Micro-strip antenna vapor chamber heat dissipation structure

Abstract

The utility model discloses a heat radiation structure for a temperature-uniforming plate of a microstrip antenna, which relates to the field of thermal control of spacecrafts and comprises a substrate and the temperature-uniforming plate, and the temperature-uniforming plate is attached to the lower portion of the substrate to conduct heat. The array heat source chip is mounted above the substrate, the conductor patch is adhered to the top end of the substrate, and the low-heat-consumption chip and the back heat source chip are mounted on the bottom surface of the substrate; the upper surface of the temperature-uniforming plate is provided with an avoiding groove facilitating installation of the low-heat-consumption chip and the back heat source chip, and a heat conduction pad is installed between the upper surface of the temperature-uniforming plate and the lower surface of the substrate. Heat generated in the running process of a heating chip device is quickly conducted to the temperature-uniforming plate, and then the heat is expanded through the high heat conductivity characteristic of the temperature-uniforming plate, so that the temperature gradient of the antenna can be reduced, the heat of the antenna can be efficiently conducted to a mounting surface to be dissipated, the temperature of the device is reduced, and the performance and the service life of the antenna are improved.

Description

Technical Field

[0001] This utility model relates to the field of spacecraft thermal control technology, specifically to a heat dissipation structure for a microstrip antenna vapor chamber. Background Technology

[0002] The rise of microwave integration technology and new manufacturing processes has driven the development of microstrip antennas. Compared with traditional antennas, microstrip antennas are not only smaller, lighter, and have a lower profile, but they are also easier to integrate, have lower costs, and are suitable for mass production. In addition, they also have the advantages of diverse electrical performance.

[0003] Microstrip antennas are highly integrated, boasting a smaller size and compact structure that simplifies many traditional antenna designs, making them ideal for satellite communications where space and weight are strictly limited. However, their smaller surface area and compact heat source make heat dissipation more challenging. Excessive temperature of the electronic components within the antenna can affect its operational efficiency, reduce reliability, and shorten its lifespan. Therefore, antenna thermal control is crucial, its primary task being to maintain the temperature of the equipment and structure within the antenna within the required range.

[0004] Due to the vacuum environment in space, heat transfer pathways are limited, with the main pathways being conduction and radiation. Small-volume microstrip antennas, with their limited surface area, have limited radiative heat dissipation capabilities, requiring efficient heat conduction and dissipation methods. Furthermore, since the heat source of a microstrip antenna is highly integrated with the transmitting array, heat conduction and dissipation measures cannot be implemented on the heat source side to avoid affecting electromagnetic wave signals; therefore, alternative heat dissipation channels must be selected.

[0005] Therefore, a heat dissipation structure for microstrip antenna vapor chambers is needed. By attaching the vapor chamber to the surface of the microstrip antenna, the heat generated during the operation of the heat-generating chip device can be quickly conducted to the vapor chamber itself, which can effectively solve the heat dissipation problem of microstrip antennas. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by providing a heat dissipation structure for a microstrip antenna vapor chamber.

[0007] A heat dissipation structure for a microstrip antenna vapor chamber includes a substrate and a vapor chamber, with the vapor chamber attached to the underside of the substrate to conduct heat.

[0008] A surface heat source chip is mounted on the top of the substrate, and a conductor patch is attached to the top of the substrate. A low heat dissipation chip and a back heat source chip are mounted on the bottom surface of the substrate.

[0009] The upper surface of the heat spreader has clearance grooves to facilitate the installation of the low heat dissipation chip and the back heat source chip, and a thermal pad is installed between the upper surface of the heat spreader and the lower surface of the substrate.

[0010] Furthermore, a satellite compartment panel is installed below the heat exchanger, with the lower surface of the heat exchanger panel in close contact with the lower surface of the satellite compartment panel to conduct heat.

[0011] Furthermore, an in-cabin unit is installed below the temperature distribution plate, and a wiring hole is opened on the side of the in-cabin unit on the temperature distribution plate, through which the antenna cable passes and connects to the in-cabin unit.

[0012] Furthermore, the satellite cabin panel has a hollowed-out section in the middle, the internal unit is located at the hollowed-out section of the satellite cabin panel, and the bottom perimeter of the temperature distribution plate is attached to the upper surface of the satellite cabin panel.

[0013] Furthermore, the clearance groove is located directly below the low heat dissipation chip and the back heat source chip, and the area of ​​the clearance groove at the position corresponding to the low heat dissipation chip and the back heat source chip is larger than the area of ​​the low heat dissipation chip and the back heat source chip.

[0014] Furthermore, a heat dissipation protrusion is provided inside the clearance groove at the position corresponding to the back heat source chip. The heat dissipation protrusion is integrally formed with the heat spreader and is attached to the lower surface of the back heat source chip.

[0015] Furthermore, the clearance groove is hollowed out at the position corresponding to the low heat dissipation chip to form a through portion, and the lower end of the low heat dissipation chip passes through the through portion and extends to the bottom of the clearance groove.

[0016] Furthermore, the clearance grooves are connected at the positions of multiple back heat source chips to form a connecting part. The connecting part does not penetrate the heat spreader plate, and the number of chips located inside the connecting part is equal to that of the back heat source chips.

[0017] Furthermore, the thermal pad consists of a substrate thermally conductive part, an opening, and an adhesive thermally conductive part. The substrate thermally conductive part has an opening through which the low heat dissipation chip passes at the position corresponding to the low heat dissipation chip. The substrate thermally conductive part has an adhesive thermally conductive part with the same area and position as the back heat source chip at the position corresponding to the back heat source chip. The upper and lower surfaces of the adhesive thermally conductive part are respectively attached to the lower side of the back heat source chip and the upper surface of the heat dissipation protrusion.

[0018] Furthermore, the thermal pad is a silicon-based thermal pad, and the vapor chamber vapor chamber is a vapor chamber vapor chamber.

[0019] The advantages of this utility model compared with the prior art are as follows:

[0020] 1. This solution involves attaching a heat spreader to the surface of the microstrip antenna, which rapidly conducts the heat generated by the heat-generating chip device during operation to the heat spreader itself. The heat spreader then expands the heat through its high thermal conductivity. This reduces the antenna temperature gradient and efficiently conducts the antenna heat to the mounting surface for dissipation, thereby lowering the device temperature and improving antenna performance and lifespan.

[0021] 2. This solution provides sufficient space for low heat dissipation chips and back heat source chips by creating clearance grooves on the surface of the heat spreader, thus preventing the chips from being squeezed during installation and use, and ensuring the normal operation of the chips.

[0022] 3. This solution involves installing a thermal pad between the vapor chamber and the substrate. The thermal pad conducts the antenna heat to the vapor chamber and ultimately to the satellite compartment panel. At the same time, the thermal pad acts as an insulator to prevent the substrate from short-circuiting due to the contact structure. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the microstrip antenna vapor chamber heat dissipation structure proposed in this solution from a frontal view.

[0024] Figure 2 This is a schematic diagram of the overall structure of the microstrip antenna heat dissipation plate proposed in this scheme from an upward view.

[0025] Figure 3 This is a schematic diagram of the microstrip antenna vapor chamber heat dissipation structure proposed in this scheme from an explosion perspective.

[0026] Figure 4 This is a schematic diagram of the heat exchange plate and clearance groove proposed in this scheme;

[0027] Figure 5 This is a schematic diagram of the microstrip antenna and heat spreader proposed in this scheme from a frontal view during assembly.

[0028] Figure 6 This is a schematic diagram of the microstrip antenna and heat spreader proposed in this scheme from an upward viewing angle.

[0029] Figure 7 This is a schematic diagram of the microstrip antenna and thermal pad proposed in this scheme from a frontal view during assembly.

[0030] Figure 8 This is a schematic diagram of the microstrip antenna and thermal pad proposed in this scheme from an upward viewing angle during assembly.

[0031] Figure 9 This is a schematic diagram of the microstrip antenna and thermal pad assembly proposed in this scheme;

[0032] Figure 10This is a schematic diagram of the microstrip antenna proposed in this scheme from a downward viewing angle;

[0033] Figure 11 This is a schematic diagram of the microstrip antenna proposed in this scheme from a frontal view.

[0034] Figure 12 This is a schematic diagram of the vertical cross-section of the heat dissipation structure of the microstrip antenna vapor chamber proposed in this scheme.

[0035] Reference numerals: 1. Conductor patch; 2. Array heat source chip; 3. Substrate; 4. Low heat dissipation chip; 5. Rear heat source chip; 6. Heat spreader; 7. Satellite compartment panel; 8. Wiring hole; 9. In-cabin unit; 10. Clearance groove; 11. Heat dissipation boss; 12. Thermal pad;

[0036] 1001. Penetrating part; 1002. Connecting part;

[0037] 1201, Substrate thermal conductive part; 1202, Opening; 1203, Adhesive thermal conductive part. Detailed Implementation

[0038] This embodiment provides a heat dissipation structure for a microstrip antenna vapor chamber, as shown in the attached manual. Figures 1-12 As shown, the heat dissipation structure includes a microstrip antenna heat spreader, comprising a substrate 3 and a heat spreader 6. The heat spreader 6 is a vapor chamber heat spreader. The heat spreader 6 is attached to the bottom of the substrate 3 to conduct heat. The envelope size of the heat spreader 6 is designed according to the mechanical interface, and the thickness of the heat spreader 6 is designed according to the heat generated by the antenna array.

[0039] Please refer to Figure 3 As shown, an array heat source chip 2 is mounted on the top of the substrate 3, and a conductor patch 1 is attached to the top of the array heat source chip 2. This is prior art, so it will not be described in detail here. A low heat dissipation chip 4 and a back heat source chip 5 are mounted on the bottom surface of the substrate 3. This is prior art, so it will not be described in detail here. The substrate 3 and the array heat source chip 2, low heat dissipation chip 4 and back heat source chip 5 mounted on its top and bottom form a small microstrip antenna. A heat spreader 6 is attached to the bottom of the microstrip antenna to transfer the heat generated during the operation of the microstrip antenna to the heat spreader 6. The heat is then spread out by the high thermal conductivity of the heat spreader 6. This can reduce the antenna temperature gradient and efficiently conduct the antenna heat to the mounting surface for dissipation, thereby reducing the device temperature and improving the antenna performance and lifespan.

[0040] Continue to refer to Figure 3The upper surface of the heat spreader 6 has a clearance groove 10 to facilitate the installation of the low heat dissipation chip 4 and the back heat source chip 5. The direction of the clearance groove 10 is designed on the heat spreader 6 according to the layout of the low heat dissipation chip 4 and the back heat source chip 5. A thermal pad 12 is installed between the upper surface of the heat spreader 6 and the lower surface of the substrate 3. The satellite compartment 7 is installed below the heat spreader 6. The lower surface of the heat spreader 6 is in close contact with the lower surface of the satellite compartment 7 to conduct heat. The thermal pad 12 is set in the area of ​​the heat spreader 6 that is not in the clearance groove 10 to conduct the heat dissipation of the microstrip antenna to the heat spreader 6 and then further to the satellite compartment 7. At the same time, the thermal pad 12 plays an insulating role to prevent the substrate 3 from directly contacting the structural components and causing a short circuit.

[0041] Continue to refer to Figures 2-3 Below the heat spreader 6, an internal unit 9 is installed. A wire hole 8 is opened on one side of the internal unit 9 on the heat spreader 6. The antenna cable passes through the wire hole 8 and connects to the internal unit 9. The middle part of the satellite compartment 7 is hollowed out. The internal unit 9 is located at the hollowed-out part of the satellite compartment 7. The bottom and perimeter of the heat spreader 6 are attached to the upper surface of the satellite compartment 7 to facilitate the normal operation of the microstrip antenna and transfer the heat generated by the microstrip antenna during operation to the heat-conducting pad 12, and finally to the satellite compartment 7.

[0042] Refer to the instruction manual appendix Figures 3-5 The orientation and design of the clearance slot 10 in this embodiment are described in detail below: the clearance slot 10 is located directly below the low heat dissipation chip 4 and the back heat source chip 5, and the area of ​​the clearance slot 10 at the position corresponding to the low heat dissipation chip 4 and the back heat source chip 5 is larger than the area of ​​the low heat dissipation chip 4 and the back heat source chip 5. This can be referred to here. Figure 4 The clearance groove 10 has sufficient space to prevent the low heat dissipation chip 4 and the back heat source chip 5 from being squeezed by the structure during and after installation.

[0043] A heat dissipation protrusion 11 is provided inside the clearance groove 10 at the position corresponding to the back heat source chip 5. The heat dissipation protrusion 11 is integrated with the heat spreader 6 and is attached to the lower surface of the back heat source chip 5. This can be referred to Figure 4 The heat generated by the heat source chip 5 on the back during operation can be conducted to the heat dissipation plate 6 through the heat dissipation protrusion 11, which facilitates the heat dissipation in the next step.

[0044] Continue to refer to the instruction manual appendix Figure 4Further explanation of the orientation and design of the clearance groove 10 in this embodiment: The clearance groove 10 is hollowed out at the position corresponding to the low heat dissipation chip 4, forming a through portion 1001. The lower end of the low heat dissipation chip 4 passes through the through portion 1001 and extends to the bottom of the clearance groove 10. The clearance groove 10 is connected at the positions corresponding to multiple back heat source chips 5, forming a connecting portion 1002. The connecting portion 1002 does not penetrate the heat spreader 6. The heat dissipation protrusion 11 is located inside the connecting portion 1002 and is arranged in an equal number with the back heat source chips 5. This can be referred to here. Figure 4 ;

[0045] With this configuration, the low heat dissipation chip 4 in the microstrip antenna can pass through the thermal pad 12 and the heat spreader 6 in sequence for heat dissipation. The heat generated by the heat source chip 5 on the back during operation is conducted to the heat dissipation protrusion 11, and further conducted to the heat spreader 6, and finally conducted to the satellite compartment plate 7 for heat dissipation.

[0046] Refer to the instruction manual appendix Figures 6-9 The design of the thermal pad 12 in this embodiment is described in detail below: The thermal pad 12 is made of a material with high insulation and good heat dissipation performance. In this embodiment, the thermal pad 12 is a silicon-based thermal pad. Please refer to the appendix of the instruction manual. Figure 8 Specifically, the thermal pad 12 is composed of a substrate thermal conductive part 1201, an opening 1202, and an adhesive thermal conductive part 1203. The substrate thermal conductive part 1201 has an opening 1202 at the position corresponding to the through part 1001 to facilitate the passage of the low heat dissipation chip 4. The substrate thermal conductive part 1201 has an adhesive thermal conductive part 1203 at the position corresponding to the position of the connecting part 1002, which is equal in area and position to the back heat source chip 5. The upper and lower surfaces of the adhesive thermal conductive part 1203 are respectively attached to the lower side of the back heat source chip 5 and the upper surface of the heat dissipation protrusion 11.

[0047] Based on the above explanation of the corresponding clearance slot 10, we can conclude that:

[0048] The low heat dissipation chip 4 passes through the opening 1202 and the heat spreader 6 in sequence and extends to the bottom of the heat spreader 6 for heat dissipation. The unit 9 inside the cabin will not block the heat dissipation of the low heat dissipation chip 4, because in actual design, the unit 9 inside the cabin and the low heat dissipation chip 4 will be kept in the same position as much as possible. Even if they are in the same position, the low heat dissipation chip 4 in the same position is very few and will not affect the overall heat dissipation effect.

[0049] The heat source chip 5 on the back is attached to the heat-conducting part 1203, and the heat-conducting part 1203 is attached to the heat dissipation protrusion 11. The heat generated by the heat source chip 5 during operation is conducted to the heat dissipation protrusion 11 through the heat-conducting part 1203, and further conducted to the heat spreader 6. While the heat spreader 6 dissipates heat itself, it also conducts heat to the satellite compartment 7 because the heat spreader 6 is attached to the satellite compartment 7 with the largest area.

[0050] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0051] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0052] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0053] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A microstrip antenna heat spreader structure, characterized by, Including the substrate (3) and the uniform temperature plate (6), the lower surface of the substrate (3) is attached to the uniform temperature plate (6) to conduct heat; The top of the array heat source chip (2) is attached to the conductor patch (1), and the bottom of the substrate (3) is installed with the low heat consumption chip (4) and the back heat source chip (5); The upper surface of the uniform temperature plate (6) is provided with a recess (10) for installing the low heat consumption chip (4) and the back heat source chip (5), and a heat-conducting pad (12) is installed between the upper surface of the uniform temperature plate (6) and the lower surface of the substrate (3).

2. The microstrip antenna heat spreader structure of claim 1, wherein: The lower surface of the uniform temperature plate (6) is attached to the lower surface of the satellite cabin plate (7) to conduct heat.

3. The microstrip antenna heat spreader structure of claim 2, wherein: The lower surface of the uniform temperature plate (6) is provided with a through hole (8) at one side of the in-cabin single machine (9), and the antenna cable passes through the through hole (8) and is connected to the in-cabin single machine (9).

4. The microstrip antenna heat spreader structure of claim 3, wherein: The middle position of the satellite cabin plate (7) is hollowed out, the in-cabin single machine (9) is located at the hollow position of the satellite cabin plate (7), and the bottom surface of the uniform temperature plate (6) is attached to the upper surface of the satellite cabin plate (7).

5. The microstrip antenna heat spreader structure of claim 1, wherein: The recess (10) is located directly below the low heat consumption chip (4) and the back heat source chip (5), and the area of the recess (10) corresponding to the position of the low heat consumption chip (4) and the back heat source chip (5) is greater than the area of the low heat consumption chip (4) and the back heat source chip (5).

6. The microstrip antenna heat spreader structure of claim 5, wherein: The heat dissipation boss (11) is provided inside the recess (10) corresponding to the position of the back heat source chip (5), the heat dissipation boss (11) is integrally provided with the uniform temperature plate (6), and the lower surface of the back heat source chip (5) is attached to the heat dissipation boss (11).

7. The microstrip antenna heat spreader structure of claim 6, wherein: The recess (10) is hollowed out corresponding to the position of the low heat consumption chip (4), forming a through portion (1001), and the lower end of the low heat consumption chip (4) passes through the through portion (1001) and extends below the recess (10).

8. The microstrip antenna heat spreader structure of claim 6, wherein: The recess (10) is connected corresponding to the position of the plurality of back heat source chips (5), forming a communication portion (1002), the communication portion (1002) does not penetrate the uniform temperature plate (6), and the 11 is located inside the communication portion (1002) and is provided in equal number with the back heat source chip (5).

9. The microstrip antenna heat spreader structure of claim 1, wherein: The heat-conducting pad (12) is composed of a base heat-conducting part (1201), an opening (1202) and a pasting heat-conducting part (1203), the opening (1202) is provided through the base heat-conducting part (1201) at positions corresponding to the low-heat-consumption chips (4) to facilitate the low-heat-consumption chips (4) to pass through, the pasting heat-conducting part (1203) is provided at positions corresponding to the back heat source chips (5) and has an area equal to that of the back heat source chips (5), the pasting heat-conducting part (1203) is pasted to the lower side of the back heat source chips (5) and the upper surface of the heat-dissipating boss (11) respectively.

10. The microstrip antenna vapor chamber heat spreading structure of claim 9, wherein: The heat-conducting pad (12) is a silicon-based heat-conducting pad, and the vapor chamber (6) is a vapor chamber.

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