Circuit board module and electronic equipment

Abstract

The utility model provides a circuit board module and electronic equipment, and relates to the technical field of circuit boards. The circuit board module comprises a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards are sequentially arranged at intervals in the first direction, the first direction is perpendicular to the plane where the first circuit boards are located, and the first circuit boards are provided with fixing parts. The second circuit board is provided with a plugging part, the plugging part is plugged and fixed with the fixing part, and the second circuit board is fixedly connected with the plurality of first circuit boards through the plugging part and the fixing part which are matched with each other; at least one first circuit board is provided with a connecting part, and the first circuit board is electrically connected with the second circuit board through the connecting part. The circuit board module and the electronic equipment provided by the utility model are used for solving the problems that the assembly space required by a plurality of circuit boards is large, and the communication connection among the plurality of circuit boards is troublesome.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more particularly to circuit board modules and electronic devices. Background Technology

[0002] With the development of technology, the functions of electronic devices are constantly being enriched. In current electronic devices, especially power monitoring devices, due to space constraints and multifunctional requirements, the design of circuit boards is often small in size and extremely compact in layout. Multiple circuit boards are usually interconnected, with each circuit board performing different functions to form a circuit board module.

[0003] To enable signal transmission between multiple circuit boards, flying wires or connectors are typically used as connection methods. Even the sampling signals of current bars rely on these traditional methods for transmission. However, this connection method has drawbacks in practical applications, including larger product size and lower overall reliability; furthermore, communication connections between multiple circuit boards are cumbersome and installation efficiency is low. Utility Model Content

[0004] This application provides circuit board modules and electronic devices to solve the problems of large assembly space required for multiple circuit boards and cumbersome communication connections between multiple circuit boards.

[0005] In a first aspect, this application provides a circuit board module, including a plurality of first circuit boards and second circuit boards;

[0006] Multiple first circuit boards are arranged at intervals along a first direction, the first direction being perpendicular to the plane where the first circuit boards are located, and the first circuit boards are provided with a fixing part;

[0007] The second circuit board is provided with a plug-in part, which is plugged into and fixed with the fixing part. The second circuit board is fixedly connected to a plurality of first circuit boards through the cooperating plug-in part and the fixing part.

[0008] At least one of the first circuit boards is provided with a connecting portion, and the first circuit board is electrically connected to the second circuit board through the connecting portion.

[0009] As an optional implementation, the insertion part is configured as a through hole, and a conductive layer is disposed inside the through hole;

[0010] In at least one of the first circuit boards, the fixing portion is reused to form the connecting portion;

[0011] The fixing part inserted into the through hole is electrically connected to the conductive layer, and the first circuit board is electrically connected to the second circuit board through the cooperating fixing part and the conductive layer.

[0012] As an optional implementation, the insertion portion is configured as a through hole;

[0013] When the fixing part is inserted and fixed to the plug-in part, the fixing part is inserted into the through hole and the fixing part is insulated from the first circuit board.

[0014] As an optional implementation, the fixing part is interference-fitted with the through hole.

[0015] As an optional implementation, when the fixing part is inserted into the through hole, at least a portion of the fixing part extends to the side of the second circuit board away from the first circuit board.

[0016] As an optional implementation, the second circuit board is provided with metallized holes;

[0017] The connecting part passes through the metallized hole, and the first circuit board is electrically connected to the second circuit board through the matching connecting part and the metallized hole.

[0018] As an optional implementation, the connecting portion is welded and fixed to the second circuit board.

[0019] As an optional implementation, the number of fixing portions on the first circuit board having the connecting portion is set to multiple;

[0020] The plurality of fixing portions and the connecting portions are arranged along a second direction; in the second direction, at least one of the fixing portions is close to a first end of the second circuit board, and at least one of the fixing portions is close to a second end of the second circuit board.

[0021] As an optional implementation, a receiving cavity is formed between two adjacent first circuit boards in the first direction;

[0022] The first circuit board is provided with a first device, which is disposed within the receiving cavity; and / or, the second circuit board is provided with a second device, which is disposed within the receiving cavity.

[0023] Secondly, this application provides an electronic device including any of the circuit board modules described above.

[0024] The circuit board module and electronic device provided in this application embodiment include a circuit board module comprising multiple first circuit boards and second circuit boards. The multiple first circuit boards are arranged sequentially at intervals along a first direction, which is perpendicular to the plane where the first circuit boards are located. This reduces the volume occupied by the multiple circuit boards within the device and effectively reduces the required assembly space. The first circuit boards are provided with a fixing part, and the second circuit boards are provided with a plug-in part. The second circuit boards are fixedly connected to the multiple first circuit boards through the cooperating plug-in part and fixing part. At least one first circuit board is provided with a connecting part, and the first circuit board is electrically connected to the second circuit board through the connecting part. This eliminates the need for traditional connecting wires and screws between circuit boards, which not only improves the assembly stability between circuit boards but also improves the convenience of communication connection between multiple circuit boards. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] Figure 1 This is a schematic diagram of the circuit board module provided in an embodiment of this application;

[0027] Figure 2 for Figure 1 A schematic diagram of the connection structure between the first and second circuit boards in the middle;

[0028] Figure 3 for Figure 1 A schematic diagram of the structure of the first circuit board in the middle;

[0029] Figure 4 for Figure 1 A schematic diagram of the structure of the second circuit board.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100 - First circuit board;

[0032] 110 - Fixing part;

[0033] 120 - Connecting part;

[0034] 200 - Second circuit board;

[0035] 201 - First end;

[0036] 202 - Second end;

[0037] 210 - Connector;

[0038] 220 - Metallized via;

[0039] 300 - Reception cavity;

[0040] 400 - First Device;

[0041] 500 - Second device;

[0042] 600 - Third device.

[0043] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0045] In the embodiments of this application, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for better describing the embodiments of this application and their implementations, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may also be used in some cases to indicate a certain dependency or connection relationship. For those skilled in the art, the specific meaning of these terms in the embodiments of this application can be understood according to the specific circumstances.

[0046] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0047] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0048] In this application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplarily" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0049] Unless otherwise stated, the term "multiple" means two or more.

[0050] As the background technology shows, with the development of technology, the functions of electronic devices are constantly being enriched. Circuit boards are an important component of electronic devices, capable of being electrically connected to electronic components to supply power or transmit electrical signals.

[0051] For example, power monitoring equipment or power management equipment usually has the functions of monitoring relays and power monitoring. Such equipment combines power monitoring and protection functions, and can comprehensively monitor and control the power system.

[0052] These multifunctional electronic devices typically consist of interconnected circuit boards, each performing a different function, forming a circuit board module. For example: a circuit board measures and records electrical parameters such as voltage, current, power factor, frequency, and energy consumption to achieve power monitoring; a circuit board monitors the status of relays and can protect and control circuits through relays to achieve relay monitoring and control; a circuit board processes data using a built-in microprocessor or DSP, analyzes electrical parameters, and generates reports and alarms to achieve data processing and analysis; and a circuit board communicates with external devices or systems to achieve communication functions. Because of the need to integrate multiple functional modules, the circuit board modules of electronic devices are quite complex. Existing circuit boards require mechanical connections via screws or connecting rods, and communication connections are achieved through methods such as flying wires.

[0053] However, in existing electronic devices, the assembly space required for interconnecting multiple circuit boards is large, which results in a large device size that is inconvenient to install and use. Furthermore, the communication connections between multiple circuit boards are also quite complex, requiring manual installation, which is inefficient and makes it difficult to achieve automated production and installation.

[0054] Therefore, this application provides a circuit board module and an electronic device. The circuit board module includes multiple first circuit boards and second circuit boards. The multiple first circuit boards are arranged sequentially at intervals along a first direction, which is perpendicular to the plane where the first circuit boards are located. This reduces the volume occupied by multiple circuit boards within the device, effectively reducing the required assembly space and thus reducing the size of the electronic device. The first circuit boards are provided with a fixing part, and the second circuit boards are provided with a plug-in part. The second circuit boards are fixedly connected to the multiple first circuit boards through the cooperating plug-in part and fixing part. At least one first circuit board is provided with a connecting part, and the first circuit board is electrically connected to the second circuit board through the connecting part. This eliminates the need for traditional connecting parts such as flying wires and screws between circuit boards, which not only improves the assembly stability between circuit boards but also improves the convenience of communication connection between multiple circuit boards. This helps to realize automated production and installation and improves assembly efficiency.

[0055] The technical solution of this application will be described in detail below with reference to the accompanying drawings and specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0056] Figure 1 This is a schematic diagram of the circuit board module provided in an embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the connection structure between the first and second circuit boards in the middle; Figure 3 for Figure 1 A schematic diagram of the structure of the first circuit board in the middle; Figure 4 for Figure 1 A schematic diagram of the structure of the second circuit board.

[0057] Combination Figures 1 to 4 As shown, one embodiment of this application provides a circuit board module, including a plurality of first circuit boards 100 and second circuit boards 200; the plurality of first circuit boards 100 are arranged sequentially at intervals along a first direction, the first direction being perpendicular to the plane where the first circuit boards 100 are located, and the first circuit boards 100 are provided with a fixing part 110; the second circuit boards 200 are provided with a plug-in part 210, the plug-in part 210 is plugged into and fixed with the fixing part 110, and the second circuit boards 200 are fixedly connected to the plurality of first circuit boards 100 through the cooperating plug-in part 210 and the fixing part 110; at least one first circuit board 100 is provided with a connecting part 120, and the first circuit board 100 is electrically connected to the second circuit board 200 through the connecting part 120.

[0058] It should be noted that the first direction is Figure 1 The Z-axis in the plane. The plane containing the first circuit board 100 and... Figure 1 The planes containing the X-axis and Y-axis are parallel.

[0059] By setting up multiple first circuit boards 100 and second circuit boards 200, different functional modules can be distributed across different circuit boards, allowing each circuit board to focus on a specific function, such as power monitoring, relay control, or data processing, thus achieving flexible function allocation and modular design. Furthermore, the design with multiple circuit boards provides the possibility of system expansion; users can add or remove the number of circuit boards as needed to accommodate different electronic devices.

[0060] Among them, multiple first circuit boards 100 along Figure 1 The Z-axis spacing setting can effectively utilize vertical space to reduce the area occupied by the circuit board module, optimize the overall spatial layout of electronic devices, improve the internal space utilization of products, reduce the size of electronic devices, and meet the requirements of product miniaturization.

[0061] Through the interlocking of the plug-in part 210 and the fixing part 110, the first circuit board 100 and the second circuit board 200 can be quickly and reliably connected together, reducing the complexity of manual installation and improving assembly efficiency. Furthermore, this plug-in connection method facilitates the modular design of the circuit board, making the replacement and maintenance of the circuit board more convenient.

[0062] The connection part 120 is provided on the first circuit board 100, which not only ensures a reliable electrical connection between the first circuit board 100 and the second circuit board 200 and guarantees the stable transmission of signals and power, but also reduces the wiring complexity caused by traditional connection methods such as flying wires, and improves the reliability of the circuit board module and the degree of production automation.

[0063] Therefore, the circuit board module provided in this application has the effects of space optimization, simplified installation, modular design and reliable electrical connection, and solves the problems of large assembly space and complex communication connection required for circuit board interconnection in traditional electronic devices.

[0064] In some embodiments, the insertion portion 210 is configured as a through hole, and a conductive layer is disposed in the through hole; in at least one first circuit board 100, the fixing portion 110 is reused to form a connecting portion 120; the fixing portion 110 inserted in the through hole is electrically connected to the conductive layer, and the first circuit board 100 is electrically connected to the second circuit board 200 through the cooperating fixing portion 110 and the conductive layer.

[0065] For example, the connection portion 120 can be a gold finger. A gold finger is a connector used on circuit boards, typically to establish an electrical connection between two circuit boards. Furthermore, connecting two circuit boards via gold fingers does not require excessive space at the connection point, thus meeting the requirements for product miniaturization.

[0066] Among them, the first circuit board 100 along Figure 1The edge in the Y direction can be fitted with bumps that fit the through hole, and the gold fingers can be gold-plated contacts set on the bumps.

[0067] By using the fixing part 110 as the connecting part 120, the dual functions of mechanical fixing and electrical connection between the first circuit board 100 and the second circuit board 200 can be realized simultaneously. This integrated design can reduce the number of components, simplify the design, and improve the compactness of the circuit board module.

[0068] By providing a conductive layer within the through-hole, a good conductive path is provided, reducing contact resistance and ensuring a more stable and reliable electrical connection between the insertion part 210 and the fixing part 110. The fixing part 110 is inserted into the through-hole and electrically connected to the conductive layer, providing a stable electrical connection while also ensuring the firmness of the mechanical fixation, thus avoiding poor electrical connection due to vibration or external force.

[0069] In some other embodiments, the plug-in portion 210 is configured as a through hole; when the fixing portion 110 is plugged into and fixed with the plug-in portion 210, the fixing portion 110 is inserted into the through hole and the fixing portion 110 is in insulating contact with the first circuit board 100.

[0070] For example, the through hole can be circular or rectangular, and the shape of the fixing part 110 is adapted to the shape of the through hole.

[0071] Mechanical connection between circuit boards is achieved by inserting the fixing part 110 into the through hole. The plug-in fixing method simplifies the assembly process, supports quick installation and disassembly, and improves production efficiency and maintenance convenience.

[0072] In this embodiment, the fixing part 110 is in insulating contact with the first circuit board 100. The fixing part 110 and the plug-in part 210 are only used to realize the mechanical connection between the first circuit board 100 and the second circuit board 200, avoiding unnecessary electrical connections. This helps to reduce the short circuit risk between the first circuit board 100 and the second circuit board 200, and improves the safety and reliability of the circuit board module.

[0073] In some embodiments, the fixing part 110 is interference-fitted with the through hole.

[0074] It should be noted that an interference fit refers to a situation where the size of the fixing part 110 is slightly larger than the size of the through hole. When the fixing part 110 is inserted into the through hole, it provides additional fixing force through mechanical interference. An interference fit can improve the tightness and stability of the connection, reducing the risk of loosening due to vibration or external forces.

[0075] Interference fits eliminate the need for additional fasteners or adhesives during assembly, simplifying the assembly process. Furthermore, interference fits can compensate for dimensional tolerances that arise during manufacturing, ensuring a tight connection after assembly.

[0076] In some embodiments, when the fixing part 110 passes through the through hole, at least a portion of the fixing part 110 extends to the side of the second circuit board 200 away from the first circuit board 100.

[0077] Understandably, the length of the fixing part 110 is greater than the length of the second circuit board 200. Figure 1 Thickness in the Y direction. Part of the fixing part 110 can extend through the second circuit board 200 to the side of the second circuit board 200 opposite to the first circuit board 100. This can increase the contact area between the fixing part 110 and the sidewall of the through hole, provide a more stable assembly effect, and increase the structural stability of the circuit board module.

[0078] In some embodiments, the second circuit board 200 is provided with a metallized hole 220; the connecting part 120 passes through the metallized hole 220, and the first circuit board 100 is electrically connected to the second circuit board 200 through the cooperating connecting part 120 and the metallized hole 220.

[0079] It should be noted that the metallized hole 220 can be a hole with a conductive structure; the conductive structure is made of a metal material; the surface of the connecting part 120 is provided with metal contacts, and when the conductive structure is connected to the metal contacts of the connecting part 120, electrical contact can be achieved.

[0080] For example, the conductive structure of the metallized via 220 can be made of a flexible metal, such as phosphor bronze or beryllium copper. The flexible metal is able to bend under pressure and provide continuous contact pressure, thereby ensuring the stability of the electrical connection.

[0081] Specifically, when the connecting part 120 passes through the metallized hole 220, the conductive structure of the metallized hole 220 will be in close contact with the metal contacts on the surface of the connecting part 120. This mechanical contact ensures that electrical signals can be transmitted between the first circuit board 100 and the second circuit board 200.

[0082] In some embodiments, the connecting portion 120 is welded and fixed to the second circuit board 200.

[0083] For example, the connector 120 can be welded to the second connector plate by wave soldering. By firmly bonding the connector 120 to the metallized hole 220 of the second circuit board 200 with molten solder, the stability of the electrical connection can be improved.

[0084] Soldering provides a low-resistance electrical connection. Furthermore, the solder joints are typically covered with solder, which provides protection against oxidation or corrosion of the contact surfaces of the connection 120 and the metallized via 220, thereby extending the lifespan of the circuit board module and ensuring stable signal and power transmission.

[0085] Furthermore, by welding and fixing the connecting part 120 to the second circuit board 200, the mechanical stability between the first circuit board 100 and the second circuit board 200 can be further improved based on the connection between the fixing part 110 and the plug-in part 210, resulting in higher product reliability and better vibration resistance of the circuit board module.

[0086] Combination Figure 3 and Figure 4 As shown, in some embodiments, on the first circuit board 100 having the connecting portion 120, the number of fixing portions 110 is set to a plurality; the plurality of fixing portions 110 and the connecting portion 120 are arranged along a second direction; in the second direction, at least one fixing portion 110 is close to the first end 201 of the second circuit board 200, and at least one fixing portion 110 is close to the second end 202 of the second circuit board 200.

[0087] It should be noted that the second direction is Figure 1 In the X direction. Each of the second circuit boards 200 can be distributed parallel to the first circuit board 100. Figure 1 The two ends in the Y direction.

[0088] The fixing part 110 is disposed along the first circuit board 100. Figure 1 After the fixing part 110 is connected to the second circuit board 200 at both ends in the Y direction, the fixing points can be distributed at the first end 201 and the second end 202 of the second circuit board 200, which can achieve a more balanced stress distribution and improve the mechanical stability of the circuit board module. The first end 201 of the second circuit board 200 is oriented towards... Figure 1 At one end in the X direction, the second end 202 of the second circuit board 200 is opposite to the second circuit board 200. Figure 1 One end in the X direction.

[0089] Understandably, by setting multiple fixing parts 110, mechanical stress can be effectively dispersed, the burden on a single fixing point can be reduced, and the circuit board can be ensured not to loosen or shift under vibration or impact conditions. This makes the mechanical connection between the first circuit board 100 and the second circuit board 200 more stable and enhances the vibration resistance of the circuit board module.

[0090] Combination Figure 1 and Figure 2 As shown, in some embodiments, in a first direction, a receiving cavity 300 is formed between two adjacent first circuit boards 100; the first circuit board 100 is provided with a first device 400, which is disposed within the receiving cavity 300; and / or, the second circuit board 200 is provided with a second device 500, which is disposed within the receiving cavity 300.

[0091] It should be noted that the distance between two adjacent first circuit boards 100, i.e. the height of the receiving cavity 300 along the Z direction, can be flexibly designed according to the actual needs of the first device 400 and the second device 500 installed. This application embodiment does not impose any restrictions on this.

[0092] In some embodiments, the first circuit board 100 is further provided with a third device 600, which may be disposed on the uppermost first circuit board 100 facing towards Figure 1 On the Z-axis side. The second circuit board 200 may also be provided with a fourth device (not shown in the figure), which may be provided on the side of the second circuit board 200 opposite to the receiving cavity 300.

[0093] Among them, the first device 400, the second device 500, the third device 600, and the fourth device are all functional devices.

[0094] By forming a receiving cavity 300 between adjacent first circuit boards 100, the space between the first circuit boards 100 can be effectively utilized to integrate more functional devices within a limited space, improving the overall compactness of the electronic device. It can also simplify the wiring between circuit boards and reduce signal transmission paths. Furthermore, placing the first device 400 and the second device 500 within the receiving cavity 300 can provide a certain degree of physical protection, reducing the impact of the external environment on the devices, such as dust, moisture, and mechanical shock.

[0095] In some embodiments, a heat dissipation structure may also be provided within the receiving cavity 300 to help manage the heat of functional devices and improve the thermal performance and reliability of the circuit board module.

[0096] Specifically, the embodiments of this application integrate functional devices within the receiving cavity 300, achieving technical effects such as space optimization, flexible layout, device protection, thermal management, component integration, and simplified wiring. This optimizes the design of the circuit board module and can solve the problems of insufficient space utilization and poor device protection that may exist in traditional designs.

[0097] Another aspect of this application provides an electronic device, including the circuit board module provided in any of the above embodiments.

[0098] The circuit board module has been described in detail in the above embodiments and will not be repeated here.

[0099] In summary, the circuit board module and electronic device provided in this application, by arranging multiple first circuit boards 100 sequentially and spaced apart along a first direction, can reduce the volume occupied within the device and effectively reduce the required assembly space, thereby reducing the size of the electronic device; by providing a fixing part 110 on the first circuit board 100 and a plug-in part 210 on the second circuit board 200, the first circuit board 100 and the second circuit board 200 are fixedly connected through the cooperating plug-in part 210 and the fixing part 110, improving the convenience and stability of assembly between circuit boards; by providing a connecting part 120 on the first circuit board 100, the first circuit board 100 is electrically connected to the second circuit board 200 through the connecting part 120, which not only improves the convenience of communication connection between multiple circuit boards, but also further improves the mechanical stability between circuit boards, which helps to realize automated production and installation and improve assembly efficiency.

[0100] Finally, it should be noted that those skilled in the art, upon considering the specification and practicing the application disclosed herein, will readily conceive of other embodiments of this application. The embodiments of this application are intended to cover any variations, uses, or adaptations of the embodiments of this application that follow the general principles of the embodiments of this application and include common knowledge or customary technical means in the art not disclosed in the embodiments of this application. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of the embodiments of this application are indicated by the following claims.

[0101] It should be understood that the embodiments of this application are not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from their scope. The scope of the embodiments of this application is limited only by the appended claims.

Claims

1. A circuit board module, characterized by comprising: The first circuit board (100) and the second circuit board (200) are provided. The first circuit board (100) is provided with a fixing part (110). The second circuit board (200) is provided with a plug-in part (210) which is plugged and fixed with the fixing part (110). The first circuit board (100) is electrically connected with the second circuit board (200) through the connecting part (120).

2. The circuit board module of claim 1, wherein, The plug-in part (210) is a through hole provided with a conductive layer. The fixing part (110) of the first circuit board (100) is used to form the connecting part (120). The fixing part (110) of the first circuit board (100) is electrically connected with the conductive layer.

3. The circuit board module of claim 1, wherein, The fixing part (110) is plugged into the through hole when the fixing part (110) is plugged and fixed with the plug-in part (210). The fixing part (110) is in insulating contact with the first circuit board (100).

4. The circuit board module according to claim 2 or 3, characterized in that, The fixing part (110) is in interference fit with the through hole.

5. The circuit board module of claim 2 or 3, wherein When the fixing part (110) is plugged into the through hole, at least part of the fixing part (110) extends to the side of the second circuit board (200) away from the first circuit board (100).

6. The circuit board module of claim 1, wherein, The second circuit board (200) is provided with a metalized hole (220). The connecting part (120) is plugged into the metalized hole (220), and the first circuit board (100) is electrically connected with the second circuit board (200) through the connecting part (120) and the metalized hole (220).

7. The circuit board module of claim 6, wherein, The connecting part (120) is welded and fixed with the second circuit board (200).

8. The circuit board module of claim 1, wherein, The number of the fixing part (110) on the first circuit board (100) provided with the connecting part (120) is multiple. The fixing part (110) and the connecting part (120) are arranged along a second direction.

9. The circuit board module of claim 1, wherein, In the second direction, at least one fixing part (110) is close to the first end (201) of the second circuit board (200), and at least one fixing part (110) is close to the second end (202) of the second circuit board (200). In the first direction, an accommodating cavity (300) is formed between two adjacent first circuit boards (100). The first circuit board (100) is provided with a first device (400) arranged in the accommodating cavity (300); and / or the second circuit board (200) is provided with a second device (500) arranged in the accommodating cavity (300).

10. An electronic device, comprising: A circuit board module comprising a circuit board as claimed in any of claims 1-9.

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