Three-dimensional magnetic sensor based on spin orbit moment

Abstract

The utility model relates to the technical field of sensors, in particular to a three-dimensional magnetic sensor based on spin orbit moment, which comprises a packaging shell and a sensor chip packaged in the packaging shell. Compared with the prior art, the utility model has the following advantages: the heat radiation fins are arranged on the side wall of the packaging shell, so that the heat radiation area is effectively increased, the heat radiation is accelerated, the stable performance of the sensor can still be maintained under the high-strength working condition, the service life is prolonged, and the sensor chip adopts a bottom-to-top stacked structure, so that the cost is reduced. Particularly, the combination of the spin-orbit coupling layer and the magnetic layer enables the sensor to respond to the change of an external magnetic field and detect the direction and the strength of the magnetic field through the change of magnetic moment, so that the accurate measurement of a three-dimensional magnetic field is realized, and the magnetic layer is prepared into a circular or annular shape, thereby facilitating the uniform distribution of the magnetic field. And the buffer layer is arranged between the magnetic layer and the spin-orbit coupling layer, so that the transmission efficiency of the spin-polarized current is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of sensor, concretely refers to a three -dimensional magnetic sensor based on spin orbit moment. BACKGROUND

[0002] With the rapid development of modern science and technology, magnetic sensors play a crucial role in many fields such as navigation positioning, biomedical, consumer electronics, automotive electronics and industrial automation. Traditional magnetic sensors are mostly based on giant magnetoresistance or tunnel magnetoresistance effect, although these sensors perform well in sensitivity and stability, but still face certain technical challenges in realizing three-dimensional magnetic field detection. Especially in the application scene of high sensitivity to magnetic field direction, fast response speed and low power consumption requirement, traditional magnetic sensors are difficult to meet the growing demand. In recent years, new magnetic sensor technology based on spin orbit moment has attracted much attention due to its unique advantages. Spin orbit moment effect utilizes the interaction between spin-polarized current and magnetic material, which can efficiently manipulate the direction of magnetic moment, thus realizing high-precision detection of magnetic field. This technology not only improves the sensitivity of magnetic sensor, but also reduces the power consumption, providing new possibilities for developing high-performance three-dimensional magnetic sensors. However, the application of spin orbit moment effect in actual three-dimensional magnetic sensor design still needs to solve a series of technical problems, such as how to effectively dissipate heat to ensure long-term stable operation of the sensor, how to optimize the sensor structure to improve the accuracy of magnetic field detection, and how to ensure the reliability and durability of the sensor in complex environment, especially in packaging design, not only to ensure the good connection between sensor chip and external circuit, but also to prevent internal structure from short circuit and damage, at the same time, also need to consider how to improve the response speed and sensitivity of the sensor. SUMMARY

[0003] The utility model aims at least to solve one of the technical problems existing in the prior art. Therefore, one purpose of the utility model is to provide a three-dimensional magnetic sensor based on spin orbit moment, which has reasonable structure, stable performance and high sensitivity.

[0004] To solve the above technical problems, the technical scheme provided by the utility model is as follows: a three-dimensional magnetic sensor based on spin orbit moment, comprising:

[0005] The packaging shell comprises a shell body, the side wall of the shell body is provided with a heat dissipation fin, a pin hole is formed in the side wall of the shell body, and an electrode pin is fixed in the pin hole by filling insulating sealant;

[0006] A sensor chip is arranged in the shell, the sensor chip is sequentially stacked from bottom to top with a substrate, a spin-orbit coupling layer, a magnetic layer, an insulating layer and an electrode layer, the substrate provides support for the sensor chip, the spin-orbit coupling layer can generate spin-polarized current when current passes through, the magnetic layer generates magnetic moment change under the action of spin-polarized current and external magnetic field, the insulating layer is used for isolating the magnetic layer and the electrode layer to prevent short circuit, and the electrode layer is connected with the electrode pin and used for applying current and leading out electric signal.

[0007] Preferably, the magnetic layer is prepared in a circular or annular shape.

[0008] Preferably, a buffer layer is arranged between the magnetic layer and the spin-orbit coupling layer.

[0009] Preferably, a thin film layer with abnormal Hall effect is arranged between the magnetic layer and the insulating layer.

[0010] Preferably, a gap of 0.2-0.5mm is arranged between the four peripheral sidewalls and the top surface of the sensor chip and the inner wall of the shell, and an elastic protective layer is filled in the gap.

[0011] Preferably, the electrode layer is made of low-resistance material.

[0012] After the above structure, the application has the following advantages:

[0013] The application can effectively increase the heat dissipation area and accelerate heat dissipation by arranging the heat dissipation fins on the sidewall of the packaging shell, thereby ensuring that the sensor can still maintain stable performance under high-intensity working conditions, prolonging the service life, the sensor chip adopts a structure of stacking from bottom to top, especially the combination of the spin-orbit coupling layer and the magnetic layer, so that the sensor can respond to the change of the external magnetic field and detect the direction and strength of the magnetic field through the change of the magnetic moment, realizing accurate measurement of the three-dimensional magnetic field, the magnetic layer is prepared in a circular or annular shape, which is helpful to uniformly distribute the magnetic field and improve the accuracy and sensitivity of the magnetic field detection, the buffer layer is arranged between the magnetic layer and the spin-orbit coupling layer, which can optimize the interface performance and improve the transmission efficiency of the spin-polarized current, the thin film layer with abnormal Hall effect is arranged between the magnetic layer and the insulating layer, which can detect the change of the magnetic moment by using abnormal Hall effect, further improving the sensitivity and response speed of the sensor, the gap is arranged between the four peripheral sidewalls and the top surface of the sensor chip and the inner wall of the shell, and the elastic protective layer is filled in the gap, providing additional buffering and damping effect, preventing the sensor chip from being damaged due to external impact.

[0014] The above summary is intended to illustrate the application and is not intended to be limiting thereof. Further aspects, embodiments and features of the application will become apparent from the detailed description in conjunction with the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 is a structural schematic diagram of the present application.

[0017] Figure 2 is a front view of the present application.

[0018] Figure 3 is Figure 2 is a cross-sectional structure schematic diagram of A-A in the figure.

[0019] As shown in the figure: 1, shell; 2, heat dissipation fin; 3, electrode pin; 4, base; 5, spin-orbit coupling layer; 6, buffer layer; 7, magnetic layer; 8, thin film layer; 9, insulating layer; 10, electrode layer; 11, elastic protective layer. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0021] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0022] In conjunction with the drawings Figures 1-3 A three-dimensional magnetic sensor based on spin-orbit torque, comprising a packaging shell and a sensor chip packaged in the packaging shell.

[0023] The packaging shell comprises a shell 1 made of a non-magnetic material with good thermal conductivity and mechanical stability, the size of the internal cavity matches the sensor chip, heat dissipation fins 2 are arranged on the side wall of the shell 1, the heat dissipation fins 2 are made of copper sheets to improve the heat conduction efficiency, so as to timely dissipate the heat generated during the operation of the sensor, maintain the stable working temperature of the sensor, and reduce the influence of temperature change on the performance of the sensor, pin holes are arranged on the side wall of the shell 1, and electrode pins 3 are fixed in the pin holes by filling insulating sealant.

[0024] The sensor chip is arranged in the shell 1, a gap of 0.2-0.5mm is arranged between the four side walls and the top surface of the sensor chip and the inner wall of the shell 1, and an elastic protective layer 11 is filled in the gap to prevent the sensor chip from being damaged due to external mechanical impact.

[0025] The sensor chip is sequentially stacked with a substrate 4, a spin-orbit coupling layer 5, a magnetic layer 7, an insulating layer 9 and an electrode layer 10 from bottom to top, a buffer layer 6 is arranged between the magnetic layer 7 and the spin-orbit coupling layer 5, the buffer layer 6 is made of magnesium oxide and the like, which improves the interface characteristics and enhances the injection efficiency of the spin-polarized current, the magnetic layer 7 is prepared into a circular or annular shape by a micro-nano processing technology, which optimizes the magnetic field response characteristics and improves the sensitivity, the electrode layer 10 is made of a low-resistance material, a thin film layer 8 with abnormal Hall effect is arranged between the magnetic layer 7 and the insulating layer 9, which can accurately capture the magnetic signal change in the z-axis direction, when there is a component in the z-axis direction of the external magnetic field, the carriers in the thin film will be deflected due to the action of the magnetic field, thereby generating a transverse Hall voltage, by reasonably arranging the electrodes in the two-dimensional plane to detect this Hall voltage, the magnetic signal change in the z-axis direction can be integrated into the two-dimensional sensor plane, combined with the detection of the magnetic layer 7 on the x-axis and y-axis direction magnetic field change in the plane, the comprehensive and accurate monitoring of the three-dimensional space magnetic field change is realized.

[0026] The substrate 4 is made of a silicon wafer, which provides support for the sensor chip, the spin-orbit coupling layer 5 is made of a heavy metal material, which has a strong spin-orbit coupling effect and can generate spin-polarized current when current passes through, the magnetic layer 7 is made of cobalt, iron and their alloys, which has a suitable magnetic moment and magnetic anisotropy, and generates a magnetic moment change under the action of spin-polarized current and external magnetic field, the insulating layer 9 is made of silicon dioxide and the like, which is used to isolate the magnetic layer 7 and the electrode layer 10 to prevent short circuit, the electrode layer 10 is made of a metal material, and the electrode layer 10 is connected with the electrode pins 3 for applying current and leading out electrical signals.

[0027] When the current passes through the spin orbit coupling layer 5, a spin polarization current is generated due to the spin orbit coupling effect, the spin polarization current is injected into the magnetic layer 7, interacts with the magnetic moment in the magnetic layer 7, generates a spin orbit torque, when there is an external three-dimensional magnetic field, different components of the magnetic field will generate torques of different directions on the magnetic moment in the magnetic layer 7, so that the orientation of the magnetic moment in the three-dimensional space changes, and the change of the magnetic moment will cause the corresponding change of the physical quantity such as the resistance or Hall voltage of the magnetic layer 7, the electrical signal is led out through the electrode layer 10, and is detected and processed by the external signal processing circuit, so that the perception of the three-dimensional magnetic field is realized, wherein the thin film layer 8 is specially used for generating a detectable Hall voltage signal for the z-axis magnetic field component, and cooperates with other detection mechanisms of the magnetic layer 7 to improve the overall measurement accuracy.

[0028] The above describes the utility model and its implementation mode, and this description is not restrictive, and the shown in the full text is only one of the implementation modes of the utility model, and the actual structure is not limited thereto. In summary, if a person skilled in the art is inspired thereby, without departing from the creative purpose of the utility model, similar structure modes and embodiments are not creatively designed, which should belong to the protection scope of the utility model.

Claims

1. A spin-orbit torque based three-dimensional magnetic sensor, characterized in that, The application relates to a sensor chip and a packaging shell thereof. The packaging shell comprises a shell body, heat dissipation fins are arranged on the side wall of the shell body, pin holes are formed in the side wall of the shell body, and electrode pins are fixed in the pin holes through filling of insulating sealant. The sensor chip is arranged in the shell body, and the sensor chip is sequentially stacked with a substrate, a spin-orbit coupling layer, a magnetic layer, an insulating layer and an electrode layer from bottom to top.

2. A spin-orbit torque based three-dimensional magnetic sensor according to claim 1, characterized in that: The substrate provides support for the sensor chip.

3. The spin-orbit torque based three-dimensional magnetic sensor of claim 1, wherein: The spin-orbit coupling layer can generate spin-polarized current when current passes through.

4. The spin-orbit torque based three-dimensional magnetic sensor of claim 1, wherein: The magnetic layer generates magnetic moment change under the action of spin-polarized current and an external magnetic field.

5. The spin-orbit torque based three-dimensional magnetic sensor of claim 1, wherein: The insulating layer is used for isolating the magnetic layer and the electrode layer to prevent short circuit.

6. The spin-orbit torque-based three-dimensional magnetic sensor of claim 1, wherein: The electrode layer is connected with the electrode pins and is used for applying current and leading out electric signals. The magnetic layer is prepared in a circular or annular shape. A buffer layer is arranged between the magnetic layer and the spin-orbit coupling layer. A thin film layer with abnormal Hall effect is arranged between the magnetic layer and the insulating layer. A gap with a width of 0.2-0.5 mm is arranged between the four side walls and the top surface of the sensor chip and the inner wall of the shell body, and an elastic protective layer is filled in the gap. The electrode layer is made of low-resistance material.

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