Interchangeable wafer suction cup mounting device

Abstract

The utility model discloses an interchangeable wafer suction cup installation device, which is used for being installed on a machine table and comprises a base assembly, at least two self-resetting pressing contact assemblies, a wafer suction cup and a control identification assembly. The base assembly is detachably installed on the machine table. The self-resetting pressing contact assembly is movably installed on the base assembly, the self-resetting pressing contact assembly comprises a pressing end and a pair of electrode contacts, and the self-resetting pressing contact assembly is suitable for connecting or disconnecting the corresponding pair of electrode contacts to generate corresponding contact state signals when the pressing end is pressed; the wafer suction cup is detachably installed on the installation platform of the base assembly. According to the utility model, the mounting and dismounting of the wafer suction cup can be realized conveniently and quickly, meanwhile, the interchange of various types of wafer suction cups is supported, and the adaptability and the use efficiency of a machine table are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of interchangeable wafer chuck mounting device, belong to wafer test equipment technical field. BACKGROUND

[0002] At present, the equipment in the field of wafer detection technology of semiconductor industry is usually equipped with wafer chuck, and the main function of wafer chuck is to fix the wafer to be detected on the chuck by vacuum adsorption, so as to facilitate accurate detection by the equipment. However, due to the variety of products involved by different institutions (such as fab factory, research institute, university, etc.), the demand for wafer chuck also shows diversification. For example, the detection objects may include wafer, wafer square, Gel-pak, frame (iron ring blue film) and small size and large quantity of wafer, etc. This leads to the fact that a machine usually only has one kind of wafer chuck to quickly detect a specific type of wafer.

[0003] However, for some institutions affected by factors such as site restrictions, insufficient professionals or limited funds, a machine needs to adapt to different wafer chucks, and it is convenient to exchange various wafer chucks.

[0004] After searching the prior art, it is found that a replaceable wafer chuck is disclosed in Chinese patent No. CN218274553U. In this patent, the wafer chuck is detachably connected with the base, and the detection and identification are realized by contact terminals. However, in actual use, it is found that since the wafer chuck is designed as a circle, and multiple contact pieces are installed on the wafer chuck, accurate alignment is required during installation. If the alignment is not accurate, the contact terminals may be damaged, which makes the installation and disassembly inconvenient. SUMMARY

[0005] The technical problem to be solved by the utility model is to overcome the defects of the prior art, and to provide a interchangeable wafer chuck mounting device which can conveniently and quickly realize the installation and disassembly of wafer chuck, and support the interchange of multiple types of wafer chuck, thereby improving the adaptability and use efficiency of the machine.

[0006] To solve the above technical problems, the technical scheme of the utility model is as follows: a interchangeable wafer chuck mounting device is used for mounting on a machine, comprising:

[0007] A base assembly is provided with a mounting platform, and the base assembly is detachably mounted on the machine;

[0008] At least two self-resetting press contact assemblies movably mounted on the base assembly, the self-resetting press contact assemblies comprising a press end and a pair of electrode contacts, the self-resetting press contact assemblies adapted to turn on or off a corresponding pair of electrode contacts to generate a contact state signal when the press end is pressed;

[0009] A wafer chuck detachably mounted on the mounting platform of the base assembly, the bottom of the wafer chuck selectively provided with a relief groove corresponding to the position of the self-resetting press contact assembly, and when the relief groove is not provided, the bottom surface of the wafer chuck presses against the press end of the self-resetting press contact assembly;

[0010] A control identification assembly provided in the machine, the control identification assembly being provided with a plurality of input ends, the input ends being electrically connected with the corresponding electrode contacts of the self-resetting press contact assemblies through the base assembly, the control identification assembly being adapted to receive the contact state signal generated by the self-resetting press contact assemblies and identify the type of the wafer chuck according to the contact state signal.

[0011] Further, a specific structure of a limiting assembly is provided, and the interchangeable wafer chuck mounting device further comprises a limiting assembly, the limiting assembly comprising:

[0012] At least one positioning column vertically fixed to the base assembly,

[0013] The bottom surface of the wafer chuck is provided with a positioning sleeve mounting groove;

[0014] A positioning sleeve fixedly mounted in the positioning sleeve mounting groove of the bottom surface of the wafer chuck, the positioning sleeve being provided with a positioning hole adapted to the positioning column, and the inner wall of the positioning hole and the outer wall of the positioning column are in clearance fit.

[0015] Further, a specific number of the positioning column is provided, and the positioning column is provided with two.

[0016] Further, the top end of the positioning column is provided with a guide portion, and the guide portion is a tapered structure.

[0017] Further, a specific structure of a clamping mechanism is provided, and the interchangeable wafer chuck mounting device further comprises at least one clamping mechanism, the clamping mechanism comprising:

[0018] A locking rod fixedly mounted on the bottom surface of the wafer chuck,

[0019] The mounting platform of the base assembly is provided with a connecting hole corresponding to the locking rod, and the side wall of the base assembly is provided with a transverse through groove in communication with the connecting hole.

[0020] A locking seat is fixedly installed on the transverse through slot of the sidewall of the base assembly, and a through hole is arranged in the locking seat, and a thread is arranged on the inner wall of the through hole;

[0021] A locking push rod is arranged on the outer circumferential surface of the locking rod, and an outer thread is arranged on the outer circumferential surface of the locking push rod and matched with the thread on the inner wall of the through hole of the locking seat, and the locking push rod is adapted to abut against the annular clamping groove of the locking rod through the through hole of the locking seat.

[0022] Further, an annular clamping groove is arranged on the outer circumferential surface of the locking rod, and the included angle between the upper sidewall of the annular clamping groove and the axis of the locking rod is greater than the included angle between the lower sidewall of the annular clamping groove and the axis of the locking rod.

[0023] The locking push rod is adapted to abut against the annular clamping groove of the locking rod through the through hole of the locking seat.

[0024] Further, the interchangeable wafer chuck mounting device further comprises a vacuum interface, which is mounted on the base assembly.

[0025] Further, edges on the mounting platform of the base assembly are provided with at least two dismounting auxiliary grooves.

[0026] The above technical scheme has the following beneficial effects:

[0027] In the utility model, first, the base assembly is fixedly installed on the machine table in the use process, and then the wafer chuck is installed. When the wafer chuck contacts the base assembly, because the number of the reserved avoiding grooves on the bottom surface of the wafer chuck of different models is different, the contact state of the self-resetting press contact assembly on the base assembly is also different. After the press end is pressed, the self-resetting press contact assembly is turned on or turned off through the electrode contact, and a corresponding contact state signal is generated. The control recognition assembly arranged in the machine table receives the corresponding contact state signal, judges the model of the wafer chuck, and according to the model of the wafer chuck, the machine table selects the detection plug-in corresponding to the wafer chuck of the type and the wafer, so that the ability of quickly adapting to different wafer chucks is realized, and the production efficiency and the operation accuracy are remarkably improved.

[0028] In addition, the limiting assembly effectively guarantees the accurate positioning of the wafer chuck through the cooperation of the positioning column and the positioning sleeve, avoids the deviation in the installation process, and ensures that the wafer chuck is installed in place. The clamping mechanism makes the wafer chuck and the base assembly more stable through the cooperation of the locking rod, the locking push rod and the locking seat, and prevents the problems of loosening or falling off of the wafer chuck caused by vibration or other external forces in the equipment operation process.

[0029] In conclusion, the utility model effectively promotes the interchange reliability of wafer chuck, further improves work efficiency and stability, and meets the demand of modern wafer manufacturing industry for high precision, high efficiency and high reliability. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is the three-dimensional structure schematic view of interchangeable wafer chuck mounting device of the utility model;

[0031] Figure 2 It is the three-dimensional structure schematic view of base assembly of interchangeable wafer chuck mounting device of the utility model;

[0032] Figure 3 It is the three-dimensional structure schematic view of wafer chuck of interchangeable wafer chuck mounting device of the utility model;

[0033] Figure 4 It is the structure schematic view of clamping mechanism of interchangeable wafer chuck mounting device of the utility model. DETAILED DESCRIPTION

[0034] In order to make the content of the utility model more easily be clearly understood, the utility model is further explained in detail below according to specific embodiment and combining with the drawings.

[0035] As Figures 1-4 Indicated, a kind of interchangeable wafer chuck mounting device, for installation on machine table, including:

[0036] Base assembly 1, installation platform is equipped on base assembly 1, base assembly 1 is detachably installed on machine table;

[0037] Two self-resetting press contact components 2, self-resetting press contact component 2 is movably installed on base assembly 1, self-resetting press contact component 2 includes press end and a pair of electrode contact, self-resetting press contact component 2 is adapted to when being pressed in press end to be turned on or disconnected corresponding pair of electrode contact, to produce contact state signal;

[0038] Wafer chuck 3, wafer chuck 3 is detachably installed on the installation platform of base assembly 1, wafer chuck 3 bottom is selectively provided with avoiding groove, avoiding groove is positionally corresponding with self-resetting press contact component 2, when avoiding groove is not provided, the bottom surface of wafer chuck 3 is pressed to the press end of self-resetting press contact component 2;

[0039] Control identification component, control identification component is set in machine table, control identification component is equipped with multiple input ends, input end is electrically connected with corresponding electrode contact of self-resetting press contact component 2 through base assembly 1, control identification component is adapted to receive the contact state signal sent by self-resetting press contact component 2, and the type of wafer chuck 3 is identified according to contact state signal.

[0040] In the embodiment, as shown in Figure 1 , the base assembly 1 is first fixedly installed on the machine table during use, and then the wafer chuck 3 is installed. When the wafer chuck 3 is in contact with the base assembly 1, because the number of the reserved avoidance grooves on the bottom surface of the wafer chuck 3 of different models is different, the contact state of the self-resetting press contact assembly 2 on the base assembly 1 is also different. After the press end is pressed, the self-resetting press contact assembly 2 generates a corresponding contact state signal through the conduction or disconnection of the electrode contact. The control recognition assembly arranged in the machine table receives the corresponding contact state signal to determine the model of the wafer chuck 3. According to the model of the wafer chuck 3, the machine table selects the detection plug corresponding to the wafer chuck 3 of the type to detect the wafer, thereby realizing the ability to quickly adapt to different wafer chucks 3 and significantly improving the production efficiency and the accuracy of operation.

[0041] During the pressing of the self-resetting press contact assembly 2, the state thereof can be represented by digital coding. For example, when there are only two self-resetting press contact assemblies 2, assuming that pressing is 1 and not pressing is 0, the contact state combination can be represented as 01, 10 and 11, a total of three cases, so that three models of wafer chucks 3 can be recognized. When the number of the self-resetting press contact assemblies 2 increases to three, the contact state combination is expanded to 001, 010, 011, 100, 101 and 111, a total of six cases, which can correspond to recognize six models of wafer chucks 3. By recognizing different contact state signals, the machine table can quickly determine the model of the installed wafer chuck. In some embodiments, the number of the self-resetting press contact assemblies 2 is not limited to two, and can be set according to specific needs.

[0042] The machine table can be a wafer test machine table, and the control recognition assembly can be a CPU control module (FPGA master control) arranged in the wafer test machine table. During use, the CPU control module obtains the model of the wafer chuck by the above-mentioned manner, and then performs the detection operation of the wafer according to the automatic test process issued by the upper computer. The upper computer can be a PC or an industrial computer.

[0043] Specifically, as shown in Figure 1 and Figure 3 , the interchangeable wafer chuck mounting device further comprises a limiting assembly, and the limiting assembly comprises:

[0044] two positioning columns 11, which are vertically fixed to the base assembly 1,

[0045] the bottom surface of the wafer chuck 3 is provided with a positioning sleeve mounting groove;

[0046] The positioning sleeve 12 is fixedly installed in a positioning sleeve installation groove in the bottom surface of the wafer chuck 3, and the positioning sleeve 12 is provided with a positioning hole matched with the positioning column 11, and the inner wall of the positioning hole is in clearance fit with the outer wall of the positioning column 11.

[0047] Specifically, as shown in Figure 1 , the positioning column 11 is provided with two.

[0048] Specifically, as shown in Figure 1 , the top end of the positioning column 11 is provided with a guide portion, which is a conical structure.

[0049] In this embodiment, as shown in Figure 1 and Figure 3 , the positioning column 11 adopts two, which can effectively prevent the wafer chuck 3 from rotating during installation. The conical guide portion designed at the top end of the positioning column 11 can guide the positioning sleeve 12 to accurately align with the positioning column 11, thereby improving the installation efficiency. In addition, the cross section of the positioning column 11 is circular, which can also be polygonal.

[0050] Specifically, as shown in Figure 1 and Figure 4 , the interchangeable wafer chuck installation device further comprises four clamping mechanisms, which comprise:

[0051] The locking rod 41 is fixedly installed on the bottom surface of the wafer chuck 3,

[0052] The installation platform of the base assembly 1 is provided with a connecting hole corresponding to the locking rod 41, and the side wall of the base assembly 1 is provided with a transverse through slot in communication with the connecting hole;

[0053] The locking seat 42 is fixedly installed on the transverse through slot of the side wall of the base assembly 1, and the locking seat 42 is provided with a through hole in which a screw thread is arranged;

[0054] The outer periphery of the locking push rod 43 is provided with an external thread matched with the screw thread in the inner wall of the through hole of the locking seat 42, and the locking push rod 43 is adapted to abut against the locking rod 41 through the through hole.

[0055] Specifically, as shown in Figures 1-2 , the outer periphery of the locking rod 41 is provided with an annular clamping groove, and the included angle between the upper side wall of the annular clamping groove and the axis of the locking rod 41 is greater than the included angle between the lower side wall of the annular clamping groove and the axis of the locking rod 41;

[0056] The locking push rod 43 is adapted to abut against the annular clamping groove of the locking rod 41 through the through hole of the locking seat 42.

[0057] In this embodiment, as shown in Figure 1 and Figure 4As shown, four clamping mechanisms are arranged on four sides of the base assembly 1.

[0058] In practical application, the operator first installs the wafer chuck 3 in place, so that the locking rod 41 is inserted into the connecting hole of the base assembly 1. Subsequently, by rotating the locking push rod 43, the locking push rod 43 is gradually approached and finally abuts against the annular clamping groove of the locking rod 41 by the cooperation of the external thread of the locking push rod 43 and the internal thread of the locking seat 42.

[0059] Specifically, as shown in the figure, Figures 1-2 The interchangeable wafer chuck mounting device further comprises a vacuum interface 13, which is mounted on the base assembly 1.

[0060] Specifically, as shown in the figure, Figures 1-2 The edge of the mounting platform of the base assembly 1 is provided with two disassembly auxiliary grooves 14.

[0061] In this embodiment, as shown in the figure, Figures 1-2 Figures 1-2 The vacuum interface 13 is mounted on the base assembly 1 and communicates with the wafer chuck 3 through an internal vacuum channel. When connected to an external vacuum system, the wafer chuck 3 can be provided with stable negative pressure suction force, ensuring that the wafer can be reliably sucked and fixed. The disassembly auxiliary grooves 14 provided on the edge of the mounting platform of the base assembly 1 can facilitate the disassembly of the wafer chuck 3.

[0062] In some embodiments, the pressing end of the self-resetting pressing contact assembly can be an electrical connection contact. Different resistances are arranged between two self-resetting pressing contact assemblies, and the wafers are classified by presetting the resistance value range. The machine measures the resistance value between the two contacts to determine the type of wafer chuck 3.

[0063] The above specific embodiments further illustrate the technical problems, technical solutions and beneficial effects solved by the present application. It should be understood that the above description is only for specific embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An interchangeable wafer chuck mounting device for mounting on a machine, characterized by, The interchangeable wafer chuck mounting device comprises a base assembly (1) provided with a mounting platform, the base assembly (1) being detachably mounted on a machine table; at least two self-resetting press contact assemblies (2) movably mounted on the base assembly (1), each self-resetting press contact assembly (2) comprising a press end and a pair of electrode contacts, the self-resetting press contact assembly (2) being adapted to turn on or off the corresponding pair of electrode contacts when the press end is pressed to generate a contact state signal; a wafer chuck (3) detachably mounted on the mounting platform of the base assembly (1), the wafer chuck (3) being selectively provided with a relief groove at the bottom, the relief groove corresponding to the position of the self-resetting press contact assembly (2), when the relief groove is not provided, the bottom surface of the wafer chuck (3) abutting against the press end of the self-resetting press contact assembly (2); and a control recognition assembly provided in the machine table, the control recognition assembly being provided with a plurality of input ends, the input ends being electrically connected with the corresponding electrode contacts of the self-resetting press contact assembly (2) through the base assembly (1), the control recognition assembly being adapted to receive the contact state signal generated by the self-resetting press contact assembly (2) and identify the type of the wafer chuck (3) according to the contact state signal.

2. The interchangeable wafer chuck mounting device according to claim 1, further comprising a limiting assembly, the limiting assembly comprising: at least one positioning column (11) fixedly arranged on the base assembly (1), a bottom surface of the wafer chuck (3) being provided with a positioning sleeve mounting groove, and a positioning sleeve (12) fixedly arranged in the positioning sleeve mounting groove of the bottom surface of the wafer chuck (3), the positioning sleeve (12) being provided with a positioning hole adapted to the positioning column (11), an inner wall of the positioning hole being in clearance fit with an outer wall of the positioning column (11).

3. The interchangeable wafer chuck mounting device according to claim 2, wherein the positioning column (11) is provided with two.

4. The interchangeable wafer chuck mounting device according to claim 2, wherein a top end of the positioning column (11) is provided with a guide portion, the guide portion being in conical structure.

5. The interchangeable wafer chuck mounting device according to claim 1, further comprising at least one clamping mechanism, the clamping mechanism comprising: a locking rod (41) fixedly arranged on the bottom surface of the wafer chuck (3), the mounting platform of the base assembly (1) being provided with a connecting hole corresponding to the locking rod (41), a lateral wall of the base assembly (1) being provided with a transverse through groove in communication with the connecting hole, and a locking seat (42) fixedly arranged on the transverse through groove of the lateral wall of the base assembly (1), the locking seat (42) being provided with a through hole in which a screw thread is arranged. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ A locking push rod (43) is provided with external threads on the outer circumferential surface thereof, which are matched with the internal threads of the inner wall of the through hole of the locking seat (42), and the locking push rod (43) is adapted to abut against the locking rod (41) through the through hole. 6.The interchangeable wafer chuck mounting device according to claim 5, wherein, An annular clamping groove is arranged on the outer circumferential surface of the locking rod (41), and the included angle between the upper side wall of the annular clamping groove and the axis of the locking rod (41) is greater than the included angle between the lower side wall of the annular clamping groove and the axis of the locking rod (41). The locking push rod (43) is adapted to abut against the annular clamping groove of the locking rod (41) through the through hole of the locking seat (42). 7.The interchangeable wafer chuck mounting device according to claim 1, wherein, A vacuum interface (13) is further arranged on the base assembly (1). 8.The interchangeable wafer chuck mounting device according to claim 1, wherein, At least two disassembly auxiliary grooves (14) are arranged on the edge of the mounting platform of the base assembly (1).

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