Batch type transfer clamp for chip packaging

Abstract

The utility model discloses a batch type transfer clamp for chip packaging, relates to the technical field of chip packaging, and can solve the problems that a plurality of existing mechanical clamps for transferring chips cannot be transferred at the same time, and the transfer efficiency is low. The batch type transfer clamp for chip packaging comprises a clamp base body and a plurality of suction cup assemblies used for adsorbing and clamping chips in batches, and the suction cup assemblies are distributed on the clamp base body in a rectangular array mode. Control units used for controlling the suction cup assemblies to open and close the suction function are further arranged on the clamp base body, the number of the control units is the same as that of the suction cup assemblies, and the single control units correspond to the single suction cup assemblies.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and specifically to a batch transfer fixture for chip packaging. Background Technology

[0002] The existing chip packaging process first requires using a probe card to detect parameters on a wafer containing several small square chips and pre-marking chips that do not meet quality requirements. Then, a blue film is applied to the wafer to prepare for the next step of wafer dicing.

[0003] After the blue film is applied to the wafer and it is cut into circles, the entire wafer is transferred to a dicing device for dicing. Dicing separates the chips on the wafer while ensuring they are all covered by the blue film. At this point, based on the defective chips marked in the aforementioned inspection process, the qualified chips can be transferred one by one to the subsequent conductive adhesive encapsulation process using mechanical jigs. However, the existing mechanical jigs have low chip transfer efficiency and cannot perform batch transfers, only single transfers. This low transfer efficiency also affects the efficient operation of the subsequent encapsulation process.

[0004] Based on the above background, the inventors designed a batch transfer fixture for chip packaging, which solves the problem that existing mechanical fixtures for transferring chips cannot transfer multiple chips at the same time and have low transfer efficiency. Summary of the Invention

[0005] The purpose of this application is to provide a modular elastic fixture for chip packaging, which solves the problem that existing mechanical fixtures for transferring chips cannot transfer multiple chips at the same time and have low transfer efficiency.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following solution:

[0007] This application provides a batch transfer fixture for chip packaging, including a fixture base body and multiple suction cup assemblies for batch adsorption and gripping of chips, wherein the multiple suction cup assemblies are distributed in a rectangular array on the fixture base body;

[0008] The fixture body is also equipped with a control unit for controlling the opening and closing suction function of the suction cup assembly. The number of control units is the same as the number of suction cup assemblies, and each control unit corresponds to a single suction cup assembly.

[0009] Optionally, the suction cup assembly includes a suction cup body with a plurality of suction holes, a rigid suction tube, and a permanent magnet.

[0010] The rigid suction pipe is slidably connected to the fixture seat body, the permanent magnet and the suction cup body are respectively set at both ends of the rigid suction pipe, and the adsorption hole is connected to the rigid suction pipe.

[0011] The control unit is an electromagnet mounted on the fixture base body;

[0012] The fixture seat body has a first cavity, a rigid suction pipe passes through the first cavity, and the rigid suction pipe has suction side openings facing the first cavity.

[0013] The distance between the intake side opening and the top of the first cavity is less than or equal to the distance between the electromagnet and the permanent magnet when they are in the same magnetic pole opposite state;

[0014] It also includes an air extraction pipe that communicates with the first cavity.

[0015] Optionally, the fixture seat may also include a second cavity located directly above the first cavity;

[0016] An electromagnet is embedded in the top of the second cavity, and a permanent magnet is located inside the second cavity, with the electromagnet positioned directly above the permanent magnet.

[0017] Optionally, several of the adsorption holes are distributed in a rectangular or circular array on the bottom of the suction cup body.

[0018] Optionally, the suction cup body is provided with an adsorption cavity, and a plurality of adsorption holes are connected to the adsorption cavity;

[0019] The air inlet end of the rigid suction tube extends into the adsorption chamber.

[0020] Optionally, the suction cup assembly may further include a rigid fixing plate;

[0021] The suction cup body is made of rubber or silicone material and is fitted and fixed to a rigid fixing plate. The rigid suction tube passes through the rigid fixing plate and is fixedly connected to it.

[0022] Optionally, the distance between the top of the rigid fixing plate and the main body of the clamp seat is greater than or equal to the distance between the air intake side opening and the top of the first cavity.

[0023] Optionally, the rigid fixing plate is provided with a plurality of threaded holes arranged in a rectangular array;

[0024] The rigid suction pipe is threadedly connected to the rigid fixing plate through a threaded hole;

[0025] The rigid fixing plate is also provided with several sealing bolts for sealing threaded holes.

[0026] Optionally, the control unit is a solenoid valve for controlling the airflow of the suction cup assembly.

[0027] Beneficial effects of the utility model:

[0028] I. This application provides a fixture body with suction cup assemblies arranged in a rectangular array, and a control unit on the fixture body to control the opening and closing state of the suction cup assemblies. After the fixture body moves directly above the diced wafer, the corresponding suction cup assembly can be closed according to the previously marked defective chip, while maintaining the normal adsorption function of other suction cup assemblies. This allows for the batch adsorption of multiple chips without adsorbing defective chips, effectively improving the chip transfer efficiency and solving the problem of low transfer efficiency caused by the inability of existing mechanical fixtures to transfer multiple chips simultaneously.

[0029] 2. This application provides multiple threaded holes on a rigid mounting plate, and the rigid suction pipe and the rigid mounting plate are connected by threads. Simultaneously, the threaded holes are sealed with sealing bolts, allowing adjustment of the connection position between the rigid suction pipe and the threaded holes on the rigid mounting plate when the chip size changes, thereby adjusting the position of the suction cup body and adapting to the transfer of chips of different sizes. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of an embodiment of this application.

[0031] Figure 2 This is a schematic diagram of the structure when a defective chip is encountered during the transportation process, according to an embodiment of this application.

[0032] Figure 3 This is a bottom view of the structure according to an embodiment of this application.

[0033] Explanation of reference numerals in the attached drawings: 11-suction cup body, 111-adsorption chamber, 112-adsorption hole, 12-rigid fixing plate, 13-rigid suction pipe, 131-suction side opening, 14-permanent magnet, 2-clamp seat body, 21-first cavity, 22-second cavity, 3-electromagnet, 4-extraction pipe. Detailed Implementation

[0034] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present invention is not limited thereto.

[0035] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "have," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0038] like Figures 1 to 3 As shown, a batch transfer fixture for chip packaging in this embodiment includes a fixture base body 2 and a plurality of suction cup assemblies for batch adsorption and gripping of chips. The plurality of suction cup assemblies are distributed in a rectangular array on the fixture base body 2.

[0039] The fixture body 2 is also equipped with a control unit for controlling the opening and closing suction function of the suction cup assembly. The number of control units is the same as the number of suction cup assemblies, and each control unit corresponds to a single suction cup assembly.

[0040] This embodiment sets up a rectangular array of suction cup components on the fixture body 2, and also sets up a control unit on the fixture body 2 to control the opening and closing state of the suction cup components. After the fixture body 2 moves directly above the diced wafer, the corresponding suction cup component can be closed according to the previously marked defective chip, while maintaining the normal adsorption function of other suction cup components. This allows multiple chips to be adsorbed in batches without adsorbing defective chips, effectively improving the chip transfer efficiency and effectively solving the problem of low transfer efficiency caused by the inability of mechanical fixtures for transferring chips in the prior art.

[0041] Specifically, in this embodiment, the suction cup assembly includes a suction cup body 11 with a plurality of suction holes 112, a rigid suction pipe 13, and a permanent magnet 14.

[0042] The rigid suction pipe 13 is slidably connected to the fixture seat body 2, the permanent magnet 14 and the suction cup body 11 are respectively disposed at both ends of the rigid suction pipe 13, and the adsorption hole 112 is connected to the rigid suction pipe 13.

[0043] The control unit is an electromagnet 3 mounted on the fixture base body 2;

[0044] The fixture seat body 2 is provided with a first cavity 21, and a rigid suction pipe 13 is provided through the first cavity 21. The rigid suction pipe 13 is provided with suction side openings 131 facing the first cavity 21.

[0045] The distance between the intake side opening 131 and the top of the first cavity 21 is less than or equal to the distance between the electromagnet 3 and the permanent magnet 14 when they are in the same magnetic pole opposite state;

[0046] It also includes an air extraction pipe 4 that communicates with the first cavity 21.

[0047] In this embodiment, the suction pipe 4 draws air from the rigid suction pipe 13 through the first cavity 21 and the suction side opening 131, thereby drawing air from the adsorption cavity 111 on the suction cup body 11. This achieves the effect of drawing air from several adsorption holes 112. By contacting the bottom of several suction cup bodies 11 on the fixture body 2 in this embodiment with the chip body and drawing air, the chip can be separated from the blue film and then transferred in batches. When there are unqualified chips below the suction cup bodies 11 on the fixture body 2, the current direction of the electromagnet 3 is controlled so that the relative magnetic poles between the electromagnet 3 and the permanent magnet 14 change to two mutually attractive poles, causing the suction cup assembly to move upward. At this time, the suction side opening 131 on the rigid suction pipe 13 disengages from the first cavity 21, and the entire air passage is disconnected, that is, the adsorption function of the corresponding suction cup body 11 is temporarily disconnected, while the adsorption function of other suction cup bodies 11 is not affected. Other qualified chips can be adsorbed in batches and transferred to the next process.

[0048] Specifically, in this embodiment, the fixture seat is further provided with a second cavity 22 located directly above the first cavity 21;

[0049] Electromagnet 3 is embedded in the top of the second cavity 22, and permanent magnet 14 is located inside the second cavity 22. Electromagnet 3 is located directly above permanent magnet 14. In this embodiment, by changing the direction of the current, electromagnet 3 can attract permanent magnet 14 closer to it or push permanent magnet 14 away from it, thereby causing the suction cup assembly to move up or down. When electromagnet 3 attracts permanent magnet 14, suction side opening 131 moves out of the first cavity 21, and the suction function of the corresponding suction cup body 11 is temporarily turned off. At the same time, its position is raised, and there is no need to contact and damage the chip.

[0050] Specifically, a plurality of adsorption holes 112 are arranged in a rectangular array at the bottom of the suction cup body 11, which is adapted to the square chip, so that the adsorption pressure is more uniform and avoids excessive adsorption pressure at a single point. In some embodiments, the plurality of adsorption holes 112 may also be arranged in a circular array or other arrays, which will not be elaborated here.

[0051] Specifically, the suction cup body 11 is provided with an adsorption cavity 111, and a plurality of adsorption holes 112 are all connected to the adsorption cavity 111.

[0052] The air inlet end of the rigid suction pipe 13 extends into the adsorption chamber 111. The adsorption chamber 111 can make the adsorption pressure of each adsorption hole 112 more balanced, avoiding damage to the chip during the transfer process due to uneven adsorption pressure.

[0053] Specifically, in this embodiment, the suction cup assembly further includes a rigid fixing plate 12;

[0054] The suction cup body 11 is made of rubber or silicone. The suction cup body 11 is fitted and fixed on the rigid fixing plate 12. The rigid suction pipe 13 passes through the rigid fixing plate 12 and is fixedly connected to it. The rigid fixing plate 12 can improve the stability and durability of the entire suction cup assembly.

[0055] Specifically, in this embodiment, the distance between the top of the rigid fixing plate 12 and the fixture seat body 2 is greater than or equal to the distance between the air intake side opening 131 and the top of the first cavity 21, so as to prevent the air intake side opening 131 from being unable to move out of the first cavity 21.

[0056] Specifically, in this embodiment, the rigid fixing plate 12 is provided with a plurality of threaded holes (not shown in the figure) arranged in a rectangular array;

[0057] The rigid suction pipe 13 is threadedly connected to the rigid fixing plate 12 through a threaded hole on the rigid fixing plate 12.

[0058] The rigid fixing plate 12 is also provided with a number of sealing bolts for sealing the threaded holes. By providing multiple threaded holes, and connecting the rigid suction pipe 13 and the rigid fixing plate 12 with threads, and sealing the threaded holes with the sealing bolts, the connection position between the rigid suction pipe 13 and the threaded holes on the rigid fixing plate 12 can be adjusted when the chip size changes, thereby adjusting the position of the suction cup body 11 and adapting to the transfer of chips of different sizes.

[0059] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A batch transfer fixture for chip packaging, characterized by, The clamp seat body (2) is provided with a plurality of suction disc assemblies for batch suction and clamping of chips, and the plurality of suction disc assemblies are arranged in a rectangular array on the clamp seat body (2). The clamp seat body (2) is further provided with a control unit for controlling the suction and clamping function of the suction disc assembly, the number of the control unit is the same as that of the suction disc assembly, and a single control unit corresponds to a single suction disc assembly.

2. The batch transfer fixture for chip packaging according to claim 1, wherein The suction disc assembly comprises a suction disc body (11) provided with a plurality of suction holes (112), a rigid air suction pipe (13) and a permanent magnet (14). The rigid air suction pipe (13) is in sliding connection with the clamp seat body (2), the permanent magnet (14) and the suction disc body (11) are arranged at two ends of the rigid air suction pipe (13) respectively, and the suction holes (112) are in communication with the rigid air suction pipe (13). The control unit is an electromagnet (3) arranged on the clamp seat body (2). The clamp seat body (2) is provided with a first cavity (21), the rigid air suction pipe (13) penetrates through the first cavity (21), and the rigid air suction pipe (13) is provided with an air suction side opening (131) facing the first cavity (21). The distance between the air suction side opening (131) and the top of the first cavity (21) is less than or equal to the distance between the electromagnet (3) and the permanent magnet (14) in the same magnetic pole opposite state. Further comprising an air suction pipe (4) in communication with the first cavity (21).

3. The batch transfer fixture for chip packaging according to claim 2, wherein The clamp seat is further provided with a second cavity (22) located directly above the first cavity (21). The electromagnet (3) is embedded in the top of the second cavity (22), the permanent magnet (14) is located in the second cavity (22), and the electromagnet (3) is located directly above the permanent magnet (14).

4. The batch transfer fixture for chip packaging according to claim 2, wherein A plurality of the suction holes (112) are arranged in a rectangular array or a circular array at the bottom of the suction disc body (11).

5. The batch transfer handler for chip packaging as recited in claim 2, wherein The suction disc body (11) is provided with a suction cavity (111), and a plurality of suction holes (112) are in communication with the suction cavity (111). The air inlet end of the rigid air suction pipe (13) extends into the suction cavity (111).

6. The batch transfer handler for chip packaging as recited in claim 2, wherein The suction disc assembly further comprises a rigid fixing plate (12). The suction disc body (11) is made of rubber or silicone material, and is embedded and fixed on the rigid fixing plate (12), and the rigid air suction pipe (13) penetrates through the rigid fixing plate (12) and is fixedly connected therewith.

7. The batch transfer fixture for chip packaging according to claim 6, wherein The distance between the top of the rigid fixing plate (12) and the clamp seat body (2) is greater than or equal to the distance between the air suction side opening (131) and the top of the first cavity (21).

8. The batch transfer fixture for chip packaging as claimed in claim 6, wherein The rigid fixing plate (12) is provided with a plurality of threaded holes arranged in a rectangular array. The rigid air suction pipe (13) is threadedly connected with the rigid fixing plate (12) through the threaded holes. The rigid fixing plate (12) is further provided with a plurality of plugging bolts for plugging the threaded holes.

9. The batch transfer fixture for chip packaging as claimed in claim 1, wherein The control unit is an electromagnetic valve for on-off of the air path of the suction disc assembly.

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