Rapid leak detection tool for semiconductor vacuum equipment

Abstract

The utility model provides a quick leak detection tool for semiconductor vacuum equipment, which comprises a leak detection disc, the leak detection disc is in a disc shape and is provided with a first end face and a second end face, the first end face is matched with a knife edge flange and is used for being connected with the knife edge flange, the first end face is provided with a sealing groove, the sealing groove is an annular groove, and the second end face is provided with a second end face. The center of the sealing groove coincides with the center of the leak detection disc, and a sealing ring can be arranged in the sealing groove. The second end face is used for being connected with a helium detector, a through communication hole is formed in the center of the leak detection disc, a connecting groove matched with a detection interface of the helium detector is formed in the position, on the periphery of the communication hole, of the second end face, and when the connecting groove is connected with the detection interface of the helium detector, the leak detection disc is connected with the leak detection disc. And a pipeline connected with the detection interface is communicated with the communication hole. By adopting the rapid leak detection tool for the semiconductor vacuum equipment provided by the utility model, rapid leak detection of each part of the semiconductor vacuum equipment is realized.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor equipment, especially relates to a quick leak detection tool for semiconductor vacuum equipment. BACKGROUND

[0002] Vacuum coating technology belongs to the method of physical vapor deposition film forming, has the advantages such as simple operation, sputtering rate is high, film layer is dense, has wide application in scientific research and production.In the micro-nano semiconductor manufacturing process, the application material magnetron sputtering platform occupies the majority of the market, for example, application material 5500.Process cavity carries out coating under the condition of high vacuum, semiconductor vacuum equipment needs to carry out high vacuum leak detection before use, avoids high vacuum failure, semiconductor vacuum equipment usually includes PVD cavity 2, switch valve 3 and cold pump 4, as shown in Figure Figure 1 Currently, helium detector 5 is connected to extract vacuum after PVD cavity 2, switch valve 3 and cold pump 4 are assembled, then helium detection is used to judge whether there is leakage, and this detection mode is difficult to quickly judge the leaking component and the leaking position, and the detection efficiency is low.

[0003] Therefore, it is necessary to provide a quick leak detection tool for semiconductor vacuum equipment. UTILITY MODEL CONTENT

[0004] The utility model provides a quick leak detection tool for semiconductor vacuum equipment, realizes the quick leak detection of each component of semiconductor vacuum equipment.

[0005] In order to achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of quick leak detection tool for semiconductor vacuum equipment, semiconductor vacuum equipment includes PVD cavity, switch valve and cold pump connected in sequence, the connecting port of the PVD cavity, the switch valve and the cold pump all have knife mouth flange, the PVD cavity, the switch valve and the cold pump are all connected by the knife mouth flange, quick leak detection tool includes leak detection disc, the leak detection disc is discoid, with first end surface and second end surface, the first end surface is matched with the knife mouth flange, to connect the knife mouth flange, the first end surface is provided with sealing groove, the sealing groove is circular annular groove, the center of the sealing groove coincides with the center of the leak detection disc, sealing ring can be arranged in the sealing groove;The second end surface is used to connect helium detector, the center of the leak detection disc is provided with through intercommunication hole, the second end surface is provided with the connecting groove matched with the detection interface of the helium detector on the outer periphery of the intercommunication hole, when the connecting groove is connected with the detection interface of the helium detector, the pipeline connected with the detection interface is communicated with the intercommunication hole.

[0007] Optionally, the leak detection disc is provided with a first mounting hole penetratingly arranged, the first mounting hole is arranged corresponding to the connecting hole of the knife flange, and the leak detection disc is sealingly and fixedly connected with the knife flange through a first bolt penetratingly locked to the connecting hole of the knife flange.

[0008] Optionally, the first mounting hole is a plurality of first mounting holes, and the plurality of first mounting holes are arranged on a circle coaxial with the sealing groove and having a diameter greater than that of the sealing groove.

[0009] Optionally, the leak detection disc is provided with a second mounting hole arranged corresponding to the connecting hole of the detection interface, the second mounting hole is a blind hole arranged on the second end face, and the leak detection disc is sealingly and fixedly connected with the detection interface through a second bolt penetratingly locked to the second mounting hole.

[0010] Optionally, the second mounting hole is a plurality of second mounting holes, and the plurality of second mounting holes are arranged on a circle coaxial with the connecting groove and having a diameter greater than that of the connecting groove.

[0011] Optionally, an annular connecting surface is formed between the connecting groove and the second mounting hole on the second end face, and the connecting surface is provided with a texture.

[0012] Optionally, the material of the leak detection disc is stainless steel.

[0013] Compared with the prior art, the technical scheme of the utility model has beneficial effects.

[0014] For example, the rapid leak detection tool for the semiconductor vacuum equipment is used, the first end face of the leak detection disc is matched with the knife flange to connect the knife flange, the second end face is matched with the detection interface of the helium detector to connect the helium detector, the PVD cavity, the switch valve and the cold pump are connected respectively before installation to carry out high-vacuum leak detection, whether each assembled component exists leakage is rapidly identified, the leakage component is found in time, and the detection efficiency is improved; the single leakage component is rapidly detected, the leakage position is confirmed, and the component maintenance efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a schematic view of connection of an existing semiconductor vacuum equipment PVD cavity, switch valve and cold pump;

[0016] Figure 2 is a front view of the leak detection disc in the embodiment of the utility model;

[0017] Figure 3 is a rear view of the leak detection disc in the embodiment of the utility model;

[0018] Figure 4 is the sectional view of the leak detection disc in the embodiment of the utility model;

[0019] Figure 5 is the connection schematic diagram of the fast leak detection tool for semiconductor vacuum equipment and PVD cavity and helium detector in the embodiment of the utility model;

[0020] Figure 6 is the connection schematic diagram of the fast leak detection tool for semiconductor vacuum equipment and switch valve and helium detector in the embodiment of the utility model;

[0021] Figure 7 is the connection schematic diagram of the fast leak detection tool for semiconductor vacuum equipment and cold pump and helium detector in the embodiment of the utility model.

[0022] Mark explanation:

[0023] 1, leak detection disc;11, first end face;12, second end face;13, sealing groove;14, communication hole;15, connecting groove;16, first mounting hole;17, second mounting hole;18, sealing trace;

[0024] 2, PVD cavity;21, knife mouth flange;

[0025] 3, switch valve;31, knife mouth flange;

[0026] 4, cold pump;41, knife mouth flange;

[0027] 5, helium detector;51, detection interface;52, pipeline. Specific implementation

[0028] In order to make the purpose, features and beneficial effects of the utility model more obvious and easy to understand, the specific implementation of the utility model is described in detail below in conjunction with the drawings.It can be understood that the following described specific implementation is only used to explain the utility model, and is not limited to the utility model.And, the same, similar signs in the drawing can be used to refer to the same, similar elements in different embodiments, and the description of the same, similar elements in different embodiments and the description of prior art elements, features, effects, etc.may be omitted.

[0029] Figure 2 is the front view of the leak detection disc in the embodiment of the utility model; Figure 3 is the rear view of the leak detection disc in the embodiment of the utility model; Figure 4 is the sectional view of the leak detection disc in the embodiment of the utility model; Figure 5 is the connection schematic diagram of the fast leak detection tool for semiconductor vacuum equipment and PVD cavity and helium detector in the embodiment of the utility model; Figure 6It is the quick leak detection tool for the semiconductor vacuum equipment in the embodiment of the utility model and switch valve and helium detector connection schematic diagram; Figure 7 It is the quick leak detection tool for the semiconductor vacuum equipment in the embodiment of the utility model and cold pump and helium detector connection schematic diagram.

[0030] Refer to Figures 2-7 The utility model discloses a kind of quick leak detection tools for semiconductor vacuum equipment.

[0031] Specifically, the quick leak detection tool for semiconductor vacuum equipment, semiconductor vacuum equipment includes PVD cavity 2, switch valve 3 and cold pump 4 connected in sequence, the connecting port of PVD cavity 2, switch valve 3 and cold pump 4 all have knife mouth flange 21, 31, 41, PVD cavity 2, switch valve 3 and cold pump 4 are all connected by knife mouth flange 21, 31, 41, quick leak detection tool includes leak detection disc 1, leak detection disc 1 is discoid, with first end surface 11 and second end surface 12, first end surface 11 is matched with knife mouth flange 21, 31, 41, to connect knife mouth flange 21, 31, 41, first end surface 11 is provided with sealing groove 13, sealing groove 13 is circular annular groove, the center of sealing groove 13 coincides with the center of leak detection disc 1, sealing ring can be arranged in sealing groove 13, realize the sealing when first end surface 11 is connected with knife mouth flange 21, 31, 41;Second end surface 12 is used to connect helium detector 5, the center of leak detection disc 1 is provided with through intercommunication hole 14, second end surface 12 is provided with the connecting groove 15 matched with the detection interface 51 of helium detector 5 on the outer periphery of intercommunication hole 14, when connecting groove 15 is connected with the detection interface 51 of helium detector 5, the pipeline 52 connected with detection interface 51 is communicated with intercommunication hole 14, at this time, pipeline 52 is communicated helium detector 5 and the component to be detected connected with leak detection disc 1.

[0032] In some embodiments, leak detection disc 1 is provided with first mounting hole 16, first mounting hole 16 is correspondingly arranged with the connecting hole of knife mouth flange 21, 31, 41, leak detection disc 1 is fixedly connected with knife mouth flange 21, 31, 41 by first bolt locked to the connecting hole of knife mouth flange 21, 31, 41 through first mounting hole 16.

[0033] In some embodiments, first mounting hole 16 is multiple, and the multiple first mounting holes 16 are circumferentially spaced apart on a circle with a diameter greater than the sealing groove 13 and coaxial with the sealing groove 13.

[0034] In some embodiments, leak detection disc 1 is provided with second mounting hole 17, and the second mounting hole 17 is correspondingly arranged with the connecting hole of the detection interface 51;Second mounting hole 17 is a blind hole, and the second mounting hole 17 is arranged on the second end surface 12;Leak detection disc 1 is fixedly connected with the detection interface 51 by second bolt locked to second mounting hole 17 through the connecting hole of the detection interface 51.

[0035] In some embodiments, the second mounting hole 17 is a plurality of second mounting holes 17, and the plurality of second mounting holes 17 are arranged on a circle with a diameter larger than the connecting groove 15 and coaxial with the connecting groove 15.

[0036] In some embodiments, the second end surface 12 is formed with an annular connecting surface between the connecting groove 15 and the second mounting hole 17, and the connecting surface is provided with a sealing groove 18.

[0037] In some embodiments, the material of the leak detection disc 1 is stainless steel, which has good corrosion resistance and long service life.

[0038] Please refer to Figures 5-7 In specific implementation, the existing helium detector 5 is used to detect the leakage of each component of the semiconductor vacuum equipment.

[0039] The specific steps are as follows:

[0040] The detection interface 51 of the helium detector 5 is abutted with the connecting groove 15 of the leak detection disc 1, the second bolt is locked into the second mounting hole 17 through the connecting hole of the detection interface 51, and the detection interface 51 is sealingly and fixedly connected with the leak detection disc.

[0041] The first end surface 11 of the leak detection disc 1 is abutbed with the knife flange 21 of the PVD cavity 2, and the knife flange 21 is sealingly and fixedly connected through the first bolt locked into the connecting hole of the knife flange 21 through the first mounting hole 16.

[0042] Start the helium detector 5, and vacuumize through the pipeline 52. When a certain degree of vacuum is reached, release helium gas at each detection point of the PVD cavity 2 outside the body welding and the processing sealing surface, and detect whether there is helium gas in the extracted air through the helium detector 5 to determine whether each detection point has leakage.

[0043] The detection of whether the on-off valve 3 and the cold pump 4 have leakage is similar to the detection process of whether the PVD cavity 2 has leakage, which will not be described here. It should be noted that when detecting the on-off valve 3, the on-off valve 3 needs to be closed, the knife flange 31 connected to the inlet end of the leak detection disc 1 is detected for whether there is leakage on the inlet side, and the closing performance of the on-off valve 3 is detected. When the knife flange 31 connected to the outlet end of the leak detection disc 1 is detected, whether there is leakage on the outlet side is detected, and the closing performance of the on-off valve 3 is detected.

[0044] In summary, the utility model provides a quick leak detection tool for semiconductor vacuum equipment, the first end surface 11 of leak detection disc 1 is matched with knife flange 21, 31, 41 to connect knife flange 21, 31, 41, the second end surface 12 is matched with the detection interface 51 of helium detector 5 to connect helium detector 5, before the installation of PVD cavity 2, switch valve 3 and cold pump 4, connect PVD cavity 2, switch valve 3 and cold pump 4 respectively to carry out high vacuum leak detection, quickly identify whether each assembled component exists leakage, discover leakage component in time, improve detection efficiency, the quick leak detection of single leakage component, confirm the leakage position, be favorable to improving the component maintenance efficiency.

[0045] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even if a single embodiment is described with respect to a particular feature. The examples of features provided in the present disclosure are intended to be illustrative, not limiting, unless otherwise specified. In specific implementations, one or more technical features of a dependent claim can be combined with technical features of an independent claim, and technical features from corresponding independent claims can be combined by any appropriate means, not only by the specific combinations listed in the claims, if technically feasible.

[0046] Although the present disclosure is disclosed as above, the present disclosure is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, and therefore the protection scope of the present disclosure should be subject to the scope defined by the claims.

Claims

1. A rapid leak detection tool for a semiconductor vacuum apparatus, the semiconductor vacuum apparatus comprising a PVD chamber, a switching valve, and a cold pump connected in sequence, the connection ports of the PVD chamber, the switching valve, and the cold pump each having a knife-edge flange, the PVD chamber, the switching valve, and the cold pump each being connected to each other by the knife-edge flanges, characterized in that, The quick leak detection tool comprises a leak detection disc, which is disc-shaped and has a first end face and a second end face. The first end face is matched with the knife-edge flange to connect the knife-edge flange. The first end face is provided with a sealing groove, which is a circular annular groove. The center of the sealing groove coincides with the center of the leak detection disc. A sealing ring can be arranged in the sealing groove. The second end face is used to connect a helium detector. The center of the leak detection disc is provided with a through communication hole. The second end face is provided with a connecting groove matched with the detection interface of the helium detector at the outer periphery of the communication hole. When the connecting groove is connected with the detection interface of the helium detector, the pipeline connected with the detection interface is communicated with the communication hole.

2. The rapid leak detection tool for semiconductor vacuum equipment according to claim 1, wherein, The leak detection disc is provided with a first mounting hole corresponding to the connecting hole of the knife-edge flange. The leak detection disc is sealingly and fixedly connected with the knife-edge flange through a first bolt penetrating through the first mounting hole and locking into the connecting hole of the knife-edge flange.

3. The rapid leak detection tool for semiconductor vacuum equipment according to claim 2, wherein, The first mounting hole is a plurality of first mounting holes, which are circumferentially spaced apart on a circle with a diameter greater than the sealing groove and coaxial with the sealing groove.

4. The rapid leak detection tool for semiconductor vacuum equipment according to claim 1, wherein, The leak detection disc is provided with a second mounting hole corresponding to the connecting hole of the detection interface. The second mounting hole is a blind hole arranged on the second end face. The leak detection disc is sealingly and fixedly connected with the detection interface through a second bolt penetrating through the connecting hole of the detection interface and locking into the second mounting hole.

5. The rapid leak detection tool for semiconductor vacuum equipment according to claim 4, wherein, The second mounting hole is a plurality of second mounting holes, which are circumferentially spaced apart on a circle with a diameter greater than the connecting groove and coaxial with the connecting groove.

6. The rapid leak detection tool for semiconductor vacuum equipment according to claim 4, wherein, The second end face is formed with an annular connecting face between the connecting groove and the second mounting hole. The connecting face is provided with a texture.

7. The rapid leak detection tool for semiconductor vacuum equipment according to claim 1, wherein, The material of the leak detection disc is stainless steel.

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