Edge grinding device capable of removing chips and used for semiconductor precision part machining

Abstract

The utility model discloses an edging device for semiconductor precision part processing capable of removing chips, which relates to the field of semiconductor precision part processing and comprises a base, a processing table is fixedly mounted at the top of the base, a hollow plate is fixedly connected in the processing table, and sliding grooves are symmetrically formed in the inner bottom wall of the processing table. A collecting assembly used for discharging chips is arranged in the sliding groove. Moving grooves are formed in the front faces of the left side and the right side of the machining table. According to the semiconductor precision part edge grinding device, the baffle and the clamping rod are arranged, the dust suction machine is arranged for collecting and storing ground edges generated by semiconductor precision parts and avoiding interference of impurities and chips to the machining process, the sliding plate and the sliding groove are arranged, and the collected impurities and chips are treated and discharged in a unified mode; and meanwhile, a limiting frame, a screw rod and a clamping plate are arranged, so that the semiconductor precision parts to be subjected to edge grinding machining in different thickness specifications are fixedly mounted.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor precision component processing, specifically to an edge grinding device for semiconductor precision component processing with chip removal. BACKGROUND

[0002] Semiconductor precision component processing is a highly specialized field that involves high-precision and high-efficiency processing of semiconductor materials to meet the manufacturing requirements of semiconductor devices. During the process of semiconductor precision component processing, edge grinding is required, which involves the use of an edge grinding device. However, the existing edge grinding devices have the problem that the workpiece may vibrate or shift during grinding if it is not clamped stably or if there is looseness, which affects the edge grinding effect.

[0003] To overcome the above-mentioned defects, the prior art (Chinese patent with application number 202420029114.8 and application date January 5, 2024) discloses an edge grinding device for semiconductor processing. The edge grinding device is provided with a clamping assembly. The semiconductor is placed between two clamping plates, and then the two screws are rotated to move the corresponding two clamping plates until the silicon rubber blocks are in contact with and tightly against the semiconductor, thereby achieving clamping and fixing of the semiconductor. This structure can fix different sizes of semiconductors, effectively improving the applicability of the device.

[0004] Although the prior art can solve the clamping and fixing of the semiconductor, impurities and chips may be generated during the grinding of the semiconductor. Since the edge grinding device does not have a chip removal structure, it cannot collect and store the impurities and chips generated during the grinding of the semiconductor, which may accumulate or splash and interfere with the processing process. Moreover, the position of the semiconductor is fixed during grinding, which cannot effectively grind the semiconductor comprehensively.

[0005] Therefore, we propose an edge grinding device for semiconductor precision component processing with chip removal to solve the above problems. CONTENT OF THE UTILITY MODEL

[0006] The utility model aims to provide an edge grinding device for semiconductor precision component processing with chip removal to solve the problem that the existing edge grinding devices may vibrate or shift during grinding if the workpiece is not clamped stably or if there is looseness, which affects the edge grinding effect.

[0007] To achieve the above object, the utility model provides the following technical scheme: A kind of edge grinding device for semiconductor precision component processing with chip removal, including base, fixed mounting is carried out on the top of the base processing table, hollow plate is fixedly connected in the inside of the processing table, the inner bottom wall of the processing table is symmetrically provided with sliding slot, the inside of the sliding slot is provided with the collection assembly for chip removal;The front of the left and right sides of the processing table is provided with moving slot, fixed mounting is carried out in the inside of the moving slot fixed rod, the outer wall of the fixed rod is movably connected with moving plate, the front of the moving plate is fixedly installed with baffle, the left and right sides of the baffle are provided with telescopic assembly for limiting;Fixed mounting is carried out on the top of the base support frame, support frame is provided with servo motor body on the top, the output shaft of the servo motor body is provided with clamping assembly for installing semiconductor precision component by shaft coupling.

[0008] As the preferred technical scheme of the application, the collection assembly includes a sliding plate, the top of the sliding plate is fixedly installed with a pull-out box, the inside of the left side of the pull-out box is provided with a dust collector body, the left and right sides of the dust collector body are fixedly installed with dust collection pipes, the right side of the dust collection pipe is fixedly connected with an intercepting screen cover.

[0009] As the preferred technical scheme of the application, the telescopic assembly includes a fixed cylinder, the inside of the fixed cylinder is movably connected with a movable plate, the rear of the movable plate is fixedly installed with a clamping rod, the front of the movable plate is fixedly connected with a telescopic rod, the outer wall of the telescopic rod is sleeved with a strong spring.

[0010] As the preferred technical scheme of the application, the clamping assembly includes a limiting frame, the inside of the left and right sides of the limiting frame is provided with a movable slot, the inside of the limiting frame is threadedly connected with a screw rod, the bottom of the screw rod is fixedly installed with a clamping plate, the rear of the left and right sides of the clamping plate is fixedly connected with a sliding block.

[0011] As the preferred technical scheme of the application, the sliding plate and the sliding slot are slidingly connected, the sliding plate and the pull-out box are tightly fitted, and the pull-out box and the processing table are detachably connected. By manually pulling out the pull-out box, the pull-out box drives the sliding plate to slide outward in the corresponding sliding slot, so that the pull-out box is pulled out of the processing table, and the collected impurities can be conveniently processed and removed.

[0012] As the preferred technical scheme of the application, the baffle and the processing table are telescopically connected, the baffle and the moving plate are fixedly connected, and the moving plate and the fixed rod and the moving slot are slidingly connected. The outer wall of the fixed rod is sleeved with a telescopic spring, and the top end of the telescopic spring is fixedly connected with the moving plate. By moving the baffle downward, the baffle drives the moving plate to move downward on the corresponding fixed rod and moving slot, and the connected extension spring is compressed during the movement of the moving plate.

[0013] As a preferred technical scheme of the present application, the sliding block and the movable groove are movably connected, the sliding block and the clamping plate are closely attached, the bottom of the clamping plate is provided with an anti-skid strip, the clamping plate is driven downward by the screw rod, and the sliding block is driven to move downward in the corresponding movable groove during the movement of the clamping plate, thereby increasing the stability of the movement of the clamping plate.

[0014] Compared with the prior art, the semiconductor precision component machining edge grinding device has the advantages that: the baffle and the clamping rod are provided, the dust collector is arranged, the generated edge grinding dust of the semiconductor precision component is collected and stored, the interference of the dust on the machining process is avoided, the slide plate and the slide groove are arranged, the collected dust is uniformly treated and discharged, the limiting frame, the screw rod and the clamping plate are arranged, the semiconductor precision component to be edge ground of different thickness specifications is fixed and installed, and the specific content is shown as follows.

[0015] 1. The baffle and the clamping rod are provided, the movable plate is connected to the clamping rod to move through the telescopic rod, the telescopic adjustment of the baffle is facilitated, the subsequent edge grinding process of the semiconductor precision component is shielded, and the flying of the edge grinding dust is avoided.

[0016] Further, the dust collector is arranged, the air in the pull-out box is extracted through the dust collector body and the dust extraction pipe, the edge grinding dust on the machining table is collected and stored through the hollow plate, the interference of the dust on the machining process is avoided, and the machining quality is ensured.

[0017] Further, the slide plate and the slide groove are arranged, the slide plate is driven to slide outward in the corresponding slide groove through the pull-out box, and the collected dust is uniformly treated and discharged.

[0018] 2. The limiting frame, the screw rod and the clamping plate are arranged, the clamping plate is attached to the anti-skid strip on the semiconductor precision component through the screw rod, the screw rod is fixed in the limiting frame through the cooperation of the bolt inserted into the limiting frame, and the semiconductor precision component to be edge ground of different thickness specifications is fixed and installed, so that the flexibility and adaptability of machining are improved.

[0019] Further, the servo motor body is arranged, the semiconductor precision component is rotated by 300 degrees through the cooperation of the servo motor body and the limiting frame when the polishing assembly operates to grind the edge of the semiconductor precision component, the exposed edge of the semiconductor precision component is fully polished, the adjustment time and the waiting time in the machining process are reduced, and the machining efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a front view structural schematic diagram of the utility model;

[0021] Figure 2 It is partial section structure schematic view of processing table and baffle of the utility model;

[0022] Figure 3 It is partial section structure schematic view of pull-out box and hollowed plate of the utility model;

[0023] Figure 4 It is partial section schematic view of fixed cylinder of the utility model;

[0024] Figure 5 It is partial structure schematic view of support frame and limiting frame of the utility model;

[0025] Figure 6 It is partial structure schematic view of clamping plate and screw rod of the utility model;

[0026] Figure 7 It is the utility model Figure 5 Enlarged structure schematic view of A place in middle.

[0027] In the drawing: 1, base; 2, processing table; 3, hollowed plate; 4, sliding groove; 5, sliding plate; 6, pull-out box; 7, dust collection machine body; 8, dust collection pipe; 9, intercepting net cover; 10, moving groove; 11, fixed rod; 12, support frame; 13, moving plate; 14, baffle; 15, fixed cylinder; 16, movable plate; 17, clamping rod; 18, telescopic rod; 19, strong spring; 20, servo motor body; 21, limiting frame; 22, movable groove; 23, screw rod; 24, clamping plate; 25, sliding block. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0029] Please refer to Figures 1-7 The utility model provides the following technical scheme:

[0030] Embodiment one: in order to solve the problem that the edge grinding device on the market will produce impurity scraps in the process of semiconductor grinding, since the edge grinding device is not provided with a chip removal structure, the impurity scraps generated in the process of semiconductor grinding cannot be collected, stored and removed, and the impurity scraps are easy to accumulate or splash, which can interfere with the processing process. The edge grinding device for precise semiconductor component processing with chip removal disclosed in the embodiment can refer to the accompanying Figure 1 -Appendix Figure 4The utility model relates to a processing table with dust collection function, including base 1, the top fixed mounting of base 1 has processing table 2, the inside fixed connection of processing table 2 has openwork board 3, the inside bottom wall of processing table 2 is symmetrically opened and has sliding slot 4, the inside of sliding slot 4 is provided with the collection subassembly for chip removal, the front of processing table 2 left and right sides is opened and has moving groove 10, the inside fixed mounting of moving groove 10 has fixed link 11, the outer wall movable joint of fixed link 11 has moving plate 13, the front fixed mounting of moving plate 13 has baffle 14, and the left and right sides of baffle 14 are provided with the telescopic subassembly for limiting, the collection subassembly includes slide 5, the top fixed mounting of slide 5 has pull-out box 6, the inside left side of pull-out box 6 is provided with dust absorption machine body 7, and the both sides fixed mounting of dust absorption machine body 7 has dust absorption pipe 8, and the right side fixed connection of dust absorption pipe 8 has intercepting screen cover 9, the telescopic subassembly includes fixed cylinder 15, the inside movable joint of fixed cylinder 15 has movable plate 16, the rear fixed mounting of movable plate 16 has clamping rod 17, the front fixed connection of movable plate 16 has telescopic link 18, and the outer wall of telescopic link 18 is equipped with strong spring 19, the slide between slide 5 and sliding slot 4 is connected, and slide 5 and pull-out box 6 are tightly attached, and pull-out box 6 and processing table 2 are detachably connected, the telescopic connection between baffle 14 and processing table 2, the fixed connection between baffle 14 and moving plate 13, and the sliding connection between moving plate 13 and fixed link 11 and moving groove 10, the outer wall of fixed link 11 is equipped with telescopic spring, and the top end fixed connection of telescopic spring moving plate 13.

[0031] By having the staff pull each telescopic rod 18 outward, the telescopic rod 18 moves the movable plate 16 outward while simultaneously squeezing the strong spring 19. This causes the movable plate 16 to move the locking rod 17 until it disengages from the processing table 2, facilitating the release of the fixed baffle 14. Next, the baffle 14 is moved downward, causing the movable plate 13 to move downward on the corresponding fixed rod 11 and movable slot 10. During the movement of the movable plate 13, the connected tension spring is squeezed, causing the baffle 14 to move downward and open the corresponding slot position on the processing table 2. The telescopic rod 18 is then manually released, allowing the rebound force of the strong spring 19 to drive the locking rod 17 connected to the movable plate 16 into the corresponding slot. This facilitates the subsequent installation of the semiconductor precision components for edge grinding on the processing table 2. After the semiconductor precision components are installed in subsequent steps, the telescopic rod 18 is manually pulled again, causing the locking rod 17 to disengage from the processing table 2 again. After the baffle 14 is moved upward, the telescopic rod 18 is released, allowing the locking rod 17 to re-insert into the corresponding slot. Inside the groove, the vacuum cleaner body 7 is activated via an external control board to shield the semiconductor precision component during subsequent edge grinding. This vacuum cleaner body 7 draws air from the pull-out box 6 through the suction pipe 8, creating a negative pressure in the pull-out box 6. Under this negative pressure, the impurities and debris generated during edge grinding on the processing table 2 are carried by the air through the perforated plate 3 into the pull-out box 6. The air in the pull-out box 6 then passes through the interception mesh 9 into the suction pipe 8 for inspection. The interception mesh 9 intercepts the impurities and debris carried in the air and stores them in the pull-out box 6. This process collects and stores the edge grinding generated on the semiconductor precision component, preventing the impurities and debris from interfering with the processing and ensuring processing quality. After the edge grinding of the semiconductor precision component is completed, the pull-out box 6 is manually pulled out, causing the pull-out box 6 to drive the slide plate 5 to slide outward in the corresponding slide groove 4. This pulls the pull-out box 6 out of the processing table 2, facilitating the unified processing and removal of the collected impurities and debris.

[0032] Example 2: The chip-removing edge grinding device for processing precision semiconductor components disclosed in this example provides the following technical details. For comprehensive grinding of the mounted and exposed edges of precision semiconductor components, please refer to the attached document. Figure 1 and attached Figure 5 - Appendix Figure 7The top of the base 1 is fixedly provided with a support frame 12, the top of the support frame 12 is provided with a servo motor body 20, the output shaft of the servo motor body 20 is provided with a clamping assembly for mounting a semiconductor precision component through a shaft coupling. The clamping assembly comprises a limiting frame 21, the inside of the left and right sides of the limiting frame 21 is provided with a movable groove 22, the inside of the limiting frame 21 is threadedly connected with a screw rod 23, the bottom of the screw rod 23 is fixedly provided with a clamping plate 24, the rear of the left and right sides of the clamping plate 24 is fixedly connected with a sliding block 25; the sliding block 25 and the movable groove 22 are movably connected, the sliding block 25 and the clamping plate 24 are tightly attached, and the bottom of the clamping plate 24 is provided with an anti-skid strip.

[0033] After the baffle 14 is moved downward to expose the machining table 2 by the staff, the semiconductor precision component that needs to be ground is placed on the limiting frame 21 manually, according to the thickness of the semiconductor precision component, the screw rod 23 is manually rotated counterclockwise, so that the screw rod 23 drives the clamping plate 24 to move downward, so that the clamping plate 24 drives the sliding block 25 to move downward in the corresponding movable groove 22 in the moving process, the stability of the movement of the clamping plate 24 is increased, after the clamping plate 24 drives the anti-skid strip to attach to the semiconductor precision component, the bolt is inserted into the limiting frame 21 through the rotating plate connected to the top of the screw rod 23 manually, so that the screw rod 23 is fixed in the limiting frame 21, so that the semiconductor precision component of different thickness specifications to be ground is fixedly installed, the flexibility and adaptability of the machining are improved, after the semiconductor precision component is installed on the machining table 2 and the baffle 14 is moved upward to block, the polishing assembly provided on the right side of the limiting frame 21 of the support frame 12 is started through the external control panel, so that the polishing assembly operates to grind the edge of the semiconductor precision component, at the same time, the servo motor body 20 is started through the external control panel, so that the output shaft of the servo motor body 20 drives the limiting frame 21 to rotate, so that the limiting frame 21 drives the installed semiconductor precision component to rotate by 300 degrees, so that the exposed edge of the semiconductor precision component can be polished comprehensively, the exposed edge of the semiconductor precision component is polished comprehensively, the adjustment time and waiting time in the machining process are reduced, and the machining efficiency is improved.

[0034] The contents not described in detail in the specification belong to the prior art known to those skilled in the art.

[0035] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A chip-removable edge grinding device for processing semiconductor precision parts, comprising a base (1), a processing table (2) fixedly installed on the top of the base (1), a hollow plate (3) fixedly connected inside the processing table (2), a sliding groove (4) symmetrically opened on the inner bottom wall of the processing table (2), and a collecting assembly for chip removal provided inside the sliding groove (4); characterized in that a moving groove (10) is opened on the front surface of the left and right sides of the processing table (2), a fixed rod (11) is fixedly installed inside the moving groove (10), a moving plate (13) is movably connected to the outer wall of the fixed rod (11), a baffle (14) is fixedly installed on the front surface of the moving plate (13), and an extension assembly for limiting is arranged on the left and right sides of the baffle (14); a support frame (12) is fixedly installed on the top of the base (1), a servo motor body (20) is arranged on the top of the support frame (12), a clamping assembly for installing semiconductor precision parts is arranged on the output shaft of the servo motor body (20) through a shaft coupling.

2. The edge grinding device for processing a semiconductor precision component capable of removing chips according to claim 1, characterized in that: The collecting assembly comprises a sliding plate (5), a pull-out box (6) is fixedly installed on the top of the sliding plate (5), a dust collection machine body (7) is arranged inside the left side of the pull-out box (6), dust collection pipes (8) are fixedly installed on the left and right sides of the dust collection machine body (7), and an intercepting mesh cover (9) is fixedly connected to the right side of the dust collection pipe (8).

3. The edge grinding device for processing a semiconductor precision component capable of removing chips according to claim 1, characterized in that: The extension assembly comprises a fixed cylinder (15), a movable plate (16) is movably connected inside the fixed cylinder (15), a clamping rod (17) is fixedly installed on the back of the movable plate (16), a telescopic rod (18) is fixedly connected to the front surface of the movable plate (16), and a strong spring (19) is sleeved on the outer wall of the telescopic rod (18).

4. The edge grinding device for processing a semiconductor precision component capable of removing chips according to claim 1, characterized in that: The clamping assembly comprises a limiting frame (21), a movable groove (22) is opened inside the left and right sides of the limiting frame (21), a screw rod (23) is screwedly connected inside the limiting frame (21), a clamping plate (24) is fixedly installed on the bottom of the screw rod (23), and sliding blocks (25) are fixedly connected to the back of the left and right sides of the clamping plate (24).

5. The edge grinding device for the semiconductor precision component according to claim 2, wherein: The sliding plate (5) and the sliding groove (4) are connected through sliding connection, the sliding plate (5) and the pull-out box (6) are tightly attached, and the pull-out box (6) and the processing table (2) are detachably connected.

6. The edge grinding device for processing a semiconductor precision component capable of removing chips according to claim 3, characterized in that: The baffle (14) and the processing table (2) are connected through telescopic connection, the baffle (14) and the moving plate (13) are fixedly connected, and the moving plate (13) is connected to the fixed rod (11) and the moving groove (10) through sliding connection. A telescopic spring is sleeved on the outer wall of the fixed rod (11), and the top end of the telescopic spring is fixedly connected to the moving plate (13).

7. The edge grinding device for semiconductor precision component according to claim 4, wherein: The sliding blocks (25) and the movable grooves (22) are movably connected, the sliding blocks (25) and the clamping plate (24) are tightly attached, and anti-skid strips are arranged on the bottom of the clamping plate (24).

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