Module structure

Abstract

The utility model discloses a module structure which comprises a shell, a control board and a bypass switch assembly, the control board is arranged in the shell, the bypass switch assembly comprises a bypass switch and a driving board, the driving board is electrically connected with the control board, and the driving board is controlled by signals of the control board and drives the state of the bypass switch. One side of the control panel is provided with a first installation space used for installing the drive board, one side in the shell is further provided with a second installation space used for installing the bypass switch, and the first installation space and the second installation space are arranged in an avoiding mode. According to the technical scheme, mounting of components in the module structure is facilitated, the mounting difficulty is reduced, and the space utilization rate in the module structure is increased.

Description

Technical Field

[0001] This application relates to the field of power module technology, and in particular to a module structure. Background Technology

[0002] As the functional requirements of power modules increase, the internal structure of the module will need to accommodate these requirements by adding power components or increasing their size. Consequently, the module structure may not offer a convenient installation solution, increasing installation difficulty, and the addition of power components reduces the internal space utilization of the module structure. Utility Model Content

[0003] This application provides a modular structure that facilitates the installation of internal components, reduces installation difficulty, and improves the space utilization rate within the modular structure.

[0004] This application provides a module structure, which includes a housing, a control board, and a bypass switch assembly. The control board is disposed inside the housing. The bypass switch assembly includes a bypass switch and a drive board. The drive board is electrically connected to the control board and is controlled by signals from the control board to drive the state of the bypass switch. One side of the control board has a first mounting space for mounting the drive board, and another side inside the housing has a second mounting space for mounting the bypass switch. The first mounting space and the second mounting space are spaced apart.

[0005] The technical solution of this application adds a bypass switch assembly to the module structure. The bypass switch assembly includes a bypass switch and a drive board. A first mounting space for installing the drive board is provided on one side of the control board, and a second mounting space for installing the bypass switch is provided on one side of the housing. The first mounting space and the second mounting space are arranged to avoid each other, which facilitates the installation of the bypass switch assembly inside the housing. This improves the utilization rate of the internal space of the module structure housing without affecting the overall layout of the original module structure housing. It does not require increasing the overall size of the entire module structure housing, optimizes the arrangement and layout of the various components inside the module structure housing, and effectively improves the convenience of module structure installation.

[0006] According to the foregoing embodiments of this application, the module structure further includes a copper busbar assembly. At least a portion of the copper busbar assembly is located inside the housing, and the copper busbar assembly is electrically connected to the control board. One side of the bypass switch has an overlap space, within which the copper busbar assembly and the internal cables of the housing are connected. In the above embodiments, by providing an overlap space on the lower side of the bypass switch, the copper busbar assembly and the internal cables of the housing can be connected within the overlap space, facilitating the overlap of the internal cables of the module structure and the copper busbar assembly, and helping to ensure the stability of the electrical connection.

[0007] According to the aforementioned embodiments of this application, the first mounting space is located on the upper side of the control board, the second mounting space is located on the top right side inside the housing, and the overlapping space is located below the second mounting space. In the above embodiments, the first mounting space being located on the upper side of the control board and the drive board being located within the first mounting space helps to shorten the wiring connection path between the drive board and the control board, improves the stability of the electrical connection, and reduces the complexity of wiring. The second mounting space being located on the top right side inside the housing and the overlapping space being located below the second mounting space facilitates the electrical connection between the bypass switch and the internal cables and copper busbar assemblies of the housing, which helps to ensure the stability of the electrical connection. Furthermore, since the bypass switch is installed on the top right side of the housing, it is easy for operators to access the bypass switch during installation, maintenance, or replacement.

[0008] According to the foregoing embodiments of this application, the module structure further includes a capacitor plate. The capacitor plate is disposed inside the housing and electrically connected to the control board, and the length of the housing is adapted to the length of the capacitor plate. In the above embodiments, by setting the length of the housing to be adapted to the length of the capacitor plate, when the size of the capacitor plate needs to be increased inside the module structure, the bypass switch can be adaptively installed at the top inside the extended housing, which can effectively utilize the internal space of the housing, avoid space waste, and also help ensure that the capacitor plate has sufficient installation space inside the housing, reducing the overall size of the module structure and facilitating the compact design of the internal space of the module structure.

[0009] According to the foregoing embodiments of this application, the module structure further includes a heat dissipation assembly, which includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component is disposed near the copper busbar assembly, and the second heat dissipation component is located below the capacitor plate. In the above embodiments, by setting the first heat dissipation component and the second heat dissipation component at different positions inside the housing, the first heat dissipation component and the second heat dissipation component can dissipate heat to different areas inside the housing, which can effectively improve the heat dissipation efficiency of the power components inside the housing, optimize the layout inside the housing, and improve the compactness.

[0010] According to the foregoing embodiments of this application, the module structure includes multiple second heat sinks, which are sequentially arranged below the capacitor plate. Each second heat sink includes a cooling fan and a mounting plate. The cooling fan is mounted on the mounting plate, which is detachably connected to the interior of the housing. The mounting plate includes mounting holes and heat dissipation channels. The mounting holes are detachably connected to the interior of the housing via connectors, and the heat dissipation channels are used to exhaust hot air. In the above embodiments, by sequentially arranging multiple second heat sinks below the capacitor plate, the heat dissipation efficiency of the capacitor plate can be effectively improved, the internal layout of the housing can be optimized, and the compactness can be increased. By setting each second heat sink to include a cooling fan and a mounting plate, with the cooling fan mounted on the heat sink, not only can the structure of the mounting plate be simplified and its weight reduced, but also the installation of each second heat sink and subsequent maintenance can be facilitated.

[0011] According to the foregoing embodiments of this application, the copper busbar assembly includes: a first part located inside the housing and a second part extending outside the housing. The first part is electrically connected to the control board, and the second part extends to the outside of the housing through a preset opening in the housing and is connected to an external power component of the module structure.

[0012] According to the foregoing embodiments of this application, the copper busbar assembly further includes a fixing plate disposed inside the housing, and the copper busbar assembly further includes multiple copper busbar bodies, which are sequentially installed on the fixing plate.

[0013] According to the foregoing embodiments of this application, the fixing plate includes: a plate body and a plurality of mounting portions, the plurality of mounting portions being arranged sequentially on the plate body, and the plurality of mounting portions being comb-shaped for correspondingly connecting copper busbar bodies located at different heights. In the above embodiments, by providing comb-shaped mounting portions, the mounting portions offer multiple installation height options, enabling copper busbar bodies of different heights to be stably installed through the mounting portions. The installation and positioning of the copper busbar bodies become simpler and more intuitive, improving the flexibility of copper busbar assembly installation. It can also adapt to different electrical connection requirements, facilitating electrical connections and wiring between copper busbar bodies. Each copper busbar body can be easily installed at the corresponding height position, reducing installation difficulty, and also making maintenance and replacement more convenient.

[0014] According to the aforementioned embodiments of this application, a terminal block is further provided on the side of the copper busbar body near the overlapping space. The internal cables of the housing can be connected to the copper busbar assembly through the terminal block, and the terminal block includes two overlapping holes. In the above embodiments, by providing a terminal block with two overlapping holes, it is convenient to control the installation direction of the cable, prevent the cable from rotating, and avoid the situation of arbitrarily installing the cable in the wrong direction. Attached Figure Description

[0015] Figure 1 This is a top view of the internal structure of the housing in one embodiment of the module structure of this application;

[0016] Figure 2 This is a schematic diagram of the heat dissipation component in one embodiment of the module structure in the related technology;

[0017] Figure 3 This is a schematic diagram of the structure of the second heat sink in one embodiment of the module structure of this application;

[0018] Figure 4 This is a schematic diagram of the structure of the copper busbar assembly inside the housing of one embodiment of the module structure of this application;

[0019] Figure 5 This is a front view of the fixing plate in one embodiment of the module structure of this application.

[0020] Explanation of icon numbers:

[0021] Housing - 100, Control board - 200, Copper busbar assembly - 300, Bypass switch assembly - 400, Capacitor board - 500, Heat dissipation assembly - 600;

[0022] Part 1-310, Part 2-320, Fixing plate-330, Copper busbar body-340, Bypass switch-410, Drive board-420, First heat sink-610, Second heat sink-620;

[0023] Board body-331, mounting part-332, terminal block-341, cooling fan-621, mounting plate-622;

[0024] Overlap hole - 3411, mounting hole - 6221, heat dissipation channel - 6222;

[0025] Overlap space - S1, length direction - S2, cable routing direction - S3, first installation space - S4, second installation space - S5. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0027] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0028] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0029] This application provides a modular structure that facilitates the installation of internal components, reduces installation difficulty, and improves the space utilization rate within the modular structure.

[0030] like Figure 1 As shown, this application embodiment provides a module structure, which includes: a housing 100, a control board 200, and a bypass switch assembly 400. The control board 200 is disposed inside the housing 100. The bypass switch assembly 400 includes a bypass switch 410 and a drive board 420. The drive board 420 is electrically connected to the control board 200. The drive board 420 is controlled by the signal from the control board 200 and drives the bypass switch 410. One side of the control board 200 has a first mounting space S4 for mounting the drive board 420, and the other side inside the housing 100 has a second mounting space S5 for mounting the bypass switch 410. The first mounting space S4 and the second mounting space S5 are spaced apart.

[0031] In related technologies, the method of installing the bypass switch assembly 400 within the module structure is complicated, making it difficult to quickly determine the installation position of the bypass switch assembly 400. Furthermore, after adding the bypass switch assembly 400 within the module structure, the size of the module structure's housing 100 will increase, which is not conducive to installation. The technical solution of this application adds a bypass switch assembly 400 to the module structure. The bypass switch assembly 400 includes a bypass switch 410 and a drive board 420. A first mounting space S4 for mounting the drive board 420 is provided on one side of the control board 200, and a second mounting space S5 for mounting the bypass switch 410 is provided on one side inside the housing 100. The first mounting space S4 and the second mounting space S5 are arranged to avoid each other, which facilitates the installation of the bypass switch assembly 400 inside the housing 100. The internal space utilization of the module structure housing 100 is improved without affecting the overall internal layout of the original module structure housing 100. The overall size of the housing 100 of the entire module structure is not increased. The arrangement and layout of the various components inside the module structure housing 100 are optimized, which effectively improves the convenience of module structure installation.

[0032] like Figure 1As shown, the module structure also includes a copper busbar assembly 300. At least a portion of the copper busbar assembly 300 is located inside the housing 100, and the copper busbar assembly 300 is electrically connected to the control board 200. Furthermore, a connection space S1 is provided below the bypass switch 410, allowing the copper busbar assembly 300 and the internal cables of the housing 100 to be connected within the connection space S1. This facilitates the connection between the internal cables of the module structure and the copper busbar assembly 300, and helps ensure the stability of the electrical connection.

[0033] Preferably, the first mounting space S4 is located on the upper side of the control board 200, the second mounting space S5 is located on the top right side inside the housing 100, and the overlapping space S1 is located below the second mounting space S5. By setting the first mounting space S4 on the upper side of the control board 200 and the drive board 420 within the first mounting space S4, it is beneficial to shorten the wiring connection path between the drive board 420 and the control board 200, improve the stability of the electrical connection, reduce the complexity of wiring, and also help improve the efficiency and reliability of signal transmission, reduce signal delay and interference, and better utilize the space inside the housing 100. This improves the internal space utilization of the module structure housing 100 without affecting the overall layout of the original module structure housing 100, without increasing the overall size of the entire module structure housing 100, optimizing the arrangement and layout of the components inside the module structure housing 100, and effectively improving the ease of module structure installation. The second installation space S5 is located at the top right side inside the housing 100, and the overlapping space S1 is located below the second installation space S5. This facilitates the electrical connection between the bypass switch 420 and the internal cables and copper busbar assembly 300 of the housing 100, which helps to ensure the stability of the electrical connection. Furthermore, the bypass switch is installed at the top right side of the housing, making it easy for operators to access the bypass switch during installation, maintenance, or replacement, thus making better use of the internal space of the housing 100.

[0034] It is understood that in other embodiments, the bypass switch 410 and the drive board 420 may also be located in other positions inside the housing 100. For example, the drive board 420 may be located below the control board 200, and the bypass switch 410 may be located at the bottom right side of the housing 100. This application does not limit the installation position of the bypass switch 410 and the drive board 420.

[0035] like Figure 1As shown, the module structure also includes a capacitor plate 500. The capacitor plate 500 is disposed inside the housing 100 and electrically connected to the control board 200. The length of the housing 100 is adapted to the length of the capacitor plate 500. By adapting the length of the housing 100 to the length of the capacitor plate 500, when the size of the capacitor plate 500 needs to be increased inside the module structure, the length of the housing 100 is adapted to the size of the capacitor plate 500, extending the length of the housing 100 in the length direction S2. The bypass switch 410 can be adaptively installed on the top inside the extended housing 100, which can effectively utilize the internal space of the housing 100 and avoid space waste. At the same time, it also helps to ensure that the capacitor plate 500 has sufficient installation space inside the housing 100, reducing the overall size of the module structure and facilitating the compact design of the internal space of the module structure.

[0036] like Figure 1 As shown, the module structure also includes a heat dissipation assembly 600, which is used to dissipate heat from electrical components inside the housing 100. The heat dissipation assembly 600 includes a first heat dissipation element 610 and a second heat dissipation element 620. The first heat dissipation element 610 is disposed near the copper busbar assembly 300, and the second heat dissipation element 620 is located below the capacitor plate 500. By setting the first heat dissipation element 610 and the second heat dissipation element 620 at different positions inside the housing 100, the first heat dissipation element 610 and the second heat dissipation element 620 can dissipate heat from different areas inside the housing 100, which can effectively improve the heat dissipation efficiency of power components inside the housing 100, optimize the internal layout of the housing 100, and improve compactness. In other embodiments, the first heat dissipation element 610 can also be disposed on the upper side of the capacitor plate 500, and multiple second heat dissipation elements 620 can be disposed on the left side of the capacitor plate 500. This application does not limit the installation position of the first heat dissipation element 610 and the second heat dissipation element 620.

[0037] like Figure 1 As shown, the module structure includes multiple second heat sinks 620, which are arranged sequentially below the capacitor plate 500. By arranging multiple second heat sinks 620 sequentially below the capacitor plate 500, the heat dissipation efficiency of the capacitor plate 500 can be effectively improved, the internal layout of the housing 100 can be optimized, and the compactness can be enhanced. In this application, three second heat sinks 620 are arranged sequentially below the capacitor plate 500, and the three second heat sinks 620 are arranged at equal intervals to uniformly dissipate heat from the capacitor plate 500. In other embodiments, different numbers and distances of second heat sinks 620 can be provided according to actual needs. This application does not limit the specific installation method of the second heat sinks 620.

[0038] like Figure 2As shown, in related technologies, a mounting plate is typically installed inside the housing 100, and multiple cooling fans are arranged sequentially on the mounting plate to dissipate heat from the power components inside the housing 100. For example... Figure 3 As shown in this embodiment, each second heat sink 620 includes a cooling fan 621 and a mounting plate 622. The cooling fan 621 is mounted on the mounting plate 622, which is detachably connected to the interior of the housing 100. The mounting plate 622 includes mounting holes 6221 and heat dissipation channels 6222. The mounting holes 6221 are detachably connected to the interior of the housing 100 via connectors, and the heat dissipation channels 6222 are used to exhaust internal hot air. In this application, by setting each second heat sink 620 to include a cooling fan 621 and a mounting plate 622, with each cooling fan 621 correspondingly mounted on the heat sink, the structure of the mounting plate 622 is simplified, reducing the weight of the mounting plate 622 from a single unit to multiple independent mounting plate 622 units. This also reduces the weight of the mounting plate 622, thereby reducing the weight of the entire module structure. Furthermore, the one-to-one correspondence between the cooling fan 621 and the mounting plate 622 facilitates not only the installation of each cooling fan 621 but also the removal and repair of the corresponding cooling fan 621 during subsequent maintenance. In this embodiment, a heat dissipation duct is also provided inside the housing 100. The heat dissipation duct is arranged along the cable routing direction S3, and the heat dissipation duct is also connected to the heat dissipation channel 6222 of the fan mounting plate 622, which can help to achieve better heat dissipation effect for the power components inside the housing 100.

[0039] In this embodiment, the mounting plate 622 includes a mounting hole 6221, which is detachably connected to the interior of the housing 100 via a connector, which can be in the form of a screw. The mounting hole 6221 has threads that engage with the screw, thereby detachably mounting the mounting plate 622 inside the housing 100. Alternatively, the mounting hole 6221 can be configured as a slot, with a snap-fit ​​structure matching the slot provided inside the housing 100 to detachably mount the mounting plate 622 inside the housing 100. This application does not limit the structure of the mounting plate 622 detachably connected to the interior of the housing 100.

[0040] like Figure 4 As shown, the copper busbar assembly 300 includes a first portion 310 located inside the housing 100 and a second portion 320 extending outside the housing 100. The first portion 310 is electrically connected to the control board 200, and the second portion 320 extends to the outside of the housing 100 through a pre-set opening and connects to the external power component of the module structure. Since the external power component of the module structure is divided into upper and lower copper busbar assemblies 300, the copper busbar assembly 300 of the module structure is also correspondingly set to upper and lower layers to connect to the external power component respectively, which can improve the smoothness of electrical connection and avoid electrical faults caused by space limitations.

[0041] Because the upper and lower copper busbar assemblies have different heights (300), such as Figure 4 As shown, the copper busbar assembly 300 also includes a fixing plate 330, which is disposed inside the housing 100. The copper busbar assembly 300 also includes multiple copper busbar bodies 340, which are sequentially installed on the fixing plate 330.

[0042] like Figure 5 As shown, the fixing plate 330 includes a plate body 331 and multiple mounting parts 332. The multiple mounting parts 332 are arranged sequentially on the plate body 331 and are comb-shaped to connect copper busbar bodies 340 at different heights. By setting the comb-shaped mounting parts 332, the mounting parts 332 provide multiple installation height options, allowing copper busbar bodies 340 at different heights to be stably installed through the mounting parts 332. The installation and positioning of the copper busbar bodies 340 become simpler and more intuitive, improving the installation flexibility of the copper busbar assembly 300. It can also adapt to different electrical connection requirements, facilitating electrical connections and wiring between copper busbar bodies 340. Each copper busbar body 340 can be easily installed at the corresponding height position, reducing installation difficulty and making maintenance and replacement more convenient. The comb-like design provides multiple independent mounting positions, allowing each copper busbar 340 to be independently supported and secured. This prevents displacement or collision between the copper busbars 340, improving the stability and shock resistance of the electrical connection and preventing the risk of loosening or short circuits during operation. The comb-like arrangement optimizes the spacing between the copper busbars 340, ensuring a reasonable distance between each one. This contributes to electrical insulation and provides better airflow channels for heat dissipation, improving the overall heat dissipation efficiency of the module structure.

[0043] In this embodiment, the fixing plate 330 includes an epoxy board. By including an epoxy board in the fixing plate 330, the epoxy board can provide electrical isolation and protection, which helps to ensure the safety requirements of the copper busbar assembly 300 and improves electrical safety. In other embodiments, those skilled in the art can also select other materials, such as rubber sheets, fiberglass boards, polytetrafluoroethylene, etc., according to actual needs to achieve the effect of insulation and isolation.

[0044] like Figure 4 As shown, a terminal block 341 is also provided on the side of the copper busbar body 340 near the overlapping space S1. The internal cables of the housing 100 can be connected to the copper busbar assembly 300 through the terminal block 341. The terminal block 341 includes two overlapping holes 3411. By providing the terminal block 341 with two overlapping holes 3411, it is convenient to control the installation direction of the cable, prevent the cable from rotating, avoid the situation of arbitrarily installing the cable in the correct direction, ensure the reliability of the connection, and thus improve the smoothness of the electrical connection.

[0045] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A modular structure, characterized by The module structure comprises: a shell (100); a control board (200) arranged inside the shell (100); and a bypass switch assembly (400) comprising a bypass switch (410) and a driving board (420), the driving board (420) being electrically connected with the control board (200), the driving board (420) being controlled by a signal of the control board (200) and driving the bypass switch (410) to change state, one side of the control board (200) having a first mounting space (S4) for mounting the driving board (420), one side of the shell (100) also having a second mounting space (S5) for mounting the bypass switch (410), the first mounting space (S4) and the second mounting space being arranged apart.

2. The modular structure of claim 1, wherein, The module structure further comprises: a copper bar assembly (300), at least part of the structure of the copper bar assembly (300) being located inside the shell (100), the copper bar assembly (300) being electrically connected with the control board (200); one side of the bypass switch (410) having a lapping space (S1), cables inside the copper bar assembly (300) and the shell (100) being connected in the lapping space (S1).

3. The modular structure of claim 2, wherein, The first mounting space (S4) is located on the upper side of the control board (200), the second mounting space (S5) is located on the right top inside the shell (100), and the lapping space (S1) is located below the second mounting space (S5).

4. The modular structure of claim 2, wherein, The module structure further comprises: a capacitor board (500) arranged inside the shell (100) and electrically connected with the control board (200), the length of the shell (100) being adapted to the length of the capacitor board (500).

5. The modular structure of claim 4, wherein, The module structure further comprises: a heat dissipation assembly (600) comprising a first heat dissipation member (610) and a second heat dissipation member (620), the first heat dissipation member (610) being arranged close to the copper bar assembly (300), and the second heat dissipation member (620) being located below the capacitor board (500).

6. The modular structure of claim 5, wherein, The module structure comprises a plurality of second heat dissipation members (620), the plurality of second heat dissipation members (620) being arranged below the capacitor board (500) in sequence, each of the second heat dissipation members (620) comprising: a heat dissipation fan (621); and a mounting plate (622), the heat dissipation fan (621) being mounted on the mounting plate (622), the mounting plate (622) being detachably connected inside the shell (100), the mounting plate (622) comprising a mounting hole (6221) and a heat dissipation channel (6222), the mounting hole (6221) being detachably connected with the inside of the shell (100) through a connecting member, and the heat dissipation channel (6222) being used for discharging hot air.

7. The modular structure of claim 2, wherein, The copper bar assembly (300) comprises: A first part (310) located in the shell (100), the first part (310) is electrically connected with the control panel (200); and A second part (320) extending to the outside of the shell (100), the second part (320) extends to the outside of the shell (100) through a preset opening of the shell (100) and is connected with an external power component of the module structure.

8. The modular structure of claim 7, wherein, The copper bar assembly (300) further comprises: A fixing plate (330) arranged inside the shell (100); and A plurality of copper bar bodies (340) sequentially installed on the fixing plate (330).

9. The modular structure of claim 8, wherein, The fixing plate (330) comprises: A plate body (331); and A plurality of mounting portions (332) sequentially arranged on the plate body (331), the plurality of mounting portions (332) are comb-shaped to correspondingly connect the copper bar bodies (340) at different heights.

10. The modular structure of claim 8, wherein, The side of the copper bar body (340) close to the overlapping space (S1) is further provided with a wiring terminal (341), the internal cable of the shell (100) can be connected with the copper bar assembly (300) through the wiring terminal (341), and the wiring terminal (341) comprises two overlapping holes (3411).

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