Ultrasonic cleaning equipment for silicon wafer
By controlling the start and stop of the ultrasonic vibrating plate and the adjustable-angle fixed cylinder structure using photoelectric sensors, the problem of increased dirt rate caused by the compression of cleaning process time in silicon wafer cleaning equipment has been solved, achieving energy saving, emission reduction and capacity improvement.
Patent Information
- Application Number
- CN202422766628.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-11-13
AI Technical Summary
Existing silicon wafer cleaning equipment, after reducing the cleaning process time, has seen an increase in the dirt rate and the amount of pure water and reagents used, leading to increased cost and production capacity pressure.
The ultrasonic vibrating plate is controlled by a photoelectric sensor. The presence of silicon wafers in the cleaning basket is detected by the photoelectric sensor, and the ultrasonic vibrating plate is activated only when silicon wafers are detected, reducing unnecessary power consumption. The ultrasonic vibrating plate is activated 3 seconds before the process time is reached. Combined with the adjustable angle fixing cylinder and limiting structure, the cleaning effect is ensured to remain unchanged.
Without increasing the dirt level, the cleaning process time is reduced by 5 seconds, saving pure water and chemical usage, saving 259,200 kWh of electricity annually, increasing annual production capacity by 37.76 million kWh, and reducing equipment energy consumption and costs.
Smart Images
Figure CN223748156U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of silicon wafer cleaning, especially relates to ultrasonic cleaning equipment for silicon wafer. BACKGROUND
[0002] The ultrasonic cleaning machine mainly converts the acoustic energy of the power ultrasonic frequency source into mechanical vibration, radiates the ultrasonic wave to the cleaning liquid in the tank through the tank wall, makes the micro-bubbles in the liquid vibrate under the action of the acoustic wave due to the radiation of the ultrasonic wave, utilizes the huge pressure generated by the ultrasonic cavitation to destroy the adsorption of the dirt and the surface of the cleaning piece, can destroy the dirt, and remove or weaken the boundary dirt layer.
[0003] With the increasingly fierce competition in the silicon wafer industry, the cost pressure and yield pressure are increasingly prominent, and the production increase and cost reduction become the main theme, however, the hardware characteristics of the equipment itself limit the mechanical movement time and cannot be compressed, and the compression of the cleaning process time will inevitably increase the amount of pure water and reagent, otherwise the dirt rate will increase. UTILITY MODEL CONTENTS
[0004] In view of the problems in the prior art, the utility model provides the following technical scheme:
[0005] The ultrasonic cleaning equipment for silicon wafer comprises a cleaning tank, an ultrasonic generator and an ultrasonic vibration plate are arranged in the cleaning tank, a mechanical arm for moving a cleaning basket is arranged at the upper portion of the cleaning tank, a mounting seat is fixedly connected to the outer side of the cleaning tank, an angle-adjustable fixing cylinder is arranged on the mounting seat through a rotating shaft one and a rotating shaft two, a photoelectric sensor is arranged in the fixing cylinder, the photoelectric sensor is electrically connected with the ultrasonic vibration plate, a screw rod one is threadedly connected to the fixing cylinder, knobs one and elastic plates are fixedly connected to the two ends of the screw rod one, and the elastic plates abut against the photoelectric sensor.
[0006] As a preferred technical scheme of the above-mentioned technical scheme, a spline shaft is fixedly connected to the end of the rotating shaft two away from the fixing cylinder, a spline sleeve is arranged on the outer ring of the spline shaft, a limiting plate is arranged on the outer ring of the spline sleeve, a limiting shaft is fixedly connected to the outer side of the mounting seat, and the limiting shaft is inserted into the limiting plate.
[0007] As a preferred technical scheme of the above-mentioned technical scheme, a baffle is fixedly connected to the end of the spline shaft away from the rotating shaft two, and a spring is fixedly connected between the baffle and the limiting plate.
[0008] As a preferred technical scheme of the above-mentioned technical scheme, a sliding sleeve is fixedly connected to the end of the rotating shaft one close to the rotating shaft two, a sliding rod is movably sleeved on the inner ring of the sliding sleeve, fixed plates one are fixedly connected to the two ends of the sliding rod, and the fixed plates one are fixed to the outer wall of the fixing cylinder.
[0009] As the preferred technical scheme of the above, the second rotating shaft is fixedly connected with a silk cover at one end close to the first rotating shaft, the silk cover is threadedly connected with a second screw rod, the outer wall of the fixed cylinder is fixedly connected with two second fixed plates, one end of the second screw rod is rotationally connected with one second fixed plate, the other end penetrates through the other second fixed plate and is fixedly connected with a second knob.
[0010] The utility model discloses the beneficial effects are:
[0011] 1. When the cleaning basket is close to the cleaning tank and comes to the monitoring range of the photoelectric sensor, the photoelectric sensor controls the ultrasonic vibration plate to start, and the ultrasonic vibration plate is stopped after the process time of the medicament tank and the rinsing tank is reached, so that the ultrasonic vibration plate is opened 3s in advance, the product dirt rate is unchanged, the cleaning process time is reduced by 5s under the same pure water and medicament dosage, and the annual production capacity contribution is 0.0596 million / h * 11h / class * 8 lines * 60 classes / month * 12 months / year = 3776 million.
[0012] 2. When the photoelectric sensor judges that the cleaning basket is not loaded with silicon wafers by detecting the shielding or reflection of light, the ultrasonic generator and the ultrasonic vibration plate will not start, so as to save the power consumption of the ultrasonic generator and the ultrasonic vibration plate. Each cleaning tank is provided with 2 ultrasonic generators and 2 ultrasonic vibration plates, and the total power is 12KW. The annual power saving is 12KW * 15 tanks * 0.5h / day * 8 lines * 30 days / month * 12 months / year = 259200 degrees BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 The structure schematic diagram of the ultrasonic cleaning equipment for silicon wafers in the embodiment is shown.
[0014] Figure 2 The structure schematic diagram of the limiting plate and the limiting shaft in the embodiment is shown.
[0015] Figure 3 The structure schematic diagram of the elastic plate and the photoelectric sensor in the embodiment is shown.
[0016] BRIEF DESCRIPTION OF DRAWINGS
[0017] 1. Cleaning tank; 2. Mounting seat; 3. First rotating shaft; 4. Slide sleeve; 5. Second rotating shaft; 6. Silk cover; 7. Spline shaft; 8. Baffle; 9. Spline sleeve; 10. Limiting plate; 11. Spring; 12. Limiting shaft; 13. Fixed cylinder; 14. First screw rod; 15. First knob; 16. Elastic plate; 17. Photoelectric sensor; 18. First fixed plate; 19. Slide rod; 20. Second fixed plate; 21. Second screw rod; 22. Second knob. DETAILED DESCRIPTION
[0018] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the utility model technical scheme will be described clearly and completely in combination with embodiments below.
[0019] The existing silicon wafer cleaning machine reagent tank and rinsing tank ultrasonic vibration plate start-stop working mode is: the mechanical arm horizontally moves above the tank body, puts the material to the lower position of the tank body and opens the clamping jaw, and the ultrasonic vibration plate is started; the reagent tank and the rinsing tank set the process time, and the ultrasonic vibration plate is stopped.
[0020] Embodiment 1
[0021] As shown in Figure 1 , Figure 2 and Figure 3 , the ultrasonic cleaning equipment for silicon wafers includes a cleaning tank 1, an ultrasonic generator and an ultrasonic vibration plate are installed inside the cleaning tank 1, a mechanical arm for moving a cleaning basket is arranged above the cleaning tank 1, a mounting seat 2 is fixedly connected to the outside of the cleaning tank 1, an angle-adjustable fixing cylinder 13 is installed on the mounting seat 2 through a rotating shaft one 3 and a rotating shaft two 5, a photoelectric sensor 17 is arranged in the fixing cylinder 13, the photoelectric sensor 17 is electrically connected with the ultrasonic vibration plate, a lead screw one 14 is threadedly connected to the fixing cylinder 13, a knob one 15 and an elastic plate 16 are fixedly connected to both ends of the lead screw one 14, the elastic plate 16 abuts against the photoelectric sensor 17, and the model of the photoelectric sensor 17 is Keyence PZ-V71 but is not limited to this.
[0022] Specifically, a plurality of cleaning tanks 1 are arranged side by side, two ultrasonic generators and two ultrasonic vibration plates are arranged in one cleaning tank 1, the power of the ultrasonic generator and the ultrasonic vibration plate is 3KW, cleaning agent and rinsing agent are added, the cleaning basket is moved into the cleaning tank 1 by the mechanical arm to clean the silicon wafers, when the cleaning basket is close to the cleaning tank 1 and enters the monitoring range of the photoelectric sensor 17, the photoelectric sensor 17 controls the ultrasonic vibration plate to start, the ultrasonic vibration plate is stopped when the process time of the reagent tank and the rinsing tank is reached, the ultrasonic vibration plate is started 3s in advance, the product contamination rate does not change, under the same amount of pure water and reagent, the cleaning process time is reduced by 5s, the annual production capacity is 0.0596 million / h*11h / class*8 lines*60 classes / month*12 months / year=3776 million, when the photoelectric sensor 17 detects that the cleaning basket is not loaded with silicon wafers by detecting the shielding or reflection of light, the ultrasonic generator and the ultrasonic vibration plate will not start, so as to save the power consumption of the ultrasonic generator and the ultrasonic vibration plate.
[0023] As shown in Figure 2 and Figure 3 , the end of the rotating shaft two 5 away from the fixing cylinder 13 is fixedly connected with a spline shaft 7, a spline sleeve 9 is sleeved on the outer ring of the spline shaft 7, a limiting plate 10 is sleeved on the outer ring of the spline sleeve 9, a limiting shaft 12 is fixedly connected to the outside of the mounting seat 2, and the limiting shaft 12 is insertedly matched with the limiting plate 10.
[0024] Specifically, through the movable cooperation of the spline shaft 7 and the spline sleeve 9, and the plug-in cooperation of the limiting plate 10 and the limiting shaft 12, when the limiting plate 10 is plugged with the limiting shaft 12, the fixed cylinder 13 cannot rotate around the rotating shaft one 3 and the rotating shaft two 5 for adjustment, and when the limiting plate 10 is unplugged with the limiting shaft 12, the fixed cylinder 13 can rotate around the rotating shaft one 3 and the rotating shaft two 5 for adjustment. The photoelectric sensor 17 has two monitoring modes, one of which is parallelly arranged at the opening side of the cleaning tank 1 and used for monitoring the position of the cleaning basket, and the other of which is vertically arranged at the opening side of the cleaning tank 1 and used for monitoring the descending height of the mechanical arm.
[0025] As shown in Figure 2 and Figure 3 , the spline shaft 7 is fixedly connected with the baffle 8 at the end away from the rotating shaft two 5, and the baffle 8 is fixedly connected with the spring 11 between the limiting plate 10.
[0026] Specifically, through the elastic action of the spring 11, the limiting plate 10 is pushed by the spring 11 to be close to the mounting seat 2 without any external force, so that the limiting plate 10 is always plugged with the limiting shaft 12.
[0027] Embodiment 2
[0028] As shown in Figure 1 , Figure 2 , and Figure 3 , compared with embodiment 1, the rotating shaft one 3 is fixedly connected with the sliding sleeve 4 at the end close to the rotating shaft two 5, the sliding sleeve 4 is movably sleeved with the sliding rod 19, the sliding rod 19 is fixedly connected with the fixed plate one 18 at both ends, and the fixed plate one 18 is fixed on the outer wall of the fixed cylinder 13.
[0029] Specifically, through the sliding cooperation of the sliding sleeve 4 and the sliding rod 19, the position of the fixed cylinder 13 can be linearly adjusted, so that the fixed cylinder 13 can not block the normal lifting of the cleaning basket into the inside of the cleaning tank 1 when the fixed cylinder 13 is adjusted in the monitoring mode.
[0030] As shown in Figure 2 , the rotating shaft two 5 is fixedly connected with the silk sleeve 6 at the end close to the rotating shaft one 3, the silk sleeve 6 is threadedly connected with the screw rod two 21, the outer wall of the fixed cylinder 13 is fixedly connected with two fixed plate two 20, one end of the screw rod two 21 is rotationally connected with one fixed plate two 20, the other end penetrates through the other fixed plate two 20 and is fixedly connected with the knob two 22.
[0031] Specifically, rotating the knob two 22 can drive the screw rod two 21 to rotate, and through the threaded connection of the screw rod two 21 and the silk sleeve 6, the fixed cylinder 13 will not slide randomly.
[0032] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them.
Claims
1. An ultrasonic cleaning device for silicon wafers, comprising a cleaning tank (1), an ultrasonic generator and an ultrasonic vibration plate are installed inside the cleaning tank (1), and a mechanical arm for moving a cleaning basket is arranged on the top, characterized in that: The outside of the cleaning tank (1) is fixedly connected with a mounting seat (2), the mounting seat (2) is provided with an angle-adjustable fixing cylinder (13) through a rotating shaft one (3) and a rotating shaft two (5), the inside of the fixing cylinder (13) is provided with a photoelectric sensor (17), the photoelectric sensor (17) is electrically connected with an ultrasonic vibration plate, and the fixing cylinder (13) is screwedly connected with a lead screw one (14), both ends of the lead screw one (14) are fixedly connected with a knob one (15) and an elastic plate (16) respectively, and the elastic plate (16) abuts against the photoelectric sensor (17).
2. The apparatus for ultrasonic cleaning of a silicon wafer according to claim 1, wherein The end, away from the fixing cylinder (13), of the rotating shaft two (5) is fixedly connected with a spline shaft (7), the spline shaft (7) is sleeved with a spline sleeve (9) outside, the spline sleeve (9) is sleeved with a limiting plate (10) outside, the outside of the mounting seat (2) is fixedly connected with a limiting shaft (12), and the limiting shaft (12) is insertedly connected with the limiting plate (10).
3. The apparatus for ultrasonic cleaning of a silicon wafer according to claim 2, wherein The end, away from the rotating shaft two (5), of the spline shaft (7) is fixedly connected with a baffle (8), and the baffle (8) is fixedly connected with the limiting plate (10) and the spring (11).
4. The apparatus for ultrasonic cleaning of a silicon wafer according to claim 1, wherein The end, close to the rotating shaft two (5), of the rotating shaft one (3) is fixedly connected with a sliding sleeve (4), the inside of the sliding sleeve (4) is movably sleeved with a sliding rod (19), both ends of the sliding rod (19) are fixedly connected with a fixed plate one (18), and the fixed plate one (18) is fixed to the outer wall of the fixing cylinder (13).
5. The apparatus for ultrasonic cleaning of a silicon wafer according to claim 4, wherein The end, close to the rotating shaft one (3), of the rotating shaft two (5) is fixedly connected with a silk sleeve (6), the silk sleeve (6) is screwedly connected with a lead screw two (21), the outer wall of the fixing cylinder (13) is fixedly connected with two fixed plate twos (20), one end of the lead screw two (21) is rotationally connected with one fixed plate two (20), the other end penetrates through the other fixed plate two (20) and is fixedly connected with a knob two (22).