Semiconductor wafer jacking mechanism

Abstract

The utility model provides a semiconductor wafer jacking mechanism, which comprises a base, a fixed seat, a driving motor, a driving eccentric gear, a first driven eccentric gear, a second driven eccentric gear, a movable seat, a vacuum ejector pin seat and an ejector pin cap, a driving eccentric gear is arranged on the inner side face of the fixed seat, a first driven eccentric gear is rotationally arranged above the driving eccentric gear, a second driven eccentric gear is rotationally arranged below the driving eccentric gear, a movable seat is arranged on the rear side of the fixed seat, a vacuum ejector pin seat is arranged on the upper end face of the movable seat, and an ejector pin cap is arranged on the upper end face of the vacuum ejector pin seat. According to the design, the problem that an original semiconductor wafer jacking mechanism is poor in reciprocating motion stability is solved, the structure is reasonable, the eccentric gear rotates to drive the moving seat to reciprocate up and down, the motion efficiency is high, the movement is more stable, and the practicability is high.

Description

Technical Field

[0001] This utility model is a semiconductor wafer lifting mechanism, belonging to the technical field of wafer lifting mechanism. Background Technology

[0002] With the recent miniaturization of electronic components, semiconductor wafers are also trending towards thinner designs, and thin semiconductor devices with a thickness of 100µm or less can now be produced. However, these thin semiconductor devices are easily damaged and difficult to handle, especially the process of removing individual semiconductor wafers from wafer dicing, which is extremely challenging.

[0003] Chinese patent CN206210764U proposes a semiconductor wafer lifting mechanism. This mechanism uses a pin assembly and a drive assembly on a base. The drive assembly moves the pin assembly up and down, causing it to attract and pierce a blue film, thus lifting the semiconductor wafer. The design essentially uses an eccentric wheel to rotate and compress a spring-loaded slider, causing it to reciprocate. However, this method suffers from unstable pin assembly movement, affecting the lifting effect and resulting in low practicality. Therefore, a semiconductor wafer lifting mechanism is urgently needed to address these problems. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a semiconductor wafer lifting mechanism to solve the problems mentioned in the background technology. This utility model has a reasonable structure and drives the moving seat to move up and down reciprocally through the rotation of the eccentric gear. It has high motion efficiency, more stable movement, and strong practicality.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor wafer lifting mechanism, comprising a base, a fixed seat, a drive motor, a drive eccentric gear, a first driven eccentric gear, a second driven eccentric gear, a movable seat, a vacuum ejector seat, and an ejector cap. The fixed seat is disposed on the upper surface of the base, the drive motor is disposed on the outer side of the fixed seat, the drive eccentric gear is disposed on the inner side of the fixed seat, the first driven eccentric gear is rotatably disposed above the drive eccentric gear, the second driven eccentric gear is rotatably disposed below the drive eccentric gear, the movable seat is disposed on the rear side of the fixed seat, the vacuum ejector seat is disposed on the upper surface of the movable seat, and an ejector cap is disposed on the upper surface of the vacuum ejector seat.

[0006] Furthermore, a first connecting shaft is provided on the inner side of the movable seat, and a first bearing is embedded on the inner side of the first driven eccentric gear. The first driven eccentric gear is rotatably connected to the first connecting shaft through the first bearing.

[0007] Furthermore, a second connecting shaft is provided on the inner side of the movable seat, and a second bearing is embedded on the inner side of the second driven eccentric gear. The second driven eccentric gear is rotatably connected to the second connecting shaft through the second bearing.

[0008] Furthermore, the output end of the drive motor is fitted with a motor shaft, the drive eccentric gear is fitted on the outer side of the motor shaft, the drive eccentric gear meshes with the first driven eccentric gear, and the drive eccentric gear meshes with the second driven eccentric gear.

[0009] Furthermore, a limiting slider is fitted at the front end of the motor shaft, a limiting groove is formed on the rear end face of the movable seat, the limiting slider slides tightly along the inner wall of the limiting groove, a mounting bracket is installed on the outer side of the fixed seat, and the drive motor is mounted on the upper end face of the mounting bracket.

[0010] Furthermore, the movable seat has positioning grooves extending through its left and right sides, and a positioning plate is slidably disposed inside the positioning groove. A connecting block is disposed on the inner side of the positioning plate, and the positioning plate is fixedly connected to the fixed seat through the connecting block.

[0011] The beneficial effects of this utility model are as follows: This utility model provides a semiconductor wafer lifting mechanism. Because it adds a driving eccentric gear, a first driven eccentric gear, and a second driven eccentric gear, when the axis of the driving eccentric gear moves away from the axis of the first driven eccentric gear and closer to the axis of the second driven eccentric gear, the driving motor drives the moving seat to extend upward. At this time, the moving seat drives the vacuum ejector pin to extend upward. When the axis of the driving eccentric gear moves closer to the axis of the first driven eccentric gear and away from the axis of the second driven eccentric gear, the driving motor drives the moving seat to retract downward. Through the rotation of the driving motor, the stable and efficient reciprocating motion of the moving seat is achieved. Attached Figure Description

[0012] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0013] Figure 1 This is a schematic diagram of the structure of a semiconductor wafer lifting mechanism according to the present invention;

[0014] Figure 2 This is a schematic diagram of the structure of a semiconductor wafer lifting mechanism according to this utility model from another perspective;

[0015] Figure 3 This is a partial cross-sectional view of the semiconductor wafer lifting mechanism of this utility model during its movement.

[0016] Figure 4 This is a partial cross-sectional view of the semiconductor wafer lifting mechanism of this utility model during its movement.

[0017] Figure 5 This is a partial cross-sectional view of a semiconductor wafer lifting mechanism according to the present invention.

[0018] Figure 6 This is a partial cross-sectional view of a semiconductor wafer lifting mechanism according to the present invention.

[0019] In the diagram: 1-base, 2-fixed seat, 21-positioning plate, 22-connecting block, 3-drive motor, 31-mounting bracket, 32-motor shaft, 33-limiting slider, 4-drive eccentric gear, 5-first driven eccentric gear, 51-first connecting shaft, 52-first bearing component, 6-second driven eccentric gear, 61-second connecting shaft, 62-second bearing component, 7-moving seat, 71-positioning groove, 72-limiting slide groove, 8-vacuum ejector pin seat, 9-ejector pin cap. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] Please see Figures 1-6 This utility model provides a technical solution: a semiconductor wafer lifting mechanism, including a base 1, a fixed seat 2, a drive motor 3, a drive eccentric gear 4, a first driven eccentric gear 5, a second driven eccentric gear 6, a movable seat 7, a vacuum ejector seat 8, and an ejector cap 9. The fixed seat 2 is provided on the upper surface of the base 1, the drive motor 3 is provided on the outer side of the fixed seat 2, the drive eccentric gear 4 is provided on the inner side of the fixed seat 2, the first driven eccentric gear 5 is rotatably provided above the drive eccentric gear 4, the second driven eccentric gear 6 is rotatably provided below the drive eccentric gear 4, the movable seat 7 is provided on the rear side of the fixed seat 2, the vacuum ejector seat 8 is provided on the upper surface of the movable seat 7, and the ejector cap 9 is provided on the upper surface of the vacuum ejector seat 8. This design solves the problem of poor stability of the reciprocating motion of the original semiconductor wafer lifting mechanism.

[0022] As the first embodiment of this utility model: A first connecting shaft 51 is provided on the inner side of the movable base 7, and a first bearing 52 is embedded on the inner side of the first driven eccentric gear 5. The first driven eccentric gear 5 is rotatably connected to the first connecting shaft 51 through the first bearing 52. The first connecting shaft 51 can fix the position of the first driven eccentric gear 5, and the first driven eccentric gear 5 can rotate around the first connecting shaft 51. A second connecting shaft 61 is provided on the inner side of the movable base 7, and a second bearing 62 is embedded on the inner side of the second driven eccentric gear 6. The second driven eccentric gear 6 is rotatably connected to the second connecting shaft 61 through the second bearing 62. The second connecting shaft 61 can fix the position of the second driven eccentric gear 6, and the second driven eccentric gear 6 can rotate around the second connecting shaft 61. A motor shaft 32 is clamped at the output end of the drive motor 3, and a drive eccentric gear 4 is clamped on the outer side of the motor shaft 32. The drive motor 3 can drive the drive eccentric gear 4 through the motor shaft 32. When gear 4 rotates, it drives eccentric gear 4 to mesh with the first driven eccentric gear 5, and drives eccentric gear 4 to mesh with the second driven eccentric gear 6. The drive eccentric gear 4 can drive the first driven eccentric gear 5 and the second driven eccentric gear 6 to rotate. A limit slider 33 is installed at the front end of the motor shaft 32, and a limit groove 72 is opened on the rear end face of the movable seat 7. The limit slider 33 slides tightly along the inner wall of the limit groove 72. This design can limit the position of the motor shaft 32. A mounting bracket 31 is installed on the outer side of the fixed seat 2. The drive motor 3 is installed on the upper end face of the mounting bracket 31. The mounting bracket 31 can fix the position of the drive motor 3. Positioning grooves 71 are opened through the left and right sides of the movable seat 7. A positioning plate 21 is slidably arranged inside the positioning groove 71. A connecting block 22 is provided on the inner side of the positioning plate 21. The positioning plate 21 is fixedly connected to the fixed seat 2 through the connecting block 22. The design of the positioning plate 21 and the positioning groove 71 can limit the movement trajectory of the movable seat 7.

[0023] As a second embodiment of this utility model: A user operates an external controller to turn on the drive motor 3. The drive motor 3 drives the drive eccentric gear 4 to rotate via the motor shaft 32. Since the drive eccentric gear 4 meshes with both the first driven eccentric gear 5 and the second driven eccentric gear 6, when the axis of the drive eccentric gear 4 moves away from the axis of the first driven eccentric gear 5 and closer to the axis of the second driven eccentric gear 6, such as... Figure 4 The drive motor 3 drives the movable seat 7 to extend upwards. At this time, the movable seat 7 drives the vacuum ejector pin to extend upwards. Simultaneously, the air hole on the top surface of the ejector pin cap 9 forms a negative pressure, thereby adsorbing the blue film. The protruding ejector pin inside the ejector pin cap 9 punctures the blue film and lifts the semiconductor wafer on the upper surface of the blue film, facilitating subsequent wafer pickup. When the axis of the drive eccentric gear 4 approaches the axis of the first driven eccentric gear 5 and moves away from the axis of the second driven eccentric gear 6, as... Figure 3The drive motor 3 drives the movable seat 7 to retract downwards. Through the rotation of the drive motor 3, the movable seat 7 achieves stable and efficient reciprocating motion.

[0024] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0025] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor wafer pop-up mechanism comprising a base, a fixed seat, a driving motor, a driving eccentric gear, a first driven eccentric gear, a second driven eccentric gear, a moving seat, a vacuum needle seat and a needle cap, characterized in that: The upper end face of the base is provided with a fixing seat, the outer side face of the fixing seat is provided with a driving motor, the inner side face of the fixing seat is provided with a driving eccentric gear, the first driven eccentric gear is rotationally arranged above the driving eccentric gear, the second driven eccentric gear is rotationally arranged below the driving eccentric gear, the rear side of the fixing seat is provided with a moving seat, the upper end face of the moving seat is provided with a vacuum thimble seat, and the upper end face of the vacuum thimble seat is provided with a thimble cap.

2. A semiconductor wafer pop mechanism as set forth in claim 1, further comprising: The inner side face of the moving seat is provided with a first connecting shaft, the first driven eccentric gear is embedded with a first bearing piece, and the first driven eccentric gear is rotationally connected with the first connecting shaft through the first bearing piece.

3. A semiconductor wafer pop mechanism as set forth in claim 1, further comprising: The inner side face of the moving seat is provided with a second connecting shaft, the second driven eccentric gear is embedded with a second bearing piece, and the second driven eccentric gear is rotationally connected with the second connecting shaft through the second bearing piece.

4. A semiconductor wafer pop mechanism as set forth in claim 1, further comprising: The output end of the driving motor is clamped with a motor shaft, the driving eccentric gear is clamped on the outer side face of the motor shaft, the driving eccentric gear is meshed with the first driven eccentric gear, and the driving eccentric gear is meshed with the second driven eccentric gear.

5. A semiconductor wafer pop mechanism as set forth in claim 4, further comprising: The front end of the motor shaft is clamped with a limiting sliding block, the rear end face of the moving seat is provided with a limiting sliding groove, the limiting sliding block closely slides along the inner wall of the limiting sliding groove, the outer side face of the fixing seat is provided with a mounting frame, and the driving motor is mounted on the upper end face of the mounting frame.

6. A semiconductor wafer pop mechanism as in claim 1, wherein: The left and right sides of the moving seat are provided with a positioning groove, the positioning groove is provided with a positioning plate which slides, the inner side face of the positioning plate is provided with a connecting block, and the positioning plate is fixedly connected with the fixing seat through the connecting block.

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