Earphone

Abstract

The utility model discloses an earphone, and relates to the field of wearable equipment, and the earphone comprises a housing, a circuit board, an onboard antenna, a radio frequency module, and a main control chip. The circuit board is arranged in the shell, the circuit board comprises a first surface and a second surface which are arranged at an interval in the thickness direction, the onboard antenna is arranged on the first surface, the radio frequency module is electrically connected with the onboard antenna, the main control chip is electrically connected with the radio frequency module, and the main control chip controls the onboard antenna to transmit and receive signals through the radio frequency module, the radio frequency module and the main control chip are arranged on the second surface. By planning the arrangement positions of the onboard antenna, the main control chip and the radio frequency module on the circuit board, staggered arrangement of the onboard antenna, the main control chip and the radio frequency module is realized, so that the clearance area of the onboard antenna is enlarged, signal shielding and electromagnetic interference of other elements to the onboard antenna are reduced, and the antenna reliability is improved. The signal transmitting and receiving capability of the onboard antenna is improved, and the problem that the performance of the onboard antenna in the earphone is poor is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wearable devices, and in particular to an earphone. BACKGROUND

[0002] Onboard antennas are widely used in Bluetooth modules due to their low debugging cost and easy integration. In order to cater to the pursuit of wireless convenience by users, earphone products generally have built-in Bluetooth modules to achieve efficient wireless audio transmission. However, the Bluetooth module of an earphone rarely has an onboard antenna. Due to the compact volume inside the earphone, the layout space is extremely limited, and other elements inside the earphone will interfere with the onboard antenna, thereby affecting the signal transmission effect of the onboard antenna. Especially when a low-end chip and an onboard antenna work together, the radio frequency performance of the low-end chip is poor, which further affects the transmitting and receiving capabilities of the onboard antenna, resulting in problems such as lag, echo, and frequent disconnection during use, and poor user experience. CONTENT OF THE UTILITY MODEL

[0003] The embodiments of the present application provide an earphone, which can solve the problem of poor performance of an onboard antenna in the earphone.

[0004] The embodiments of the present application provide an earphone, which includes a shell, a circuit board, an onboard antenna, a radio frequency module, and a master control chip. The circuit board is arranged in the shell, and includes a first surface and a second surface which are arranged at intervals in the thickness direction. The onboard antenna is arranged on the first surface. The radio frequency module is electrically connected with the onboard antenna, and is arranged on the second surface to increase the clearance of the onboard antenna. The master control chip is electrically connected with the radio frequency module, and controls the onboard antenna to transmit and receive signals through the radio frequency module. The master control chip is arranged on the second surface to increase the clearance of the onboard antenna.

[0005] In some embodiments, the earphone further includes a load element which is connected in series with the onboard antenna, and the load element is used to improve the performance of the onboard antenna.

[0006] In some embodiments, the load element includes at least one of a capacitor, an inductor, and a zero ohm resistor.

[0007] In some embodiments, the onboard antenna includes a first antenna segment, a second antenna segment, and a third antenna segment which are connected in sequence. The load element includes a capacitor, an inductor, and a zero ohm resistor. The zero ohm resistor is connected in series between the first antenna segment and the second antenna segment. The capacitor is connected in series between the second antenna segment and the third antenna segment. The inductor is connected in series between the third antenna segment and the ground.

[0008] In some embodiments, the first surface of the circuit board is provided with an electrode pad, and the earphone further comprises: a battery disposed on one side of the second surface of the circuit board; a flexible flat cable, one end of the flexible flat cable being connected to the electrode pad, the other end of the flexible flat cable being connected to the battery, the flexible flat cable being arranged around the circuit board, and the flexible flat cable being spaced apart from the second surface.

[0009] In some embodiments, the earphone further comprises a spacer, the spacer being disposed between the flexible flat cable and the second surface to space apart the flexible flat cable from the second surface.

[0010] In some embodiments, the circuit board is provided with a ground layer, a projection of the electrode pad in the thickness direction of the circuit board being spaced apart from the ground layer, and / or a projection of the on-board antenna in the thickness direction of the circuit board being spaced apart from the ground layer.

[0011] In some embodiments, the electrode pad comprises a positive electrode pad and a negative electrode pad, the circuit board is further provided with a positive electrode trace and a negative electrode trace, and the earphone further comprises a first inductor and a second inductor, the first inductor being connected in series between the positive electrode trace and the positive electrode pad, and the second inductor being connected in series between the negative electrode trace and the negative electrode pad.

[0012] In some embodiments, the earphone further comprises an auxiliary antenna, one end of the auxiliary antenna being grounded, the auxiliary antenna being spaced apart from and coupled to the on-board antenna.

[0013] In some embodiments, the earphone further comprises a transient voltage suppression diode, the transient voltage suppression diode being connected in parallel to the on-board antenna.

[0014] In some embodiments, the earphone is one of an open earphone, a semi-in-ear earphone, an in-ear earphone, and a headphone.

[0015] According to an earphone provided by the embodiments of the present application, the arrangement positions of the on-board antenna, the main control chip, and the radio frequency module on the circuit board are planned, so as to reduce the interference on the on-board antenna, and realize the staggered arrangement of the on-board antenna, the main control chip, and the radio frequency module, wherein the on-board antenna is arranged on the first surface of the circuit board, and the main control chip and the radio frequency module are arranged on the second surface of the circuit board, which helps to increase the clearance of the on-board antenna, reduce the signal shielding and electromagnetic interference of other elements on the on-board antenna, and further improve the signal transmission and reception capability of the on-board antenna, so as to realize more stable and efficient wireless audio transmission. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0017] Figure 1 A structural schematic diagram of an earphone according to an embodiment of the present application;

[0018] Figure 2 An exploded structural schematic diagram of an earphone according to an embodiment of the present application;

[0019] Figure 3 A schematic diagram of a circuit board and element layout structure thereon according to an embodiment of the present application;

[0020] Figure 4 A head model efficiency diagram of a semi-ear-insert earphone according to an embodiment of the present application;

[0021] Figure 5 A wearing schematic diagram of a semi-ear-insert earphone according to an embodiment of the present application;

[0022] Reference signs:

[0023] 1, earphone;

[0024] 10, housing; 11, upper housing; 12, lower housing;

[0025] 20, circuit board; 21, electrode pad; 211, positive electrode pad; 212, negative electrode pad; 22, loudspeaker pad; 221, loudspeaker positive electrode pad; 222, loudspeaker negative electrode pad; 201, first surface; 202, second surface; 203, clearance;

[0026] 30, on-board antenna; 31, first antenna segment; 32, second antenna segment; 33, third antenna segment;

[0027] 41, radio frequency module; 42, main control chip; 43, transient suppression diode; 44, auxiliary antenna; 45, first inductor; 46, second inductor;

[0028] 50, load element; 51, capacitor; 52, inductor; 53, zero-ohm resistor;

[0029] 61, battery; 62, flexible flat cable; 63, spacer; 64, loudspeaker assembly;

[0030] X, thickness direction of the circuit board; Y, length direction of the circuit board; Z, width direction of the circuit board. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0032] The inventors found that the Bluetooth module of the earphone in the related art rarely uses an on-board antenna. On the one hand, the performance of the on-board antenna is easily affected by the internal structure and environment of the earphone, and the signal transmission performance is not ideal. On the other hand, the performance of the on-board antenna depends on the performance of the master control chip, and the on-board antenna is difficult to work with a low-end chip. Since the radio frequency performance of the low-end chip itself is poor, it is difficult to effectively support the work of the on-board antenna, resulting in more unstable antenna signal transmission, and further exacerbating the problems of earphone lag, echo and frequent disconnection.

[0033] Based on this, the present application provides an earphone, please refer to Figures 1-3 , the earphone 1 includes a housing 10, a circuit board 20, an on-board antenna 30, a radio frequency module 41 and a master control chip 42.

[0034] In the present application, the housing 10 has an internal space, and the housing 10 is used to provide a housing space for other elements of the earphone 1. The circuit board 20 is arranged in the housing 10, the on-board antenna 30, the radio frequency module 41 and the master control chip 42 are arranged on the circuit board 20, the radio frequency module 41 is electrically connected with the on-board antenna 30, and the master control chip 42 is electrically connected with the radio frequency module 41. The master control chip 42 controls the on-board antenna 30 to transmit and receive signals through the radio frequency module 41, the on-board antenna 30 is responsible for receiving and transmitting wireless signals, so as to realize the communication between the earphone 1 and external devices.

[0035] Please continue to refer to Figures 2-3 , the circuit board 20 includes a first surface 201 and a second surface 202 arranged in the thickness direction X. The on-board antenna 30 is arranged on the first surface 201, the radio frequency module 41 is arranged on the second surface 202, the radio frequency module 41 is arranged in a staggered manner with the on-board antenna 30, which helps to increase the clearance area 203 of the on-board antenna 30. The master control chip 42 is arranged on the second surface 202, and the master control chip 42 is arranged in a staggered manner with the on-board antenna 30, which helps to increase the clearance area 203 of the on-board antenna 30. In this way, by planning the arrangement positions of the on-board antenna 30, the master control chip 42 and the radio frequency module 41 on the circuit board 20, the on-board antenna 30 is arranged in a staggered manner with the master control chip 42 and the radio frequency module 41, which helps to increase the clearance area 203 of the on-board antenna 30, reduces the signal shielding and electromagnetic interference of other elements on the on-board antenna 30, and further improves the signal transmission and reception capability of the on-board antenna 30, so as to realize more stable and efficient wireless audio transmission.

[0036] In some embodiments, the earphone 1 further comprises a load element 50 connected in series with the on-board antenna 30, by adjusting the parameter value of the load element 50, a proper load element 50 is selected to adjust the resonant frequency of the on-board antenna 30, so as to improve the performance of the on-board antenna 30.

[0037] For example, the load element 50 comprises at least one of a capacitor, an inductor and a zero ohm resistor, the on-board antenna 30 is impedance loaded by the capacitor, the inductor or the zero ohm resistor, and the current distribution and impedance characteristics on the on-board antenna 30 are changed, wherein the capacitor or the inductor can be a lumped element or a distributed parameter element formed by some structure and the on-board antenna 30.

[0038] In some embodiments, the on-board antenna 30 comprises a first antenna segment 31, a second antenna segment 32 and a third antenna segment 33 connected in sequence, the load element 50 comprises a capacitor 51, an inductor 52 and a zero ohm resistor 53, the zero ohm resistor 53 is connected in series between the first antenna segment 31 and the second antenna segment 32, the capacitor 51 is connected in series between the second antenna segment 32 and the third antenna segment 33, and the inductor 52 is connected in series between the third antenna segment 33 and the ground. In this way, the on-board antenna 30 is adjustable by setting the capacitor 51, the inductor 52 and the zero ohm resistor 53, for example, by adjusting the size of the capacitor 51, the resonant frequency and the impedance of the on-board antenna 30 can be adjusted.

[0039] In some embodiments, the clearance area 203 for setting the on-board antenna 30 is located at the edge area of the circuit board 20, wherein the clearance area 203 can be located at one side of the circuit board 20, or the clearance area 203 extends along the edge of the circuit board 20, and the on-board antenna 30 is set at the edge area of the circuit board 20. It should be noted that the traces of the elements on the circuit board 20 are mostly concentrated in the middle area, the trace length can be minimized to reduce the loss, and the clearance area 203 set at the edge area can reduce the influence of other elements and their traces on the signal of the on-board antenna 30. For example, the first antenna segment 31 and the second antenna segment 32 are U-shaped antennas, and the third antenna segment 33 is a W-shaped antenna, and the first antenna segment 31, the second antenna segment 32 and the third antenna segment 33 are connected in sequence along the length direction Y of the circuit board 20, wherein the first antenna segment 31 and the second antenna segment 32 are arranged side by side at one end of the circuit board 20 along the width direction Z, and the third antenna segment 33 is arranged at one end of the circuit board 20 along the length direction Y.

[0040] In some embodiments, the earphone 1 further comprises a transient suppression diode 43 connected in parallel with the on-board antenna 30. It can be understood that the earphone 1 is a product frequently contacted by users, and the on-board antenna 30 inside the earphone 1 is at risk of electrostatic discharge. In the trend of miniaturization, the earphone 1 is highly integrated, and the internal components are extremely compact, and the damage caused by electrostatic discharge is more serious. In order to improve the electrostatic discharge of the on-board antenna 30, the application adopts the transient suppression diode 43 as a protective element. Exemplarily, one end of the transient suppression diode 43 is electrically connected with the first antenna segment 31, and the other end is grounded. When the electrostatic discharge energy enters the on-board antenna 30 through the external environment, the transient suppression diode 43 can be activated to prevent excessive voltage and current from damaging the on-board antenna 30 and its internal circuit.

[0041] Optionally, the junction capacitance of the transient suppression diode 43 is Cj, wherein 0 < Cj < 0.25 pF. Within this range, the transient suppression diode 43 has little effect on the performance of the on-board antenna 30. It can be understood that if the junction capacitance value of the transient suppression diode 43 is too large, it will change the resonant frequency and impedance of the on-board antenna 30, affecting the performance of the on-board antenna 30.

[0042] In some embodiments, the earphone 1 further comprises an auxiliary antenna 44, one end of the auxiliary antenna 44 being grounded, the auxiliary antenna 44 being arranged in a spaced manner with the on-board antenna 30 and being coupled with the on-board antenna 30. The auxiliary antenna 44 plays a coupling and radiation role, further radiates the energy transmitted by the on-board antenna 30, thereby minimizing the reflection and loss of signals.

[0043] In some embodiments, the shell 10 comprises an upper shell 11 and a lower shell 12 mounted on the upper shell 11, and the upper shell 11 and the lower shell 12 jointly form a containing space. Among them, the upper shell 11 covers the lower shell 12 along the thickness direction X of the circuit board 20, thereby facilitating the assembly of the circuit board 20, the on-board antenna 30, the radio frequency module 41, the main control chip 42 and other components in the shell 10.

[0044] In the embodiments of the present application, the circuit board 20 is mounted on the shell 10, and the circuit board 20 is arranged apart from the side wall of the lower shell 12. The lower shell 12 includes a head portion for extending into the user's ear and a tail portion for being arranged outside the user's ear. In the length direction of the circuit board 20, the circuit board 20 has a first edge towards the head portion of the lower shell 12 and a second edge towards the tail portion of the lower shell 12. The interval distance between the first edge and the head portion of the lower shell 12 is d1, the interval distance between the second edge and the tail portion of the lower shell 12 is d2, 0mm < d1 < 1.2mm, 0mm < d2 < 0.5mm, and in the width direction Z of the circuit board 20, the interval distance between the edge of the circuit board 20 and the lower shell 12 is d3, 0mm < d3 < 0.3mm. In this way, the interval distance between the circuit board 20 and the side wall of the shell 10 is small, which is convenient for forming a compact structure and is beneficial to the miniaturization design of the earphone 1.

[0045] In some embodiments, the circuit board 20 is a multilayer circuit board, and the circuit board 20 is a hard circuit board. The circuit board 20 is provided with wires, which include power lines, signal lines and ground lines, etc., and the wires are used for electrically connecting the elements arranged on the circuit board 20, such as the radio frequency elements in the radio frequency module 41, the master control chip 42, etc. Generally, the circuit board 20 includes a plurality of sub-wire layers and medium layers arranged in layers. Each two sub-wire layers are provided with a medium layer therebetween. Two of the plurality of sub-wire layers are respectively located at two outer sides in the thickness direction X of the circuit board 20 and form the first surface 201 and the second surface 202. The circuit board 20 further includes a ground layer and a power layer, and the ground layer and the power layer are arranged between the plurality of sub-wire layers. The ground of the elements arranged on the circuit board 20 can be connected to the ground layer through a via.

[0046] In some embodiments, the on-board antenna 30 is arranged in the clearance area 203, and the clearance area 203 is completely clear. Therefore, the ground layer, the power layer and the plurality of sub-wire layers correspond to the clearance to form the clearance area 203, and the projection of the on-board antenna 30 in the thickness direction X of the circuit board 20 is arranged apart from the ground layer. It should be noted that the boundary between the clearance area 203 and the non-clearance area (dashed line) is only for clearly showing the clearance area 203, and does not represent the actual boundary shape and size of the area. Figure 3

[0047] ​In some embodiments, the earphone 1 further comprises a battery 61 and a flexible wire 62, the battery 61 is arranged on one side of the second surface 202 of the circuit board 20 along the thickness direction X of the circuit board 20, and the battery 61 is electrically connected to the circuit board 20 through the flexible wire 62. Among them, the first surface 201 of the circuit board 20 is provided with an electrode pad 21, one end of the flexible wire 62 is connected to the electrode pad 21, the other end of the flexible wire 62 is connected to the battery 61, and the flexible wire 62 is arranged around the circuit board 20. It can be seen that the flexible wire 62 is bent and extended from the end of the first surface 201 to below the main control chip 42 arranged on the second surface 202, and is bent and extended towards the battery 61 after being folded back along the length direction of the circuit board 20, and is finally connected to one side of the battery 61.

[0048] In actual use, the length of the flexible wire 62 is redundant, at least part of the wire is movable, and displacement may occur during use of the earphone 1, which may cause bumping to elements on the circuit board 20. In the embodiment of the application, the flexible wire 62 is arranged spaced apart from the second surface 202, which reduces the probability of contact between the flexible wire 62 and the elements arranged on the second surface 202, improves the damage and electromagnetic interference of the elements caused by the flexible wire 62, and reduces the risk of performance fluctuation of the on-board antenna 30.

[0049] Alternatively, the flexible wire 62 can be directly spaced apart from the second surface 202, that is, the spacing is achieved by maintaining a certain distance, thereby reducing the risk of contact and interference of the flexible wire 62 to the elements arranged on the second surface 202. Alternatively, the flexible wire 62 can be indirectly spaced apart from the second surface 202, for example, by arranging a spacer 63 to space apart the flexible wire 62 and the second surface 202, the spacer 63 is arranged between the flexible wire 62 and the second surface 202, and the spacer 63 can play a role of physical isolation.

[0050] For example, the spacer 63 can be EVA cotton (Ethylene Vinyl Acetate Copolymer, Ethylene Vinyl Acetate Copolymer cotton), wherein the thickness of the EVA cotton is h, 0.8mm≤h≤2mm, within this range, the EVA cotton can play a good isolation role. If h<0.8mm, the EVA cotton is too thin, the spacer 63 may lack sufficient strength and durability, and it is difficult to effectively play a spacing and protection role for a long time; if h>2.0mm, the EVA cotton is too thick, the spacer 63 occupies a larger space in the thickness direction X of the circuit board 20, which is not conducive to realizing the compactness of the structure of the earphone 1.

[0051] In some embodiments, the circuit board 20 is provided with a ground layer, and the projection of the electrode pad 21 on the thickness direction X of the circuit board 20 is spaced apart from the ground layer, that is, the region of the first surface 201 for arranging the electrode pad 21 corresponds to a clearance, and the clearance treatment can reduce electromagnetic interference and radio frequency interference, thereby improving the overall performance of the circuit. Further, the distance from the edge of the projection of the electrode pad 21 on the thickness direction X of the circuit board 20 to the ground layer is greater than 0.5 mm, so that the signal interference and signal integrity can be reduced, and the electrode pad 21 can be prevented from being too close to other elements and wires, thereby reducing the influence of the welding thermal stress of the electrode pad 21 on other elements and wires.

[0052] In some embodiments, the electrode pad 21 includes a positive electrode pad 211 and a negative electrode pad 212, and the circuit board 20 is further provided with a positive electrode wire and a negative electrode wire. The earphone 1 further includes a first inductor 45 and a second inductor 46 arranged on the second surface 202, the first inductor 45 is connected in series between the positive electrode wire and the positive electrode pad 211, and the second inductor 46 is connected in series between the negative electrode wire and the negative electrode pad 212. The first inductor 45 and the second inductor 46 are arranged side by side in the width direction Z of the circuit board 20. In the present application, the first inductor 45 and the second inductor 46 are connected in series in the battery wire to play a filtering role. Since the input end current of the battery 61 fluctuates, the series inductor can hinder the high-frequency current path and filter high-frequency interference signals.

[0053] Further, the inductance value of the first inductor 45 is L1, and the inductance value of the second inductor 46 is L2, wherein 10nH≤L1≤100nH, 10nH≤L2≤100nH. Within this range, the first inductor 45 and the second inductor 46 have appropriate response speed, and can well adapt to the battery circuit and play a role in optimizing the performance and stability of the circuit. For example, L1 can be 68nH, and L2 can be 68nH.

[0054] In some embodiments, the earphone 1 further includes a speaker assembly 64, which is electrically connected to the circuit board 20 through the flexible flat cable 62. The speaker assembly 64 is arranged on the head of the lower shell 12. The speaker assembly 64 is responsible for converting electrical signals in the earphone 1 into sound signals and emitting sound. Specifically, along the thickness direction X of the circuit board 20, the speaker assembly 64 is arranged between the second surface 202 of the circuit board 20 and the battery 61. The first surface 201 of the circuit board 20 is provided with a speaker pad 22. One end of a part of the flexible flat cable 62 is connected to the speaker pad 22, and the other end is connected to the speaker assembly 64. In this way, the battery 61 and the speaker assembly 64 are both electrically connected to the circuit board 20 through the flexible flat cable 62, and the battery 61 can supply power to the speaker assembly 64.

[0055] In the above structure, the loudspeaker pad 22 includes a loudspeaker positive pad 221 and a loudspeaker negative pad 222. Along the length direction Y of the circuit board 20, the positive pad 211 and the negative pad 212 of the electrode pad 21, the loudspeaker positive pad 221 and the loudspeaker negative pad 222 of the loudspeaker pad 22 are all located at the end of the circuit board 20 away from the on-board antenna 30, and the four pads are arranged side by side along the width direction Z of the circuit board 20, reducing the cross interference between the pads and improving the neatness and maintainability of the circuit. Among them, each pad is rectangular, and the distance between the adjacent two pads in the width direction Z of the circuit board 20 is greater than 0.5mm, so that the solder can flow fully and cover the pad during soldering, thereby avoiding soldering defects such as empty welding and virtual welding, and the sufficient distance also improves the heat stress problem that may occur during soldering, thereby improving the soldering quality.

[0056] In a specific assembly, the flexible flat cable 62 can be connected with the above-mentioned electrode pad 21 and loudspeaker pad 22 through pulse thermal compression welding. The pulse thermal compression welding uses a short high-temperature pulse to melt the solder and quickly cools, thereby forming a stable solder joint. The pulse thermal compression welding has good welding consistency, which helps to keep the multiple pad points on the circuit board 20 have the same electrical performance and mechanical strength, thereby improving the stability and reliability of the circuit structure and improving signal interference and performance degradation.

[0057] In the embodiment of the present application, the main control chip 42 is responsible for processing audio signals, controlling various functions of the earphone and communicating with other devices. The main control chip 42 is connected with other components (such as a speaker, a microphone, a battery 61, etc.) of the earphone 1 through the circuit board 20. Optionally, the main control chip 42 can use a high-end chip or a low-end chip.

[0058] In the embodiment of the present application, the radio frequency module 41 adopts a smaller package size, thereby leaving more space for the on-board antenna 30 and improving the overall performance of the Bluetooth module of the earphone 1. For example, the elements (such as capacitors, resistors, inductors, etc.) on the radio frequency module 41 adopt a 01005 package size, and the length of the 01005 package size is 0.4mm and the width is 0.2mm. The smaller package size does not occupy too much space on the first surface 201, thereby leaving more space for the on-board antenna 30 and improving the performance of the on-board antenna 30.

[0059] It should be noted that the type of the earphone 1 is not particularly limited in the present application, which can be an in-ear earphone, a semi-in-ear earphone, an open earphone, an ear muff earphone, etc.

[0060] In some embodiments, the earphone 1 can be an open earphone, for example, the earphone 1 is a bone conduction earphone, and the circuit board 20, the on-board antenna 30, the radio frequency module 41, and the master control chip 42 are arranged in the control part of the bone conduction earphone. It should be noted that the bone conduction earphone transmits sound through the skull to the inner ear directly without passing through the eardrum by vibrating the bone through the vibrator. The bone conduction earphone generally includes two machine core parts, two control parts, a rear hanging part, and an ear hanging part. The machine core part and the control part are connected through the ear hanging part, and the two ends of the rear hanging part are connected to one of the machine core parts. The inside of the machine core part is provided with a vibrator unit, and the front end of the machine core part has a release area in contact with the skin of the user's head. In use, the contact area is in contact with the skin of the human head through the self-elastic force of the rear hanging part and the ear hanging part to form a clamping force, the vibrator unit converts the audio electrical signal into mechanical vibration, and transmits to the user through the contact area, thereby generating a bone channel, and the user ultimately receives the corresponding sound through bone conduction.

[0061] Alternatively, the earphone 1 is an ear hanging type earphone. In order to balance the weight distribution of the earphone and reduce the pressure on the ear, the power supply assembly and the electro-acoustic assembly are generally arranged in two earphone shells in the ear hanging type earphone, the two earphone shells are connected through the ear hanging part, and the connecting wires are arranged inside the ear hanging part to realize the electrical connection between the power supply assembly and the electro-acoustic assembly. The earphone shell provided with the electro-acoustic assembly has a first surface for fitting the inner concha of the user, and the end of the ear hanging part away from the earphone shell deviates from the first surface to form a clamping space between the ear hanging part and the earphone shell for clamping the ear of the user. In this embodiment, the circuit board 20 and the electro-acoustic assembly are arranged in the same earphone shell, and the on-board antenna 30, the radio frequency module 41, and the master control chip 42 are arranged in the circuit board 20 in a staggered manner.

[0062] Alternatively, the earphone 1 can be an ear clip type earphone. In order to balance the weight distribution of the earphone and reduce the pressure on the ear, the power supply assembly and the electro-acoustic assembly are generally arranged in two earphone shells in the ear clip type earphone, the two earphone shells are connected through the ear clip part, and the connecting wires are arranged inside the ear hanging part to realize the electrical connection between the power supply assembly and the electro-acoustic assembly. The ear clip part is arranged in an arc shape and forms a clamping space in the middle region, and the clamping space of the ear clip part can clamp the earphone 1 on the ear of the user. In this embodiment, the circuit board 20 and the electro-acoustic assembly are arranged in the same earphone shell, and the on-board antenna 30, the radio frequency module 41, and the master control chip 42 are arranged in the circuit board 20 in a staggered manner.

[0063] Optionally, the earphone 1 can be a neckband earphone, which comprises a neckband and earphone bodies arranged at two ends of the neckband, wherein the earphone bodies are wearable on the ears of a user, and the neckband is capable of being hung on the neck of the user. In this embodiment, the earphone body comprises a shell 10, and an electro-acoustic assembly, a power supply assembly and a circuit board 20 arranged in the shell 10, wherein the electro-acoustic assembly and the power supply assembly are electrically connected to the circuit board 20, so that the power supply assembly can supply power to the circuit board 20 and the electro-acoustic assembly, and the electro-acoustic assembly is used for sound generation. Moreover, the on-board antenna 30 is arranged in a staggered manner with the radio frequency module 41 and the master control chip 42 on the circuit board 20.

[0064] In some embodiments, the earphone 1 can be an in-ear earphone, and an earplug part is arranged on the earphone body of the in-ear earphone. By inserting the earplug part into the ear canal, better sealing is obtained to reduce sound leakage and reduce the influence of external noise on audio. In the in-ear earphone, the earplug part is arranged outside the shell 10, and the electro-acoustic assembly, the power supply assembly and the circuit board 20 are arranged in the internal space of the shell 10. The on-board antenna 30 is arranged in a staggered manner with the radio frequency module 41 and the master control chip 42 on the circuit board 20, and the electro-acoustic assembly and the power supply assembly are electrically connected to the circuit board 20, so that the power supply assembly can supply power to the circuit board 20 and the electro-acoustic assembly. The electro-acoustic assembly is arranged corresponding to the earplug part, so that the sound emitted by the electro-acoustic assembly can be effectively transmitted to the user's ear after the earplug part is inserted into the user's ear canal.

[0065] In some embodiments, the earphone 1 can be a circum-aural earphone, which comprises a support assembly and ear cover assemblies. The two ends of the support assembly are connected to the two ear cover assemblies. When a user wears the circum-aural earphone, the support assembly will span across the head of the user, and the two ends thereof form a clamping force so that the two ear cover assemblies are worn on the ears of the user. The circum-aural earphone further comprises a sound broadcasting assembly arranged in the ear cover assembly, and the sound broadcasting assembly comprises a circuit board 20, an on-board antenna 30, a radio frequency module 41 and a master control chip 42. The on-board antenna 30 is arranged in a staggered manner with the radio frequency module 41 and the master control chip 42 on the circuit board 20.

[0066] In some embodiments, the earphone 1 can be a semi-in-ear earphone, which is fixed by a clamping position between the earphone body and the user's outer ear, wherein the earphone body includes a shell 10 having a front cavity and a rear cavity, wherein the part of the shell 10 corresponding to the front cavity is used to clamp into the user's outer ear, and the part of the shell 10 corresponding to the rear cavity is used to be placed outside the user's ear. In this embodiment, the circuit board 20 is arranged in the rear cavity of the shell 10, and the battery 61 and the loudspeaker assembly 64 are arranged in the front cavity of the shell 10. The circuit board 20 includes a first surface 201 and a second surface 202 arranged in a thickness direction X, the radio frequency module 41 is electrically connected with the on-board antenna 30, the main control chip 42 is electrically connected with the radio frequency module 41, and the main control chip 42 controls the on-board antenna 30 to transmit and receive signals through the radio frequency module 41, wherein the on-board antenna 30 is arranged on the first surface 201, and the radio frequency module 41 and the main control chip 42 are arranged on the second surface 202.

[0067] It should be noted that compared with in-ear earphones, semi-in-ear earphones are closer to the user's ear, and the user's ear absorbs more antenna energy of the Bluetooth module in the semi-in-ear earphone, resulting in a relatively reduced energy radiated by the antenna, thereby affecting the radiation performance of the antenna and increasing the risk of product lag, echo and frequent disconnection. Based on the above semi-in-ear earphone, please refer to Figure 4 It can be seen that in the entire Bluetooth frequency band, the average radiation efficiency of the on-board antenna 30 in the above semi-in-ear earphone reaches -12.60 dB, which has good radiation performance. Please refer to Figure 5 When the head model wears the above semi-in-ear earphone, the on-board antenna 30 radiates close to a sphere, and the radiation is relatively uniform and covers a wide range, which can bring good experience to the user and improve the problem of earphone lag, echo and frequent disconnection and reconnection.

[0068] In some embodiments, the earphone 1 is an air conduction earphone, including but not limited to the above ear-hanging earphone, ear-clamping earphone, neck-hanging earphone, in-ear earphone, semi-in-ear earphone, etc.

[0069] The following will take the semi-in-ear earphone as an example and combine specific embodiments to further illustrate the present application. It should be understood that these embodiments are only used to illustrate the present application and are not used to limit the scope of the present application. The performance of the semi-in-ear earphone is tested by the following method in each embodiment and each comparative example in the present application:

[0070] (1) Distance pulling test

[0071] In the simulation test environment, the earphone to be tested is connected with the first pairing device at the test starting point, and data information is transmitted to the earphone to be tested through the first pairing device based on the test item. The earphone to be tested is moved to an initial position 10 m away from the test starting point, and the audio quality of the earphone to be tested is observed and recorded. The distance between the earphone to be tested and the pairing device is gradually increased, and the audio quality of the earphone to be tested is observed and recorded. The distance at which the earphone to be tested first appears to be stuck and the distance at which the earphone to be tested continuously appears to be stuck are recorded.

[0072] (2) Anti-interference sticking test

[0073] In the simulation interference environment, the earphone to be tested is connected with the second pairing device, and signal data is transmitted to the earphone to be tested through the second pairing device, while a strong interference signal is emitted through the channel of an interference device (such as a router, etc.), and the number of times the earphone to be tested is stuck within 10 min is recorded.

[0074] Comparative example

[0075] The comparative example includes a shell, a circuit board, an on-board antenna, a radio frequency module, and a master control chip. The circuit board is arranged in the shell, the on-board antenna, the radio frequency module, and the master control chip are arranged on the circuit board, the radio frequency module is electrically connected with the on-board antenna, the master control chip is electrically connected with the radio frequency module, and the master control chip controls the on-board antenna to transmit and receive signals through the radio frequency module. The on-board antenna, the radio frequency module, and the master control chip are arranged on the same surface of the circuit board.

[0076] Embodiment

[0077] The difference between the comparative example and the embodiment includes that the circuit board 20 includes a first surface 201 and a second surface 202 arranged in a thickness direction X, the on-board antenna 30 is arranged on the first surface 201, and the radio frequency module 41 and the master control chip 42 are arranged on the second surface 202.

[0078] The anti-pulling test results of the semi-in-ear earphone in the comparative example and the embodiment are shown in Table 1.

[0079] Table 1

[0080]

[0081] According to the experimental results in Table 1, it can be seen that, by arranging the on-board antenna 30 on the first surface 201 of the circuit board 20 and arranging the master control chip 42 on the second surface 202 of the circuit board 20, in the test items of indoor and outdoor scenes, playing music, and calling, the first sticking distance of the embodiment is greater than that of the comparative example, and the continuous sticking distance of the embodiment is greater than that of the comparative example. Compared with the comparative example, the signal transmission effect of the embodiment is improved.

[0082] The anti-interference jam test results of the semi-ear canal earphones in the comparative examples and the examples are shown in Table 2.

[0083] Table 2

[0084]

[0085] According to the experimental results in Table 2, it can be seen that in the case of transmitting strong interference signals in each channel, the jam times of the semi-ear canal earphones of the examples are less than those of the semi-ear canal earphones of the comparative examples. Compared with the average jam of 80.2 times of the semi-ear canal earphones of the comparative examples, the average jam of the semi-ear canal earphones of the examples is 53.6 times, and the average jam times are reduced by 33.2%. Compared with the cumulative jam of 401 times of the semi-ear canal earphones of the comparative examples, the cumulative jam of the semi-ear canal earphones of the examples is 268 times, and the cumulative jam times are reduced by 33.2%. In summary, the signal transmission quality of the on-board antenna 30 of the semi-ear canal earphones of the examples is improved more obviously.

[0086] The same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components; in the description of the present application, it should be understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation of the present patent. For those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0087] In addition, in the present application, the description involving "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0088] In the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixing" and the like should be understood in a broad sense, for example, "fixing" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0089] The above only describes preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An earphone, characterized by comprising: The earphone comprises: a shell; a circuit board arranged in the shell, the circuit board comprising a first surface and a second surface arranged in a thickness direction; a built-in antenna arranged on the first surface; a radio frequency module electrically connected with the built-in antenna, the radio frequency module being arranged on the second surface to increase a clearance of the built-in antenna; a master control chip electrically connected with the radio frequency module, the master control chip controlling the built-in antenna to transmit and receive signals through the radio frequency module, the master control chip being arranged on the second surface to increase the clearance of the built-in antenna.

2. The earphone of claim 1, wherein The earphone further comprises a load element connected in series with the built-in antenna, the load element being used to improve performance of the built-in antenna.

3. The earphone of claim 2, wherein The load element comprises at least one of a capacitor, an inductor and a zero ohm resistor.

4. The earphone of claim 2, wherein The built-in antenna comprises a first antenna segment, a second antenna segment and a third antenna segment connected in sequence, the load element comprises a capacitor, an inductor and a zero ohm resistor, the zero ohm resistor is connected in series between the first antenna segment and the second antenna segment, the capacitor is connected in series between the second antenna segment and the third antenna segment, and the inductor is connected in series between the third antenna segment and a ground.

5. The earphone of claim 1, wherein The first surface of the circuit board is provided with an electrode pad, and the earphone further comprises: a battery arranged on one side of the second surface of the circuit board; a flexible flat cable, one end of the flexible flat cable being connected to the electrode pad, the other end of the flexible flat cable being connected to the battery, the flexible flat cable being arranged around the circuit board, and the flexible flat cable being arranged in a spaced manner with the second surface.

6. The earphone of claim 5, wherein The earphone further comprises a spacer arranged between the flexible flat cable and the second surface to arrange the flexible flat cable in a spaced manner with the second surface.

7. The earphone of claim 5, wherein The circuit board is provided with a ground layer, a projection of the electrode pad in the thickness direction of the circuit board is arranged in a spaced manner with the ground layer; and / or a projection of the built-in antenna in the thickness direction of the circuit board is arranged in a spaced manner with the ground layer.

8. The earphone of claim 5, wherein, The electrode pad comprises a positive electrode pad and a negative electrode pad, the circuit board is further provided with a positive electrode trace and a negative electrode trace, the earphone further comprises a first inductor and a second inductor, the first inductor is connected in series between the positive electrode trace and the positive electrode pad, and the second inductor is connected in series between the negative electrode trace and the negative electrode pad.

9. The earphone of claim 1, wherein, The earphone further comprises an auxiliary antenna, one end of the auxiliary antenna being grounded, the auxiliary antenna being arranged in a spaced manner with the built-in antenna and being coupled with the built-in antenna.

10. The earphone of claim 1, wherein, The earphone further comprises a transient voltage suppression diode connected in parallel with the built-in antenna.

11. The earphone of claim 1, wherein, The earphone satisfies at least one of the following conditions: (1) the earphone is one of an open earphone, a semi-in-ear earphone, an in-ear earphone and a headphone; (2) the earphone is one of a bone conduction earphone and an air conduction earphone.

Images