Material box for collecting silicon wafers and sorting machine

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a material box for collecting silicon wafers and a sorting machine, the material box comprises a silicon wafer supporting plate, the silicon wafer supporting plate is provided with silicon wafer side edge baffles forming an included angle, at least one clamping jaw avoiding notch is respectively arranged on one side of the included angle and the edge of the silicon wafer supporting plate on the opposite side of the side of the included angle, and the clamping jaw avoiding notch is arranged on the silicon wafer side edge baffle. The silicon wafers are collected in the material box through the silicon wafer supporting plate and the silicon wafer side baffles forming the included angle, and after the silicon wafers are collected to a certain number, the automatic clamping jaw is allowed to clamp the silicon wafers in the material box through the clamping jaw avoiding notch, so that the requirement of the automatic clamping jaw for discharging treatment is met, and the working efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, to a material box and sorting machine for collecting silicon wafers. Background Technology

[0002] In the silicon wafer semiconductor industry, silicon wafers are collected and stored in cassettes before packaging, allowing for manual handling and unloading for subsequent packaging. However, with the increasing automation of equipment, there are currently no cassettes suitable for automated grippers to unload the wafers. Utility Model Content

[0003] The purpose of this invention is to provide a material box and sorting machine for collecting silicon wafers, so as to solve the technical problem that there is no material box suitable for automated gripper unloading in the prior art.

[0004] To achieve the above objectives, in a first aspect, the present invention provides a material box for collecting silicon wafers, which includes a silicon wafer tray, a silicon wafer side baffle formed by an angle on the silicon wafer tray, and at least one claw clearance notch on the edge of the silicon wafer tray on one side of the angle and the opposite side of the angle.

[0005] The wafer collection box uses a wafer tray and angled wafer side guards to collect wafers. After a certain number of wafers are collected, the automated gripper can use the gripper to avoid the notch and pick up the wafers from the box, thus meeting the needs of the automated gripper for unloading and improving work efficiency.

[0006] Alternatively, when the wafer tray is fixedly installed, the wafer tray is tilted relative to the wafer side baffles on one or both sides of the horizontal plane at an angle.

[0007] Optionally, the wafer tray has two opposite sides, and a wafer side baffle on one side of the included angle is connected to one of the opposite sides, and the included angle corresponds to one of the corners of the collected wafer.

[0008] Optionally, the silicon wafer side baffles on one or both sides of the included angle can be detachably connected to the silicon wafer support plate.

[0009] Optionally, the silicon wafer support plate is provided with multiple sets of fixing screws, and the silicon wafer side baffle is provided with screw holes. The screw holes correspond to the positions of the fixing screws. When the screw holes are connected to different sets of fixing screws, the distance between the silicon wafer side baffles on both sides of the included angle is different.

[0010] Alternatively, multiple sets of fixing screws are provided on the side baffle of the silicon wafer, and screw holes are provided on the silicon wafer support plate. The screw holes correspond to the positions of the fixing screws. When the screw holes are connected to different sets of fixing screws, the distance between the side baffles of the silicon wafer on both sides of the included angle is different.

[0011] Optionally, two gripper clearance notches are provided on each of the two opposite sides; one side of the included angle includes a first silicon wafer side baffle and a second silicon wafer side baffle, which are respectively located on both sides of a gripper clearance notch on one of the two opposite sides; the other side of the included angle includes a third silicon wafer side baffle, which is respectively located on both sides of another gripper clearance notch on one of the two opposite sides.

[0012] Optionally, a wafer pad is provided on the wafer tray.

[0013] Optionally, the silicon wafer support plate is provided with at least one pin, and the silicon wafer pad is provided with a blind hole. The position of the blind hole corresponds to the position of the pin, and the silicon wafer pad is fixed to the silicon wafer support plate by the clearance fit between the pin and the blind hole.

[0014] Optionally, the silicon wafer side baffle has a buffer layer on the side facing the silicon wafer collection area.

[0015] Optionally, the silicon wafer tray is provided with mounting holes for mounting and fixing the material box.

[0016] Secondly, this utility model provides a sorting machine, which includes the aforementioned material box for collecting silicon wafers.

[0017] Since the sorting machine includes the aforementioned hopper for collecting silicon wafers, its technical effect is similar to that of the aforementioned hopper for collecting silicon wafers, and will not be described again here to save space. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A structural diagram of a material box for collecting silicon wafers provided in an embodiment of this utility model;

[0020] Figure 2 Another structure of a material box for collecting silicon wafers provided in this embodiment of the present invention Figure 1 ;

[0021] Figure 3 Another structure of a material box for collecting silicon wafers provided in this embodiment of the present invention Figure 2 ;

[0022] Figure 4 The silicon wafer collection state of another silicon wafer collection box provided in this embodiment of the utility model Figure 1 ;

[0023] Figure 5 The silicon wafer collection state of another silicon wafer collection box provided in this embodiment of the utility model Figure 2 ;

[0024] Figure 6 The silicon wafer collection state of another silicon wafer collection box provided in this embodiment of the utility model Figure 3 ;

[0025] Figure 7 A state diagram of the silicon wafers being picked up by the automated gripper in an embodiment of this utility model.

[0026] The following are the labeling elements in the figure:

[0027] 1. Silicon wafer support plate; 11. Gripper clearance notch; 2. Silicon wafer side baffle; 21. First silicon wafer side baffle; 22. Second silicon wafer side baffle; 23. Third silicon wafer side baffle; 3. Fixing screw; 4. Pin; 5. Silicon wafer pad; 6. Buffer layer; 7. Mounting hole; 8. Silicon wafer; 9. Automated gripper. Detailed Implementation

[0028] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0029] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0030] During silicon wafer processing, wafers are collected and stored in cassettes for easy manual handling and subsequent packaging. Because silicon wafers are thin and brittle, the cassette structure is typically complex to ensure the wafers are not damaged. However, current cassette designs are not yet suitable for use with grippers in automated equipment and require improvement.

[0031] In view of the above issues, see Figure 1 and Figure 7 In some embodiments of this utility model, a material box for collecting silicon wafers is provided, which includes a silicon wafer tray 1, a silicon wafer side baffle 2 with an angled shape on the silicon wafer tray 1, and at least one gripper clearance notch 11 on the edge of the silicon wafer tray 1 on one side of the angle and the opposite side of the angled shape. The silicon wafers are collected in the material box by the silicon wafer tray 1 and the angled silicon wafer side baffle. After a certain number of silicon wafers are collected, the automated gripper 9 is allowed to grip the silicon wafers 8 in the material box through the gripper clearance notch 11 to meet the needs of the automated gripper 9 for unloading and improve work efficiency.

[0032] Further, see Figure 2 , Figure 3 and Figure 7 In some embodiments of this utility model, a material box for collecting silicon wafers is also provided, which includes a silicon wafer tray 1, a silicon wafer side baffle 2 with an angled shape on the silicon wafer tray 1, the silicon wafer tray 1 having two opposite sides, each of the two opposite sides having at least one claw clearance notch 11, the silicon wafer side baffle 2 on one side of the angle being connected to one of the two opposite sides, and the angle corresponding to one of the corners of the collected silicon wafer 8.

[0033] Combination Figure 4 , Figure 5 , Figure 6 and Figure 7 When collecting silicon wafers, place silicon wafer 8 onto silicon wafer tray 1. If there is more than one silicon wafer 8, such as... Figure 6 As shown, the silicon wafers include a collected silicon wafer 8a, a silicon wafer 8b in the process of sliding down, and a silicon wafer 8c to be collected. The silicon wafers 8a are placed overlappingly on the silicon wafer tray 1. The side baffles 2 of the silicon wafers are respectively abutted against the two sides of one corner of the silicon wafer, so that the silicon wafers are kept stable on the silicon wafer tray 1, thereby achieving the effect of collecting silicon wafers. When using the automated gripper 9 for unloading, the gripper is aligned with the gripper clearance notch 11 on the silicon wafer tray 1, and then the spacing of the gripper is controlled to clamp the silicon wafer, so as to achieve the effect of unloading by the automated gripper 9, thereby improving work efficiency.

[0034] Therefore, according to the silicon wafer collection box provided by this utility model, the silicon wafer tray 1 and at least two silicon wafer side baffles 2 are used. The silicon wafer tray 1 includes at least two opposite sides, and each of the two opposite sides is provided with at least one gripper clearance notch 11. The at least two silicon wafer side baffles 2 are connected to the silicon wafer tray 1 and form an angle, which corresponds to one of the corners of the silicon wafer collected in the box. The silicon wafer side baffle 2 on one side of the angle is located on an opposite side, thereby achieving the effect of collecting silicon wafers and allowing the automated gripper 9 to align with the gripper clearance notch 11 on the silicon wafer tray 1 to grip the silicon wafer, so as to use the automated gripper 9 for unloading and improve work efficiency.

[0035] Specifically, the silicon wafer tray 1 can be a flat plate, and the shape of the flat plate is not unique. For example... Figure 1 As shown, the silicon wafer tray 1 is an irregular polygonal plate with two gripper clearance notches 11 on each of its two opposite sides. The side adjacent to the two opposite sides is a straight edge, while the other side is a beveled edge. In practical applications, the gripper clearance notches 11 on the silicon wafer tray 1 not only provide a position for the automated gripper 9 to pick up the silicon wafer, but also allow any silicon wafer debris to be screened out through the gripper clearance notches 11 during wafer collection, reducing the time required for manual cleaning. Furthermore, broken silicon wafers can also fall off from the gripper clearance notches 11, reducing the need for maintenance of silicon wafer debris.

[0036] Furthermore, in some alternative embodiments, where two gripper clearance notches 11 are provided on each of the two opposite sides, such as... Figure 1 As shown, a first silicon wafer side baffle 21 and a second silicon wafer side baffle 22 are provided on one side of the included angle. The first silicon wafer side baffle 21 and the second silicon wafer side baffle 22 are located on opposite sides. A third silicon wafer side baffle 23 is provided on the other side of the included angle. The first silicon wafer side baffle 21 and the second silicon wafer side baffle 22 are spaced apart on both sides of a claw clearance notch 11 on opposite sides. The second silicon wafer side baffle 22 and the third silicon wafer side baffle 23 are spaced apart on both sides of another claw clearance notch 11 on opposite sides.

[0037] like Figure 1 As shown, the first silicon wafer side baffle 21 and the second silicon wafer side baffle 22 are on one plane, and the third silicon wafer side baffle 23 is on another plane. The two planes form an included angle, and the first silicon wafer side baffle 21 and the second silicon wafer side baffle 22 are connected on one of the two opposite sides. The first silicon wafer side baffle 21 and the second silicon wafer side baffle 22 are spaced apart on both sides of a claw clearance notch 11 on one of the two opposite sides. The second silicon wafer side baffle 22 is relatively larger than the first silicon wafer side baffle 22. The side baffle 21 is closer to the third silicon wafer side baffle 23, and the second silicon wafer side baffle 22 and the third silicon wafer side baffle 23 are spaced apart on one of the opposite sides of the other gripper clearance notch 11. The second silicon wafer side baffle 22 and the third silicon wafer side baffle 23 are not on the same plane, and they are located on both sides of the included angle. In this way, while the silicon wafer side baffle is against the silicon wafers collected on the material box, it can also ensure that the automated gripper 9 can normally grip the silicon wafers in the gripper clearance notch 11.

[0038] Preferably, the third silicon wafer side baffle 23 is detachably connected to the silicon wafer tray 1. When collecting silicon wafers with smaller dimensions, the position of the third silicon wafer side baffle 23 connected to the silicon wafer tray 1 is adjusted to be closer to the second silicon wafer side baffle 22. When collecting silicon wafers with larger dimensions, the position of the third silicon wafer side baffle 23 connected to the silicon wafer tray 1 is adjusted to be farther away from the second silicon wafer side baffle 22. In practice, the connection position can be adjusted by the detachable connection between the third silicon wafer side baffle 23 and the silicon wafer tray 1 to accommodate the collection of silicon wafers of various sizes.

[0039] Understandably, the number of claw clearance notches 11 on the silicon wafer tray 1 is adapted to the structure of the automated claw 9. In practice, the number of claw clearance notches 11 on each opposite edge can also be one or three (or even more), which will not be elaborated here.

[0040] The silicon wafer side baffle 2 can be selected as a strip, and the dimensions of the silicon wafer side baffle 2 can be the same or different. For example... Figure 1 As shown, the two silicon wafer side baffles 2 connected to the gripper clearance notch 11 are of the same size, but the silicon wafer side baffle 2 connected to one of the two adjacent opposite sides is longer than the two silicon wafer side baffles 2 connected to the gripper clearance notch 11. It is understood that the silicon wafer side baffles 2 connected to the silicon wafer tray 1 form an angle relative to one of the corners of the silicon wafer. For example, this angle is the same size as one of the corners of the silicon wafer. Therefore, when collecting silicon wafers, the silicon wafer is placed on the silicon wafer tray 1 with one corner aligned with the angle formed by the silicon wafer side baffles 2, so that the silicon wafer is stably placed on the silicon wafer tray 1. For example, as... Figure 4 As shown, the silicon wafer 8 is rectangular, and the silicon wafer side baffle 2 forms a right angle on the silicon wafer support plate 1. When placing the silicon wafer, the two adjacent sides of the silicon wafer 8 can just abut against the silicon wafer side baffle 2 to maintain stability.

[0041] In addition, the silicon wafer side baffle 2 can be integrally formed and connected to the silicon wafer tray 1, or it can be detachably connected to the silicon wafer tray 1.

[0042] In some alternative embodiments, the silicon wafer side baffles 2 on one or both sides of the included angle are detachably connected to the silicon wafer support plate 1.

[0043] Specifically, one side of the included angle refers to the area containing one of the two faces of the included angle. The two sides of the included angle refer to the areas of the two faces that constitute the included angle. In this embodiment, at least two silicon wafer side baffles 2 are partially detachably connected to the silicon wafer support plate 1 along one face, while the remaining silicon wafer side baffles 2 are fixedly connected (including but not limited to welding, integral molding, etc.) to the silicon wafer support plate 1 along the other face to form an included angle; or, at least two silicon wafer side baffles 2 are detachably connected to the silicon wafer support plate 1 along two faces to form an included angle.

[0044] The specific implementation of the detachable connection between the silicon wafer side baffle 2 and the silicon wafer support plate 1 is not unique, and includes, but is not limited to, any one of the following: threaded connection, plug-in connection, snap-fit ​​connection or sliding connection.

[0045] In one embodiment, taking a threaded connection as an example, the silicon wafer support plate 1 is provided with multiple sets of fixing screws 3, and the silicon wafer side baffle 2 is provided with screw holes (not shown in the figure). The screw holes correspond to the positions of the fixing screws 3. When the screw holes are connected to different sets of fixing screws 3, the distance between the silicon wafer side baffles 2 on both sides of the included angle is different. Alternatively, the silicon wafer side baffle 2 is provided with multiple sets of fixing screws 3, and the silicon wafer support plate 1 is provided with screw holes. The screw holes correspond to the positions of the fixing screws 3. When the screw holes are connected to different sets of fixing screws 3, the distance between the silicon wafer side baffles 2 on both sides of the included angle is different.

[0046] Specifically, combined Figure 1 For example, the silicon wafer support plate 1 is provided with 3 sets of fixing screws 3, each set including 2 fixing screws 3, and the 3 sets of fixing screws 3 are arranged in an array. Correspondingly, the silicon wafer side baffle 2 is provided with 6 screw holes, which are also arranged in an array and correspond to the positions of the 3 sets of fixing screws 3. When connecting the silicon wafer side baffle 2 to the silicon wafer support plate 1, the six screw holes on the silicon wafer side baffle 2 can be aligned with the three sets of fixing screws 3, or the four screw holes on the silicon wafer side baffle 2 can be aligned with the two sets of fixing screws 3, or the two screw holes on the silicon wafer side baffle 2 can be aligned with the one set of fixing screws 3. Then, the fixing screws 3 are threadedly connected to the screw holes, thereby connecting the silicon wafer side baffle 2 to the silicon wafer support plate 1. Furthermore, the screw holes on the silicon wafer side baffle 2 can be aligned with different sets of fixing screws 3 on the silicon wafer support plate 1 for threaded connection. This can change the contact position between the silicon wafer side baffle 2 and the silicon wafer on the silicon wafer support plate 1 to meet the distance requirements of the silicon wafer side baffle 2 when collecting silicon wafers of different specifications.

[0047] In this embodiment, the silicon wafer side baffle 2 is detachably connected to the silicon wafer tray 1 by means of fixing screws 3 and screw holes, so that the position of the silicon wafer side baffle 2 on the silicon wafer tray 1 is adjustable. This connection method is not only simple to adjust, but also has a stable effect and is suitable for collecting silicon wafers of various sizes and specifications.

[0048] In some alternative embodiments, when the wafer tray is fixedly installed, the wafer tray 1 is tilted relative to the wafer side baffles 2 facing one or both sides of the horizontal plane at an angle.

[0049] Specifically, the material box is used to be installed on the lifting module of the sorting machine. Preferably, the silicon wafer tray 1 is provided with mounting holes 7 for mounting and fixing the material box. The silicon wafer tray 1 is fixedly connected to the lifting module through the mounting holes 7, so that the entire material box is fixedly installed on the lifting module of the sorting machine.

[0050] With the wafer tray fixedly installed on the lifting module, the wafer tray 1 is tilted towards the wafer side baffle 2 on one side of the included angle, so that the entire wafer tray has an inclined angle on the lifting module. The size of the inclined angle can be set according to the actual application, and this utility model does not limit it. For example, as shown in the figure, the wafer tray 1 is tilted towards the wafer side baffle 2 on one opposite side. When collecting wafers, the wafers are loaded into the wafer tray 1 from the other opposite side. After the wafers contact the wafer tray 1, because the wafer tray 1 has an inclined angle, and under the guidance of the wafer side baffle 2 on the adjacent side of the two opposite sides, the wafers will automatically slide along the wafer tray 1 to the position of the wafer side baffle 2, thereby achieving the effect of automatic straightening of the wafers during the collection process.

[0051] Of course, in practice, the silicon wafer tray 1 can also be tilted to the silicon wafer side baffles 2 on both sides of the included angle at the same time, so that when collecting silicon wafers, the silicon wafers can automatically and neatly abut against the silicon wafer side baffles 2 on both sides.

[0052] In some alternative embodiments, during the collection of silicon wafers, in order to avoid damage caused by direct contact between the silicon wafers and the silicon wafer tray 1, a silicon wafer pad is provided on the silicon wafer tray 1 to protect the silicon wafers.

[0053] Specifically, the silicon wafer support plate is preferably a glass fiber board. Of course, in practice, carbon fiber board, acrylic board or plastic board can also be used as the silicon wafer support plate 1. This utility model does not limit this.

[0054] In practical use, the silicon wafer pad needs to be cleaned to ensure its cleanliness. Therefore, the connection between the silicon wafer pad and the silicon wafer support plate 1 is preferably detachable to facilitate the replacement and cleaning of the silicon wafer pad.

[0055] For example, in one optional embodiment, the silicon wafer tray 1 is provided with at least one pin 4, and the silicon wafer pad is provided with blind holes (not shown in the figure). The positions of the blind holes correspond to the positions of the pins 4. The silicon wafer pad is fixed to the silicon wafer tray 1 by a clearance fit between the pins 4 and the blind holes. Specifically, the pins 4 and the silicon wafer tray 1 are interference-fitted to secure the pins 4 to the silicon wafer tray 1. The silicon wafer pad is hung on the corresponding pins 4 through the blind holes. The pins 4 and the blind holes are clearance-fitted to facilitate the replacement and cleaning of the silicon wafer pad.

[0056] Furthermore, in practice, the silicon wafer pad may be provided with at least one pin 4, and the silicon wafer support plate 1 may be provided with blind holes. The position of the blind holes corresponds to the position of the pin 4, and the silicon wafer pad is fixed to the silicon wafer support plate 1 by the clearance fit between the pin 4 and the blind holes.

[0057] Of course, other connection methods can also be used between the silicon wafer pad and the silicon wafer support plate 1 to achieve a detachable connection, not limited to the pin 4 and blind hole method. This utility model does not limit this.

[0058] In some alternative embodiments, a buffer layer 6 is provided on the side of the silicon wafer side baffle 2 facing the silicon wafer collection side. During the silicon wafer collection process, the buffer layer 6 can largely offset the impact force from the silicon wafer, avoiding damage to the silicon wafer during the collection process.

[0059] Specifically, the material of the buffer layer 6 is not unique, but is preferably a flexible material. For example, the buffer layer 6 can be foam, soft rubber, or silicone.

[0060] In a second embodiment of the present invention, a sorting machine is also provided, which includes the aforementioned material box for collecting silicon wafers.

[0061] Specifically, the sorting machine is used to sort silicon wafers. In practice, the sorting machine is equipped with a lifting module. The aforementioned wafer collection box is fixedly installed on the lifting module. This box can be used for manual unloading after collection, or it can be used for unloading by the automated gripper 9. For example, after a certain number of silicon wafers have been collected by the box, the automated gripper 9 can grab the silicon wafers 8 in the box to achieve automatic unloading. In addition, the aforementioned wafer collection box has a simple structure and low installation cost.

[0062] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A magazine for silicon wafer collection, characterized by, The silicon wafer supporting plate is provided with silicon wafer side edge stoppers at an included angle, and at least one clamping jaw avoiding notch is arranged on the edge of the silicon wafer supporting plate on the side of the included angle and the opposite side of the included angle.

2. The boat for silicon wafer collection according to claim 1, wherein, In the case of fixed installation of the material box, the silicon wafer supporting plate is inclined to the silicon wafer side edge stopper on the side or both sides of the included angle relative to the horizontal plane.

3. The boat for silicon wafer collection of claim 1, wherein, The silicon wafer supporting plate has two opposite edges, the silicon wafer side edge stopper on the side of the included angle is connected to one of the two opposite edges, and the included angle corresponds to one of the angles of the collected silicon wafer.

4. The boat for silicon wafer collection of claim 3, wherein, The silicon wafer side edge stopper on the side or both sides of the included angle is detachably connected to the silicon wafer supporting plate.

5. The boat for silicon wafer collection of claim 4, wherein, The silicon wafer supporting plate is provided with a plurality of sets of fixing screws, and the silicon wafer side edge stopper is provided with screw holes corresponding to the positions of the fixing screws, and the distance between the silicon wafer side edge stoppers on the two sides of the included angle is different when the screw holes are connected to different sets of fixing screws. Alternatively, the silicon wafer side edge stopper is provided with a plurality of sets of fixing screws, and the silicon wafer supporting plate is provided with screw holes corresponding to the positions of the fixing screws, and the distance between the silicon wafer side edge stoppers on the two sides of the included angle is different when the screw holes are connected to different sets of fixing screws.

6. The boat for silicon wafer collection according to any one of claims 3-5, wherein, Two clamping jaw avoiding notches are arranged on each of the two opposite edges. The side of the included angle includes a first silicon wafer side edge stopper and a second silicon wafer side edge stopper, and the first silicon wafer side edge stopper and the second silicon wafer side edge stopper are separately arranged on one side of the clamping jaw avoiding notch on one of the two opposite edges. The other side of the included angle includes a third silicon wafer side edge stopper, and the third silicon wafer side edge stopper is separately arranged on the other side of the clamping jaw avoiding notch on one of the two opposite edges.

7. The cartridge for silicon wafer collection according to any one of claims 1 to 5, wherein The silicon wafer supporting plate is provided with a silicon wafer backing plate.

8. The boat for silicon wafer collection of claim 7, wherein, The silicon wafer supporting plate is provided with at least one pin, and the silicon wafer backing plate is provided with a blind hole corresponding to the position of the pin, and the silicon wafer backing plate is fixed on the silicon wafer supporting plate by the clearance fit of the pin and the blind hole.

9. The boat for silicon wafer collection according to any one of claims 1-5, wherein, The silicon wafer side edge stopper is provided with a buffer layer on the side facing the collected silicon wafer.

10. The cartridge for silicon wafer collection according to any one of claims 1-5, wherein, The silicon wafer supporting plate is provided with a mounting hole for mounting the material box.

11. A sorter characterized by The material box for collecting silicon wafers according to any one of claims 1-10 is provided.

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