Heat dissipation device suitable for circuit board

Abstract

The utility model relates to a heat dissipation device suitable for a circuit board, which comprises a base, the base comprises a first surface and a second surface which are oppositely arranged, the second surface of the base is provided with a plurality of heat dissipation fins, the heat dissipation fins are of symmetrical stepped structures, the heights of the heat dissipation fins are sequentially reduced in a stepped mode from the middle to the two sides, and the height of the heat dissipation fins is larger than that of the first surface. A plurality of heat dissipation grooves are formed in the end faces of the ends, away from the base, of the heat dissipation fins at intervals, a plurality of heat dissipation holes are formed in the second surface of the base and distributed in the intervals of the heat dissipation fins, and a plurality of copper pipes are installed in the base in an embedded mode and distributed in parallel. The LED lamp can effectively reduce consumption of heat dissipation materials, and has the advantages of being low in cost, good in heat dissipation effect and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board technical field, specifically, relate to a heat abstractor suitable for circuit board. BACKGROUND

[0002] With the development of the times, electronic component castings develop towards the direction of multifunction and large capacity, accordingly, the wiring density of circuit boards is higher and higher, and the heat generated on the circuit board also greatly increases, if the generated heat cannot be dissipated from the circuit board in time, heat accumulation occurs, which easily causes the temperature of the circuit board or electronic component to be too high, affecting its performance, and in severe cases, the circuit board and electronic component can even be burnt out.

[0003] At present, most of the circuit board heat abstractors are usually provided with a plurality of parallel heat dissipation fins, which mainly increase the height and width of all the heat dissipation fins or increase the number of the heat dissipation fins to improve the overall heat dissipation effect, but due to the different wiring densities of various parts on the circuit board, the heat generated by each part is also different, and under normal circumstances, the temperature of the center of the circuit board is always higher than that of the edge part, and the existing heat dissipation device cannot dissipate heat for each part of the circuit board, the utilization rate of the heat dissipation fins is low, and the manufacturing material consumption of the heat dissipation fins is large, and the cost is high. SUMMARY

[0004] Therefore, the utility model provides a circuit board heat abstractor with low cost and good heat dissipation effect.

[0005] A heat abstractor suitable for a circuit board, comprising a base, the base comprising a first surface and a second surface arranged oppositely, a plurality of heat dissipation fins are arranged on the second surface of the base, the heat dissipation fins are symmetrical stepped structures, the height of the heat dissipation fins decreases in steps from the middle to both sides, a plurality of heat dissipation grooves are arranged on the end face of the heat dissipation fins away from the base, a plurality of heat dissipation holes are opened on the second surface of the base, the heat dissipation holes are distributed in the intervals of the heat dissipation fins, a plurality of copper pipes are embedded and installed in the base, and the copper pipes are distributed in parallel.

[0006] In the above technical solution, when cooperating with the circuit board, the base is installed at the bottom of the circuit board, the first surface of the base is in contact with the bottom surface of the circuit board, so as to conduct heat on the circuit board to the base and the heat dissipation fins, wherein generally the circuit density of the middle part of the circuit board is higher than that of the edge, so when the circuit board works, heat is more likely to accumulate in the middle part of the circuit board, and the temperature of the part closer to the middle part of the circuit board is higher, therefore, the heat dissipation fins are arranged in a stepped structure with high middle and low edges, the middle part has the highest height and can have a larger surface area, so as to improve the heat dissipation speed and help quickly dissipate the heat accumulated in the center part of the circuit board, since the heat generated by other parts of the circuit board is relatively small, the height of the heat dissipation fins is also relatively reduced, so that the material consumption of the heat dissipation fins can be greatly saved and the cost is reduced, in addition, the end surface of the heat dissipation fin is provided with a heat dissipation groove, which further increases the surface area of the heat dissipation fin and improves the heat dissipation effect of the heat dissipation fin while reducing the material consumption; at the same time, the base is provided with heat dissipation holes in the intervals between the heat dissipation fins, which increases the surface area without affecting the heat conduction to the heat dissipation fins, and further improves the heat dissipation speed, in addition, the base is provided with a plurality of copper pipes inside, the copper pipes have good heat conduction performance and can accelerate the heat conduction speed, so that the heat on the circuit board can be quickly conducted to the heat dissipation fins below to avoid heat accumulation.

[0007] Optionally, in an embodiment, the heat dissipation fin comprises a first heat dissipation part, a second heat dissipation part and a third heat dissipation part with heights decreasing in turn, the second heat dissipation part and the third heat dissipation part are symmetrically arranged on both sides of the first heat dissipation part,

[0008] In the above technical solution, the second heat dissipation part is located between the first heat dissipation part and the third heat dissipation part, so that the heat dissipation fin has a stepped structure with heights decreasing in turn from the middle to both sides.

[0009] Optionally, in an embodiment, a plurality of heat dissipation columns are arranged on the second surface of the base, the heat dissipation columns are arranged in the first heat dissipation part from the height direction.

[0010] In the above technical solution, the heat dissipation column and the heat dissipation fin are in an integrated structure, the height of the heat dissipation column is the same as that of the first heat dissipation part, and the heat dissipation column is used to further increase the surface area of the first heat dissipation part region and further improve the heat dissipation effect on the center part of the circuit board.

[0011] Optionally, in an embodiment, a plurality of heat dissipation columns are arranged on the second surface of the base, the heat dissipation columns are arranged in the first heat dissipation part from the height direction.

[0012] In the above technical solution, the heat dissipation column and the heat dissipation fin are in an integrated structure, the height of the heat dissipation column is the same as that of the first heat dissipation part, and the heat dissipation column is used to further increase the surface area of the first heat dissipation part region and further improve the heat dissipation effect on the center part of the circuit board.

[0013] Optionally, in an embodiment, a plurality of fixing plates are arranged on the second surface of the base in a spaced manner, the fixing plates are perpendicular to the heat dissipation fins, and the heat dissipation fins are arranged through the fixing plates.

[0014] In the technical scheme, each heat dissipation fin is arranged through the fixing plate in a perpendicular manner, the fixing plate is used for fixing the plurality of heat dissipation fins, so that the overall structural strength is improved, and the situation that the heat dissipation fins are broken due to external force is reduced.

[0015] Optionally, in an embodiment, limit plates are arranged on both sides of the first surface of the base, and clamping plates are rotatably arranged at the top ends of the limit plates.

[0016] In the technical scheme, when the circuit board is installed, the circuit board is arranged on the first surface of the base, the limit plates on both sides are used for limiting the circuit board, and the clamping plates at the top ends of the limit plates can be rotated to clamp the circuit board, so that the circuit board is kept stable.

[0017] Optionally, in an embodiment, a plurality of air holes are arranged on the limit plates.

[0018] In the technical scheme, the air holes are used for reducing the heat accumulation between the limit plates, and are helpful for heat dissipation of the circuit board.

[0019] Compared with the prior art, the application has the following beneficial effects:

[0020] According to the application, the heat dissipation fins in the stepped structure can be arranged to dissipate heat from each area of the circuit board, the utilization rate of the heat dissipation fins is improved, the material consumption for manufacturing the heat dissipation fins is reduced, and the cost is reduced;

[0021] According to the application, the heat dissipation grooves arranged on the heat dissipation fins and the plurality of heat dissipation holes arranged on the base increase the heat dissipation area, and the heat dissipation effect is further improved, so that heat accumulation is prevented.

[0022] According to the application, the copper pipe embedded in the base can accelerate the heat conduction speed, so that the heat generated on the circuit board can be conducted to the heat dissipation fins in time, heat accumulation is prevented, the temperature of the circuit board is prevented from being too high, and the reliability is high. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0024] Figure 1 Fig. 1 is a structural schematic view of a heat dissipation device according to an embodiment of the application.

[0025] Figure 2 is a side view of the heat dissipation device in Figure 1

[0026] Figure 3 is a bottom view of the heat dissipation device in Figure 1

[0027] Explanation of reference numerals in the drawings:

[0028] 1 - base; 11 - heat dissipation hole; 12 - copper pipe; 2 - heat dissipation fin; 21 - first heat dissipation part; 22 - second heat dissipation part; 23 - third heat dissipation part; 24 - heat dissipation groove; 3 - heat dissipation column; 31 - heat conduction hole; 4 - fixing sheet; 5 - limiting plate; 51 - air hole; 52 - protrusion; 6 - clamping plate. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0030] Therefore, the detailed description of the embodiments of the present application provided below in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts are within the scope of protection of the present application.

[0031] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0032] Please refer to Figures 1 to 3 In a preferred embodiment of the present application, a heat dissipation device suitable for a circuit board is provided, which comprises a base 1, the base 1 comprises a first surface and a second surface arranged oppositely, a plurality of heat dissipation fins 2 are arranged on the second surface of the base 1, the heat dissipation fins 2 are symmetrical stepped structures, the height of the heat dissipation fins 2 decreases in a stepped manner from the middle to both sides, a plurality of heat dissipation grooves 24 are arranged on the end face of the heat dissipation fins 2 away from the base 1, a plurality of heat dissipation holes 11 are opened on the second surface of the base 1, and the heat dissipation holes 11 are distributed in the intervals of the heat dissipation fins 2.

[0033] Specifically, refer to Figure 1 ​​, the first surface of the base 1 is the upper surface of the base 1, and the second surface is the lower surface of the base 1, the heat dissipation fin 2 includes a first heat dissipation part 21, a second heat dissipation part 22 and a third heat dissipation part 23 in turn from high to low, wherein the second heat dissipation part 22 and the third heat dissipation part 23 are symmetrically arranged on both sides of the first heat dissipation part 21, and the second heat dissipation part 22 is located between the first heat dissipation part 21 and the third heat dissipation part 23, and the heat dissipation fin 2 as a whole has a stepped structure with the height gradually decreasing from the middle to both sides when viewed from the front; it is worth mentioning that the base 1 and the heat dissipation fin 2 are made of the same material, both of which are graphene, and have good heat conduction and heat dissipation performance.

[0034] In the present embodiment, the heat dissipation device is installed at the bottom of the circuit board, and the first surface of the base 1 is attached to the bottom surface of the circuit board, so as to conduct the heat on the circuit board to the base 1 and the heat dissipation fin 2; generally, the circuit density of the middle part of the circuit board is higher than that of the edge, so when the circuit board is working, the heat is more likely to accumulate in the middle part of the circuit board, so the closer to the middle part of the circuit board, the more heat generated and the higher the temperature, therefore, the first heat dissipation part 21 corresponding to the middle part of the circuit board has the highest height, the largest surface area and the fastest heat dissipation speed, which can help to quickly dissipate the heat accumulated in the center part of the circuit board, and since the heat generated by other parts of the circuit board is relatively small, the height of the heat dissipation fin 2 is also relatively low, thereby effectively reducing the material consumption of the heat dissipation fin 2 and reducing the cost, in addition, the end surface of the heat dissipation fin 2 is provided with a heat dissipation groove 24, which further increases the surface area of the heat dissipation fin 2 and improves the heat dissipation effect of the heat dissipation fin 2 while reducing material consumption; the base 1 is provided with a heat dissipation hole 11 in the interval between each heat dissipation fin 2, which forms a channel for heat dissipation while increasing the surface area of the base 1, thereby further improving the heat dissipation speed, wherein the heat dissipation hole 11 is arranged in the interval between each heat dissipation fin 2 so as not to affect the heat conduction between the base 1 and the heat dissipation fin 2.

[0035] Please refer to Figures 1 to 2 In the present embodiment, a plurality of copper pipes 12 are embedded and installed in the base 1, and the plurality of copper pipes 12 are distributed in parallel, and the copper pipes 12 have good heat conduction performance, which can accelerate the heat conduction speed, so as to quickly conduct the heat on the circuit board to the heat dissipation fin 2 below, thereby avoiding heat accumulation.

[0036] It should be noted that since most of the heat on the circuit board is generated in the middle part, in order to reduce unnecessary costs, the copper pipes 12 in the present embodiment are only installed in the base 1 at positions corresponding to the first heat dissipation part 21, so as to ensure that the heat in the main heat generating area of the circuit board is quickly conducted, thereby preventing heat accumulation on the circuit board, in addition, in some embodiments, copper pipes 12 can also be additionally arranged in other parts of the base 1.

[0037] Please refer to Figure 3 In the embodiment, the second surface of the base 1 is provided with a plurality of heat dissipation columns 3, the plurality of heat dissipation columns 3 are distributed at intervals, the heat dissipation columns 3 are provided in the first heat dissipation part 21 from the height direction, wherein the heat dissipation columns 3 are of an integral structure with the heat dissipation fins 2, the height of the heat dissipation columns 3 is the same as the height of the first heat dissipation part 21, the heat dissipation columns 3 are used for further increasing the surface area of the first heat dissipation part 21 region, and further improving the heat dissipation effect on the central part of the circuit board.

[0038] Further, the center of the heat dissipation column 3 is provided with a heat conduction hole 31 penetrating along the height direction, the heat conduction hole 31 can further increase the surface area of the heat dissipation column 3, so that a large amount of heat transferred from the center of the circuit board can form a heat flow outward along the heat conduction hole 31, thereby effectively improving the speed and efficiency of heat dissipation.

[0039] Please refer to Figures 1 to 3 In the embodiment, the second surface of the base 1 is provided with a plurality of heat dissipation columns 3, the plurality of heat dissipation columns 3 are distributed at intervals, the heat dissipation columns 3 are provided in the first heat dissipation part 21 from the height direction, wherein the heat dissipation columns 3 are of an integral structure with the heat dissipation fins 2, the height of the heat dissipation columns 3 is the same as the height of the first heat dissipation part 21, the heat dissipation columns 3 are used for further increasing the surface area of the first heat dissipation part 21 region, and further improving the heat dissipation effect on the central part of the circuit board.

[0040] Please refer to Figures 1 to 2 In the embodiment, the first surface of the base 1 is provided with a limiting plate 5 on both sides, the top end of the limiting plate 5 is rotatably provided with a clamping plate 6, in the specific installation, the circuit board is placed on the first surface of the base 1, the limiting plate 5 on both sides is used for limiting the circuit board, then the clamping plate 6 at the top end of the limiting plate 5 is rotated, the edge of the circuit board is pressed tightly, the circuit board is clamped in, so that the heat dissipation device and the circuit board remain stable.

[0041] Wherein, referring to Figure 1 The front and rear ends of the limiting plate 5 are provided with protruding lugs 52, so that the front and rear ends of the limiting plate 5 form L-shaped corners, thereby limiting the circuit board in the front and rear directions.

[0042] Please refer to Figures 1 to 2 In the embodiment, the limiting plate 5 is uniformly provided with a plurality of air holes 51, the air holes 51 are used for reducing the heat accumulation between the limiting plates 5, which is helpful for the heat dissipation on the circuit board.

[0043] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

[0044] In the description of the utility model, it is understood that the terms such as '' up '' '' down '' '' front '' '' back '' '' left '' '' right '' '' vertical '' '' horizontal '' '' top '' '' bottom '' '' inside '' '' outside '' The orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0045] In addition, the terms '' first '' and '' second '' are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with '' first '' and '' second '' can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of '' multiple '' is two or more than two, unless otherwise specifically limited.

[0046] In the utility model, unless otherwise specifically defined and limited, the terms '' installation '' '' connection '' '' connection '' '' fixed '' and other terms should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; It can be mechanically connected, or it can be electrically connected; It can be directly connected, or it can be indirectly connected through an intermediate medium; It can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

Claims

1. A heat dissipating device for a circuit board, characterized by comprising: The base comprises a first surface and a second surface arranged oppositely, a plurality of fins are arranged on the second surface of the base, the fins are symmetrically stepped structures, the heights of the fins decrease step by step from the middle to the two sides, a plurality of heat dissipation grooves are arranged on the end face of the end of the fins away from the base, a plurality of heat dissipation holes are formed on the second surface of the base, the heat dissipation holes are distributed in the intervals of the fins, and a plurality of copper pipes are embedded and arranged in the base.

2. The heat dissipating device for a circuit board according to claim 1, wherein The fins comprise a first heat dissipation part, a second heat dissipation part and a third heat dissipation part with decreasing heights, and the second heat dissipation part and the third heat dissipation part are symmetrically arranged on the two sides of the first heat dissipation part.

3. The heat dissipating device for a circuit board according to claim 2, wherein A plurality of heat dissipation columns are arranged on the second surface of the base, and the heat dissipation columns are arranged in the first heat dissipation part in the height direction.

4. The heat dissipating device for a circuit board according to claim 3, wherein Heat conduction holes penetrating in the height direction are formed in the heat dissipation columns.

5. The heat dissipating device for a circuit board according to claim 1, wherein A plurality of fixing pieces are arranged on the second surface of the base at intervals, the fixing pieces are perpendicular to the fins, and the fins are arranged in the fixing pieces.

6. The heat dissipating device for a circuit board according to claim 1, wherein Limiting plates are arranged on the two sides of the first surface of the base, and clamping plates are rotatably arranged on the top ends of the limiting plates.

7. The heat dissipating device for a circuit board according to claim 6, wherein A plurality of air holes are uniformly arranged on the limiting plates.

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