Tail gas dust removal treatment device for silicon wafer cutting, grinding and polishing

Abstract

The utility model discloses a silicon wafer cutting, grinding and polishing tail gas dust removal treatment device which comprises a shell, a first spraying washing bin, a second spraying washing bin, a third spraying washing bin and a fourth spraying washing bin which are communicated in sequence are formed in the shell through a partition plate frame, and a circulating filtering mechanism communicated with the interior of the shell is arranged on the outer side of the shell. The first washing and spraying mechanism, the second washing and spraying mechanism, the third washing and spraying mechanism and the fourth washing and spraying mechanism are connected with the circulating filtering mechanism, and the silicon wafer cutting, grinding and polishing production tail gas is circularly washed in the first spraying washing bin, the second washing and spraying bin, the third spraying washing bin and the fourth spraying washing bin; the silicon wafer cutting, grinding and polishing production tail gas makes full contact with water, silicon dust in the silicon wafer cutting, grinding and polishing production tail gas is removed, multi-stage circulating washing and spraying are adopted, the treatment effect of the silicon wafer cutting, grinding and polishing production tail gas is improved, and the silicon wafer cutting, grinding and polishing production tail gas reaches the emission standard after being treated.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the tail gas treatment technical field of silicon wafer production, concretely relates to a tail gas dust removal treatment device of silicon wafer cutting, grinding and polishing. BACKGROUND

[0002] Silicon wafer, also known as wafer, is processed from silicon ingot, and millions of transistors can be etched on the silicon wafer through special process, which is widely used in the manufacture of integrated circuits.

[0003] Tail gas will be generated in the production process of silicon wafer cutting, grinding and polishing, and the production tail gas needs to be treated by a tail gas treatment device. The existing silicon wafer production tail gas treatment device is mostly a single-cavity scrubbing tower for washing the silicon wafer production tail gas. However, the single-cavity silicon wafer production tail gas treatment device cannot completely wash the silicon wafer production tail gas, resulting in poor silicon wafer production tail gas treatment effect and failure to meet the emission standard. Therefore, we propose a tail gas dust removal treatment device for silicon wafer cutting, grinding and polishing. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a tail gas dust removal treatment device for silicon wafer cutting, grinding and polishing to solve the problems raised in the background.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a tail gas dust removal treatment device for silicon wafer cutting, grinding and polishing, comprising a shell, a first spray washing bin, a second washing spray bin, a third spray washing bin and a fourth washing spray bin are formed in sequence and connected by a partition plate frame in the shell, a tail gas inlet and a tail gas outlet are respectively arranged at the positions corresponding to the first spray washing bin and the fourth washing spray bin on the shell;

[0006] A circulating filtration mechanism is arranged on the outside of the shell and communicates with the inside of the shell. The inside of the first spray washing bin, the second washing spray bin, the third spray washing bin and the fourth washing spray bin is respectively provided with a first washing spray mechanism, a second washing spray mechanism, a third washing spray mechanism and a fourth washing spray mechanism connected with the circulating filtration mechanism.

[0007] Preferably, the bottom of the first spray washing bin and the second washing spray bin is communicated, the upper part of the second washing spray bin and the third spray washing bin is communicated, and the bottom of the third spray washing bin and the fourth washing spray bin is communicated.

[0008] Preferably, the circulating filtration mechanism comprises a circulating water pump, a circulating water inlet pipe, a circulating water outlet pipe and a filter.

[0009] The circulating water pump is arranged outside the shell through a mounting support, an output end of the circulating water pump is communicated with the first washing spray mechanism, the second washing spray mechanism, the third washing spray mechanism and the fourth washing spray mechanism through a circulating water inlet pipe, an input end of the circulating water pump is connected with the circulating water outlet pipe, one end of the circulating water outlet pipe penetrates into the inner bottom of the second washing spray chamber, and the filter is arranged at a position corresponding to the outside of the shell on the circulating water outlet pipe.

[0010] Preferably, the outside of the shell is further provided with a water injection pipe penetrating into the lower part of the third spray washing chamber, and the bottoms of the second washing spray chamber and the third spray washing chamber are communicated through a water passage.

[0011] Preferably, the first washing spray mechanism and the second washing spray mechanism each comprise a main pipe, a plurality of sub-pipes and a double-end spray nozzle.

[0012] The main pipe is communicated with the circulating water inlet pipe, the plurality of sub-pipes are arranged at equal intervals and communicated with the main pipe, and output ends of the plurality of sub-pipes each extend into the first spray washing chamber and the second washing spray chamber, and each output end of the sub-pipes is connected with the double-end spray nozzle.

[0013] Preferably, the third washing spray mechanism and the fourth washing spray mechanism each comprise a connecting pipe, a single-end spray nozzle, a hole plate and a spray seat.

[0014] One of the connecting pipes is communicated with the main pipe and penetrates into the upper part of the third spray washing chamber, and the other connecting pipe is communicated with the circulating water inlet pipe and penetrates into the upper part of the fourth washing spray chamber, and output ends of the two connecting pipes are each provided with the single-end spray nozzle.

[0015] The third spray washing chamber and the fourth washing spray chamber are each provided with the hole plates distributed at equal intervals, and the uppermost hole plate is provided with the spray seat.

[0016] Preferably, the spray seat is in a circular truncated cone structure, and the spray seat and the single-end spray nozzle are arranged in alignment.

[0017] Compared with the prior art, the utility model has the beneficial effects that:

[0018] 1. The utility model discloses a first spray washing bin, second washing spray bin, third spray washing bin, fourth washing spray bin, circulation filter mechanism, first washing spray mechanism, second washing spray mechanism, third washing spray mechanism and fourth washing spray mechanism, and the silicon wafer cutting, grinding and polishing production tail gas is washed in the first spray washing bin, second washing spray bin, third spray washing bin and fourth washing spray bin, makes the silicon wafer cutting, grinding and polishing production tail gas and water fully contact, removes the silicon dust of silicon wafer cutting, grinding and polishing production tail gas, and the silicon wafer cutting, grinding and polishing production tail gas treatment effect is good, adopts multistage circulation washing spray, improves the processing effect of silicon wafer cutting, grinding and polishing production tail gas, and makes the silicon wafer cutting, grinding and polishing production tail gas reach the discharge standard after processing.

[0019] 2. The utility model discloses in the spray water circulation process, the water in the shell is circulated to the circulating water pump by the circulation outlet pipe, the filter on the circulation outlet pipe can filter the impurity in the water at this time, guarantee the clean of circulation spray water, prolong the use time of circulation spray water, reduce the cost. ACCURACY OF DRAWINGS

[0020] Figure 1 It is the whole three -dimensional structure schematic diagram of the utility model;

[0021] Figure 2 It is the whole three -dimensional structure schematic diagram of the utility model;

[0022] Figure 3 It is the sectional three -dimensional structure schematic diagram of the utility model;

[0023] Figure 4 It is the sectional three -dimensional structure schematic diagram of the utility model;

[0024] Figure 5 It is the sectional three -dimensional structure schematic diagram of the utility model.

[0025] In the drawing: 1, shell;2, partition plate frame;3, first spray washing bin;4, second washing spray bin;5, third spray washing bin;6, fourth washing spray bin;7, tail gas import;8, tail gas export;9, circulation filter mechanism;901, circulating water pump;902, circulation inlet pipe;903, circulation outlet pipe;904, filter;10, first washing spray mechanism;11, second washing spray mechanism;12, third washing spray mechanism;13, fourth washing spray mechanism;14, water injection pipe;15, water inlet;16, main pipeline;17, auxiliary pipeline;18, double -end spray nozzle;19, connecting pipe;20, single -end spray nozzle;21, aperture plate;22, spray seat. DETAILED DESCRIPTION

[0026] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0027] Please refer to Figures 1-5 The tail gas dust removal treatment device for silicon wafer cutting, grinding and polishing provided by the present application comprises a shell 1, a first spray washing bin 3, a second spray washing bin 4, a third spray washing bin 5 and a fourth spray washing bin 6 are sequentially connected in communication through a partition plate frame 2 in the shell 1, the bottom of the first spray washing bin 3 and the second spray washing bin 4 is communicated, the upper part of the second spray washing bin 4 and the third spray washing bin 5 is communicated, the bottom of the third spray washing bin 5 and the fourth spray washing bin 6 is communicated, and a tail gas inlet 7 and a tail gas outlet 8 are respectively arranged at positions corresponding to the first spray washing bin 3 and the fourth spray washing bin 6 on the shell 1;

[0028] A circulating filtration mechanism 9 in communication with the inside of the shell 1 is arranged on the outside of the shell 1, the circulating filtration mechanism 9 comprises a circulating water pump 901, a circulating water inlet pipe 902, a circulating water outlet pipe 903 and a filter 904, the circulating water pump 901 is arranged on the outside of the shell 1 through a mounting support, the output end of the circulating water pump 901 is communicated with a first spray washing mechanism 10, a second spray washing mechanism 11, a third spray washing mechanism 12 and a fourth spray washing mechanism 13 through the circulating water inlet pipe 902, the input end of the circulating water pump 901 is connected with the circulating water outlet pipe 903, one end of the circulating water outlet pipe 903 is led into the inside bottom of the second spray washing bin 4, the filter 904 is arranged at a position corresponding to the outside of the shell 1 on the circulating water outlet pipe 903, and a water injection pipe 14 leading into the lower part of the third spray washing bin 5 is further arranged on the outside of the shell 1, and the bottom of the second spray washing bin 4 and the third spray washing bin 5 is communicated through a water inlet 15;

[0029] The inside of the first spray washing bin 3, the second spray washing bin 4, the third spray washing bin 5 and the fourth spray washing bin 6 is respectively provided with the first spray washing mechanism 10, the second spray washing mechanism 11, the third spray washing mechanism 12 and the fourth spray washing mechanism 13 connected with the circulating filtration mechanism 9;

[0030] The first washing spray mechanism 10 and the second washing spray mechanism 11 each comprise a main pipe 16, a plurality of sub-pipes 17 and a double-end spray nozzle 18; the main pipe 16 is communicated with the circulating water inlet pipe 902, the plurality of sub-pipes 17 are arranged at equal intervals and communicated with the main pipe 16, and the output ends of the plurality of sub-pipes 17 each extend into the first spray washing bin 3 and the second washing spray bin 4, and the output end of each sub-pipe 17 is connected with a double-end spray nozzle 18;

[0031] The third washing spray mechanism 12 and the fourth washing spray mechanism 13 each comprise a connecting pipe 19, a single-end spray nozzle 20, a hole plate 21 and a spray seat 22; one of the connecting pipes 19 is communicated with the main pipe 16 and penetrates into the upper part of the third spray washing bin 5, and the other connecting pipe 19 is communicated with the circulating water inlet pipe 902 and penetrates into the upper part of the fourth washing spray bin 6, and the output ends of the two connecting pipes 19 are each provided with a single-end spray nozzle 20; the third spray washing bin 5 and the fourth washing spray bin 6 are each provided with hole plates 21 arranged at equal intervals, and the uppermost hole plate 21 is provided with a spray seat 22, the spray seat 22 has a circular truncated cone structure, and the spray seat 22 and the single-end spray nozzle 20 are arranged in alignment, so that the spray water is not directly sprayed onto the hole plate 21, and the device can be used normally.

[0032] The utility model discloses a first spray washing bin 3, second washing spray bin 4, third spray washing bin 5, fourth washing spray bin 6, circulation filtering mechanism 9, first washing spray mechanism 10, second washing spray mechanism 11, third washing spray mechanism 12 and fourth washing spray mechanism 13 are provided, when using, first, injects water to the water injection pipe 14, makes water fill up the lower part of first spray washing bin 3, second washing spray bin 4, third spray washing bin 5, fourth washing spray bin 6, then through the tail gas import 7 and enter the silicon wafer cutting grinding polishing production tail gas, starts circulating water pump 901, and circulating water pump 901 supplies water to first washing spray mechanism 10, second washing spray mechanism 11, third washing spray mechanism 12 and fourth washing spray mechanism 13 through circulating inlet pipe 902, when the silicon wafer cutting grinding polishing production tail gas enters first spray washing bin 3 and second washing spray bin 4 in proper order, double -end spray nozzle 18 carries out twice spray dedusting to the silicon wafer cutting grinding polishing production tail gas, carries away a large amount of silicon dust in the silicon wafer cutting grinding polishing production tail gas, then the silicon wafer cutting grinding polishing production tail gas enters third spray washing bin 5 and fourth washing spray bin 6 in proper order, and through single -end spray nozzle 20 and orifice plate 21 cooperation uses, again to the silicon wafer cutting grinding polishing production tail gas carries out spray washing, makes the silicon wafer cutting grinding polishing production tail gas and water carry out full contact, and the silicon wafer cutting grinding polishing production tail gas completes the circulation washing in first spray washing bin 3, second washing spray bin 4, third spray washing bin 5 and fourth washing spray bin 6, removes the silicon dust of silicon wafer cutting grinding polishing production tail gas, finally by tail gas export 8 and exports, and the silicon wafer cutting grinding polishing production tail gas treatment effect is good, adopts multistage circulation washing spray, improves the processing effect of the silicon wafer cutting grinding polishing production tail gas, makes the silicon wafer cutting grinding polishing production tail gas reach the discharge standard after processing;

[0033] In the spray water circulation process, the water in the shell 1 is circulated to the circulating water pump 901 by the circulating outlet pipe 903, at this time, the filter 904 on the circulating outlet pipe 903 can filter the impurities in the water, ensure the cleanliness of the circulating spray water, prolong the use time of the circulating spray water, and reduce the cost.

[0034] In summary, the use method of the tail gas dust removal treatment device for silicon wafer cutting, grinding and polishing provided by the embodiment is as follows: when used, water is first injected into the water injection pipe 14 to fill the lower parts of the first spray washing bin 3, the second spray washing bin 4, the third spray washing bin 5 and the fourth spray washing bin 6, then the silicon wafer cutting, grinding and polishing production tail gas is introduced through the tail gas inlet 7, the circulating water pump 901 is started, the circulating water pump 901 supplies water to the first spray washing mechanism 10, the second spray washing mechanism 11, the third spray washing mechanism 12 and the fourth spray washing mechanism 13 through the circulating water inlet pipe 902, when the silicon wafer cutting, grinding and polishing production tail gas enters the first spray washing bin 3 and the second spray washing bin 4 in sequence, the double-end spray nozzle 18 sprays and removes dust twice on the silicon wafer cutting, grinding and polishing production tail gas, and carries away a large amount of silicon dust in the silicon wafer cutting, grinding and polishing production tail gas, then the silicon wafer cutting, grinding and polishing production tail gas enters the third spray washing bin 5 and the fourth spray washing bin 6 in sequence, and is sprayed and washed again by the single-end spray nozzle 20 and the perforated plate 21, so that the silicon wafer cutting, grinding and polishing production tail gas is fully contacted with water, and the silicon wafer cutting, grinding and polishing production tail gas is washed in the first spray washing bin 3, the second spray washing bin 4, the third spray washing bin 5 and the fourth spray washing bin 6 to remove the silicon dust in the silicon wafer cutting, grinding and polishing production tail gas.

[0035] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A device for removing dust from exhaust gas of a silicon wafer slicing, grinding and polishing process, characterized by comprising: The shell (1) is provided with a tail gas inlet (7) and a tail gas outlet (8) corresponding to the first spray washing chamber (3) and the fourth spray washing chamber (6) respectively. The outer side of the shell (1) is provided with a circulating filtering mechanism (9) in communication with the inside of the shell (1), and the inside of the first spray washing chamber (3), the second spray washing chamber (4), the third spray washing chamber (5) and the fourth spray washing chamber (6) is respectively provided with a first washing spray mechanism (10), a second washing spray mechanism (11), a third washing spray mechanism (12) and a fourth washing spray mechanism (13) connected with the circulating filtering mechanism (9).

2. The apparatus for removing dust from the exhaust gas of a silicon wafer slicing, grinding and polishing process according to claim 1, wherein: The bottom of the first spray washing chamber (3) and the second spray washing chamber (4) is communicated, the upper part of the second spray washing chamber (4) and the third spray washing chamber (5) is communicated, and the bottom of the third spray washing chamber (5) and the fourth spray washing chamber (6) is communicated.

3. The apparatus for removing dust from the exhaust gas of a silicon wafer slicing, grinding and polishing process according to claim 1, wherein: The circulating filtering mechanism (9) comprises a circulating water pump (901), a circulating water inlet pipe (902), a circulating water outlet pipe (903) and a filter (904). The circulating water pump (901) is arranged on the outer side of the shell (1) through a mounting support, the output end of the circulating water pump (901) is communicated with the first washing spray mechanism (10), the second washing spray mechanism (11), the third washing spray mechanism (12) and the fourth washing spray mechanism (13) through the circulating water inlet pipe (902), the input end of the circulating water pump (901) is connected with the circulating water outlet pipe (903), one end of the circulating water outlet pipe (903) penetrates into the inside bottom of the second spray washing chamber (4), and the filter (904) is arranged on the circulating water outlet pipe (903) at a position corresponding to the outer side of the shell (1).

4. The apparatus for removing dust from the exhaust gas of a silicon wafer slicing, grinding and polishing process according to claim 1, wherein: The outer side of the shell (1) is further provided with a water injection pipe (14) penetrating into the lower part of the third spray washing chamber (5), and the bottom of the second spray washing chamber (4) and the third spray washing chamber (5) is communicated through a water inlet (15).

5. The apparatus for removing dust from the exhaust gas of a silicon wafer slicing, grinding and polishing process according to claim 3, wherein: The first washing spray mechanism (10) and the second washing spray mechanism (11) each comprise a main pipeline (16), a sub-pipeline (17) and a double-end spray nozzle (18). The main pipeline (16) is communicated with the circulating water inlet pipe (902), the sub-pipeline (17) is provided with a plurality of sub-pipelines (17), the plurality of sub-pipelines (17) are communicated with the main pipeline (16) at equal intervals, and the output end of each sub-pipeline (17) extends into the first spray washing chamber (3) and the second spray washing chamber (4), and the output end of each sub-pipeline (17) is connected with one double-end spray nozzle (18).

6. The apparatus for removing dust from the exhaust gas of a silicon wafer slicing, grinding and polishing process according to claim 5, wherein: The third washing spray mechanism (12) and the fourth washing spray mechanism (13) each comprise a connecting pipe (19), a single-end spray nozzle (20), a hole plate (21) and a spray seat (22); One of the connecting pipes (19) is communicated with the main pipe (16) and penetrates into the upper part of the third spray washing bin (5), and the other connecting pipe (19) is communicated with the circulating water inlet pipe (902) and penetrates into the upper part of the fourth washing spray bin (6), and the output ends of the two connecting pipes (19) are each provided with the single-end spray nozzle (20); The third spray washing bin (5) and the fourth washing spray bin (6) are each provided with the hole plates (21) which are distributed at equal intervals, and the uppermost hole plate (21) is provided with the spray seat (22).

7. The apparatus for removing dust from the exhaust gas of a silicon wafer slicing, grinding and polishing process according to claim 6, characterized in that: The spray seat (22) is in a circular truncated cone structure, and the spray seat (22) and the single-end spray nozzle (20) are distributed in alignment.

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