Sensor circuit board with efficient heat dissipation

Abstract

The utility model belongs to the technical field of circuit board heat dissipation, and relates to an efficient heat dissipation sensor circuit board, which comprises a substrate main body, a high-heat area arranged at the top of the substrate main body, a low-heat area arranged at the top of the substrate main body, and a heat dissipation assembly arranged at the bottom of the outer side of the substrate main body. According to the utility model, the heat dissipation efficiency of the heat dissipation assembly on a high-heat area and a low-heat area is different, so that the overall temperature of the substrate main body is kept consistent in the working process, and the problem that the temperature of the substrate main body is too large due to the overlarge temperature difference on the surface of a circuit board is solved. And the temperature gradient enables the circuit board to have the conditions of welding spot cracking and substrate warping caused by thermal expansion mismatching, so that the service life of the substrate main body is further prolonged, and the working stability of the substrate main body is further improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board heat dissipation, and relates to a sensor circuit board with high heat dissipation efficiency. BACKGROUND

[0002] The sensor circuit board is a special circuit board integrating sensors and signal processing circuits, mainly converts physical quantities into electrical signals and realizes amplification, filtering and transmission of the circuit, mainly composed of sensors, signal processing circuits, substrates and other parts, and is widely used in the fields of automobile electronics and industrial monitoring.

[0003] For example, patent (CN222216261U) discloses a sensor circuit board with high heat dissipation efficiency, which is characterized in that it comprises a frame and a circuit board body mounted in the frame, the frame is provided with support strips on the opposite inner sides at the middle part for supporting the circuit board body, and the frame is provided with a plurality of ventilation grooves along the length direction of the opposite inner sides, and the two side walls of the frame without the support strips are provided with a fixing assembly for fixing the circuit board body on the support strips. Through the above structure, the circuit board body can be mounted on the frame, the air outside the frame can flow through the upper ventilation grooves and the lower ventilation grooves, the front surface of the circuit board body is cooled, and the back surface of the circuit board body is cooled through the lower ventilation grooves, so that the heat dissipation of the circuit board body is realized.

[0004] In the use of the above-mentioned technology, it is found that the existing technology has the following technical problems: in the use of the above-mentioned device, because the circuit board surface is integrated with electronic components with different functions, the functions of these electronic components are different, and the energy consumption and heat dissipation efficiency of these electronic components are also significantly different, when the circuit board is cooled without distinction, the temperature difference of the circuit board surface may be too large, and this temperature gradient may cause the circuit board to crack due to thermal expansion mismatch and the substrate to warp, resulting in reduced service life of the device. UTILITY MODEL CONTENTS

[0005] The utility model solves the technical problems: in the use of the above-mentioned device, because the circuit board surface is integrated with electronic components with different functions, the functions of these electronic components are different, and the energy consumption and heat dissipation efficiency of these electronic components are also significantly different, when the circuit board is cooled without distinction, the temperature difference of the circuit board surface may be too large, and this temperature gradient may cause the circuit board to crack due to thermal expansion mismatch and the substrate to warp, resulting in reduced service life of the device.

[0006] The utility model discloses a sensor circuit board of high -efficient heat dissipation, including substrate main part, substrate main part top is provided with high heat area, substrate main part top is provided with low heat area, substrate main body outside bottom is provided with heat dissipation subassembly, substrate main part and heat dissipation subassembly are connected through installation component.

[0007] The heat dissipation assembly includes a heat dissipation device housing, the heat dissipation device housing is located at the bottom outside the substrate main body, the heat dissipation device housing top is provided with full coverage fin near the substrate main body, the heat dissipation device housing top is provided with grid fin near the low heat area, the heat dissipation device housing inside is provided with first heat dissipation fin near the full coverage fin, the grid fin inside is provided with second heat dissipation fin near the grid fin, the heat dissipation device housing outside one end is provided with air blowing device main body.

[0008] The installation component includes a sliding block, the sliding block is provided with an inclined groove near one side of the substrate main body, the heat dissipation device housing top is fixedly connected with a fixed block near the sliding block, the fixed block is slidably connected with the sliding block inside, the sliding block is fixedly connected with a return spring on both sides of the outside, and the other end of the return spring is fixedly connected with the heat dissipation device housing.

[0009] The substrate main body is provided with a limiting groove inside, and the heat dissipation device housing outside is fixedly connected with a clamping block near the limiting groove.

[0010] The air blowing device main body is provided with a filter plate outside.

[0011] The air blowing device main body is provided with a sliding groove outside, the sliding groove is fixedly connected with a sliding column inside, the sliding groove is provided with a cleaning plate, and the sliding column is slidably connected with the cleaning plate outside.

[0012] Compared with the prior art, the utility model has the advantages that the heat dissipation efficiency of the high heat area and the low heat area is different through the heat dissipation assembly, the overall temperature of the substrate main body remains consistent during the working process, the temperature gradient caused by the large temperature difference on the surface of the circuit board causes the circuit board to expand and the solder joint to crack, and the use life and working stability of the substrate main body are further improved.

[0013] Through the use of the filter plate, when the air blowing device main body cools the heat dissipation device housing inside, the cleanliness of the air entering the heat dissipation device housing is further improved, and the influence of external impurities on the heat dissipation effect is reduced. DRAWINGS

[0014] In order to more clearly illustrate the technical scheme of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings described in the following are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0015] Figure 1 Fig. 1 is a structural schematic diagram of the substrate body of the present application.

[0016] Figure 2 Fig. 2 is a structural schematic diagram of the heat dissipation device shell of the present application.

[0017] Figure 3 Fig. 3 is a schematic diagram of the full-coverage cooling fin of the present application.

[0018] Figure 4 Fig. 4 is an enlarged view of A of Fig. 3. Figure 2

[0019] Fig. 5 is an enlarged view of B of Fig. 3. Figure 5 Figure 2 Fig. 6 is a schematic diagram of the air blowing device of the present application.

[0020] In the figure: 1, substrate body; 11, high heat area; 12, low heat area; 2, heat dissipation device shell; 21, full-coverage cooling fin; 22, grid-shaped cooling fin; 23, first cooling fin; 24, second cooling fin; 25, air blowing device body; 3, sliding block; 31, inclined groove; 32, fixed block; 33, return spring; 4, limiting groove; 41, clamping block; 5, filter plate; 6, sliding groove; 61, sliding column; 62, cleaning plate. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the present application more clear, the following will further describe the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0022] In order to make the personnel in the technical field better understand the present application scheme, the following will combine the drawings to clearly and completely describe the technical scheme in the embodiment of the present application.

[0023] It should be noted that, in the case of no conflict, the embodiments and the features and technical schemes in the embodiments in the present application can be combined with each other.

[0024] It should be noted that: similar signs and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0025] Embodiment 1: as​Figure 1 Figure 5 As shown in the figure, a high-efficiency heat dissipation sensor circuit board comprises a substrate body 1, a high-heat area 11 is arranged on the top of the substrate body 1, a low-heat area 12 is arranged on the top of the substrate body 1, a heat dissipation assembly is arranged on the bottom of the outer side of the substrate body 1, the substrate body 1 is connected with the heat dissipation assembly through a mounting assembly, the heat dissipation assembly comprises a heat dissipation device shell 2, the heat dissipation device shell 2 is located on the bottom of the outer side of the substrate body 1, full-coverage cooling fins 21 are arranged on the top of the heat dissipation device shell 2 close to the substrate body 1, grid-shaped cooling fins 22 are arranged on the top of the heat dissipation device shell 2 close to the low-heat area 12, first cooling fins 23 are arranged inside the heat dissipation device shell 2 close to the full-coverage cooling fins 21, second cooling fins 24 are arranged inside the grid-shaped cooling fins 22 close to the grid-shaped cooling fins 22, a blower device body 25 is arranged on one end of the outer side of the heat dissipation device shell 2, the mounting assembly comprises a sliding block 3, an inclined groove 31 is arranged on one side of the sliding block 3 close to the substrate body 1, a fixing block 32 is fixedly connected on the top of the heat dissipation device shell 2 close to the sliding block 3, the sliding block 3 is slidably connected inside the fixing block 32, reset springs 33 are fixedly connected on the outer sides of the sliding block 3, the other ends of the reset springs 33 are fixedly connected with the heat dissipation device shell 2, a limiting groove 4 is arranged inside the substrate body 1, a clamping block 41 is fixedly connected on the outer side of the heat dissipation device shell 2 close to the limiting groove 4, the clamping block 41 is slidably connected inside the limiting groove 4.

[0026] When working, the surface is divided into the high-heat area 11 and the low-heat area 12, then the high-heat area 11 is installed in the heat dissipation device shell 2 through the cooperation of the limiting groove 4 and the clamping block 41, when the substrate body 1 slides into the heat dissipation device shell 2, the substrate body 1 extrudes the inclined groove 31 on the end of the sliding block 3, so that the sliding block 3 starts to slide on the top of the heat dissipation device shell 2, at the same time, the fixing block 32 limits the sliding block 3, at the same time, the sliding block 3 is displaced outward, the reset springs 33 are stretched by pulling, when the substrate body 1 is completely installed in the heat dissipation device shell 2, the reset springs 33 rebound to limit the end of the substrate body 1, so as to achieve the purpose of installing the substrate body 1 on the heat dissipation device shell 2, when the substrate body 1 works, the blower device body 25 drives the substrate body 1 to dissipate heat, because the energy consumption of the high-heat area 11 is higher, the full-coverage cooling fins 21 and the first cooling fins 23 are arranged on the bottom, so as to give strong heat dissipation effect, the energy consumption of the high-heat area 11 is lower, the grid-shaped cooling fins 22 and the second cooling fins 24 are used on the bottom, so as to save the weight and cost of the heat dissipation assembly, through the difference of the heat dissipation efficiency of the heat dissipation assembly for the high-heat area 11 and the low-heat area 12, the overall temperature of the substrate body 1 is kept consistent during the working process, so as to reduce the situation that the circuit board is cracked and warped due to the large temperature difference of the surface of the circuit board and the thermal expansion mismatch caused by the temperature gradient, further increasing the service life and working stability of the substrate body 1. ​

[0027] Embodiment 2: as Figure 1 Figure 2 Figure 5 As shown in the drawings, the filter plate 5 is installed outside the air blower body 25, the air blower body 25 is provided with a sliding groove 6, the sliding groove 6 is internally fixedly connected with a sliding column 61, and the sliding groove 6 is internally installed with a cleaning plate 62, and the cleaning plate 62 is slidably connected outside the sliding column 61.

[0028] In operation, when the external air passes through the air blower body 25, the filter plate 5 filters the small particles in the air, reducing the influence of impurities in the external air on the heat dissipation efficiency, and after the filter plate 5 works for a period of time, the cleaning plate 62 is pulled to slide in the sliding groove 6 and the sliding column 61, thereby cleaning the surface of the filter plate 5 and increasing the cleanliness of the surface of the filter plate 5.

[0029] The preferred embodiments disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details and limit the utility model to the specific implementation. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the utility model, so that the person skilled in the art can well understand and use the utility model. The utility model is limited by the claims and the whole scope and equivalents thereof.​​

Claims

1. A sensor circuit board with high-efficiency heat dissipation, characterized in that: The substrate includes a substrate body (1), a high-heat area (11) is provided on the top of the substrate body (1), a low-heat area (12) is provided on the top of the substrate body (1), a heat dissipation component is provided on the bottom of the outer side of the substrate body (1), and the substrate body (1) and the heat dissipation component are connected by a mounting component.

2. The sensor circuit board with high-efficiency heat dissipation according to claim 1, characterized in that: The heat dissipation assembly includes a heat dissipation device housing (2), which is located at the bottom outside of the substrate body (1). A full-coverage heat dissipation fin (21) is provided on the top of the heat dissipation device housing (2) near the substrate body (1). A grid-shaped heat dissipation fin (22) is provided on the top of the heat dissipation device housing (2) near the low-heat area (12). A first heat dissipation fin (23) is installed inside the heat dissipation device housing (2) near the full-coverage heat dissipation fin (21). A second heat dissipation fin (24) is installed inside the grid-shaped heat dissipation fin (22) near the grid-shaped heat dissipation fin (22). A blower body (25) is installed at one end of the outer side of the heat dissipation device housing (2).

3. The sensor circuit board with high-efficiency heat dissipation according to claim 2, characterized in that: The mounting assembly includes a sliding block (3), the sliding block (3) has a slanted groove (31) on the side near the substrate body (1), a fixing block (32) is fixedly connected to the top of the heat dissipation device housing (2) near the sliding block (3), the sliding block (3) is slidably connected inside the fixing block (32), and a return spring (33) is fixedly connected to both sides of the outside of the sliding block (3), the other end of the return spring (33) is fixedly connected to the heat dissipation device housing (2).

4. The sensor circuit board with high-efficiency heat dissipation according to claim 2, characterized in that: The substrate body (1) has a limiting groove (4) inside, and a locking block (41) is fixedly connected to the outer side of the heat dissipation device shell (2) near the limiting groove (4). The locking block (41) is slidably connected inside the limiting groove (4).

5. The sensor circuit board with high-efficiency heat dissipation according to claim 2, characterized in that: A filter plate (5) is installed on the outside of the main body (25) of the blower.

6. The sensor circuit board with high-efficiency heat dissipation according to claim 2, characterized in that: The blower body (25) has a groove (6) on the outside, a sliding column (61) is fixed inside the groove (6), a cleaning plate (62) is installed inside the groove (6), and the cleaning plate (62) is slidably connected to the outside of the sliding column (61).

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