Sapphire substrate wafer thickness detection device

Abstract

The utility model provides a sapphire substrate wafer thickness detection device, which relates to the technical field of wafer thickness detection and comprises a bottom plate, an adjusting plate, a movable plate and a detection piece. The whole bottom plate is of a rectangular structure; the adjusting plate is arranged in the bottom plate and is of an L-shaped structure. The movable plate is arranged in the bottom plate; and the detection piece is arranged above the bottom plate. The sapphire substrate wafer detection device solves the problems that after an existing sapphire substrate wafer is produced, the edge is generally detected, the middle position cannot be detected, manual observation is needed, errors are easily caused, and the sapphire substrate wafer detection device is inconvenient to use.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer thickness detection technical field, more specifically, it is particularly related to sapphire substrate wafer thickness detection device. BACKGROUND

[0002] Sapphire substrate wafer is the material of vital importance in modern semiconductor and photoelectric technology;Its excellent material properties make it have obvious competitive advantage in technical performance and application value.

[0003] Based on the prior art, it is found that the current sapphire substrate wafer is usually detected at the edge after production, the middle position cannot be detected, and manual observation is required, which is prone to error and inconvenient to use. INVENTION CONTENTS

[0004] In order to solve the above technical problems, the utility model provides sapphire substrate wafer thickness detection device to solve the problem in the background art.

[0005] The utility model discloses sapphire substrate wafer thickness detection device, by the following specific technical means:

[0006] Sapphire substrate wafer thickness detection device: including bottom plate, adjusting plate, moving plate and detection piece;The whole bottom plate is rectangular structure;The adjusting plate is arranged in the bottom plate, and the adjusting plate is L-shaped structure;The moving plate is arranged in the bottom plate;The detection piece is arranged above the bottom plate.

[0007] Further;The bottom plate includes adjusting groove, support and sliding groove;The adjusting groove is opened in the middle position of the top of the bottom plate, and the adjusting groove is rectangular structure;The support is slidably connected on one side of the top of the bottom plate, and the support is rectangular structure, and the periphery of the support is provided with scale;The sliding groove is opened on both sides of the support, and the sliding groove is T-shaped structure.

[0008] Further;The adjusting plate includes telescopic rod and auxiliary part;The telescopic rod is fixedly connected in the adjusting plate;The auxiliary part is arranged at one end of the telescopic rod, and the outer side of the auxiliary part is in contact with the moving plate.

[0009] Further;The bottom of the moving plate is L-shaped structure, and the bottom of the moving plate is in contact with the top of one side of the adjusting plate.

[0010] Further;The detection piece includes slot, sliding block and contact piece;The slot is opened in the middle position of one side of the detection piece, and the support is inserted in the slot;The sliding block is opened on both sides of the slot, and the sliding block is T-shaped structure, and the sliding block is inserted in the sliding groove;The contact piece is arranged at the bottom of the detection piece, and the bottom of the contact piece is in contact with the bottom of the adjusting groove.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] In the device, when in use, the detection piece is pulled to drive the sliding block to slide in the sliding groove, the contact piece is away from the adjusting groove, the wafer is placed in the adjusting groove, the adjusting plate and the moving plate are pushed, the adjusting plate and the moving plate are simultaneously moved to make the telescopic rod contract to drive the auxiliary piece to move, so that the wafer is completely fixed in the adjusting groove, thereby fixing the wafer of different sizes, after fixing, the contact piece is in contact with the top of the wafer, and then the detection piece slides around the support post, so that the thickness of the wafer is known by observing the sliding distance of the detection piece around the support post, and then the device is convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structure shown in the drawings without creative labor.

[0014] Figure 1 It is the front view structural schematic diagram of the utility model.

[0015] Figure 2 It is the structural schematic diagram of the utility model when in use.

[0016] Figure 3 It is the structural schematic diagram of the bottom plate of the utility model.

[0017] Figure 4 It is the structural schematic diagram of the adjusting plate and the moving plate of the utility model.

[0018] Figure 5 It is the structural schematic diagram of the detection piece of the utility model.

[0019] In the drawing, the corresponding relationship between the component name and the drawing number is as follows:

[0020] 1, bottom plate;

[0021] 101, adjusting groove; 102, support post; 103, sliding groove;

[0022] 2, adjusting plate;

[0023] 201, telescopic rod; 202, auxiliary piece;

[0024] 3, moving plate;

[0025] 4, detection piece;

[0026] 401, slot; 402, slider; 403, contact. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications will also change accordingly.

[0029] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of those skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection required by the present application.

[0030] Embodiment:

[0031] As shown in the accompanying drawings: Figure 1 to the accompanying drawings: Figure 5 As shown in the accompanying drawings:

[0032] The utility model provides a sapphire substrate wafer thickness detection device, including bottom plate 1, adjusting plate 2, moving plate 3 and detection piece 4, the whole bottom plate 1 is rectangular structure, adjusting plate 2 is located in the inside of bottom plate 1, and adjusting plate 2 is L shape structure, moving plate 3 is located in the inside of bottom plate 1, and detection piece 4 is located above bottom plate 1.

[0033] Among them, bottom plate 1 includes: adjusting groove 101, support 102 and sliding slot 103, adjusting groove 101 is opened in the middle position of bottom plate 1 top, and adjusting groove 101 is rectangular structure, support 102 is slidably connected on one side of bottom plate 1 top, and support 102 is rectangular structure, and the periphery of support 102 is provided with scale, and sliding slot 103 is opened on both sides of support 102, and sliding slot 103 is T shape structure.

[0034] The adjusting groove 101 is used for placing the wafer, the support 102 is used for assisting the detection piece 4 to slide, and the sliding groove 103 is used for assisting the sliding block 402 to slide.

[0035] The adjusting plate 2 comprises a telescopic rod 201 and an auxiliary piece 202; the telescopic rod 201 is fixedly connected inside the adjusting plate 2; the auxiliary piece 202 is arranged at one end of the telescopic rod 201, and the outer side of the auxiliary piece 202 is in contact with the moving plate 3.

[0036] The telescopic rod 201 is used for driving the auxiliary piece 202 to move, and the auxiliary piece 202 is used for cooperating with the moving plate 3 to move.

[0037] The bottom of the moving plate 3 is in L-shaped structure, and the bottom of the moving plate 3 is in contact with the top of one side of the adjusting plate 2.

[0038] The detection piece 4 comprises a slot 401, a sliding block 402 and a contact piece 403; the slot 401 is arranged at the middle position of one side of the detection piece 4, and the support 102 is inserted into the slot 401; the sliding block 402 is arranged at both sides of the slot 401, and the sliding block 402 is in T-shaped structure and is inserted into the sliding groove 103; and the contact piece 403 is arranged at the bottom of the detection piece 4, and the bottom of the contact piece 403 is in contact with the bottom of the adjusting groove 101.

[0039] The sliding block 402 is used for assisting the detection piece 4 to move, and the contact piece 403 is used for detecting the wafer.

[0040] The specific use mode and effect of the embodiment are as follows:

[0041] In the utility model, when in use, the detection piece 4 is pulled, the detection piece 4 drives the sliding block 402 to slide in the sliding groove 103, the contact piece 403 is away from the adjusting groove 101, the wafer is placed in the adjusting groove 101, the adjusting plate 2 and the moving plate 3 are pushed, when the adjusting plate 2 and the moving plate 3 move simultaneously, the telescopic rod 201 is contracted, drives the auxiliary piece 202 to move, thus the wafer is completely fixed in the adjusting groove 101, different size wafers are fixed, after fixing, the contact piece 403 is in contact with the top of the wafer, and then the detection piece 4 slides around the support 102, thus the thickness of the wafer is known by observing the sliding distance of the detection piece 4 around the support 102, and then the utility is facilitated.

[0042] Of course, the above description is not a limitation of the utility model, the utility model also is not limited to the above examples, the changes, modifications, additions or replacements made by the technical personnel in the technical field within the essential range of the utility model also should belong to the protection range of the utility model.

Claims

1. A device for detecting the thickness of a sapphire substrate wafer, comprising a base plate (1), an adjusting plate (2), a moving plate (3) and a detecting piece (4); characterized in that: The bottom plate (1) is a whole rectangular structure; the adjusting plate (2) is arranged inside the bottom plate (1), and the adjusting plate (2) is an L-shaped structure; the moving plate (3) is arranged inside the bottom plate (1); the detection piece (4) is arranged above the bottom plate (1); the bottom plate (1) comprises an adjusting groove (101), a support (102) and a sliding groove (103); the adjusting groove (101) is arranged at the middle position of the top of the bottom plate (1), and the adjusting groove (101) is a rectangular structure; the support (102) is slidingly connected to one side of the top of the bottom plate (1), and the support (102) is a rectangular structure, and the support (102) is provided with a scale on the periphery; the sliding groove (103) is arranged on both sides of the support (102), and the sliding groove (103) is a T-shaped structure; the detection piece (4) comprises a slot (401), a sliding block (402) and a contact piece (403); the slot (401) is arranged at the middle position of one side of the detection piece (4), and the support (102) is inserted into the slot (401); the sliding block (402) is arranged on both sides of the slot (401), and the sliding block (402) is a T-shaped structure, and the sliding block (402) is inserted into the sliding groove (103); the contact piece (403) is arranged at the bottom of the detection piece (4), and the bottom of the contact piece (403) is in contact with the bottom of the adjusting groove (101).

2. The apparatus for detecting the thickness of a sapphire substrate wafer according to claim 1, wherein: The adjusting plate (2) comprises a telescopic rod (201) and an auxiliary piece (202); the telescopic rod (201) is fixedly connected to the inside of the adjusting plate (2); the auxiliary piece (202) is arranged at one end of the telescopic rod (201), and the outer side of the auxiliary piece (202) is in contact with the moving plate (3).

3. The apparatus for detecting the thickness of a sapphire substrate wafer as claimed in claim 1, wherein: The bottom of the moving plate (3) is an L-shaped structure, and the bottom of the moving plate (3) is in contact with the top of one side of the adjusting plate (2).

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