Insulating cost-reducing structure of mainboard radiator

Abstract

The utility model provides an insulating cost-reducing structure of a mainboard radiator. The insulating cost-reducing structure comprises a mainboard body, a radiating assembly and an insulating assembly, a mounting hole is formed in the mainboard body, the insulation assembly is fixed on the mainboard body through the mounting hole, and the heat dissipation assembly is connected with the mainboard body through the insulation assembly. The three mounting holes are formed in the mainboard body, and the three mounting holes are formed at equal intervals. The insulation assembly comprises three pressing rivet columns, the three pressing rivet columns are all arranged on one side of the heat dissipation assembly, and each pressing rivet column partially penetrates through one mounting hole. According to the insulation cost-reducing structure of the mainboard radiator, the heat dissipation assembly and the insulation assembly are installed in a matched mode, heat dissipation can be well carried out on components on the whole mainboard body, and the problem that in the using process, insulation paper is damaged, and consequently the overall insulation reliability is poor is not prone to occurring.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic inverter technology, and in particular to a cost-reducing insulation structure for a motherboard heat sink. Background Technology

[0002] When installing and using existing motherboards, they often do not have a simple heat dissipation mechanism pre-installed, which makes the components on the motherboard prone to overheating and resulting in poor overall performance. When a heat dissipation mechanism is added, additional mounting holes need to be made on the motherboard, and the added heatsink and the motherboard are usually separated by insulating paper. During use, the insulating paper is prone to damage, resulting in poor overall insulation reliability. Utility Model Content

[0003] To solve the above problems, the present invention adopts the following technical solution: a motherboard heat sink insulation cost reduction structure, comprising: a motherboard body, a heat sink component and an insulation component;

[0004] The motherboard body has mounting holes, the insulating component is fixed to the motherboard body through the mounting holes, and the heat dissipation component is connected to the motherboard body through the insulating component.

[0005] Furthermore, the motherboard body has three mounting holes, which are equidistant from each other.

[0006] Furthermore, the insulating component includes three press-fit posts, all of which are disposed on one side of the heat dissipation component, and each press-fit post partially passes through a mounting hole.

[0007] Furthermore, the heat dissipation assembly includes a mounting plate and a plurality of heat dissipation plates, one end of each of the rivet posts is connected to a heat dissipation plate, some of the heat dissipation plates are disposed on one side of the mounting plate, and other heat dissipation plates are disposed on the other side of the mounting plate.

[0008] Furthermore, the mounting plate is integrally formed with several of the heat sinks.

[0009] Furthermore, each of the heat sinks has several grooves on both sides, and the grooves are spaced apart sequentially.

[0010] Furthermore, a heat-conducting plate is detachably mounted on one side of the mounting plate, and one side of the heat-conducting plate abuts against the motherboard body.

[0011] Furthermore, the motherboard body is detachably provided with several MOS transistors, each of which is attached to the heat-conducting plate.

[0012] Furthermore, the heat-conducting plate is a copper plate.

[0013] Furthermore, the mounting plate has several fixing holes, and the heat-conducting plate has several insertion holes. Each insertion hole is movably connected to a fixing hole, and the heat-conducting plate is detachably provided with several bolts, each bolt moving through a insertion hole and a fixing hole.

[0014] The beneficial effects of this utility model are as follows: by using this motherboard heat sink insulation cost reduction structure, through the cooperation and installation between the heat dissipation component and the insulation component, the components on the entire motherboard body can be well dissipated, and the insulation paper is less likely to be damaged during use, resulting in poor overall insulation reliability. Attached Figure Description

[0015] The accompanying drawings further illustrate the present invention, but the embodiments in the drawings do not constitute any limitation on the present invention.

[0016] Figure 1 This is a schematic diagram of the overall structure of a motherboard heatsink insulation cost reduction structure provided in one embodiment;

[0017] Figure 2 This is a schematic diagram of a one-way connection between a heat dissipation component and an insulation component, provided in one embodiment. Detailed Implementation

[0018] The technical solution of this utility model will be further described below with reference to the accompanying drawings of the embodiments. This utility model is not limited to the following specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0019] like Figures 1 to 2 As shown, a motherboard heatsink insulation cost reduction structure includes: a motherboard body 100, a heat dissipation component and an insulation component 300; the motherboard body 100 has a mounting hole (not shown), the insulation component 300 is fixed to the motherboard body 100 through the mounting hole, and the heat dissipation component is connected to the motherboard body 100 through the insulation component 300.

[0020] Specifically, the motherboard body 100 has three mounting holes, which are equidistant from each other. The insulating component 300 includes three rivet posts, each located on one side of the heat dissipation component, with each rivet post partially passing through a mounting hole. The heat dissipation component includes a mounting plate 210 and several heat dissipation plates 220. One end of each rivet post is connected to a heat dissipation plate 220. Some heat dissipation plates 220 are located on one side of the mounting plate 210, while others are located on the other side. The mounting plate 210 and the heat dissipation plates 220 are integrally formed. Several grooves 221 are provided on both sides of each heat dissipation plate 220, and these grooves are spaced apart sequentially. A heat-conducting plate 400 is detachably mounted on one side of the mounting plate 210, and one side of the heat-conducting plate 400 abuts against the motherboard body 100. The motherboard body 100 is detachably equipped with a plurality of MOSFETs 500, each of which is attached to the heat-conducting plate 400. The heat-conducting plate 400 is a copper plate. The mounting plate 210 has a plurality of fixing holes (not shown), and the heat-conducting plate 400 has a plurality of insertion holes (not shown). Each insertion hole is movably connected to a fixing hole, and the heat-conducting plate 400 is detachably equipped with a plurality of bolts (not shown), each of which movably passes through a insertion hole and a fixing hole.

[0021] In other words, by using this heat dissipation component and insulation component 300 on the motherboard body 100, during installation, three rivet posts are first fixedly mounted on a heat sink 220, and this heat sink 220 is connected to the mounting plate 210. It is worth mentioning that the heat dissipation component can be configured according to specific needs. That is, in the first method, the mounting plate 210 and several heat sinks 220 can be integrally formed, or in the second method, several heat sinks 220 can be detachably mounted on the mounting plate 210. In other words, if it is necessary to add or remove heat sinks 220 according to specific circumstances, the second method should be used. Therefore, the choice can be made according to specific needs, which will not be described in detail in this embodiment.

[0022] Furthermore, after installing the three clamping posts onto the entire heat dissipation assembly, the three clamping posts are then inserted into the three mounting holes and secured. This ensures a secure installation of the entire heat dissipation assembly. The heatsink 400 is then installed, and several MOSFETs 500 are fixed to the motherboard body 100 and then attached to the heatsink 400. In other words, during use, the heat generated by the MOSFETs 500 can be conducted through the heatsink 400 to the motherboard body 100, and then dissipated through the heatsinks 220, thus achieving rapid heat dissipation. It is worth mentioning that by using the three clamping posts to separate the motherboard body 100 from the heatsink assembly, a good insulation effect is achieved. Therefore, there is no need to add extra insulating paper, effectively avoiding the problem of poor overall insulation reliability caused by insulation paper damage during use.

[0023] In one embodiment, the mounting plate 210 is further provided with several connection holes (not shown), each of which is equipped with a cooling fan (not shown). All the cooling fans are located above the heat-conducting plate 400, meaning that if the heat from the MOSFET 500 were to be dissipated directly, it could be quickly dissipated by the cooling fans. Furthermore, the cooling fans can be directly connected to the power supply on the motherboard body 100 to achieve electrical connection, and the heat generated by the cooling fans themselves can be transferred to the heat sinks 220 for heat dissipation through the mounting plate 210.

[0024] It is worth mentioning that by installing heat dissipation components, the components installed on the entire motherboard body 100 can be effectively cooled. In other words, the heat generated by the components will be transferred through the motherboard body 100 to the three pressing posts or heat conduction plates 400, and then cooled by several heat sinks 220.

[0025] In summary, the above embodiments are not limiting embodiments of this utility model. Any modifications or equivalent variations made by those skilled in the art based on the substantive content of this utility model are within the technical scope of this utility model.

Claims

1. A mainboard radiator insulation cost reduction structure, characterized in that, Including: The mainboard body, the heat dissipation assembly and the insulating assembly; The mainboard body is provided with mounting holes, the insulating assembly is fixed on the mainboard body through the mounting holes, and the heat dissipation assembly is connected with the mainboard body through the insulating assembly.

2. The mainboard radiator insulation cost reduction structure of claim 1, characterized in that: Three mounting holes are provided on the mainboard body.

3. The mainboard radiator insulation cost reduction structure of claim 2, characterized in that: The insulating assembly includes three riveting columns, and the three riveting columns are arranged on one side of the heat dissipation assembly.

4. The mainboard radiator insulation cost reduction structure according to claim 3, characterized in that: The heat dissipation assembly includes a mounting plate and a plurality of heat dissipation plates, one end of each riveting column is connected with a heat dissipation plate, part of the heat dissipation plates are arranged on one side of the mounting plate, and the other part of the heat dissipation plates are arranged on the other side of the mounting plate.

5. The mainboard radiator insulation cost reduction structure according to claim 4, characterized in that: The mounting plate and the plurality of heat dissipation plates are integrally formed.

6. The mainboard radiator insulation cost reduction structure of claim 4, wherein: A plurality of grooves are provided on two sides of each heat dissipation plate, and the grooves are sequentially and spaced apart.

7. The mainboard heat spreader insulation cost reduction structure of claim 4, wherein: A heat conduction plate is detachably mounted on one side of the mounting plate, and one side of the heat conduction plate abuts against the mainboard body.

8. The mainboard heat spreader insulation cost reduction structure of claim 7, wherein: A plurality of MOS tubes are detachably arranged on the mainboard body, and each MOS tube is attached to the heat conduction plate.

9. The mainboard heat spreader insulation cost reduction structure of claim 8, wherein: The heat conduction plate is a copper plate.

10. The mainboard heat spreader insulation cost reduction structure of claim 9, wherein: A plurality of fixing holes are provided on the mounting plate, a plurality of insertion holes are provided on the heat conduction plate, each insertion hole is in movable communication with a fixing hole, and a plurality of bolts are detachably arranged on the heat conduction plate, each bolt is movably inserted through a insertion hole and a fixing hole.

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