Chlorine gas absorption etching cylinder
By designing a chlorine absorption etching cylinder, the lack of laboratory chlorine recycling devices was solved, achieving efficient regeneration and stability of the etching solution, and making it suitable for simulating laboratory chlorine etching reactions.
Patent Information
- Application Number
- CN202520148534.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-22
AI Technical Summary
The market lacks small-scale acid etching tank devices for chlorine gas recycling that simulate sodium chlorate-hydrochloric acid etching solutions for laboratory research and testing, which prevents laboratories from effectively utilizing chlorine gas for etching reactions.
A chlorine absorption etching cylinder was designed, including an etching reaction cylinder, an etching auxiliary cylinder, and a chlorine absorption/etching solution circulation structure. A Venturi jet injector and a circulating jet pump are used to achieve the mixing and circulation of chlorine and etching solution. A heating component and an etching solution parameter monitoring structure are provided to ensure the stability and efficiency of the etching process.
It enables efficient reuse of chlorine gas in the laboratory, simplifies the operation process, improves the regeneration efficiency and stability of the etching solution, and is suitable for the use of laboratory simulated acidic etching solutions.
Smart Images
Figure CN223738147U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the etching technical field of PCB circuit board, especially relates to a chlorine gas absorption etching jar. BACKGROUND
[0002] In the etching procedure of PCB circuit board, sodium chlorate-hydrochloric acid system etching liquid is commonly used etching liquid, it has high stability, finished product yield is high, cost is low, etching rate controllable and the like advantages, and its chemical reaction formula is as follows:
[0003] ① Cu + CuCl2 → Cu2Cl2 (copper etching reaction);
[0004] ② 3Cu2Cl2 + NaClO3 + 6HCl → 6CuCl2 + NaCl + 3H2O (regeneration reaction).
[0005] Reaction mechanism is as follows: under strong acid condition, copper chloride and copper ion directly react to etch copper on the board surface, and reaction product cuprous chloride is oxidized to generate copper chloride again to continue reacting with copper.
[0006] Some PCB factories reduce production cost, improve resource utilization, realize sodium chlorate-hydrochloric acid system etching liquid reduction, resource and harmless treatment, and carry out electrolysis regeneration treatment on sodium chlorate-hydrochloric acid system; and the electrolysis regeneration mode is that heavy metal copper ions in waste liquid are removed in the form of copper plate at the negative electrode, and low-copper tail liquid after electrolysis is used as regeneration liquid, and after adjustment, it is used as etching regeneration sub-liquid and returned to the etching line; and chlorine gas produced at the positive electrode during electrolysis can be returned to the etching machine in the form of Venturi jet to directly react with copper on the PCB to achieve etching.
[0007] The reaction formula of electrolysis sodium chlorate-hydrochloric acid system etching liquid is as follows:
[0008] Negative electrode reaction formula: Cu 2+ + 2e - → Cu;
[0009] Positive electrode reaction formula: positive electrode: 2Cl - + e - → Cl2.
[0010] And the reaction formula of chlorine gas returned to the etching machine and reacted with the PCB is as follows:
[0011] Cu + Cl2 → CuCl2;
[0012] In addition, chlorine gas can also react with monovalent copper in the etching liquid to improve etching activity of the chemical solution, and its reaction formula is as follows:
[0013] 2CuCl + Cl2 → 2CuCl2.
[0014] The technology of regenerating sodium chlorate-hydrochloric acid system etching liquid by electrolysis has been widely applied in copper recovery industry, but there is no small simulation chlorine gas recycling acid etching cylinder device for laboratory research and development and testing of sodium chlorate-hydrochloric acid system etching liquid on the market. Content of the utility model
[0015] The utility model aims at providing a chlorine gas absorption etching cylinder to solve the problems in the above background art.
[0016] To achieve the above object, the utility model provides the following technical scheme: a chlorine gas absorption etching cylinder, comprising an etching reaction cylinder, an etching auxiliary cylinder and a chlorine gas absorption / etching liquid circulation structure.
[0017] The chlorine gas absorption / etching liquid circulation structure comprises an etching cylinder circulating jet pump, a circulating jet pump inlet pipe is connected between the etching cylinder circulating jet pump and the etching auxiliary cylinder, a circulating jet pump outlet pipe is arranged between the etching cylinder circulating jet pump and the etching reaction cylinder, a Venturi jet device is arranged on the top surface of the etching reaction cylinder, a jet branch pipe is arranged in the etching reaction cylinder, the water outlet of the Venturi jet device is connected with the jet branch pipe, an electrolytic equipment exhaust pipe is connected with the air inlet of the Venturi jet device, and the water inlet of the Venturi jet device is connected with the circulating jet pump outlet pipe.
[0018] Preferably, the etching auxiliary cylinder is provided with a heating assembly and an etching liquid parameter monitoring structure, and the inside of the etching reaction cylinder is provided with a PCB etching structure.
[0019] Preferably, the heating assembly comprises a heating coil pipe, and the heating coil pipe is arranged in the inside of the etching auxiliary cylinder.
[0020] Preferably, the etching liquid parameter monitoring structure comprises an ORP meter probe and a specific gravity meter probe, and the ORP meter probe and the specific gravity meter probe are arranged in the etching auxiliary cylinder.
[0021] Preferably, the PCB etching structure comprises an etching plate clamping groove, and the etching plate clamping groove is arranged in the inside of the etching reaction cylinder.
[0022] Preferably, the top surface of the etching reaction cylinder is provided with a reaction cylinder exhaust pipe.
[0023] The utility model at least has following beneficial effects:
[0024] The utility model provides a kind of chlorine absorption etching jar, suitable for laboratory research and development, test use, and is provided with etching liquid parameter monitoring structure, chlorine gas recycling structure and parameter adjusting mechanism, can be simulated in laboratory acidic etching liquid chlorine gas recycling, the structure of this scheme is novel, easy to operate, each component can be disassembled and replaced, convenient maintenance, satisfy use demand. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 It is the whole structure schematic diagram of the utility model;
[0026] Figure 2 It is the internal structure schematic diagram of the etching reaction jar and etching auxiliary jar of the utility model.
[0027] In the figure mark: 1, etching reaction jar;2, etching auxiliary jar;3, heating coil;4, venturi jet device;5, reaction jar exhaust pipe;6, etching jar circulating jet pump;7, jet branch pipe;8, etching plate card slot;9, circulating jet pump discharge pipe;10, circulating jet pump inlet pipe;11, ORP meter probe;12, specific gravity meter probe. DETAILED DESCRIPTION
[0028] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor belong to the range of protection of the utility model.
[0029] EMBODIMENT
[0030] Please refer to Figure 1 And Figure 2 The utility model provides a kind of technical scheme: a kind of chlorine absorption etching jar, including etching reaction jar 1, etching auxiliary jar 2 and chlorine absorption / etching liquid circulating structure;
[0031] Chlorine absorption / etching liquid circulating structure includes etching jar circulating jet pump 6, circulating jet pump inlet pipe 10 is connected between etching jar circulating jet pump 6 and etching auxiliary jar 2, circulating jet pump discharge pipe 9 is equipped between etching jar circulating jet pump 6 and etching reaction jar 1, the top surface of etching reaction jar 1 is equipped with venturi jet device 4, the inside of etching reaction jar 1 is equipped with jet branch pipe 7, venturi jet device 4 water outlet is connected with jet branch pipe 7, venturi jet device 4 air inlet is connected with electrolytic equipment exhaust pipe, venturi jet device 4 water inlet is connected with circulating jet pump discharge pipe 9.
[0032] Etching auxiliary jar 2 is equipped with heating assembly and etching liquid parameter monitoring structure;The inside of etching reaction jar 1 is equipped with PCB etching structure.
[0033] The heating assembly comprises a heating coil 3 arranged inside the etching auxiliary cylinder 2; the etching liquid parameter monitoring structure comprises an ORP probe 11 and a specific gravity probe 12 inserted in the etching auxiliary cylinder 2, and specifically, the ORP probe 11 is connected with an etching liquid ORP controller; the PCB etching structure comprises an etching board slot 8 arranged inside the etching reaction cylinder 1.
[0034] The top surface of the etching reaction cylinder 1 is provided with a reaction cylinder exhaust pipe 5.
[0035] In the embodiment, the etching reaction cylinder 1 is the main body of the whole etching cylinder, and the etching reaction cylinder 1 is provided with a jet branch pipe 7, an etching board slot 8, and a reaction cylinder exhaust pipe 5 arranged above.
[0036] The etching reaction cylinder 1 is the main body of the whole etching cylinder, and the etching reaction cylinder 1 is provided with a jet branch pipe 7, an etching board slot 8, and a reaction cylinder exhaust pipe 5 arranged above.
[0037] The etching auxiliary cylinder 2 is directly connected with the etching reaction cylinder 1, and the etching liquid in the etching reaction cylinder 1 directly overflows into the etching auxiliary cylinder 2. The etching auxiliary cylinder 2 is provided with a heating coil 3, an ORP probe 11, and a specific gravity probe 12. The etching auxiliary cylinder 2 is externally connected with a circulating jet pump inlet pipe 10.
[0038] The embodiment realizes the mass transfer convection of the etching liquid in the acid etching cylinder through the working jet of the etching cylinder circulating jet pump 6, that is, the etching reaction cylinder 1 is connected with the etching cylinder circulating jet pump 6 through a circulating jet pump outlet pipe 9, and the etching auxiliary cylinder 2 is connected with the etching cylinder circulating jet pump 6 through a circulating jet pump inlet pipe 10. The above structure is used to realize the continuous mass transfer convection of the etching liquid in the etching reaction cylinder.
[0039] Working principle of the acid etching cylinder using chlorine gas:
[0040] The acid etching liquid is composed of hydrochloric acid, sodium chlorate, copper chloride, and sodium chloride, and is stored in the etching reaction cylinder 1 and the etching auxiliary cylinder 2.
[0041] ① Circulation and Reaction Process: First, turn on the electrolysis equipment, then turn on the etching tank circulation jet pump 6 to continuously agitate the chemicals in the etching auxiliary tank and etching reaction tank. Use a Venturi jet injector 4 to draw in chlorine gas produced by the electrolysis equipment. The chlorine gas is mixed with the etching solution in a "water-bubble" manner, and injected as bubbles into the jet branch pipe 7 at the bottom of the etching reaction tank 1. The jet branch pipe 7 has multiple holes at a 45° angle, and the total cross-sectional area of these holes is 90% of the main pipe's cross-sectional area. The chlorine gas and etching solution mixed bubbles are jetted into the etching reaction tank 1 through the bottom jet branch pipe 7. As these mixed bubbles rise, they continuously break due to pressure changes, releasing chlorine gas. The chlorine gas reacts directly with the monovalent copper in the etching solution and also with the PCB copper plate in the etching reaction tank. This process achieves the effect of chlorine regeneration and reuse. Subsequently, the reacted chemicals are pushed by the water flow and overflow into the etching auxiliary cylinder 2. The etching reaction cylinder 1 and the etching auxiliary cylinder 2 are separated by a baffle plate with three holes. Water overflows into the etching auxiliary cylinder 2 through the holes to prevent turbulent water flow, which would cause large fluctuations in the chemical parameters of the hydrometer and ORP meter. After the etching solution overflows into the etching auxiliary cylinder 2, the etching cylinder circulation jet pump 6 will draw out the chemicals in the auxiliary cylinder, and after the chlorine gas is sucked out by the Venturi jet 4, it will be pumped back to the etching reaction cylinder 1 to complete the entire circulation and reaction process.
[0042] Parameter control process: The specific gravity in etching reaction tank 1 is controlled between 1.185 and 1.22 (actually converted to copper ion concentrations of 110 g / L to 130 g / L; the actual control value needs to be calibrated using a hydrometer). When the specific gravity in the tank is higher than the set value, regeneration solution (made by mixing water, hydrochloric acid, and copper-containing regeneration solution in a certain proportion) is manually added. The water temperature in etching reaction tank 1 is manually monitored. If the temperature is low, the heating coil of etching auxiliary tank 2 is turned on to control the temperature at 50 ± 1℃.
[0043] Etching process: When preparing for chlorine reuse / etching simulation experiment, turn on the etching solution ORP controller. When the etching solution ORP of the entire etching reaction tank is controlled at 520-560mV, when the ORP value of the solution in the tank exceeds 560mV, the chlorine supply at the chlorine input end of the Venturi ejector 4 is turned off. When the ORP value of the solution in the tank is lower than 530mV, chlorine is supplied to etching reaction tank 1 through the Venturi ejector 4.
[0044] During the etching process, the etching rate of the etching solution is first measured, and then the double-sided PCB is placed into the etching board slot 8. The immersion time is appropriately controlled according to the measured etching rate.
[0045] The etching reaction tank is equipped with an exhaust fan at the top, which keeps the inside of the etching reaction tank under a slight negative pressure to prevent chlorine gas from leaking out.
[0046] The basic principle, main characteristics and advantages of the present application are shown and described above. It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be considered as exemplary and non-limiting. The scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims should be included in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.
[0047] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A chlorine gas absorption etching tank characterized by, The etching reaction cylinder (1), the etching auxiliary cylinder (2) and the chlorine gas absorption / etching liquid circulation structure are included. The chlorine gas absorption / etching liquid circulation structure includes an etching cylinder circulation jet pump (6), a circulation jet pump inlet pipe (10) connected between the etching cylinder circulation jet pump (6) and the etching auxiliary cylinder (2), a circulation jet pump outlet pipe (9) provided between the etching cylinder circulation jet pump (6) and the etching reaction cylinder (1), a Venturi jet device (4) provided on the top surface of the etching reaction cylinder (1), a jet branch pipe (7) provided in the etching reaction cylinder (1), the water outlet of the Venturi jet device (4) connected with the jet branch pipe (7), an air exhaust pipe of electrolytic equipment connected with the air inlet of the Venturi jet device (4), and the water outlet of the Venturi jet device (4) connected with the circulation jet pump outlet pipe (9).
2. A chlorine etching tank according to claim 1, wherein: The etching auxiliary cylinder (2) is provided with a heating assembly and an etching liquid parameter monitoring structure, and the etching reaction cylinder (1) is provided with a PCB etching structure.
3. A chlorine etching cell according to claim 2, wherein: The heating assembly includes a heating coil (3) arranged in the etching auxiliary cylinder (2).
4. The chlorine etching cell of claim 2 wherein: The etching liquid parameter monitoring structure includes an ORP meter probe (11) and a specific gravity meter probe (12) inserted in the etching auxiliary cylinder (2).
5. A chlorine etching cell according to claim 2, wherein: The PCB etching structure includes an etching board slot (8) arranged in the etching reaction cylinder (1).
6. The chlorine etch cell of claim 1 wherein: The top surface of the etching reaction cylinder (1) is provided with a reaction cylinder air exhaust pipe (5).