Semiconductor packaging product test seat

Abstract

The utility model discloses a semiconductor packaging product test seat, which comprises a test seat main body, a fixing piece, a test execution mechanism, a fixing frame and a probe, the probe is positioned in the middle of the bottom end of the test seat main body, the test execution mechanism is clamped at the upper end position of the test seat main body, and the probe is inserted into the middle of the test execution mechanism. The fixing piece is clamped at the upper end of the test execution mechanism, the fixing frame is clamped at the inner side of the test execution mechanism, a lower hole is formed in the position, located at the bottom of the probe, of the bottom end of the test seat body, and the probe is inserted into the lower hole. The semiconductor packaging product test seat overcomes the defect that a plurality of needles are not uniformly stressed, and realizes that each hole site of each execution mechanism is provided with a single-body mechanism which is independently controlled so as to ensure the state of action together; and the overall strength can be controlled according to the change of the upper and lower strengths of the two actuating mechanisms according to actual values, so that the electrical performance is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging product test, especially relates to a semiconductor packaging product test seat. BACKGROUND

[0002] The semiconductor packaging product test seat is a supporting equipment for semiconductor packaging detection, is used in the process of testing electrical performance after the semiconductor product passes the manufacturing process, and the performance inspection of the product is formed by contacting the semiconductor product to judge the normal electrical performance, but the aging test is also used in the test process, and with the continuous development of science and technology, people's manufacturing process requirements for the semiconductor packaging product test seat are also higher and higher.

[0003] The existing semiconductor packaging product test seat has certain disadvantages in use, and the connection of the product and the contact pin installed in the test seat is good in the test process, which is an important link for improving reliability. The product contact pin is a MOS type probe that is opened in two directions, and the main feature is that the spherical product contact point is formed into a ball mode to realize electrical physical conduction. However, due to the warping of the actuator, the ball grabbing force is uneven, and when multiple needles are used, local ball grabbing failure may occur. When the MOS type probe contacts the product terminal, the greater the force, the better the electrical performance, and the physical electrical performance is improved. Only the improvement of the ball grabbing force also relatively improves the force of the open needle head, which leads to the short board of the force of the pressing plate, so the electrical characteristics need to be considered, and the test seat of the used equipment parameters is developed. Therefore, we provide a semiconductor packaging product test seat. UTILITY MODEL CONTENTS

[0004] The technical problem solved by the utility model is that the semiconductor packaging product test seat provided by the utility model overcomes the defect of uneven force of multiple needles, realizes that each hole position of the actuator is controlled by a single body mechanism to ensure that the actuators act together, and can control the overall force according to the actual value change of the up-down force of the two actuators to improve the electrical performance, so that the problems in the background art can be effectively solved.

[0005] Technical scheme: In order to achieve the above purpose, the utility model adopts the technical scheme that a semiconductor packaging product test seat, including test seat main part, fixed part, test execution mechanism, fixed frame and probe, the probe is positioned in the bottom end middle part of the test seat main part, the test execution mechanism is clamped in the upper end position of the test seat main part, and the probe is inserted into the middle part of the test execution mechanism, the fixed part is clamped in the upper end of the test execution mechanism, the fixed frame is clamped in the inner side of the test execution mechanism, the lower hole is arranged in the position of the probe bottom of the test seat main part bottom end, and the probe is inserted into the lower hole.

[0006] Preferably, the probe is clamped in the middle of the test seat body, and the probe passes through the middle of the test execution mechanism and extends out, the fixing frame is clamped at both ends of the test execution mechanism and limits the middle position of the test execution mechanism, and the fixing piece is clamped on the test execution mechanism for fixation.

[0007] Preferably, the middle of the fixing piece is provided with an opening, the opening is located directly above the plurality of hole positions, and the probe passes through the test execution mechanism.

[0008] Preferably, the test execution mechanism comprises an execution body, a corner support body, a plurality of hole positions, a support point, a probe seat and a probe frame, the plurality of hole positions are located in the middle of the execution body, the corner support body is located on the side of the execution body, the support point is located at the position where the fixing frame is installed at both ends of the execution body, and the probe seat and the probe frame are located on the plurality of hole positions and contact the probe.

[0009] Preferably, the probe passes through the plurality of hole positions and contacts the probe seat and the probe frame on both sides, and the probe head extends out of the position of the plurality of hole positions for testing.

[0010] Preferably, the probe comprises a first contact pin and a second contact pin, and the first contact pin and the second contact pin both pass through the middle of the test execution mechanism.

[0011] Beneficial effects: compared with the prior art, the semiconductor packaging product test seat has the following beneficial effects: the semiconductor packaging product test seat overcomes the defect that multiple pins are unevenly stressed, realizes that each execution mechanism has a single control single mechanism in the hole position to ensure the state of simultaneous action, and can control the overall force according to the actual value change of the up-down force of the two execution mechanisms to realize the improvement of electrical performance; at the same time, the starting force is maintained to continue to use the original equipment, which reduces the investment and production line downtime and has obvious effect, the whole semiconductor packaging product test seat has simple structure, convenient operation and better use effect than the traditional way. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a whole structure schematic view of the semiconductor packaging product test seat of the utility model.

[0013] Figure 2 It is a sectional view of the packaging product test seat in the semiconductor packaging product test seat of the utility model.

[0014] Figure 3 It is a structure schematic view of the plan view in the semiconductor packaging product test seat of the utility model.

[0015] Figure 4The utility model discloses a plurality of hole position structure schematic diagram in semiconductor packaging product test seat.

[0016] Figure 5 The utility model discloses a plurality of hole position structure schematic diagram in semiconductor packaging product test seat.

[0017] Figure 6 The utility model discloses a plurality of hole position structure schematic diagram in semiconductor packaging product test seat.

[0018] Figure 7 The utility model discloses a plurality of hole position structure schematic diagram in semiconductor packaging product test seat.

[0019] Figure 8 The utility model discloses a plurality of hole position structure schematic diagram in semiconductor packaging product test seat.

[0020] In the drawing: 10, test seat main part, 11, lower hole, 20, fixed part, 21, opening, 30, executing mechanism, 31, executing main body, 32, corner support body, 33, plurality of hole positions, 34, support point, 35, probe seat, 36, probe frame, 40, fixed frame, 50, probe, 52, first contact thimble, 54, second contact thimble. DETAILED DESCRIPTION

[0021] The technical scheme of the utility model will be described clearly and completely below in combination with the drawings and specific embodiments, but the person skilled in the art will understand that the following described embodiments are part of the embodiments of the utility model, not all the embodiments, and are only used for illustrating the utility model, and should not be regarded as limiting the scope of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor are within the protection scope of the utility model. The unmarked specific conditions in the embodiments are carried out according to the conventional conditions or the conditions suggested by the manufacturer. The reagents or instruments used are not marked the manufacturer, and are all the conventional products that can be obtained by market purchase.

[0022] In the description of the utility model, it needs to be explained that the orientation or position relation indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like is the orientation or position relation based on the shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the indicated device or element to have a particular orientation, to be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", "third" are only for the description purpose, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the utility model, it is to explain, unless another explicit provision and limitation, term "installation", "link", "connection" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be two elements inside the communication.For the ordinary skill in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0024] As Figures 1-8 Shown, a kind of semiconductor package product test seat, including test seat main body 10, fixed part 20, test execution mechanism 30, fixed frame 40 and probe 50, probe 50 is positioned in the bottom end middle part of test seat main body 10, test execution mechanism 30 is engaged in the upper end position of test seat main body 10, and probe 50 is inserted into the middle part of test execution mechanism 30, fixed part 20 is engaged in the upper end of test execution mechanism 30, fixed frame 40 is engaged in the inner side of test execution mechanism 30, the lower hole 11 of test seat main body 10 bottom end is located in the position of the bottom of probe 50, and probe 50 is inserted in lower hole 11, overcome the defect that multiple needle force is uneven, realize the hole position of each execution mechanism is all a single control monomer mechanism and ensure the state of action together, and the force of two execution mechanisms can be controlled according to actual value change to realize the improvement of electrical performance.

[0025] Further, probe 50 is engaged in the middle part of test seat main body 10 and is positioned, and probe 50 passes through the middle part of test execution mechanism 30 and extends, fixed frame 40 is engaged in the two ends of test execution mechanism 30 and limits the middle position of test execution mechanism 30, and fixed part 20 is engaged in test execution mechanism 30 and is fixed.

[0026] Further, the middle part of fixed part 20 is provided with opening 21, and opening 21 is located directly above the plurality of hole positions 33, and probe 50 passes through test execution mechanism 30.

[0027] Further, test execution mechanism 30 includes execution main body 31, corner support body 32, plurality of hole positions 33, support point 34, probe seat 35 and probe frame 36, plurality of hole positions 33 are located in the middle part of execution main body 31, corner support body 32 is located in the side of execution main body 31, support point 34 is located in the position of the two ends of execution main body 31 and is installed fixed frame 40, probe seat 35 and probe frame 36 are located on plurality of hole positions 33, and probe seat 35 and probe frame 36 contact probe 50.

[0028] Further, probe 50 passes through plurality of hole positions 33 and contacts probe seat 35 and probe frame 36 on both sides, and the head of probe 50 extends out of the position of plurality of hole positions 33 to test.

[0029] Furthermore, the probe 50 includes a first contact pin 52 and a second contact pin 54, both of which pass through the middle of the test actuator 30.

[0030] Working principle: This utility model includes a test base body 10, a lower hole 11, a fixing member 20, an opening 21, a test execution mechanism 30, an execution body 31, a corner support 32, multiple hole positions 33, a support point 34, a probe base 35, a probe frame 36, a fixing frame 40, a probe 50, a first contact pin 52, and a second contact pin 54. It overcomes the defect of uneven force on multiple pins, realizes that each execution mechanism hole position has a single controlled unit mechanism to ensure that they operate together, and can control the overall force by changing the up and down force of the two execution mechanisms according to the actual value to improve electrical performance.

[0031] At the same time, it maintains the startup momentum and continues to operate the original equipment, which has a significant effect on reducing investment and production line downtime.

[0032] The test fixture mainly consists of a body, positioning components, an actuator, fixing components, and probe heads.

[0033] The main body is located at the bottom of the test socket and has holes that can accommodate multiple probes that run vertically through it.

[0034] The fastener is installed on the upper part of the main body, and after being isolated by a small section on the upper part of the main body, so there is a gap between the fastener and the bottom surface and the upper part of the main body. The fastener has an opening in the center that can be opened from the top and bottom, protruding from the upper part of the actuator.

[0035] The actuator is installed on the upper part of the body, which can move up and down. The point where the actuator descends is called the first position, and the point where it rises is called the second position. The actuator moves up and down between the first position and the second position.

[0036] An execution mechanism consists of a main body and peripheral components; the main body and peripheral components are part of the execution mechanism.

[0037] A portion of the actuator moves up and down within the gap between the upper body and the fixing component.

[0038] The actuator body has a plurality of holes that can be penetrated from top to bottom, the holes are the lower holes of the body and the upper holes overlap, the holes and the lower holes form a containing space, the containing space can fix the probe. The corner support body is around the actuator body, so the corner support body can be subjected to external force from top to bottom, the corner support body has no downward external force, the actuator body can restore to its original position, the inside of the corner support body has an open support point of a fixing frame, the fixing frame is connected with the body, with the upward and downward migration of the actuator, the fixing frame positions and covers the semiconductor chip on the actuator body, and the downward pressing of the semiconductor chip test socket mounted semiconductor chip can fix the position.

[0039] It should be noted that the relational terms herein such as first and second (one and two) and the like are used solely to distinguish one from another entity or action, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises... a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0040] The basic principle and main features of the present application and the advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principle of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A semiconductor package product test socket, comprising a test socket body (10), a fixing member (20), a test execution mechanism (30), a fixing frame (40) and a probe (50), characterized in that: The probe (50) is positioned in the middle of the bottom end of the test seat body (10), the test execution mechanism (30) is clamped at the upper end of the test seat body (10), and the probe (50) is inserted into the middle of the test execution mechanism (30), the fixing part (20) is clamped at the upper end of the test execution mechanism (30), the fixing frame (40) is clamped at the inner side of the test execution mechanism (30), and the lower hole (11) is arranged at the position of the bottom end of the test seat body (10) and the bottom of the probe (50).

2. The semiconductor package product test socket according to claim 1, wherein: The probe (50) is clamped in the middle of the test seat body (10) and extends through the middle of the test execution mechanism (30), the fixing frame (40) is clamped at both ends of the test execution mechanism (30) and limits the middle position of the test execution mechanism (30), and the fixing part (20) is clamped on the test execution mechanism (30) for fixation.

3. The semiconductor package product test socket of claim 1, wherein: The middle of the fixing part (20) is provided with an opening (21), the opening (21) is located directly above the plurality of hole positions (33), and the probe (50) passes through the test execution mechanism (30).

4. The semiconductor package product test socket of claim 1, wherein: The test execution mechanism (30) comprises an execution body (31), a corner support body (32), a plurality of hole positions (33), a support point (34), a probe seat (35) and a probe frame (36), the plurality of hole positions (33) are located in the middle of the execution body (31), the corner support body (32) is located at the side of the execution body (31), the support point (34) is located at the position of the two ends of the execution body (31) for installing the fixing frame (40), the probe seat (35) and the probe frame (36) are located on the plurality of hole positions (33), and the probe seat (35) and the probe frame (36) contact the probe (50).

5. The semiconductor package product test socket of claim 4, wherein: The probe (50) passes through the plurality of hole positions (33) and contacts the probe seat (35) and the probe frame (36) on both sides, and the head of the probe (50) extends out of the position of the plurality of hole positions (33) for testing.

6. The semiconductor package product test socket of claim 1, wherein: The probe (50) comprises a first contact needle (52) and a second contact needle (54), and the first contact needle (52) and the second contact needle (54) pass through the middle of the test execution mechanism (30).

Images