Baking device used in wafer packaging
By designing a wafer packaging baking device with a circulating airflow system, the problem of high energy consumption in existing devices has been solved, achieving low-power heating and saving energy.
Patent Information
- Application Number
- CN202520117935.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-18
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-18
AI Technical Summary
Existing wafer packaging baking equipment has high energy consumption because it requires a continuous supply of fresh air for heating, resulting in high power heating requirements.
Design a baking device that employs a heating chamber and a baking room circulating airflow system. The circulating air is heated by a heating wire and forms a vertical hot airflow through the blow-out and exhaust vents, reducing the introduction of fresh air and lowering the power requirement of the heating wire.
It achieves low-power temperature maintenance, reduces energy consumption, and saves energy.
Smart Images
Figure CN223720438U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer production technical field, concretely relate to a kind of baking device used in wafer packaging. BACKGROUND
[0002] Wafer needs to print text and pattern information on packaging shell after being packaged, usually white ink printing, and needs to wait for ink drying before detection and packaging process. In order to speed up work efficiency and reduce online waiting, wafer is usually sent into oven to dry ink quickly, and hot air blowing is used to improve drying speed. However, the oven in the prior art is always heated by sucking air from the environment and blowing it to the wafer, and then discharging hot air. This method needs to continuously suck new air, so it needs to maintain high power heating, which consumes a lot of energy. SUMMARY
[0003] In order to solve the above problems in the prior art, the utility model provides a kind of baking device used in wafer packaging.
[0004] In order to achieve the above technical effects, the utility model adopts the following scheme:
[0005] A kind of baking device used in wafer packaging, comprising a body, the upper end of the body is provided with an oven, the upper end of the body is also hingedly provided with a cover that covers the oven, a removable tray is provided in the oven, the tray is provided with a plurality of placement openings matched with wafers and a plurality of vertical hollow holes, and the tray is spaced apart from the bottom of the oven.
[0006] A heating chamber is provided in the cover, a heating wire is provided in the heating chamber, the heating chamber is in communication with the oven, an air inlet is provided in the upper end of the cover and communicates with the heating chamber, an exhaust chamber is provided in the body and communicates with the oven, a fan box is connected to the exhaust chamber, a fan assembly is provided in the fan box, the fan box communicates with an air outlet provided outside the body, and the air outlet and the air inlet are connected by a hose.
[0007] In the preferred technical solution, the air inlet is arranged at the center of the heating chamber, the heating chamber communicates with the oven through a plurality of air blowing holes, the air blowing holes are located above the oven, and the oven communicates with the exhaust chamber through a plurality of exhaust holes, and the exhaust holes are arranged at the bottom of the oven.
[0008] In the preferred technical solution, the diameter of the air blowing holes gradually increases from the center to the periphery.
[0009] In the preferred technical solution, a heat insulation layer is provided on the inner wall of the heating chamber, and the heat insulation layer comprises a heat insulation cotton layer.
[0010] Preferably, the inner wall of the baking chamber is provided with a support table, and the carrier plate is placed on the support table and is spaced from the bottom of the baking chamber.
[0011] Preferably, the carrier plate is provided with a handle on both sides.
[0012] Compared with the prior art, the beneficial effects are:
[0013] The utility model discloses simple structure, convenient to use, the carrier plate of loading wafer is put into the baking chamber, still upper machine cover, start fan assembly, and the baking chamber, exhaust cavity, fan case and heating cavity are connected and become a circulating air flow loop, and the temperature of circulating air is heated to the set temperature by heating wire, and since the cold air is not added, so the heating wire only needs the low power of maintaining temperature, reduces the energy consumption, and saves the energy. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is the cross section schematic drawing of the hot baking state of the utility model.
[0015] Figure 2 It is the cross section schematic drawing of the machine cover opening state in the utility model.
[0016] Reference signs: 1, machine body;2, baking chamber;3, machine cover;4, support table;5, carrier plate;6, placing opening;7, hollow hole;8, handle;9, heating cavity;10, heating wire;11, blowing hole;12, air inlet;13, exhaust cavity;14, exhaust hole;15, fan case;16, fan assembly;17, air outlet. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.
[0018] A baking apparatus for wafer packaging includes a body 1, with a downward-facing baking chamber 2 at the upper end of the body 1. A cover 3, hinged to the upper end of the body 1, covers the baking chamber 2. A removable tray 5 is located inside the baking chamber 2. The tray 5 has several placement openings 6 that match the wafers and several vertical perforations 7. The tray 5 is spaced apart from the bottom of the baking chamber 2. A heating chamber 9 is located inside the cover 3, containing a heating wire 10. The heating chamber 9 is connected to the baking chamber 2. An air inlet 12, connected to the heating chamber 9, is located at the upper end of the cover 3. An exhaust chamber 13, connected to the baking chamber 2, is located inside the body 1. A fan housing 15 is connected to the exhaust chamber 13, containing a fan assembly 16. The fan housing 15 is connected to an air outlet 17 located outside the body 1. The air outlet 17 and the air inlet 12 are connected via a flexible hose.
[0019] After placing the wafer-containing tray 5 into the baking chamber 2, the cover 3 is put back on, and the fan assembly 16 is turned on. The baking chamber 2, the exhaust chamber 13, the fan box 15, and the heating chamber 9 are connected to form a circulating airflow loop. After the heating wire 10 heats the circulating air to the set temperature, since no cold air is added, the heating wire 10 only needs to maintain the temperature with low power, which reduces energy consumption and saves energy.
[0020] In a preferred embodiment, the air inlet 12 is positioned at the center of the heating chamber 9, the heating chamber 9 is connected to the baking chamber 2 through a plurality of air blowing holes 11, the air blowing holes 11 are located above the baking chamber 2, the baking chamber 2 is connected to the exhaust chamber 13 through a plurality of exhaust holes 14, and the plurality of exhaust holes 14 are located at the bottom of the baking chamber 2.
[0021] Hot air is blown in from the top of the baking chamber 2 and discharged from the bottom of the baking chamber 2, thus forming a hot air flow that passes vertically through the carrier tray 5, which can blow hot air directly onto the surface of the wafer for drying.
[0022] In a preferred embodiment, the diameter of a plurality of air holes 11 gradually increases from the air hole 11 located in the center toward the air holes 11 on all sides.
[0023] Since the air inlet 12 corresponds to the center of the heating chamber 9, the air intake is mainly concentrated in the middle of the heating chamber 9 and gradually decreases towards the surrounding area. Therefore, the diameter of the air outlet 11 gradually increases from the center to the surrounding area, which can balance the airflow in various places and make the hot air in the baking chamber 2 as even as possible.
[0024] In a preferred embodiment, a heat insulation layer is provided on the inner wall of the heating chamber 9, and the heat insulation layer includes a heat insulation cotton layer. The heat insulation cotton is a prior art material, and it is adhered to the inner wall of the heating chamber 9 by adhesive.
[0025] The heat of the heating cavity 9 is prevented from being lost by the heat insulation layer.
[0026] Preferably, the inner wall of the baking chamber 2 is provided with a support table 4, and the carrier disc 5 is arranged on the support table 4 and spaced from the bottom of the baking chamber 2.
[0027] Preferably, the carrier disc 5 is provided with a handle 8 on both sides.
[0028] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0029] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.
[0030] Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
Claims
1. A baking apparatus for use in wafer packaging, characterized by comprising: The utility model provides a wafer baking device, including the body (1), the upper end of body (1) is equipped with the baking chamber (2), the upper end of body (1) is hingedly equipped with the cover (3) of covering baking chamber (2), be equipped with the removable carrier plate (5) in baking chamber (2), be equipped with a plurality of with wafer matching placement port (6) and be equipped with a plurality of vertical hollow hole (7) on carrier plate (5), carrier plate (5) is spaced apart with the bottom of baking chamber (2); The cover (3) is equipped with heating cavity (9) in, heating cavity (9) is equipped with heating wire (10) in, heating cavity (9) is communicated with baking chamber (2) setting, the upper end of cover (3) is equipped with the air inlet (12) of communication with heating cavity (9), the body (1) is equipped with the exhaust cavity (13) of communication with baking chamber (2) in, exhaust cavity (13) is connected with fan box (15), fan box (15) is equipped with fan assembly (16) in, fan box (15) is communicated with the air outlet (17) of setting in the body (1) outside, air outlet (17) is connected through the hose with air inlet (12).
2. The baking apparatus for use in wafer packaging according to claim 1, wherein The air inlet (12) is set up in the center of heating cavity (9), and the heating cavity (9) is communicated with the baking chamber (2) through a plurality of air blowing holes (11), the air blowing hole (11) is located above the baking chamber (2), and the baking chamber (2) is communicated with the exhaust cavity (13) through a plurality of exhaust holes (14), and the plurality of exhaust holes (14) are arranged on the bottom of the baking chamber (2).
3. The baking apparatus for use in wafer packaging according to claim 2, wherein The hole diameter of the plurality of air blowing holes (11) gradually increases from the air blowing hole (11) located in the center to the air blowing hole (11) located around.
4. The baking apparatus for use in wafer packaging according to claim 1, wherein The inner wall of the heating cavity (9) is provided with a layer of heat insulation layer, and the heat insulation layer comprises a heat insulation cotton layer.
5. The baking apparatus for use in wafer packaging according to claim 1, wherein The inner wall of the baking chamber (2) is provided with a support table (4), and the carrier plate (5) is placed on the support table (4) and spaced apart from the bottom of the baking chamber (2).
6. The baking apparatus for use in wafer packaging according to claim 5, wherein The two sides of the carrier plate (5) are provided with handles (8).