Vehicle-mounted chip heat dissipation device

Abstract

The utility model discloses a vehicle-mounted chip heat dissipation device which is characterized in that the vehicle-mounted chip heat dissipation device comprises a middle frame used for installing a PCB provided with chip components, the PCB is arranged in the middle frame, a heat dissipation fan is arranged on the middle frame, the axis of the heat dissipation fan is parallel to the PCB, and airflow blown out by the heat dissipation fan flows from one end of the PCB to the other end of the PCB. According to the vehicle-mounted chip heat dissipation device, the position relation between the heat dissipation fan and the PCBs to be subjected to heat dissipation is changed, so that one heat dissipation fan can conduct heat dissipation on the PCBs, and the heat dissipation effect is good.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of air cooling heat dissipation, especially to a vehicle-mounted chip heat dissipation device. BACKGROUND

[0002] With the rapid development and continuous progress of the automobile industry, and in order to improve the competitiveness of products, the major automobile manufacturers have more and more functional requirements for automobile electronic products, and the more functions and the more complex, the higher the corresponding automobile host chip computing power, followed by the gradually increasing power consumption and heat of components, so the heat dissipation requirement of the host itself is also improved. The better heat dissipation method commonly used in the host at present is to use a fan to dissipate heat, that is, to assemble a fan on the heat-conducting medium + metal heat sink to actively dissipate heat. This heat dissipation method has good heat dissipation effect because it actively dissipates heat through the fan, but dust and other debris are easily accumulated on the heat dissipation fan during long-term operation of the heat dissipation fan, affecting the heat dissipation effect. Generally, the fan needs to be disassembled and cleaned before being reinstalled. In the prior art, the heat dissipation fan is installed inside the heat dissipation device, and at the same time, due to the small overall structure of the heat dissipation device and the compact installation of the components, it is difficult to disassemble the heat dissipation fan, and professional tools are generally required to assist in disassembly, which affects the maintenance efficiency of the fan. SUMMARY

[0003] In order to overcome at least one of the defects of the prior art described above, the utility model provides a vehicle-mounted chip heat dissipation device, which changes the positional relationship between the heat dissipation fan and the PCB to be cooled, so that the airflow blown by the heat dissipation fan flows from one end of the PCB to the other end, the heat dissipation is uniform, and the heat dissipation effect is good. In addition, the heat dissipation fan is installed in the installation slot in an inserted manner, which is convenient for maintenance of the heat dissipation fan and further ensures the heat dissipation effect and efficiency of the heat dissipation fan.

[0004] The utility model employs the technical scheme that:

[0005] A vehicle-mounted chip heat dissipation device, comprising a middle frame for mounting a PCB provided with chip components, the PCB being arranged in the middle frame, a heat dissipation fan being arranged on the middle frame, the axis of the heat dissipation fan being parallel to the PCB, the airflow blown by the heat dissipation fan flowing from one end of the PCB to the other end.

[0006] An installation part for mounting the heat dissipation fan is arranged on the middle frame, and the heat dissipation fan is inserted and mounted with the installation part.

[0007] Further, the PCB is provided with at least two pieces, each PCB being arranged in a stacked manner in the middle frame, the axis of the heat dissipation fan being parallel to each PCB, the airflow blown by the heat dissipation fan passing through each PCB at the same time and flowing from one end of the PCB to the opposite end, and the chip components on the PCB being cooled.

[0008] Further, the outer diameter of the fan face of the heat dissipation fan is not less than the height of the stacked PCBs.

[0009] Further, a gap is provided between the adjacent two PCBs.

[0010] Further, a heat conducting medium is further provided on the PCB, and the heat conducting medium is close to the chip component and the middle frame.

[0011] Further, the mounting portion is a mounting groove, the mounting groove has a groove opening facing the PCB, the heat dissipation fan is inserted into the mounting groove through the groove opening, the surface of the mounting groove is hollow, the fan face of the heat dissipation fan placed in the mounting groove faces the hollow surface of the mounting groove, and the axis of the fan face of the heat dissipation fan is parallel to the PCB.

[0012] Further, the middle frame is provided with a first heat dissipation hole and a second heat dissipation hole, the first heat dissipation hole and the second heat dissipation hole are provided on a set of opposite sides of the middle frame, the heat dissipation fan is provided at the position of the first heat dissipation hole or the position of the second heat dissipation hole, and the fan face faces the second heat dissipation hole or the first heat dissipation hole.

[0013] Further, the heat dissipation fan is externally sleeved with a rubber sleeve, the rubber sleeve is adapted to the mounting portion and is placed in the mounting portion, and is fixed by the middle frame and the PCB.

[0014] The outer side surface of the rubber sleeve is provided with elastic bones, positioning bones and positioning holes;

[0015] The elastic bones are provided in two groups and are respectively located on a set of opposite outer side surfaces of the rubber sleeve facing the middle frame and the PCB, after the rubber sleeve is placed in the mounting portion, the two groups of elastic bones are respectively in contact with and are pressed by the middle frame and the PCB;

[0016] The positioning bones and the positioning holes are respectively provided on the other set of outer side surfaces of the rubber sleeve, the mounting portion is provided with a limiting column and a limiting groove, after the rubber sleeve is mounted in the mounting portion, the limiting column is inserted into the positioning hole, and the positioning bone is placed in the limiting groove.

[0017] Further, the middle frame is made of metal, and the middle frame is provided with a heat dissipation fin and a top cover at the top, and the top cover is placed above the heat dissipation fin.

[0018] In summary, the vehicle-mounted chip heat dissipation device has the following technical effects:

[0019] 1. In the setting of the heat dissipation fan, by adopting the installation mode that the heat dissipation fan axis is parallel to the PCB board, the airflow blown by the heat dissipation fan flows from one end of the PCB board to the other end, and the whole PCB board surface can be cooled.

[0020] 2. The mounting part for mounting the heat dissipation fan is arranged on the middle frame, the heat dissipation fan is inserted and mounted with the mounting part, the heat dissipation fan is convenient to mount and dismount, the heat dissipation fan is convenient to maintain, and the heat dissipation effect of the heat dissipation fan in operation is further ensured. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is an exploded view of one embodiment of the utility model of a vehicle-mounted chip heat dissipation device.

[0022] Figure 2 It is a structural schematic view of one embodiment of the utility model of a vehicle-mounted chip heat dissipation device.

[0023] Figure 3 Position Figure 2 Rear view.

[0024] Figure 4 It is a structural schematic view of the middle frame without the top cover, Figure 2

[0025] Figure 5 It is a structural schematic view of the middle frame.

[0026] Figure 6 It is a bottom view of the middle frame.

[0027] Figure 7 It is a structural schematic view of the rubber sleeve.

[0028] Among them, the meaning of the reference signs is as follows:

[0029] 1, top cover; 2, heat dissipation fin; 3, second heat dissipation hole; 4, first heat dissipation hole; 5, heat dissipation fan; 6, rubber sleeve; 7, connector; 8, heat conducting medium; 9, PCB board one; 10, bottom cover; 11, chip component; 12, PCB board two; 13, middle frame; 14, elastic rib; 15, positioning rib; 16, fan outlet hole; 17, positioning hole; 18, mounting groove; 19, limiting column; 20, limiting groove. DETAILED DESCRIPTION

[0030] In order to better understand and implement, the technical scheme in the embodiment of the utility model will be clearly and completely described below by combining the drawings in the embodiment of the utility model.

[0031] ​In the description of the utility model, it is necessary to explain that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown based on the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model.

[0033] Referring to Figure 1 The utility model discloses a vehicle chip heat abstractor, and the heat dissipation fan can heat the larger PCB board or multiple PCB boards simultaneously, is even in heat dissipation, and the heat dissipation effect is good.

[0034] As Figure 1 The utility model discloses a vehicle chip heat abstractor, and the heat dissipation fan can heat the larger PCB board or multiple PCB boards simultaneously, is even in heat dissipation, and the heat dissipation effect is good.

[0035] Based on the above scheme, when the heat dissipation fan is arranged, the heat dissipation fan is installed in parallel with the PCB board, so that the airflow blown by the heat dissipation fan flows from one end of the PCB board to the other end, and the entire PCB board can be cooled.

[0036] The heat dissipation mode of the above scheme can use a smaller heat dissipation fan to cool the larger area PCB board. The heat dissipation mode of the above scheme can effectively reduce the distance between the heat dissipation fan and the PCB board, not only reducing the height of the entire heat dissipation device, but also reducing the volume of the entire heat dissipation device. The heat dissipation mode of the above scheme can evenly cool the entire PCB board.

[0037] The heat dissipation fan is installed on the side of the middle frame, and the problem that foreign matters directly enter the fan to cause the heat dissipation fan to fail due to the exposure of the heat dissipation fan is well solved. In the technical scheme, the heat dissipation fan is installed on the side of the middle frame, and then the middle frame is installed in the vehicle body. At this time, the fan on the side of the middle frame is blocked by some products due to the assembly of the middle frame in the vehicle body. Thus, the noise generated by the operation of the heat dissipation fan is trapped in the vehicle body, the noise in the interior space of the vehicle compartment is reduced, the problem that the heat dissipation fan is loud and the noise is transmitted to the vehicle compartment in the prior art is improved, and the comfort in the vehicle compartment is improved.

[0038] As shown in Figure 4 and Figure 6 , the middle frame is provided with a mounting portion for mounting the heat dissipation fan, and the heat dissipation fan is inserted and mounted with the mounting portion. The heat dissipation fan and the mounting portion on the middle frame are inserted and mounted, which is convenient to operate, facilitates the mounting and dismounting of the heat dissipation fan, facilitates the maintenance and cleaning of the heat dissipation fan in time, ensures that the heat dissipation fan is in a good working state, and further ensures the heat dissipation effect of the heat dissipation fan.

[0039] As shown in Figure 1 , the PCB board is provided with at least two pieces, such as Figure 1 PCB board one 9 and PCB board two 12. Of course, more pieces of PCB boards can also be provided here, not limited to two pieces, Figure 1 only one embodiment is given.

[0040] As shown in Figure 1 , in the middle frame, each PCB board is arranged in a stacked manner in the middle frame 13, the axis of the heat dissipation fan 5 is parallel to each PCB board, the airflow blown by the heat dissipation fan 5 passes through each PCB board at the same time, and the airflow passes through from one end of the PCB board to the opposite end, and the chip components 11 on the PCB board are cooled.

[0041] In the scheme, along the airflow direction generated by the heat dissipation fan, the airflow blown by the heat dissipation fan 5 passes through each PCB board at the same time, and the airflow passes through from one end of the PCB board to the opposite end, and the chip components 11 on the PCB board are cooled.

[0042] The various PCBs are arranged in a stacked manner, so that a cooling fan can cool the various PCBs, ensuring that the air flow directly blows on each PCB and cools it. In the cooling process, the air flow blown by the cooling fan 5 passes through each PCB at the same time, from one end of the PCB to the opposite end, and cools the chip components 11 on the PCB. It is worth noting that "the air flow blown by the cooling fan 5 passes through each PCB at the same time" means that each PCB can obtain the air flow directly blown by the cooling fan, and the air flow does not need to pass through one PCB and then another PCB. Of course, in actual work, due to different installation positions, the air flow reaching each PCB may not be completely time-synchronized, but the time difference is very small and can be ignored, and the time difference does not affect the cooling efficiency and effect of each PCB.

[0043] In addition, in the present scheme, by arranging the various PCBs in a stacked manner, the number of PCBs can be increased, and the cooling effect of each PCB can be ensured, so that more chip components 11 can be installed on each PCB, avoiding the situation that when there are many chip components 11, all the chip components 11 are installed on one PCB to achieve cooling, which not only affects the cooling effect, but also is not conducive to the layout and installation of chip components 11 on the PCB. In the present scheme, more chip components 11 are installed on different PCBs, which facilitates the layout and installation of chip components 11, and when a chip component 11 on a PCB fails, the PCB can be directly replaced, which speeds up the maintenance efficiency and reduces the cost.

[0044] In the present technical solution, the outer diameter of the fan face of the cooling fan 5 is not less than the height of the stacked PCBs in the middle frame 13, so that in the thickness direction of the PCB, multiple PCBs can be installed in the cooling device of the present scheme, and the air flow blown by the cooling fan can enter each PCB to cool it. The present scheme is arranged to ensure cooling of each PCB while minimizing the overall volume of the cooling device.

[0045] In the present technical solution, there is a gap between the two adjacent PCBs, which ensures that the air flow generated by the cooling fan can enter the surface of each PCB to cool the chip components 11 on the PCB. In addition, the appropriate gap between the two adjacent PCBs also facilitates the installation of chip components 11 on the PCB.

[0046] In the technical solution, the PCB is further provided with a heat-conducting medium 8, which is arranged close to the chip component 11 and the middle frame. The heat-conducting medium is arranged to transfer the heat on the chip component 11 to the middle frame, the airflow generated by the cooling fan passes through the middle frame and carries the heat out of the middle frame, thereby cooling the chip component 11. The arrangement of the heat-conducting medium enables efficient cooling of the chip component 11, especially the heat inside the chip component 11 is conducted out and carried away by the airflow, thereby improving the cooling effect of the chip component 11. In addition, the arrangement of the heat-conducting medium enables the heat on the chip component 11 to be evenly transferred to the middle frame, and then the airflow generated by the cooling fan passes through the middle frame to cool the middle frame, thereby achieving rapid and efficient cooling. The heat is continuously transferred between the chip component 11 and the middle frame, thereby cooling the chip component 11.

[0047] In addition, during assembly, the middle frame is in direct contact with the top cover, thereby enabling the heat to be directly transferred to the top cover and enabling the middle frame to dissipate part of the heat to the outside through the top cover.

[0048] In the technical solution, the middle frame 13 is provided with a first cooling hole 4 and a second cooling hole 3, the first cooling hole 4 and the second cooling hole 3 are arranged on a pair of opposite outer sides of the middle frame 13, the cooling fan is arranged at the position of the first cooling hole 4 or the second cooling hole 3, and the fan surface of the cooling fan faces the second cooling hole 3 or the first cooling hole 4. Figure 5 As shown in the middle, the first cooling hole 4 is arranged as the installation position of the cooling fan 5, the cooling fan is installed on the side of the first cooling hole 4, and the fan surface of the cooling fan faces the second cooling hole 3. When the cooling fan works, the cooling fan inhales the external airflow from the first cooling hole 4 and blows it out, the airflow blown out by the cooling fan passes through each PCB and is blown out at the position of the second cooling hole 3, thereby forming an airflow convection. The second cooling hole 3 is an internal cooling hole of the middle frame, and the first cooling hole 4 is a self-cooling hole of the cooling fan.

[0049] Further, a filtering structure such as filter cotton can be arranged at the position of the second cooling hole 3 to filter the air entering the middle frame, thereby filtering out the dust and water vapor in the air, protecting the PCBs in the middle frame, avoiding pollution or corrosion of the PCBs and the chip components 11 on the PCBs, reducing the failure rate of the chip components 11, and prolonging the service life of the chip components 11.

[0050] In the technical solution, the mounting portion is a mounting groove 18, the mounting groove 18 has a groove opening facing the PCB, and the cooling fan is inserted into the mounting groove through the groove opening.

[0051] The surface of the mounting groove 18 is hollowed, the fan surface of the heat dissipation fan placed in the mounting groove faces the hollowed surface of the mounting groove, and the fan surface axis of the heat dissipation fan is parallel to the PCB plate.

[0052] In order to facilitate the installation of the heat dissipation fan in the mounting groove 18, or to facilitate the installation of the heat dissipation fan in the mounting groove 18, the slot of the mounting groove 18 faces the PCB plate, so that when the heat dissipation fan is installed or removed, the PCB plate is removed to insert the heat dissipation fan into the slot or pull it out of the slot. In the installation of the heat dissipation fan, no external auxiliary tool is needed, the installation is convenient and fast, the heat dissipation fan can be maintained and cleaned in time, the heat dissipation fan is ensured to be in a good working state, and the heat dissipation function and effect of the heat dissipation fan are ensured.

[0053] In the technical solution, the heat dissipation fan is externally sleeved with a rubber sleeve 6, the rubber sleeve 6 is adapted to the mounting groove 18 and placed in the mounting groove, and fixed by the middle frame and the PCB plate. When the heat dissipation fan is installed, the rubber sleeve 6 is first sleeved on the outside of the heat dissipation fan, and then the heat dissipation fan and the rubber sleeve are inserted into the mounting groove together. The fixing of the rubber sleeve and the heat dissipation fan in the mounting groove, especially in the depth direction of the mounting groove, is mainly fixed by the middle frame and the PCB plate, that is, the rubber sleeve is placed between the middle frame and the PCB plate, and after the PCB plate and the middle frame are fixed, the rubber sleeve and the heat dissipation fan are also fixed.

[0054] The rubber sleeve is sleeved on the outside of the heat dissipation fan, the flexibility and buffering performance of the rubber sleeve are utilized to absorb and isolate the vibration generated during the operation of the fan, avoid the vibration generated during the operation of the heat dissipation fan being directly transmitted to the middle frame and the PCB plate, avoid causing the vibration of the middle frame, further avoid causing the vibration of the PCB plate, prolong the service life of the PCB plate and the chip components 11 on the PCB plate, and reduce the failure rate of the chip components 11.

[0055] In addition, the heat dissipation fan is installed on the middle frame by the rubber sleeve, the vibration of the middle frame is reduced, that is, the noise of the whole middle frame during operation is reduced, and the abnormal sound generated by the direct contact between the fan and the middle frame is avoided.

[0056] In the technical solution, the outer side of the rubber sleeve 6 is provided with elastic bones 14, positioning bones 15 and positioning holes 17. Figure 7 As shown in the drawings, the elastic bones 14 are provided with two groups, and are respectively located on the opposite outer sides of the rubber sleeve 6 facing the middle frame 13 and the PCB plate. After the rubber sleeve is placed in the mounting groove, the two groups of elastic bones are in contact with and pressed by the middle frame and the PCB plate respectively. By contacting and pressing the elastic bones by the middle frame and the PCB plate, reliable installation of the rubber sleeve is realized, and further reliable installation of the heat dissipation fan is realized.

[0057] Based on the above scheme, the fan is installed through the rubber sleeve, and the assembly is simple, the occupied space is small, the rubber sleeve is light in weight, and the overall miniaturization and light weight of the heat dissipation device are facilitated.

[0058] Based on the above scheme, the middle frame and the PCB board are in contact with and extrude the elastic bones, further making the rubber sleeve tightly wrapped outside the heat dissipation fan, and realizing stable installation of the fan.

[0059] The positioning bones and the positioning holes are respectively arranged on the other group of outer side surfaces of the rubber sleeve, as shown in Figure 7 The mounting groove 18 is provided with a limiting column 19 and a limiting groove 20, as shown in Figure 6 After the rubber sleeve 6 is installed in the mounting groove 18, the limiting column 19 is inserted into the positioning hole 17, and the positioning bone 15 is placed in the limiting groove 20.

[0060] In the technical scheme, the positioning bone 15 and the positioning hole 17 realize positioning of the installation of the rubber sleeve, avoid misinstallation of the rubber sleeve, and also facilitate quick installation of the rubber sleeve and the heat dissipation fan.

[0061] The fan wire hole 16 is further arranged on the rubber sleeve, the wire connected with the heat dissipation fan is passed through the fan wire hole 16, and the installation of the rubber sleeve and the heat dissipation fan is facilitated.

[0062] In the technical scheme, the middle frame 13 is made of metal, and the middle frame 13 is provided with the heat dissipation fins 2 and the top cover 1 at the top, and the top cover 1 is placed above the heat dissipation fins 2. The heat on the PCB board is transferred to the heat dissipation fins 2 or the bottom cover 10, and then transferred outward through the top cover 1 and the bottom cover 10, so that the heat dissipation effect is increased. In the scheme, the heat dissipation fins are arranged in a bullet head type, the wind resistance is reduced, and the heat dissipation efficiency is improved.

[0063] Figure 2 In the technical scheme, the connector 7 is used for realizing communication connection or electrical conduction between the on-board chip and external equipment, in Figure 1 In order to make the internal structure exploded in Figure 1 more clearly observed, Figure 1 The connector 7 is omitted in the exploded view.

[0064] The technical means disclosed in the technical scheme of the utility model is not limited to the technical means disclosed in the above-mentioned embodiments, and also includes the technical scheme composed of any combination of the above technical features. It should be noted that, for ordinary skilled persons in the technical field, without departing from the principle of the utility model, a number of improvements and refinements can be made, and these improvements and refinements are also considered to be within the protection scope of the utility model.

Claims

1. A vehicle-mounted chip heat dissipation device, characterized in that: The application relates to a middle frame for mounting a PCB board provided with chip components, wherein the PCB board is arranged in the middle frame, a heat dissipation fan is arranged on the middle frame, the axis of the heat dissipation fan is parallel to the PCB board, and the airflow blown by the heat dissipation fan flows from one end of the PCB board to the other end. An installation part for installing the heat dissipation fan is arranged on the middle frame, and the heat dissipation fan is inserted and installed with the installation part.

2. The on-vehicle chip heat dissipation device according to claim 1, characterized by: The PCB board is provided with at least two PCB boards, each of which is arranged in a laminated manner in the middle frame, the axis of the heat dissipation fan is parallel to each of the PCB boards, the airflow blown by the heat dissipation fan simultaneously passes through each of the PCB boards, and the airflow flows from one end of the PCB board to the opposite end, and the chip components on the PCB board are cooled.

3. The on-board chip cooling device of claim 2, wherein: The outer diameter of the fan surface of the heat dissipation fan is not less than the height of the laminated PCB boards in the middle frame.

4. The on-board chip heat dissipation device according to claim 2, characterized in that: There is a gap between the adjacent two PCB boards.

5. The on-board chip heat dissipation device of claim 1, wherein: A heat conduction medium is further arranged on the PCB board, and the heat conduction medium is arranged close to the chip components and the middle frame.

6. The on-board chip heat dissipation device of claim 1, wherein: The installation part is an installation groove, the installation groove has a groove opening facing the PCB board, the heat dissipation fan is inserted into the installation groove through the groove opening, the surface of the installation groove is hollow, the fan surface of the heat dissipation fan arranged in the installation groove faces the hollow surface of the installation groove, and the axis of the fan surface of the heat dissipation fan is parallel to the PCB board.

7. The on-board chip cooling device according to claim 1 or 2 or 6, characterized in that: First and second heat dissipation holes are arranged on the middle frame, the first and second heat dissipation holes are arranged on a set of opposite sides of the middle frame, the heat dissipation fan is arranged at the position of the first heat dissipation hole or the position of the second heat dissipation hole, and the fan surface faces the second heat dissipation hole or the first heat dissipation hole.

8. The on-board chip cooling device of claim 7, wherein: An adhesive sleeve is arranged outside the heat dissipation fan, the adhesive sleeve is adapted to the installation part and arranged in the installation part, and the adhesive sleeve is fixed by the middle frame and the PCB board.

9. The on-board chip cooling device of claim 8, wherein: Elastic ribs, positioning ribs and positioning holes are arranged on the outer side surface of the adhesive sleeve. Two sets of elastic ribs are arranged on a set of opposite outer side surfaces of the adhesive sleeve facing the middle frame and the PCB board, respectively, and the two sets of elastic ribs are in contact with and pressed by the middle frame and the PCB board after the adhesive sleeve is arranged in the installation part. The positioning ribs and the positioning holes are arranged on the other set of outer side surfaces of the adhesive sleeve, respectively, a limiting column and a limiting groove are arranged in the installation part, and the limiting column is inserted into the positioning hole and the positioning rib is arranged in the limiting groove after the adhesive sleeve is arranged in the installation part.

10. The on-board chip heat dissipation device of claim 1, wherein: The middle frame is made of metal, and the top of the middle frame is provided with a heat dissipation fin and a top cover, and the top cover is arranged above the heat dissipation fin.

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