Positioning mechanism for semiconductor silicon epitaxial wafer production
By designing automated positioning components and bearing rings, the problems of low accuracy and single-workpiece positioning in existing positioning mechanisms have been solved, enabling simultaneous positioning of multiple workpieces and improving production efficiency and equipment adaptability.
Patent Information
- Application Number
- CN202520162132.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-23
AI Technical Summary
Existing positioning mechanisms require manual adjustment in semiconductor silicon epitaxial wafer production, resulting in poor accuracy, cumbersome operation, difficulty in automating to meet the needs of products with different specifications and sizes, and the ability to position only a single workpiece, leading to low production efficiency.
A positioning mechanism comprising a worktable, a motor-driven positioning component, and a bearing ring is designed. The motor drive enables automated adjustment and simultaneous positioning of multiple workpieces, while the use of a rotating structure and a transmission structure improves operational convenience and accuracy.
It enables automated positioning of products of different specifications and sizes, improves positioning quality and production efficiency, reduces human error and labor intensity, and enhances the adaptability and practicality of the equipment.
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Figure CN223723281U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor silicon epitaxial wafer production, specifically to a positioning mechanism for semiconductor silicon epitaxial wafer production. BACKGROUND
[0002] Semiconductor silicon epitaxial wafer production technology refers to growing a high-quality silicon thin film on the surface of a silicon substrate through chemical vapor deposition or molecular beam epitaxy, etc. This thin film is called a silicon epitaxial layer. Through epitaxial growth, the doping concentration, lattice structure, and film thickness can be precisely controlled on the silicon wafer, thereby improving device performance and reliability and meeting the needs of different electronic products.
[0003] During the production of semiconductor silicon epitaxial wafers, the epitaxial growth process requires uniform deposition of thin films on the silicon substrate. Any slight deviation can affect the quality of the epitaxial layer and the performance of the device. Therefore, a precise positioning mechanism is used to ensure the accurate alignment and fixation of the silicon wafer in the epitaxial growth equipment, avoiding problems such as uneven deposition, unreasonable stress distribution, or lattice mismatch caused by positional errors.
[0004] The inventor found the following problems in the prior art during the implementation of the utility model: 1. The commonly used positioning mechanism currently needs to be adjusted manually during use and assembly, which has poor precision and is more cumbersome and laborious to operate. It is difficult to adapt to automatic production of different specifications and sizes, which reduces the positioning quality and operating efficiency; 2. The commonly used positioning mechanism can only position and fix a single workpiece, making it difficult to realize simultaneous positioning and processing of multiple workpieces, which reduces production efficiency and has poor practicality. UTILITY MODEL CONTENTS
[0005] The utility model discloses a positioning mechanism for semiconductor silicon epitaxial wafer production, to solve the problem of the above background art that manual adjustment is usually needed, the precision is poor, and the operation is more complicated and laborious, and the production requirements of products of different specifications and sizes are difficult to realize the positioning machining of multiple workpieces simultaneously. In order to achieve the above object, the utility model provides the following technical scheme: a positioning mechanism for semiconductor silicon epitaxial wafer production, including operation platform, the bottom of operation platform is installed with a plurality of bottom columns, one end of operation platform top is installed with operation box, one side of operation box is hinged with the protective door, the surface of protective door is provided with observation window, one end of one side of protective door is installed with the door handle, one side of operation platform is installed with first motor, the one side drive of first motor has unidirectional screw rod, the surface screw thread connection of unidirectional screw rod has mobile seat, the both ends sliding connection of mobile seat's bottom has slide rod, one end of mobile seat upper surface is provided with recess, the recess is installed with second motor, the top drive of second motor has driving gear, the surface of driving gear is engaged with driven gear, the inside installation of driven gear has the rotation bar, the bottom end rotation of rotation bar's surface is connected with the rotary drum, the top of rotation bar is installed with operation table, the top of operation table is installed with a plurality of bearing rings, the top of operation table is provided with mounting groove, the inside installation of mounting groove has positioning assembly.
[0006] The positioning assembly includes a third motor movably installed in the mounting groove, a bidirectional screw rod driven by one side of the third motor, and side clamping plates threadedly connected to both ends of the surface of the bidirectional screw rod.
[0007] Further preferably, the bottom columns are symmetrically distributed about the horizontal center line of the operation platform.
[0008] Further preferably, the protective door and the door handle constitute an opening and closing structure through the operation box.
[0009] Further preferably, the operation table and the driven gear constitute a rotating structure through the rotation bar.
[0010] Further preferably, the bearing rings are equally distributed on the top of the operation table.
[0011] Further preferably, the side clamping plates and the second motor constitute a transmission structure through the bidirectional screw rod.
[0012] Further preferably, rubber pads are installed on one side of the side clamping plates.
[0013] Compared with the prior art, the utility model has the beneficial effects that:
[0014] The utility model discloses, through the design improvement of positioning assembly, can automatically adjust the positioning according to the product demand of different specifications and sizes, adapt to different production needs, improve the positioning quality significantly, avoid artificial error, reduce the working hours and labour intensity simultaneously, simplify the operation process, enhance the flexibility and operability of production process.
[0015] The utility model discloses, make multiple workpieces can be firmly positioned in the same time, avoid the inefficient problem of single workpiece one by one operation, improve the overall efficiency of processing process, still reduce the time of workpiece replacement and artificial cost, enhance the adaptability and practicality of equipment. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the front view structure schematic drawing of the utility model;
[0017] Figure 2 It is the inside explosion structure schematic drawing of workbench of the utility model;
[0018] Figure 3 It is the inside explosion structure schematic drawing of workbench of the utility model;
[0019] Figure 4 It is the inside explosion structure schematic drawing of workbench of the utility model;
[0020] In the drawing: 1, workbench;2, bottom column;3, workbench;4, protective door;5, observation window;6, door handle;7, first motor;8, one-way screw;9, mobile seat;10, slide bar;11, recess;12, second motor;13, driving gear;14, driven gear;15, rotating rod;16, rotating cylinder;17, operation table;18, bearing ring;19, installation groove;20, positioning assembly;2001, third motor;2002, bidirectional screw;2003, side clamping plate. DETAILED DESCRIPTION
[0021] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative work belong to the scope of the utility model protection.
[0022] Please refer to Figures 1 to 4The utility model provides technical scheme: positioning mechanism is used in semiconductor silicon epitaxial wafer production, including workstation 1, workstation 1's bottom is installed with several bottom column 2, workstation 1 top's one end is installed with work box 3, work box 3 one side is hinged with protective door 4, and the surface of protective door 4 is provided with observation window 5, and one end of the one side of protective door 4 is installed with door handle 6, and one side of workstation 1 is installed with first motor 7, and one side of first motor 7 is driven with unidirectional screw rod 8, and the surface of unidirectional screw rod 8 is threadedly connected with mobile seat 9, and the both ends of the bottom of mobile seat 9 are slidably connected with slide rod 10, and one end of the upper surface of mobile seat 9 is provided with recess 11, and recess 11 is installed with second motor 12 in the inside, and the top of second motor 12 is driven with driving gear 13, and the surface of driving gear 13 is engaged with driven gear 14, and driven gear 14 is installed with rotating rod 15 in the inside, and the surface of rotating rod 15 is rotatably connected with rotary drum 16 at the bottom end, and the top of rotating rod 15 is installed with operation table 17, and the top of operation table 17 is installed with several bearing rings 18, and the top of operation table 17 is provided with mounting groove 19 at one end close to bearing ring 18, and mounting groove 19 is installed with positioning assembly 20 in the inside.
[0023] Positioning assembly 20 includes third motor 2001 movably installed in the inside of mounting groove 19, and the one side of third motor 2001 is driven with bidirectional screw rod 2002, and the both ends of the surface of bidirectional screw rod 2002 are threadedly connected with side clamping plate 2003.
[0024] In the embodiment, as shown in the figure, Figure 1 The bottom columns 2 are symmetrically distributed about the horizontal center line of the workstation 1. The symmetrical distribution design can ensure uniform distribution of the load on the workstation 1, avoid structural deviation or deformation, improve the carrying capacity and service life of the workstation 1, and effectively improve the stability and uniformity of the overall structure.
[0025] In the embodiment, as shown in the figure, Figure 1 The protective door 4 and the door handle 6 constitute an opening and closing structure through the work box 3. The opening and closing structure design can easily and conveniently open the protective door 4 by pulling the door handle 6, facilitate subsequent workpiece assembly and fixing operations, and play a certain protection effect together with the work box 3.
[0026] In the embodiment, as shown in the figure, Figure 3 The operation table 17 and the driven gear 14 constitute a rotating structure through the rotating rod 15. The rotating structure design can drive the operation table 17 and the positioning assembly 20 to rotate synchronously through the action of the second motor 12, provide more convenient workpiece assembly operation, avoid frequent movement and adjustment of the operator, and improve the work efficiency.
[0027] In the embodiment, as shown in the figure, Figure 4As shown, the carrier rings 18 are annularly and equidistantly distributed on the top of the operation table 17; so that multiple workpieces can be uniformly and stably fixed on the operation table 17, the utilization of space can be improved, multiple workpieces can be machined at the same time, thereby improving production efficiency and ensuring uniform machining precision.
[0028] In the embodiment, as shown in the figure, Figure 4 As shown, the side clamping plate 2003 is connected with the second motor 12 through the bidirectional screw rod 2002 to form a transmission structure; through the transmission structure, the side clamping plate 2003 can be driven to move in the horizontal direction by the third motor 2001, thereby automatically and conveniently adjusting the applicability of the workpiece loaded inside, reducing labor cost and improving work efficiency.
[0029] In the embodiment, as shown in the figure, Figure 4 As shown, the side clamping plate 2003 is connected with the second motor 12 through the bidirectional screw rod 2002 to form a transmission structure; through the transmission structure, the side clamping plate 2003 can be driven to move in the horizontal direction by the third motor 2001, thereby automatically and conveniently adjusting the applicability of the workpiece loaded inside, reducing labor cost and improving work efficiency.
[0030] The use method and advantages of the utility model are as follows:
[0031] As shown in the figure, Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown in the figure, first, the operator pulls the door handle 6 to drive the protective door 4 to flip and open, then starts the first motor 7 to drive the moving seat 9 and the operation table 17 to automatically transmit and take out, then the substrate workpiece required to be machined can be placed in the multiple carrier rings 18 one by one, and the second motor 12 can be started to drive the operation table 17 and the positioning assembly 20 to automatically rotate, thereby avoiding the problem that the operator needs to frequently shift and adjust the position of himself when loading the workpiece, improving the use experience, then the third motor 2001 is started to drive the two side clamping plates 2003 to move relative to each other, thereby automatically and conveniently positioning the workpiece with high quality, without the need for additional labor assistance, improving work efficiency and reducing work cost, then the same operation can be performed to drive the moving seat 9 and the workpiece to reset, then the protective door 4 is closed, and the machining operation can be performed, and the working condition inside can be observed in real time through the observation window 5 during the machining process.
[0032] The basic principle, main features and advantages of the present application are shown and described above. The technical personnel in the industry should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A positioning mechanism for producing a semiconductor silicon epitaxial wafer, comprising a worktable (1), characterized in that: The bottom of the workbench (1) is provided with several bottom columns (2), one end of the top of the workbench (1) is provided with a work box (3), one side of the work box (3) is hinged with a protective door (4), the surface of the protective door (4) is provided with an observation window (5), one end of one side of the protective door (4) is provided with a door handle (6), one side of the workbench (1) is provided with a first motor (7), one side of the first motor (7) is driven with a one-way screw rod (8), the surface of the one-way screw rod (8) is threadedly connected with a moving seat (9), both ends of the bottom of the moving seat (9) are slidably connected with a sliding rod (10), one end of the upper surface of the moving seat (9) is provided with a groove (11), the inside of the groove (11) is provided with a second motor (12), the top of the second motor (12) is driven with a driving gear (13), the surface of the driving gear (13) is engaged with a driven gear (14), the inside of the driven gear (14) is provided with a rotating rod (15), the surface of the bottom end of the rotating rod (15) is rotatably connected with a rotating drum (16), the top of the rotating rod (15) is provided with an operation table (17), the top of the operation table (17) is provided with several bearing rings (18), one end of the top of the operation table (17) close to the bearing ring (18) is provided with a mounting groove (19), the inside of the mounting groove (19) is provided with a positioning assembly (20). The positioning assembly (20) comprises a third motor (2001) movably mounted in the inside of the mounting groove (19), one side of the third motor (2001) is driven with a bidirectional screw rod (2002), both ends of the surface of the bidirectional screw rod (2002) are threadedly connected with a side clamping plate (2003).
2. The positioning mechanism for producing a semiconductor silicon epitaxial wafer according to claim 1, characterized by: The bottom column (2) is symmetrically distributed about the horizontal center line of the workbench (1).
3. The positioning mechanism for producing a semiconductor silicon epitaxial wafer according to claim 1, characterized in that: The protective door (4) and the door handle (6) constitute an opening and closing structure through the work box (3).
4. The positioning mechanism for producing a semiconductor silicon epitaxial wafer according to claim 1, wherein: The operation table (17) and the driven gear (14) constitute a rotating structure through the rotating rod (15).
5. The positioning mechanism for producing a semiconductor silicon epitaxial wafer according to claim 1, characterized in that: The bearing rings (18) are annularly and equidistantly distributed on the top of the operation table (17).
6. The positioning mechanism for producing a semiconductor silicon epitaxial wafer according to claim 1, wherein: The side clamping plate (2003) and the second motor (12) constitute a transmission structure through the bidirectional screw rod (2002).
7. The positioning mechanism for producing a semiconductor silicon epitaxial wafer according to claim 1, characterized by: One side of the side clamping plate (2003) is provided with a rubber pad.