Heat preservation device for silicon carbide ceramic green body

Abstract

The utility model discloses a heat preservation device for a silicon carbide ceramic green body, and relates to the technical field of ceramic heat preservation. The cooling device comprises a heat preservation tank, a cooling control part and a temperature display part, the cooling control part comprises a heat preservation cover, a heat conduction assembly and a heat dissipation assembly, the heat preservation cover covers the heat preservation tank, the heat conduction assembly is fixedly installed below the heat preservation cover, the heat dissipation assembly is fixedly installed above the heat preservation cover, and the heat conduction assembly is connected with the heat dissipation assembly. And the temperature display component is fixedly mounted above the heat preservation cover. Heat dissipation in the heat preservation tank is controlled by controlling heat dissipation of the heat dissipation assembly, and therefore the heat preservation duration and the cooling speed of the silicon carbide ceramic body in the heat preservation tank are controlled; the real-time temperature of the silicon carbide ceramic green body in the heat preservation tank is monitored and displayed through the temperature display component, so that an operator can conveniently observe the real-time temperature of the silicon carbide ceramic green body in the heat preservation tank, and the heat preservation duration is controlled or the cooling speed is adjusted.

Description

TECHNICAL FIELD

[0001] The utility model belongs to ceramic heat preservation technical field, especially, relate to a kind of heat preservation device for silicon carbide ceramic body. BACKGROUND

[0002] Silicon carbide ceramic has superhard, fire resistance and high temperature resistance and other advantages, and is usually used in various abrasive wheels, abrasive cloth, sandpaper and nozzle, gas turbine components, etc.;Silicon carbide ceramic body needs to be heat preserved after production to prevent physical property degradation caused by temperature fluctuation and to ensure the stability and uniformity of the body at high temperature. After the production of silicon carbide ceramic body, the temperature will decrease rapidly, which makes the surface and internal temperature of the product unable to reach the process temperature required for the next process. When heat preserving silicon carbide ceramic body, the cooling rate and heat preservation time of the ceramic cannot be adjusted according to the actual material properties and required performance. In addition, when heat preserving silicon carbide ceramic, the heat preservation time and cooling rate cannot be adjusted according to the real-time temperature, so the final quality cannot be accurately controlled.

[0003] Therefore, we provide a heat preservation device for silicon carbide ceramic body to solve the above problems. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at providing a heat preservation device for silicon carbide ceramic body, which controls the heat dissipation in the heat preservation tank by controlling the heat dissipation of the heat dissipation assembly, thereby controlling the heat preservation time and cooling rate of the silicon carbide ceramic body in the heat preservation tank. The temperature display component is installed above the heat preservation cover to monitor and display the real-time temperature of the silicon carbide ceramic body in the heat preservation tank, so that the operator can observe the real-time temperature of the silicon carbide ceramic body in the heat preservation tank, thereby controlling the heat preservation time or adjusting the cooling rate.

[0005] To solve the above technical problems, the utility model is realized by the following technical solutions:

[0006] The utility model is a heat preservation device for silicon carbide ceramic body, which includes a heat preservation tank, a cooling control component and a temperature display component. The cooling control component includes a heat preservation cover, a heat conduction assembly and a heat dissipation assembly. The heat preservation cover is above the heat preservation tank. The heat conduction assembly is fixedly installed below the heat preservation cover. The heat dissipation assembly is fixedly installed above the heat preservation cover. The heat conduction assembly is connected with the heat dissipation assembly. The temperature display component is fixedly installed above the heat preservation cover.

[0007] The utility model further sets up, the heat conduction assembly includes heat conduction copper hoop, heat conduction ring and heat conduction bowl, heat conduction copper hoop fixed mounting is in the heat preservation cover bottom, the inner ring of heat conduction copper hoop is fixed with a group of transverse heat conduction copper pipes in the circumferential array, a group of transverse heat conduction copper pipes are away from the one end of heat conduction copper hoop and are fixedly connected with heat conduction ring, the upper end circumferential array of heat conduction ring is fixed with a group of vertical heat conduction copper pipes, and vertical heat conduction copper pipe group is connected with the heat dissipation assembly of heat preservation cover upper side through heat preservation cover, and heat conduction bowl fixed mounting is in heat preservation jar, and heat conduction copper hoop lower end is pressed on the upper end face of heat conduction bowl.

[0008] The utility model further sets up, and the heat preservation cover edge two ends are respectively fixed with a handle.

[0009] The utility model further sets up, and the heat preservation jar is close to the upper end outer wall fixed with cover rim, and the circumferential array of cover rim upper side is fixed with a group of fixed keys, and the circumferential array of heat preservation cover plate surface is set up with a group of fixed key grooves, and a group of fixed keys are sleeved in each fixed key groove.

[0010] The utility model further sets up, and the heat dissipation assembly includes heat dissipation plate, heat preservation pipe sleeve and heat dissipation fan, and the lower end of heat dissipation plate is fixedly connected with the upper end of vertical heat conduction copper pipe group, and heat preservation pipe sleeve fixed mounting is on heat preservation cover plate surface and is sleeved on the outside of heat dissipation plate, and heat dissipation fan is installed on heat preservation pipe sleeve upper end pipe orifice.

[0011] The utility model further sets up, and the plate surface of heat dissipation plate is fixed with a group of radiating fins, and the radiating fin is perpendicular to the plate surface of heat dissipation plate.

[0012] The utility model further sets up, and the temperature display part includes infrared temperature sensor and digital display screen, and infrared temperature sensor is through heat preservation cover plate surface and is towards the heat preservation jar of downwards, and digital display screen fixed mounting is on heat preservation cover upper end, and infrared temperature sensor is connected with the signal input end signal of digital display screen through data line.

[0013] The utility model has the advantages of following:

[0014] 1, the utility model discloses through the cover connection cooling control part on heat preservation jar top, the heat preservation cover of cooling control part is covered on heat preservation jar, and installs heat dissipation assembly and heat conduction assembly respectively on the both ends of heat preservation cover, and heat conduction assembly transfers the temperature of silicon carbide ceramic body in heat preservation jar to heat dissipation assembly, controls the heat dissipation of heat preservation jar in through the start of control heat dissipation fan, thereby controls the heat preservation duration and cooling rate of silicon carbide ceramic body in heat preservation jar.

[0015] 2, the utility model discloses through installing temperature display part on heat preservation cover top, and temperature display part real-time temperature monitoring and display in silicon carbide ceramic body in heat preservation jar, and the real-time temperature of silicon carbide ceramic body in heat preservation jar can be observed by operator, thereby controls heat preservation duration or adjusts cooling rate.

[0016] Of course, any product implementing the present application does not necessarily need to achieve all the advantages mentioned above simultaneously. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed for the description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some of the embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 It is a structural exploded view of a heat preservation device for a silicon carbide ceramic body.

[0019] Figure 2 It is an exploded schematic view of the heat preservation cover and the heat conducting assembly.

[0020] Figure 3 It is a side sectional view of the present application.

[0021] Figure 4 It is a structural exploded view of the cooling control component.

[0022] Figure 5 It is a structural exploded view of the cooling control component and the temperature display component.

[0023] In the drawings, the component list represented by each reference numeral is as follows:

[0024] 1-heat preservation tank, 101-heat conducting bowl, 102-cover rim, 102a-fixing key, 2-cooling control component, 201-heat preservation cover, 201a-handle, 201b-fixing key slot, 202-heat conducting assembly, 202a-heat conducting copper hoop, 202a-1-horizontal heat conducting copper pipe, 202b-heat conducting ring, 202b-1-vertical heat conducting copper pipe, 202c-heat conducting bowl, 203-radiating assembly, 203a-radiating plate, 203a-1-radiating fin, 203b-heat preservation pipe sleeve, 203c-radiating fan, 3-temperature display component, 301-infrared temperature sensor, 302-digital display screen. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] Embodiment 1

[0027] Please refer toFigures 1 to 3 The utility model discloses a kind of heat preservation devices for silicon carbide ceramic body, including heat preservation tank 1, cooling control component 2 and temperature display component 3, cooling control component 2 includes heat preservation cover 201, heat conducting assembly 202 and heat dissipation assembly 203, by covering heat preservation tank 1 on top with cooling control component 2, heat preservation cover 201 in cooling control component 2 is covered on heat preservation tank 1, heat dissipation assembly 203 and heat conducting assembly 202 are respectively installed on the both ends of heat preservation cover 201, heat conducting assembly 202 transmits the temperature of silicon carbide ceramic body in heat preservation tank 1 to heat dissipation assembly 203, the heat dissipation of heat preservation tank 1 is controlled by controlling the start of heat dissipation fan 203c, to control the heat preservation duration and cooling rate of silicon carbide ceramic body in heat preservation tank 1;By installing temperature display component 3 on heat preservation cover 201, temperature display component 3 monitors and shows the real-time temperature of silicon carbide ceramic body in heat preservation tank, so that operating personnel can observe the real-time temperature of silicon carbide ceramic body in heat preservation tank, to control heat preservation duration or adjust cooling rate.

[0028] Specifically, heat preservation cover 201 is covered on top of heat preservation tank 1, heat conducting assembly 202 is fixedly installed below heat preservation cover 201, heat dissipation assembly 203 is fixedly installed above heat preservation cover 201, heat conducting assembly 202 is connected with heat dissipation assembly 203, and temperature display component 3 is fixedly installed above heat preservation cover 201.

[0029] Further, heat conducting assembly 202 includes heat conducting copper hoop 202a, heat conducting ring 202b and heat conducting bowl 202c, heat conducting copper hoop 202a is fixedly installed at the bottom of heat preservation cover 201, a group of transverse heat conducting copper pipes 202a-1 are circumferentially arranged and fixed in the inner circle of heat conducting copper hoop 202a, one end of the group of transverse heat conducting copper pipes 202a-1 away from heat conducting copper hoop 202a is fixedly connected with heat conducting ring 202b, a group of vertical heat conducting copper pipes 202b-1 are circumferentially arranged and fixed at the upper end of heat conducting ring 202b, the group of vertical heat conducting copper pipes 202b-1 penetrates through heat preservation cover 201 and is connected with heat dissipation assembly 203 above heat preservation cover 201, heat conducting bowl 202c is fixedly installed in heat preservation tank 1, the lower end of heat conducting copper hoop 202a is pressed on the upper end surface of heat conducting bowl 202c, heat conducting bowl 202c transmits the temperature of silicon carbide ceramic body to heat conducting copper hoop 202a, and then heat conducting copper hoop 202a transmits heat to heat conducting ring 202b through transverse heat conducting copper pipes 202a-1, and finally the heat is transmitted to heat dissipation assembly 203 by vertical heat conducting copper pipes 202b-1.

[0030] Further, a handle 201a is fixedly arranged at each end of the edge of heat preservation cover 201, for opening heat preservation cover 201.

[0031] Further, the heat preservation tank 1 is fixedly provided with a cover rim 102 close to the upper end outer wall, a group of fixed keys 102a are fixedly arranged on the cover rim 102 in a circumferential array, a group of fixed key grooves 201b are arranged on the plate surface of the heat preservation cover 201 in a circumferential array, and the fixed keys 102a are sleeved in the fixed key grooves 201b, so that the heat preservation cover 201 is not moved when being covered on the heat preservation tank 1.

[0032] The operation process of the embodiment is as follows:

[0033] The silicon carbide ceramic body 1 is placed in the heat conduction pot 202c, and the heat preservation cover 201 is covered on the heat preservation tank 1. The heat of the silicon carbide ceramic body is transmitted to the heat conduction assembly 202 through the heat conduction pot 202c, the heat is transmitted to the heat dissipation assembly by the heat conduction assembly, the temperature of the silicon carbide ceramic body displayed by the temperature display component 3 on the heat preservation cover 201 is observed, and then the heat dissipation speed of the heat dissipation assembly is controlled to control the cooling speed and the heat preservation time of the silicon carbide ceramic body in the heat preservation tank 1.

[0034] Embodiment 2

[0035] Please refer to Figures 1 to 5 On the basis of embodiment 1, the heat dissipation assembly 203 includes a heat dissipation plate 203a, a heat preservation pipe sleeve 203b and a heat dissipation fan 203c. The heat on the heat dissipation plate 203a is dissipated by controlling the heat dissipation fan 203c, so as to control the cooling speed of the silicon carbide ceramic body in the heat preservation tank 1.

[0036] Specifically, the lower end of the heat dissipation plate 203a is fixedly connected with the upper end of the group of vertical heat conduction copper pipes 202b-1, the heat preservation pipe sleeve 203b is fixedly installed on the plate surface of the heat preservation cover 201 and sleeved outside the heat dissipation plate 203a, and the heat dissipation fan 203c is installed on the upper end pipe opening of the heat preservation pipe sleeve 203b.

[0037] Further, a group of heat dissipation fins 203a-1 are fixedly arranged on the plate surface of the heat dissipation plate 203a, and the heat dissipation fins 203a-1 are perpendicular to the plate surface of the heat dissipation plate 203a, so as to facilitate heat dissipation.

[0038] Further, the temperature display component 3 includes an infrared temperature sensor 301 and a digital display screen 302. The infrared temperature sensor 301 penetrates the plate surface of the heat preservation cover 201 and faces the heat preservation tank 1 below, and the digital display screen 302 is fixedly installed on the upper end of the heat preservation cover 201. The infrared temperature sensor 301 is signal connected with the signal input end of the digital display screen 302 through a data line. The infrared temperature sensor 301 monitors the silicon carbide ceramic body in the heat preservation tank 1 and transmits the temperature data to the digital display screen 302 for the operator to observe.

[0039] The operation process of the embodiment is as follows:

[0040] The heat conducting assembly 202 transmits the heat of the silicon carbide ceramic body to the heat dissipation plate 203a in the heat dissipation assembly, and is stored through the heat preservation pipe sleeve 203b, the temperature displayed on the digital display screen 302 is observed to adjust the cooling speed and control the heat preservation time, when the silicon carbide ceramic body needs to be cooled, the heat on the heat dissipation fin 203a-1 is transmitted out by opening the heat dissipation fan 203c, so that the silicon carbide ceramic body is cooled.

[0041] In the description of the present specification, the description referring to the terms "one embodiment", "an example", "a specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A holding device for a silicon carbide ceramic green body, characterized by: The application relates to a temperature display device for a heat preservation tank, which comprises a heat preservation tank (1), a temperature drop control component (2) and a temperature display component (3), wherein the temperature drop control component (2) comprises a heat preservation cover (201), a heat conduction assembly (202) and a heat dissipation assembly (203), the heat preservation cover (201) covers the heat preservation tank (1), the heat conduction assembly (202) is fixedly installed below the heat preservation cover (201), the heat dissipation assembly (203) is fixedly installed above the heat preservation cover (201), the heat conduction assembly (202) is connected with the heat dissipation assembly (203), and the temperature display component (3) is fixedly installed above the heat preservation cover (201).

2. A holding device for a silicon carbide ceramic green body according to claim 1, characterized in that The heat conduction assembly (202) comprises a heat conduction copper hoop (202a), a heat conduction ring (202b) and a heat conduction bowl (202c), the heat conduction copper hoop (202a) is fixedly installed at the bottom of the heat preservation cover (201), a group of transverse heat conduction copper pipes (202a-1) are circumferentially arranged in the inner ring of the heat conduction copper hoop (202a) and are fixedly arranged, one end of the group of transverse heat conduction copper pipes (202a-1) is fixedly connected with the heat conduction ring (202b) and is away from the heat conduction copper hoop (202a), a group of vertical heat conduction copper pipes (202b-1) are circumferentially arranged at the upper end of the heat conduction ring (202b) and are fixedly arranged, the group of vertical heat conduction copper pipes (202b-1) penetrates the heat preservation cover (201) and is connected with the heat dissipation assembly (203) above the heat preservation cover (201), the heat conduction bowl (202c) is fixedly installed in the heat preservation tank (1), and the lower end of the heat conduction copper hoop (202a) is pressed on the upper end face of the heat conduction bowl (202c).

3. A holding device for a silicon carbide ceramic body according to claim 2, characterized in that Two handles (201a) are fixedly arranged at the edges of the heat preservation cover (201).

4. A holding device for a silicon carbide ceramic body according to claim 3, characterized in that A cover rim (102) is fixedly arranged on the outer wall close to the upper end of the heat preservation tank (1), a group of fixed keys (102a) are circumferentially arranged above the cover rim (102) and are fixedly arranged, a group of fixed key grooves (201b) are circumferentially arranged on the plate surface of the heat preservation cover (201) and are arranged, and the group of fixed keys (102a) are sleeved in the fixed key grooves (201b).

5. A holding device for a silicon carbide ceramic body according to claim 1, characterized in that The heat dissipation assembly (203) comprises a heat dissipation plate (203a), a heat preservation pipe sleeve (203b) and a heat dissipation fan (203c), the lower end of the heat dissipation plate (203a) is fixedly connected with the upper end of the group of vertical heat conduction copper pipes (202b-1), the heat preservation pipe sleeve (203b) is fixedly installed on the plate surface of the heat preservation cover (201) and is sleeved outside the heat dissipation plate (203a), and the heat dissipation fan (203c) is installed on the upper end of the heat preservation pipe sleeve (203b).

6. A holding device for a silicon carbide ceramic body according to claim 5, characterized in that A group of heat dissipation fins (203a-1) are fixedly arranged above the plate surface of the heat dissipation plate (203a) and are perpendicular to the plate surface of the heat dissipation plate (203a).

7. A holding device for a silicon carbide ceramic body according to claim 6, characterized in that The temperature display component (3) comprises an infrared temperature sensor (301) and a digital display screen (302), the infrared temperature sensor (301) penetrates through the board surface of the heat preservation cover (201) and faces the heat preservation tank (1) below, the digital display screen (302) is fixedly installed on the upper end of the heat preservation cover (201), and the infrared temperature sensor (301) is signal connected with the signal input end of the digital display screen (302) through a data line.

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