Miniaturized TO packaging structure for MEMS chip

Abstract

The utility model relates to the technical field of chip packaging, and discloses a miniaturized TO packaging structure for an MEMS chip, which comprises a wafer, the bottom of the wafer is fixedly connected with a shell, the left side and the right side of the wafer are fixedly connected with a plurality of conducting sheets at equal intervals, the tail ends of the bottoms of the conducting sheets are fixedly connected with wires, and the conducting sheets are fixedly connected with the shell. Connecting columns are fixedly connected to the bottoms of the multiple wires, multiple springs are fixedly connected to the tops of the outer walls of the multiple connecting columns at equal intervals, gaskets are installed at the tops of the multiple connecting columns, and a conduction heat dissipation mechanism is installed at the top of the shell; the conduction heat dissipation mechanism is used for rapidly conducting heat of the miniaturized TO packaging structure of the MEMS chip. According to the utility model, the corresponding number of connecting columns are installed under the housing according to the number of the pins of the wafer, the wafer is connected with the connecting columns through the conduction sheets and the wires, and when external equipment vibrates, the vibration conducted through the connecting columns is relieved through the springs and the gaskets.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field especially relates to a miniaturized TO packaging structure for MEMS chip. BACKGROUND

[0002] TO packaging structure is a common electronic component packaging form, initially mainly used for transistor packaging, later also widely used in diode and integrated circuit electronic components, it is made of metal or ceramic material, appearance is mostly circular or rectangular, has a specific number of pins.

[0003] Through the retrieval, the patent of China announcement number for: CN216472226U, a miniaturized TO packaging structure is disclosed, including TO sealing piece, gasket and chip, specifically, TO sealing piece is provided with the electric lead wire of the communication inside and outside circuit;The gasket is set in the TO sealing piece, and the gasket electrode is arranged on the gasket and is electrically connected with the electric lead wire;Chip is arranged on the gasket, and the driving electrode of chip is electrically connected with the gasket electrode, and the driving electrode, gasket electrode and electric lead wire form the electric path in vertical direction, the utility model discloses a special design gasket and specific structure design, eliminate the influence of TO pipe base electric lead wire size to TO diameter, make TO minimum diameter mainly determine the MEMS chip size, achieve the purpose of miniaturized packaging, and the pin of the existing miniaturized TO packaging structure for MEMS wafer is connected with the packaging structure by direct welding, and this fixing mode can be conducted to the chip through the pin when the external equipment produces the vibration, thereby leading to the problem of poor contact or damage of chip. UTILITARIAN CONTENT

[0004] In order to make up for the above shortcomings, the utility model provides a miniaturized TO packaging structure for MEMS chip, aims at improving the problem that the fixing mode in the prior art can be conducted to the chip through the pin when the external equipment produces the vibration, thereby leading to the problem of poor contact or damage of chip.

[0005] In order to achieve the above object, the utility model adopts the following technical scheme: a miniaturized TO packaging structure for MEMS chip, including wafer, the bottom of the wafer is fixedly connected with the shell, the left and right sides of the wafer are equidistantly fixedly connected with a plurality of conducting sheets, the bottom ends of a plurality of the conducting sheets are fixedly connected with wires, the bottoms of a plurality of the wires are fixedly connected with connecting columns, the outer wall top of a plurality of the connecting columns is equidistantly fixedly connected with a plurality of springs, the top of a plurality of the connecting columns is installed with the gasket, the top of the shell is installed with the conducting heat dissipation mechanism, the conducting heat dissipation mechanism is used for quickly conducting the heat of the miniaturized TO packaging structure for MEMS chip.

[0006] Through the technical scheme, the wafer is fixed in the shell, then corresponding holes are opened under the shell according to the number of wafer pins, then a layer of gasket is padded in the holes, then a circle of springs is fixed, then the upper ends of the connecting columns are fixed in the middle of the springs, then corresponding numbers of conducting sheets are fixed outside the wafer pins, and the conducting sheets are connected with the corresponding connecting columns through corresponding numbers of wires, so that the vibration of the external equipment is relieved through the springs and the gaskets when the external equipment vibrates.

[0007] Further description is made to the technical scheme:

[0008] The conducting and heat dissipating mechanism comprises a clamping groove, which is opened in the top of the shell, and a ceramic plate is fixedly connected to the inner side of the clamping groove, a plurality of round holes are equidistantly opened in the top of the ceramic plate, a plurality of fine meshes are fixedly connected to the inner sides of the round holes, heat-conducting silicone grease is arranged on the inner sides of the fine meshes, and a leakage-proof film is fixedly connected to the bottom of the ceramic plate.

[0009] Through the technical scheme, the ceramic plate is fixed through the clamping groove, the heat conduction of the miniaturized TO packaging structure for the MEMS chip is improved through the ceramic plate, the round holes are opened in the ceramic plate to accommodate the heat-conducting silicone grease, the heat dissipation speed of the miniaturized TO packaging structure for the MEMS chip is further accelerated through the heat-conducting silicone grease, the fine meshes attached to the round holes can avoid the adhesion of the heat-conducting silicone grease, and the leakage-proof film fixed under the ceramic plate can avoid the leakage of the heat-conducting silicone grease.

[0010] Further description is made to the technical scheme:

[0011] A plurality of insertion grooves are equidistantly opened in the middle of the top wall of the ceramic plate, and a plurality of heat dissipation fins are fixedly connected to the top of the insertion grooves.

[0012] Through the technical scheme, the heat dissipation fins fixed through the insertion grooves can accelerate the heat dissipation speed of the ceramic plate.

[0013] Further description is made to the technical scheme:

[0014] Protective plates are mounted on the left and right sides of the shell, and screws are threadedly connected to the top of the front and rear sides of the two protective plates.

[0015] Through the technical scheme, the protective plates fixed outside the shell through the screws can provide convenience when the miniaturized TO packaging structure for the MEMS chip is picked up.

[0016] Further description is made to the technical scheme:

[0017] A plurality of ring grooves are equidistantly opened in the top of the shell, and a plurality of limiting sheets are fixedly connected to the inner sides of the ring grooves.

[0018] Through the technical scheme, the limiting piece fixed in the ring groove can limit the position of the connecting column.

[0019] Further description is made to the technical scheme:

[0020] The front and rear sides of the shell are equidistantly provided with a plurality of fixing grooves, and the inner sides of the plurality of fixing grooves are fixedly connected with connecting pieces.

[0021] Through the technical scheme, the shell can be connected with more external devices through the connecting pieces installed in the fixing grooves.

[0022] Further description is made to the technical scheme:

[0023] The right side of the wafer is provided with a signboard, and the left and right sides of the signboard are fixedly connected with drawing pins.

[0024] Through the technical scheme, the information of the wafer is marked on the signboard through the drawing pins.

[0025] Further description is made to the technical scheme:

[0026] The top four corners of the shell are fixedly connected with glass rods, and the tops of the plurality of glass rods are fixedly connected with glass plates.

[0027] Through the technical scheme, the glass plates fixed on the shell through the glass rods can avoid dust falling on the heat dissipation fins.

[0028] The utility model has the advantages of:

[0029] 1. In the utility model, a corresponding number of connecting columns are installed under the shell according to the number of wafer pins, the wafer is connected with the connecting columns through the conducting piece and the wire, and when the external device vibrates, the vibration conducted through the connecting column is relieved through the spring and the gasket, so that the effect of relieving the vibration of the TO packaging structure is realized, and the probability of poor contact or damage of the chip caused by vibration is reduced.

[0030] 2. In the utility model, the ceramic plate fixed in the clamping groove is used to improve the heat conduction of the TO packaging structure, the heat-conducting silicone grease fixed in the round hole can accelerate the heat dissipation speed of the TO packaging structure, the fine mesh cloth facilitates the replacement of the heat-conducting silicone grease in the later period, and the leakage-proof film can avoid the leakage of the heat-conducting silicone grease, so that the effect of accelerating the heat conduction of the miniaturized TO packaging structure for MEMS chip is realized. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A perspective view of a miniaturized TO packaging structure for MEMS chip is provided.

[0032] Figure 2 A partial structure sectional view of a miniaturized TO packaging structure for a MEMS chip is provided in the present application;

[0033] Figure 3 A partial structure sectional view of a miniaturized TO packaging structure for a MEMS chip is provided in the present application; Figure 2 An enlarged view of A in the middle;

[0034] Figure 4 A split view of a conduction heat dissipation mechanism of a miniaturized TO packaging structure for a MEMS chip is provided in the present application;

[0035] Figure 5 A partial structure sectional view of a miniaturized TO packaging structure for a MEMS chip is provided in the present application.

[0036] Legend:

[0037] 1, wafer; 2, conduction heat dissipation mechanism; 201, clamping groove; 202, ceramic plate; 203, round hole; 204, fine mesh cloth; 205, heat-conducting silicone grease; 206, leakage-proof film; 3, shell; 4, conduction sheet; 5, wire; 6, connecting column; 7, spring; 8, gasket; 9, insertion slot; 10, heat dissipation sheet; 11, protective plate; 12, screw; 13, ring groove; 14, limiting sheet; 15, fixing groove; 16, connecting sheet; 17, signboard; 18, drawing pin; 19, glass rod; 20, glass plate. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0039] Reference Figure 2 , Figure 3 and Figure 5The utility model provides a kind of small TO package structure for MEMS chip, including wafer 1, the bottom of wafer 1 is fixedly connected with shell 3, wafer 1 left and right side equidistance fixedly connected with multiple conducting sheets 4, the bottom end of multiple conducting sheets 4 is fixedly connected with wire 5, the bottom of multiple wire 5 is fixedly connected with connecting column 6, wafer 1 is connected with connecting column 6 by conducting sheet 4 and wire 5, the outer wall top of multiple connecting column 6 is equidistance fixedly connected with multiple springs 7, the top of multiple connecting column 6 is equipped with gasket 8, spring 7 and gasket 8 are used to absorb the vibration of connecting column 6 transmission, the top of shell 3 is equipped with conducting heat dissipation mechanism 2, conducting heat dissipation mechanism 2 is used to quickly conduct the heat of small TO package structure for MEMS chip, the left and right sides of shell 3 are equipped with guard plate 11, the top of two guard plates 11 is fixedly connected with screw 12, screw 12 is used to fix guard plate 11, the top of shell 3 is equidistance provided with multiple ring grooves 13, the inner side of multiple ring grooves 13 is fixedly connected with limit sheet 14, ring groove 13 is used to fix limit sheet 14;

[0040] Specifically, wafer 1 is fixed into shell 3, then according to the number of wafer 1 pin, a corresponding hole is opened under shell 3, then a layer of gasket 8 is placed in it, then a circle of spring 7 is fixed, then the upper end of connecting column 6 is fixed in multiple springs 7, then a corresponding number of conducting sheets 4 are fixed outside the pins of wafer 1, and then the conducting sheets 4 are connected to the corresponding connecting columns 6 through a corresponding number of wires 5. When the external device vibrates, the vibration conducted by the connecting column 6 is alleviated by the spring 7 and the gasket 8, thereby achieving the effect of alleviating the vibration of the small TO package structure for MEMS chip. The guard plate 11 fixed on the shell 3 by the screw 12 can provide convenience when picking up the small TO package structure for MEMS chip. The limit sheet 14 fixed in the ring groove 13 can limit the position of the connecting column 6.

[0041] Referring to Figure 4 Conducting heat dissipation mechanism 2 includes a clamping groove 201, which is provided on the top of the shell 3. A ceramic plate 202 is fixedly connected to the inner side of the clamping groove 201. The clamping groove 201 is used to fix the ceramic plate 202. A plurality of circular holes 203 are equidistantly provided on the top of the ceramic plate 202. A plurality of fine mesh cloths 204 are fixedly connected to the inner side of the circular holes 203. A heat-conducting silicone grease 205 is provided on the inner side of the fine mesh cloth 204. The circular holes 203 and the fine mesh cloth 204 are used to fix the heat-conducting silicone grease 205. A leak-proof film 206 is fixedly connected to the bottom of the ceramic plate 202. The leak-proof film 206 is used to prevent the heat-conducting silicone grease 205 from leaking. A plurality of insertion slots 9 are equidistantly provided in the middle of the top wall of the ceramic plate 202. A plurality of heat dissipation fins 10 are fixedly connected to the top of the insertion slots 9. The insertion slots 9 are used to fix the heat dissipation fins 10.

[0042] Specifically, the ceramic plate 202 is fixed through the clamping groove 201, the ceramic plate 202 improves the heat conduction of the miniaturized TO package structure for the MEMS chip, the ceramic plate 202 is provided with a round hole 203 for accommodating the heat-conducting silicone grease 205, the heat-conducting silicone grease 205 further accelerates the heat dissipation speed of the miniaturized TO package structure for the MEMS chip, the fine mesh cloth 204 attached in the round hole 203 can prevent the heat-conducting silicone grease 205 from sticking and facilitate the replacement of the heat-conducting silicone grease 205, the leakage-proof film 206 fixed under the ceramic plate 202 can prevent the leakage of the heat-conducting silicone grease 205, and the heat sink 10 fixed through the insertion slot 9 can accelerate the heat dissipation speed of the ceramic plate 202.

[0043] With reference to Figure 1 And Figure 3 A plurality of fixing grooves 15 are equidistantly arranged on the front and back sides of the shell 3, and the inner sides of the plurality of fixing grooves 15 are fixedly connected with connecting plates 16, the fixing grooves 15 are used for fixing the connecting plates 16, the right side of the wafer 1 is provided with a signboard 17, the left and right sides of the signboard 17 are fixedly connected with drawing pins 18, the drawing pins 18 are used for fixing the signboard 17, the top four corners of the shell 3 are fixedly connected with glass rods 19, the tops of the plurality of glass rods 19 are fixedly connected with glass plates 20, and the glass rods 19 are used for fixing the glass plates 20.

[0044] Specifically, the shell 3 can be connected with external devices through the connecting plates 16 installed in the fixing grooves 15, the information of the wafer 1 is marked on the signboard 17 fixed through the drawing pins 18, and the glass plates 20 fixed on the shell 3 through the glass rods 19 can prevent the heat sink 10 from being dusty.

[0045] Working principle: when the TO package of the MEMS chip is miniaturized, the wafer 1 is first fixed into the shell 3, then the corresponding holes are arranged under the shell 3 according to the number of the pins of the wafer 1, then a layer of gaskets 8 is padded in the holes, then a circle of springs 7 is fixed, then the upper ends of the connecting columns 6 are fixed in the middle of the plurality of springs 7, then the corresponding number of conducting plates 4 are fixed outside the pins of the wafer 1, and then the conducting plates 4 are connected with the corresponding connecting columns 6 through the corresponding number of wires 5, when the external device vibrates, the vibration conducted through the connecting columns 6 is relieved through the springs 7 and the gaskets 8, so as to realize the effect of relieving the vibration of the miniaturized TO package structure for the MEMS chip, and reduce the probability of poor contact or damage of the chip caused by vibration;

[0046] A clamping groove 201 is formed on the top of the miniaturized TO packaging structure for MEMS chip, the ceramic plate 202 is fixed through the clamping groove 201, the heat conduction of the miniaturized TO packaging structure for MEMS chip is improved through the ceramic plate 202, a round hole 203 is formed on the ceramic plate 202 for accommodating the heat-conducting silicone grease 205, the heat dissipation speed of the miniaturized TO packaging structure for MEMS chip is further accelerated through the heat-conducting silicone grease 205, the fine mesh cloth 204 attached in the round hole 203 can avoid the heat-conducting silicone grease 205 from sticking, and the heat-conducting silicone grease 205 is convenient to replace later, the leakage-proof film 206 fixed under the ceramic plate 202 can avoid the heat-conducting silicone grease 205 from leaking, so that the effect of heat accelerated conduction of the miniaturized TO packaging structure for MEMS chip is realized.

[0047] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the foregoing detailed description of the present application is made with reference to the foregoing embodiments, for the skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of the present application.

Claims

1. A miniaturized TO package structure for a MEMS chip comprising a wafer (1), characterized in that: The bottom of the wafer (1) is fixedly connected with a shell (3), the left and right sides of the wafer (1) are fixedly connected with a plurality of conducting sheets (4) at equal intervals, the bottom ends of the plurality of conducting sheets (4) are fixedly connected with wires (5), the bottoms of the plurality of wires (5) are fixedly connected with connecting columns (6), the outer walls of the plurality of connecting columns (6) are fixedly connected with a plurality of springs (7) at equal intervals at the top, the tops of the plurality of connecting columns (6) are all mounted with gaskets (8), the top of the shell (3) is mounted with a conducting heat dissipation mechanism (2), which is used for quickly conducting the heat of the miniaturized TO package structure of the MEMS chip.

2. The miniaturized TO package structure for a MEMS chip according to claim 1, characterized in that: The conducting heat dissipation mechanism (2) comprises a clamping groove (201) which is formed in the top of the shell (3), and a ceramic plate (202) is fixedly connected to the inner side of the clamping groove (201), a plurality of round holes (203) are formed in the top of the ceramic plate (202) at equal intervals, a plurality of fine mesh cloths (204) are fixedly connected to the inner sides of the plurality of round holes (203), heat-conducting silicone grease (205) is arranged on the inner sides of the plurality of fine mesh cloths (204), and a leakage-proof film (206) is fixedly connected to the bottom of the ceramic plate (202).

3. The miniaturized TO package structure for a MEMS chip according to claim 2, characterized in that: A plurality of insertion grooves (9) are formed in the top wall of the ceramic plate (202) at equal intervals, and heat dissipation fins (10) are fixedly connected to the tops of the plurality of insertion grooves (9).

4. The miniaturized TO package structure for a MEMS chip according to claim 1, characterized in that: Protective plates (11) are mounted on the left and right sides of the shell (3), and screws (12) are threadedly connected to the top front and back sides of the two protective plates (11).

5. The miniaturized TO package structure for a MEMS chip according to claim 1, characterized in that: A plurality of ring grooves (13) are formed in the top of the shell (3) at equal intervals, and limiting sheets (14) are fixedly connected to the inner sides of the plurality of ring grooves (13).

6. The miniaturized TO package structure for a MEMS chip according to claim 1, characterized in that: A plurality of fixing grooves (15) are formed in the front and back sides of the shell (3) at equal intervals, and connecting sheets (16) are fixedly connected to the inner sides of the plurality of fixing grooves (15).

7. The miniaturized TO package structure for a MEMS chip according to claim 1, characterized in that: An identification board (17) is mounted on the right side of the wafer (1), and drawing pins (18) are fixedly connected to the left and right sides of the identification board (17).

8. The miniaturized TO package structure for a MEMS chip according to claim 1, characterized in that: Glass rods (19) are fixedly connected to the four corners of the top of the shell (3), and glass plates (20) are fixedly connected to the tops of the plurality of glass rods (19).

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