafer.
3. The package structure according to claim 1, wherein: the second surface of the control wafer is in contact with a second re-wiring layer, and the second surface is a surface opposite to the first surface.
4. The package structure according to claim 3, wherein: the second re-wiring layer comprises at least one second circuit layer and an insulating material surrounding the at least one second circuit layer; the at least one second circuit layer is in contact with the second electrode on the second surface of the control wafer close to one side of the control wafer.
5. The package structure according to claim 4, wherein: the at least one second circuit layer is also in contact with a fourth electrode away from the control wafer.
6. The package structure according to claim 3, wherein: a thickness of the first re-wiring layer is not greater than a thickness of the control wafer layer insulating material; and / or a thickness of the second re-wiring layer is not greater than a thickness of the control wafer layer insulating material.
7. The package structure according to claim 1, wherein: a surface protection material is wrapped around an outer periphery of the LED display structure. The LED display structure comprises:
8. The package structure of claim 1, wherein, a single LED wafer; or an array of LED wafers; or an LED package.