Keyboard backlight module with graphite heat dissipation assembly
By introducing elastic, tight-fitting components and heat dissipation fins into the keyboard backlight module, the problem of loose contact caused by differences in material expansion coefficients is solved, achieving effective heat dissipation and improving heat dissipation efficiency and keyboard lifespan.
Patent Information
- Application Number
- CN202423101045.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-16
AI Technical Summary
In existing keyboard backlight modules, the difference in thermal expansion coefficients of different materials leads to poor contact, affecting heat dissipation. At the same time, the graphene heat sink directs heat to the circuit board below, which may cause damage.
A flexible, tightly fitting component is adopted, including a graphene heat sink, heat sink fins, and air duct structure. The heat is effectively dissipated through the air duct holes, and the flexible, tightly fitting component adapts to the differences in material expansion, ensuring close contact and maximizing heat dissipation.
This technology solves the problem of heat accumulation inside the keyboard by combining a graphene heat sink with an elastic, close-fitting component, thereby improving heat dissipation efficiency and extending the keyboard's lifespan.
Smart Images

Figure CN223743520U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to keyboard backlight module technical field, specifically is a keyboard backlight module with graphite heat radiation assembly. BACKGROUND
[0002] For the backlight keyboard, a large number of LED lamp beads are contained inside. The LED lamp beads also generate heat in the light emitting process, and the light emitting efficiency and the life of the LED lamp beads will be significantly affected by the temperature. Generally speaking, the luminous flux of the LED lamp beads will be reduced by about 3%-5% and the life will be greatly shortened if the junction temperature of the LED lamp beads is increased by 10 DEG C. If the heat accumulates inside the keyboard, the LED lamp beads will be in a high temperature environment for a long time, which not only makes the backlight brightness uneven and dark, but also accelerates the aging of the lamp beads, resulting in damage in advance. Therefore, a heat radiation assembly is usually arranged inside the backlight module of the keyboard.
[0003] In Chinese patent CN221746397U, the utility model discloses a kind of backlight modules of graphene heat dissipation, including lower metal frame, glue frame, light emitting strip, light guide plate and diffusion light enhancement film assembly, lower metal frame includes bottom plate part and is connected to the first side plate part, second side plate part, third side plate part, fourth side plate part around bottom plate part, lower metal frame is surrounded to form installation cavity inside, light guide plate is located in installation cavity, diffusion light enhancement film assembly is located above light guide plate;The top surface of bottom plate part is provided with graphene heat dissipation layer, graphene heat dissipation layer extends from the inside of first side plate part towards the inside of second side plate part, and at least covers one third of the top surface of bottom plate part;Light emitting strip is installed in installation cavity along first side plate part, light guide plate is located between the light emitting side of light emitting strip and second side plate part, graphene heat dissipation layer is located below light guide plate, effectively expands heat dissipation area, so that the heat generated by light emitting strip is more quickly transferred to lower metal frame through graphene heat dissipation layer and dissipates to outside, improves heat dissipation effect.
[0004] The existing keyboard backlight module has the problem that the difference in thermal expansion coefficient between different materials may cause the graphene heat dissipation plate and the components on its top that need to be cooled to not be in close contact when the temperature changes, affecting the cooling effect, and the graphene has excellent heat conduction and cooling performance, but directly setting it inside the keyboard will guide the heat at the top of the light emitting plate to the circuit board below, and the heat is difficult to dissipate outward, although the temperature at the position of the light emitting plate is reduced, but the temperature of other components is increased, and long-term heat accumulation may also cause damage to the keyboard.
[0005] In view of the above problems, a keyboard backlight module with a graphite heat radiation assembly is proposed. UTILITY MODEL CONTENTS
[0006] The utility model discloses a keyboard backlight module with graphite heat radiation assembly, solves the problem of different expansion coefficients, tight contact caused by heating and cooling and damage to the circuit board caused by graphene directing heat to the circuit board in the background art.
[0007] To realize the above-mentioned purpose, the utility model provides the following technical scheme: a keyboard backlight module with graphite heat radiation assembly, including backlight module installation frame, the inside fixed connection of backlight module installation frame has flexible printed circuit board, and the top of flexible printed circuit board is glued and is connected with PET film, the top of PET film is installed with heat dissipation air duct assembly, the heat dissipation air duct assembly includes heat dissipation fin, air inlet through -hole and air outlet through -hole, the air inlet through -hole and air outlet through -hole are set up respectively in both ends of backlight module installation frame, the top of heat dissipation fin is installed with elastic close -fit component, the elastic close -fit component includes graphene heat dissipation plate, and the top of graphene heat dissipation plate is fixedly connected in heat dissipation fin, the lateral fixed connection of graphene heat dissipation plate has lifting pressure block, and the bottom of lifting pressure block is fixedly connected with spring, and the connecting mode between the bottom of spring and backlight module installation frame is fixed connection.
[0008] Preferably, the top of the graphene heat dissipation plate is tightly attached to a reflector plate, the top of the reflector plate is glued and connected to a light-emitting plate, the light-emitting plate and the flexible printed circuit board are electrically connected, the top of the light-emitting plate is installed with an encapsulation assembly, and the encapsulation assembly includes a fixed panel that is pressed on the top of the light-emitting plate.
[0009] Preferably, the air inlet through-hole and the air outlet through-hole are both L-shaped, the opening end of the air outlet through-hole faces upwards, and the opening end of the air inlet through-hole faces downwards, and the air inlet through-hole and the air outlet through-hole are one-to-one corresponding.
[0010] Preferably, the heat dissipation fins are equally spaced about the bottom surface of the graphene heat dissipation plate, and the channel formed between every two heat dissipation fins corresponds to the air inlet through-hole and the air outlet through-hole.
[0011] Preferably, the lifting pressure block is slidably connected with a slot on the outside, and the slot is formed in the inner wall of the backlight module installation frame.
[0012] Preferably, the fixed panel is peripherally fixedly connected with a fixed frame, four corners of the fixed frame are penetrated by fixed screws, and the fixed screws are threadedly connected with the fixed frame.
[0013] Preferably, the bottom of the fixed frame is fixedly connected with a positioning clamping block, and the positioning clamping block is clamped and connected with the inside of the slot.
[0014] Preferably, the bottom four corners of the backlight module mounting frame are fixedly connected with keyboard supporting legs, and the bottom ends of the keyboard supporting legs are fixedly connected with silica gel anti-skid pads.
[0015] Compared with the prior art, the backlight module has the following beneficial effects:
[0016] The keyboard backlight module with the graphite heat dissipation assembly has the advantages that the heat generated by the light-emitting plate during the working process can be transferred to the graphene heat dissipation plate and then to the heat dissipation fins distributed at equal intervals at the bottom of the graphene heat dissipation plate, when the temperature inside the channel formed by the heat dissipation fins rises, the hot air expands and is discharged outward through the air outlet holes, at the same time, the internal air pressure is reduced, external air flows into the channel through the air inlet holes, and the air flow is formed in the channel, so that the heat on the surfaces of the heat dissipation fins is taken out, the heat transferred by the graphene heat dissipation plate is dissipated in a mode that the heat dissipation fins and air convection cooperate with each other, the heat dissipation efficiency is improved, and the heat transferred by the graphene heat dissipation plate is prevented from accumulating on other components in the keyboard, so that the service life of the keyboard is improved.
[0017] The keyboard backlight module with the graphite heat dissipation assembly has the advantages that when the temperature inside the keyboard changes, the elastic mechanism arranged at the side of the graphene heat dissipation plate can be adaptively compensated, the graphene heat dissipation plate can be adjusted up and down, the top surface of the graphene heat dissipation plate can be closely attached to the heat generating component at the top, and the heat conduction and heat dissipation performance are guaranteed. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is an overall explosion structure schematic view of the utility model;
[0019] Figure 2 It is an overall three-dimensional structure schematic view of the utility model;
[0020] Figure 3 It is a three-dimensional structure schematic view of the elastic close assembly part of the utility model;
[0021] Figure 4 It is a three-dimensional structure schematic view of the heat dissipation air duct assembly part of the utility model;
[0022] Figure 5 It is a three-dimensional structure schematic view of the packaging assembly part of the utility model.
[0023] In the figure: 1, backlight module mounting frame; 2, flexible printed circuit board; 3, PET film; 4, heat dissipation air duct assembly; 5, elastic close-together assembly; 6, encapsulation assembly; 7, light-emitting plate; 8, light-reflecting plate; 9, keyboard supporting leg; 401, heat dissipation fin; 402, air inlet through hole; 403, air outlet through hole; 501, graphene heat dissipation plate; 502, lifting and pressing block; 503, spring; 504, notch; 601, fixed panel; 602, fixed frame; 603, positioning clamping block; 604, fixed screw. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0025] In order to further understand the content of the present application, the present application will be described in detail in combination with the drawings. EMBODIMENT
[0026] Please refer to Figures 1 to 5 The backlight module of the keyboard with the graphene heat dissipation assembly comprises a backlight module mounting frame 1, a flexible printed circuit board 2 is fixedly connected inside the backlight module mounting frame 1, a PET film 3 is adhesively connected to the top of the flexible printed circuit board 2, a heat dissipation air duct assembly 4 is installed on the top of the PET film 3, the heat dissipation air duct assembly 4 comprises heat dissipation fins 401, air inlet through holes 402 and air outlet through holes 403, the air inlet through holes 402 and the air outlet through holes 403 are respectively formed at two ends of the backlight module mounting frame 1, an elastic close-together assembly 5 is installed on the top of the heat dissipation fins 401, the elastic close-together assembly 5 comprises a graphene heat dissipation plate 501, the graphene heat dissipation plate 501 is fixedly connected to the top of the heat dissipation fins 401, lifting and pressing blocks 502 are fixedly connected to the side of the graphene heat dissipation plate 501, springs 503 are fixedly connected to the bottom of the lifting and pressing blocks 502, the connection mode between the bottom end of the spring 503 and the backlight module mounting frame 1 is fixed connection, a light-reflecting plate 8 is closely attached to the top of the graphene heat dissipation plate 501, a light-emitting plate 7 is adhesively connected to the top of the light-reflecting plate 8, the light-emitting plate 7 is electrically connected to the flexible printed circuit board 2, an encapsulation assembly 6 is installed on the top of the light-emitting plate 7, the encapsulation assembly 6 comprises a fixed panel 601, and the fixed panel 601 is pressed on the top of the light-emitting plate 7.
[0027] The shapes of the air inlet through hole 402 and the air outlet through hole 403 are both L-shaped, the opening end of the air outlet through hole 403 faces upward, the opening end of the air inlet through hole 402 faces downward, the air inlet through hole 402 and the air outlet through hole 403 are one-to-one corresponding, the heat dissipation fins 401 are equidistantly arranged about the bottom surface of the graphene heat dissipation plate 501, and the channel formed by every two heat dissipation fins 401 in the middle is corresponding to the air inlet through hole 402 and the air outlet through hole 403, the top of the graphene heat dissipation plate 501 is close to the light reflecting plate 8 and the light emitting plate 7, graphene has extremely high thermal conductivity, the two-dimensional honeycomb lattice structure makes the carbon atoms have very strong covalent bonds, and the heat vibration is transmitted quickly, so that the heat can be efficiently transmitted from the area with high temperature to the area with low temperature, the heat generated by the light emitting plate 7 in the working process can be transmitted to the graphene heat dissipation plate 501 and then to the heat dissipation fins 401 equidistantly distributed at the bottom of the graphene heat dissipation plate 501, when the temperature in the channel formed by the heat dissipation fins 401 rises, the hot air expands and is discharged outward through the air outlet through hole 403, at the same time, the internal air pressure decreases, and the external air flow enters through the air inlet through hole 402, forming a circulating air flow in the channel, and then the heat on the surface of each heat dissipation fin 401 is taken out outward, the heat conducted by the graphene heat dissipation plate 501 is dissipated by the cooperation of the heat dissipation fins 401 and the air convection, so as to improve the heat dissipation efficiency, and also effectively prevent the heat conducted by the graphene heat dissipation plate 501 from accumulating on other parts inside the keyboard, thereby improving the practical life of the keyboard.
[0028] The lifting and pressing block 502 is slidably connected with the notch 504, and the notch 504 is arranged on the inner wall of the backlight module mounting frame 1. Under the pressing and fixing effect of the fixed panel 601, in the normal temperature state, each layer of parts inside the keyboard is tightly attached and in a stable state. When the temperature changes, due to the difference in the expansion coefficients of different materials inside, the deformation amounts are different, the elastic mechanism arranged on the side of the graphene heat dissipation plate 501 can adaptively compensate, and the graphene heat dissipation plate 501 can be adjusted up and down, so that the top surface can be tightly attached to the top heat generating component, thereby ensuring good heat conduction and heat dissipation performance.
[0029] The fixed panel 601 is fixedly connected with the fixed frame 602, the fixed screws 604 penetrate through the four corners of the fixed frame 602, and the connection between the fixed screws 604 and the fixed frame 602 is threaded connection, the bottom of the fixed frame 602 is fixedly connected with the positioning clamping block 603, and the positioning clamping block 603 is clamped and connected in the notch 504.
[0030] The keyboard supporting legs 9 are fixedly connected to the bottom four corners of the back light module mounting frame 1, and the bottom ends of the keyboard supporting legs 9 are fixedly connected with silica gel non-slip pads.
[0031] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0032] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A keyboard backlight module with a graphite heat dissipation component, characterized in that: The utility model provides a back light unit installation frame, the inside fixed connection of back light unit installation frame (1) has flexible printed circuit board (2), and the top of flexible printed circuit board (2) is glued and is connected with PET film (3), the top of PET film (3) is installed with heat dissipation air duct subassembly (4), heat dissipation air duct subassembly (4) includes heat dissipation fin (401), air inlet through -hole (402) and air outlet through -hole (403), air inlet through -hole (402) and air outlet through -hole (403) are set up respectively in both ends of back light unit installation frame (1), the top of heat dissipation fin (401) is installed with elastic close -fit subassembly (5), elastic close -fit subassembly (5) includes graphene heat dissipation plate (501), and graphene heat dissipation plate (501) fixed connection is on the top of heat dissipation fin (401), the side of graphene heat dissipation plate (501) is fixedly connected with lift pressure block (502), and the bottom of lift pressure block (502) is fixedly connected with spring (503), and the connecting mode between the bottom of spring (503) and back light unit installation frame (1) is fixed connection; The top of the graphene heat dissipation plate (501) is tightly attached to the reflector (8), and the top of the reflector (8) is glued and connected to the light-emitting plate (7), and the light-emitting plate (7) is electrically connected to the flexible printed circuit board (2), and the top of the light-emitting plate (7) is provided with an encapsulation assembly (6), and the encapsulation assembly (6) comprises a fixed panel (601), and the fixed panel (601) is pressed on the top of the light-emitting plate (7).
2. The keyboard backlight module with graphite heat-dissipation component according to claim 1, characterized in that: The shapes of the air inlet through-hole (402) and the air outlet through-hole (403) are both L-shaped, the opening end of the air outlet through-hole (403) faces upward, and the opening end of the air inlet through-hole (402) faces downward, and the air inlet through-hole (402) and the air outlet through-hole (403) are one-to-one corresponding.
3. The keyboard backlight module with graphite heat-dissipation component according to claim 1, wherein: The heat dissipation fins (401) are equidistantly arranged about the bottom surface of the graphene heat dissipation plate (501), and the channels formed between every two heat dissipation fins (401) correspond to the air inlet through-hole (402) and the air outlet through-hole (403).
4. The keyboard backlight module with graphite heat-dissipation component according to claim 1, wherein: The outside of the lift pressure block (502) is slidably connected with a notch (504), and the notch (504) is formed in the inner wall of the back light unit installation frame (1).
5. The keyboard backlight module with graphite heat-dissipation component according to claim 1, wherein: The periphery of the fixed panel (601) is fixedly connected with a fixed frame (602), four corners of the fixed frame (602) are penetrated by fixed screws (604), and the fixed screws (604) are threadedly connected with the fixed frame (602).
6. The keyboard backlight module with graphite heat-dissipation component according to claim 5, characterized in that: The bottom of the fixed frame (602) is fixedly connected with a positioning clamping block (603), and the positioning clamping block (603) is clamped and connected to the inside of the notch (504).
7. The keyboard backlight module with graphite heat-dissipation component of claim 1, wherein: The bottom four corners of the back light unit installation frame (1) are fixedly connected with keyboard supporting legs (9), and the bottom ends of the keyboard supporting legs (9) are fixedly connected with silica gel non-slip pads.
Citation Information
Patent Citations
Graphene heat dissipation backlight module
CN221746397U